DOCSLIB.ORG

Still Evolving: 200Mm

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Still Evolving: 200Mm V10/Issue 1/2015 Growing Scope 2 Demand for 20 China: 32 of 200mm Applications 200mm Tools Investment Fever Drives Advances in MEMS Outstrips Supply Kicks IC Industry Process Technologies Into High Gear Solutions for Factory and Equipment Efficiency Still evolving: 200mm MANAGEMENT SPONSOR Cheryl Knepfler CONTENTS cheryl_knepfl[email protected] PUBLISHER Growing Scope Peggy Marcucci of 200mm Applications [email protected] Drives Advances in MEMS Process Technologies 2 EDITOR-IN-CHIEF Liz Baird [email protected] TECHNOLOGY ADVISOR Helen Armer [email protected] Advanced Service Collaboration— The Fab’s CONTRIBUTING EDITORS New Normal 7 Gary Dagastine David Lammers Silicon Labs Jill O’Nan Tackles IoT Challenges 12 DESIGN Jane Olson Graphic Design Trends in Subfab Energy Consumption and Emissions NANOCHIP is published by Control 16 Applied Materials, Inc. © Copyright Applied Materials, Inc., 2015 20 www.appliedmaterials.com Demand for 200mm Tools Outstrips Supply Nanochip Fab Solutions is now delivered in an environmentally friendly online version. 26 Printed copies are available upon request. Deploying Multivariate Analysis to Improve For a free subscription, or to Fab Productivity add colleagues to the mailing list, please send an email to [email protected] with the following information: 29 • Name Case Study: • Title Wafer Scrap Reduction in • Company a 300mm Logic Foundry • Business address China: • Business email* Investment Fever Kicks IC Industry *Sorry—no general accounts, e.g., Gmail, AOL, Yahoo Into High Gear 32 All trademarks so designated or PLUS: ABOUT THE COVER: otherwise indicated as product names 38: 10 in 10: Celebrating Just as the chambered nautilus or services are trademarks of Applied Materials, Inc. in the U.S. and A Decade of Nanochip creates a larger shell for itself as it other countries. All other product and 41: The Last Word: grows, 200mm equipment continues Sematech— service marks contained herein are A Look Back to evolve—and thrive—in the era of trademarks of their respective owners. mobility and the Internet of Things. Cover image: Chris 73 at //commons.wikimedia.org/wiki/File:Nautilus CutawayLogarithmicSpiral.jpg under the creative commons cc-by-sa 3.0 license. BACK TO THE FUTURE: BUILDING THE LATEST TECHNOLOGY WITH LEGACY TOOLS A Letter from Charlie Pappis When it comes to the fast-paced world of technology, we tend to assume that whatever’s “the latest” is also “the greatest.” Just look at the long lines that form outside your local Apple store every time a new version of the iPhone is released. CHARLIE PAPPIS That’s why the unprecedented surge in demand for 200mm legacy tools, largely driven by mobility GROUP VICE PRESIDENT innovations—including smartphones and the Internet of Things (IoT)—presents such an interesting AND GENERAL MANAGER, challenge for the semiconductor industry. Although FinFETs, 3D NAND and other leading-edge device APPLIED GLOBAL SERVICES designs continue to push the IC technology roadmap, the fact is more than 75% of the ICs in the latest iPhone 6 Plus were manufactured on trailing-edge 150mm and 200mm equipment—much of it first delivered back in the 1980s. These legacy tools are vital to delivering a steady stream of cost-sensitive “More-than-Moore” devices. Fabricated with non-leading edge die, these devices are produced in fabs that must continuously evolve to operate flexibly and with peak yield and maximized output. This is a high-value problem that Applied Materials understands very well, and is committed to helping our customers address. In this issue of Nanochip you’ll learn how Applied Materials is continuing to invest in manufacturing, technology and service o¬erings for 200mm platforms through our R&D facility in Xi’an, China, our 200mm lab in Singapore, our manufacturing operation in Austin, Texas, and other satellite operations in Gloucester, Massachusetts, Kalispell, Montana, and Tel Aviv, Israel. A great example is the new Applied Vita controller, introduced last fall. Many 200mm systems have controllers that were designed decades ago and haven’t been updated since. The Vita controller includes a much more powerful processor, flash memory and other features that can bring 200mm Applied Endura and Centura systems up to modern levels of performance and process control. When combined with our growing portfolio of advanced, technology-enabled service and consulting options, which we discuss in this issue, customers can increase output and improve 200mm device performance and yield. A tangible example of our new outcome-based service programs is a case study describing how a foundry with Applied Centura tools engaged our FabVantage Consulting Group with a goal to cut scrap rates by 50%. The Applied consultants ultimately exceeded the customer’s target, with recommendations and services which, when implemented, reduced wafer scrap to <0.2% and spending on certain parts by 4x. Also detailed in this issue is the interesting strategy of Silicon Labs, a fast-growing, fabless supplier of devices targeting IoT applications, along with a compelling inside view of China’s e¬orts to become an IC powerhouse. By leveraging government seed money and matching investments that could total US $170 billion over the next 5 to 10 years, China hopes to emerge as a major new player in chip manufacturing. Finally, we salute the 10th anniversary of Nanochip Fab Solutions with a look back at how much our industry has changed over the past decade. But what hasn’t changed, and what I hope you take away from these pages, is that Applied Materials is here for you. Whether you’re trying to optimize a legacy 200mm system, move to a new technology node on a state-of-the-art 300mm system, increase output, or reduce total costs, we can help you achieve your goals. Define the performance and the results you want, and we’ll deliver the technology, service and support to get you there. NANOCHIP 1 2 NANOCHIP Interestingly, evidence which can accommodate Trend for 200mm Volume Fabs suggests that these might be more than twice as many dies Count of Companies and Fabs unduly pessimistic conclusions, as 200mm wafers. By 2013, 250 Companies Volume Fabs similar to the misrepresentation 300mm wafers represented Fab Count: +5% to +10% 200 that prompted Mark Twain to approximately 57% of overall comment, “The report of my semicondutor capacity, with IC 150 death was an exaggeration.” Insights forecasting a rise to 64% Count 100 Even with the transition to in 2018.[3] Production on 300mm 300mm wafers, fabs running wafers is predominantly in high- 50 200mm wafers have continued volume commodity chips, includ- 0 to fabricate specialty memories; ing DRAM, flash memory, and 2007 2015 image sensors; micro-controller microprocessors. Foundries and [6] units (MCUs); analog products; IDMs favor them to best amortize Figure 1. Production on 200mm tools is making small but steady gains. motion, audio, and radio- their manufacturing costs per die. followed spurred adoption of electronics, power management frequency (RF) communication However, 300mm systems are “More-than-Moore” devices. applications, and emerging IoT- devices embodying MEMS; and also used for some production of These comprise micro-scale, related MEMS and sensors.[5] discrete passive components image sensors, power manage- systems-in-package or system- such as resistors, capacitors, ment devices, and complex logic on-chip devices, integrating KEY 200MM antennas, filters and switches. and micro-component ICs with processing power with sensors, MARKET SEGMENTS Production of such devices large die sizes. RF communication, and a range makes good economic sense The automotive industry The automotive industry and of other functionalities. They in fully depreciated 200mm was among the first users of the consumer electronics sectors can be fabricated using die with fabs, including those formerly devices fabricated on 200mm have been responsible for most feature sizes greater than 1µm used for making devices now wafers and has been steadily of the 200mm production since and profitably produced on produced on 300mm wafers;[2] expanding its use of sensors for before the 2008–09 industry 200mm systems. furthermore, new market forces improving vehicle e´ciencies downturn (see figure 2). Since Although ~5% of the are re-energizing the 200mm and safety. Similarly, industrial the early 2000s, cars produced total WFE market in 2014,[1] equipment scene. Leveraging and medical applications have in the U.S. have been equipped 200mm applications are its core capabilities in precision contributed to this market. with devices like tire pressure steadily multiplying (see figure materials engineering, Applied However, the advent of wireless sensors that send data to the 1). In 2014, fab investments by Materials is addressing the new and motion-tracking technologies vehicles’ central computers. The leading foundries and IDMs challenges accompanying these in consumer electronics has been average new car now contains resulted in a 45% increase in rapidly growing market segments the major stimulus for growth in 60 microprocessors; electronics spending for secondary 200mm through sustained investment in applications produced on 200mm for such functions as advanced equipment.[4] Foundries account R&D to expand the capabilities of platforms. Sold in the hundreds of driver assistance, heating and for two-thirds of this increase, its 200mm systems. millions per year, first the iPhone air conditioning, and rear-view responding to expanding The drive to reduce chip and then the proliferation of cameras account for 40% of a demand for MCUs for costs was the leading factor in other smartphones, tablet PCs, car’s cost.[6] According to Gartner, automotive devices, consumer the transition to 300mm wafers, and related digital devices that sensors will represent 31.3% Average Electronics Content per Car Global MEMS Market (Components) for Cell Phones and Tablets 1000 7000 Tablet 6000 900 Cell Phone 5000 800 4000 $M 700 3000 2000 600 1000 500 0 2006 2008 2010 2012 2014 2016 2018 2020 2010 2011 2012 2013 2014 2015 2016 2017 2018 Figure 2.
Load more

Recommended publications
  • In the United States District Court for the District of Delaware
    IN THE UNITED STATES DISTRICT COURT FOR THE DISTRICT OF DELAWARE SEMCON TECH, LLC, Plaintiff, v. C.A. No. _________ APPLIED MATERIALS, INC., APPLIED MATERIALS SOUTH EAST ASIA PTE. JURY TRIAL DEMANDED LTD., APPLIED MATERIALS TAIWAN, LTD., APPLIED MATERIALS CHINA, APPLIED MATERIALS FRANCE S.A.R.L., AND APPLIED MATERIALS ITALIA SRL, Defendants. COMPLAINT FOR PATENT INFRINGEMENT This is an action for patent infringement arising under the Patent Laws of the United States of America, 35 U.S.C. § 1 et seq. in which Plaintiff Semcon Tech, LLC makes the following allegations against Defendants Applied Materials, Inc., Applied Materials South East Asia Pte. Ltd., Applied Materials Taiwan, Ltd., Applied Materials China, Applied Materials France S.A.R.L., and Applied Materials Italia Srl (collectively, “AMAT” or “Defendants”). PARTIES 1. Plaintiff Semcon Tech, LLC (“Semcon”) is a Delaware limited liability company. 2. On information and belief, Defendant Applied Materials, Inc. (“AMAT- US”) is a Delaware corporation with its principal place of business at 3050 Bowers Avenue, Santa Clara, California. On information and belief, AMAT can be served through its registered agent, The Corporation Trust Company, Corporation Trust Center, 1 1209 Orange Street, Wilmington, Delaware 19801. 3. On information and belief, Defendant Applied Materials South East Asia Pte. Ltd. (“AMAT-SG”) is a corporation organized under the laws of Singapore with its principal place of business at 8 Upper Changi Road North, Singapore 506906. 4. On information and belief, Defendant Applied Materials Taiwan, Ltd. (“AMAT-TW”) is a corporation organized under the laws of Taiwan with its principal place of business at No.
    [Show full text]
  • Sponsors Announced for Taiwan and China Semiconductor Industry Outlook 2003
    Taiwan and China Semiconductor Industry Outlook – 2003 September 15-16, 2003 San Jose, California www.taiwan-china-outlook.com FOR IMMEDIATE RELEASE September 10, 2003 San Jose, Calif. SPONSORS ANNOUNCED FOR TAIWAN AND CHINA SEMICONDUCTOR INDUSTRY OUTLOOK 2003 The US-Taiwan Business Council, in conjunction with the Fabless Semiconductor Association, today announced the sponsors for Taiwan and China Semiconductor Industry Outlook 2003. Platinum sponsor - Agilent Technologies Gold sponsors - Applied Materials, Intel, NVIDIA, Synopsys, Teradyne, and Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) This event, focusing on the challenges and opportunities presented by the increasing economic integration of the United States, Taiwan and China semiconductor industries, will be held from September 15-16, 2003 in San Jose, Calif. Conference presentations, panels and Q&A sessions will cover economic integration; investment; export controls and dual-use technologies; intellectual property rights; business partnerships; market potential and acquiring market share. Keynote speeches will be given by Dr. Morris Chang, chairman, CEO and founder of TSMC, Kenneth Juster, under secretary of commerce for the Bureau of Industry and Security and Lisa Bronson, deputy under secretary of defense for Technology Security Policy & Counterproliferation. Additional speakers, updates to the conference agenda and registration information are available at www.taiwan-china-outlook.com. About the Conference Sponsors: Agilent Technologies (http://www.agilent.com)
    [Show full text]
  • United States District Court for the Western District of Texas Waco Division
    Case 6:20-cv-01211 Document 1 Filed 12/31/20 Page 1 of 83 UNITED STATES DISTRICT COURT FOR THE WESTERN DISTRICT OF TEXAS WACO DIVISION Ocean Semiconductor LLC, Civil Action No.: 6:20-cv-1211 Plaintiff JURY TRIAL DEMANDED v. PATENT CASE NVIDIA Corporation (“NVIDIA”), Defendant. COMPLAINT FOR PATENT INFRINGEMENT Plaintiff Ocean Semiconductor LLC (“Ocean Semiconductor” or “Plaintiff”) files this Complaint against NVIDIA Corporation (“NVIDIA” or “Defendant”), seeking damages and other relief for patent infringement, and alleges with knowledge to its own acts, and on information and belief as to other matters, as follows: NATURE OF THE ACTION 1. This is an action for patent infringement arising under the Patent Laws of the United States, 35 U.S.C. § 1 et seq. THE PARTIES 2. Plaintiff Ocean Semiconductor is a limited liability company organized and existing under the laws of the State of Delaware, and its registered agent for service of process in Delaware is Rita Carnevale, 717 N. Union Street, Wilmington, DE 19805. Case 6:20-cv-01211 Document 1 Filed 12/31/20 Page 2 of 83 3. On information and belief, Defendant NVIDIA is a corporation organized and existing under the laws of Delaware, with its principal place of business at 2701 San Tomas Expressway, Santa Clara, CA 95050. NVIDIA is registered with the State of Texas and may be served with process through its registered agent, Corporation Service Company d/b/a CSC- Lawyers Incorporating Service Company, 211 E. 7th St., Suite 620, Austin, TX 78701. On information and belief, NVIDIA has a regional office in this District, including at least at 11001 Lakeline Blvd., Building 2, Suite 100, Austin, TX 78717.
    [Show full text]
  • Terell Johnson (323) 323-0646 [email protected] Unified Communication and Collaboration Engineer Linkedin.Com/In/Terelljayjohn Son
    8692 Falmouth Ave #3 Playa Del Rey, Ca 90293 Terell Johnson (323) 323-0646 [email protected] Unified Communication and Collaboration Engineer linkedin.com/in/terelljayjohn son EXPERIENCE SKILLS Video Engineer Snapchat, ​Venice, CA —IT Video Engineer Voice Engineer April 2017 - PRESENT IT Infrastructure Video Engineer and service owner responsible for Streaming and Content designing, deploying and managing all internal Video Conferencing, Live Delivery Streaming, Voice, Video and Collaboration technologies used globally by Collaboration Engineer Snap Inc. Placed, Looksery and Zen.ly..​F Enterprise Design Deployment Facebook, Menlo Park, CA—UC Engineer SEPT 2015 - APR 2017 Operations Engineer supporting Facebook's Global Video Conference Administration Infrastructure as apart of the AV/VC Team. Designed Global Dial plan and Cisco VCS worked cross functional with other Facebook Collaboration teams, Service Providers, VARs, and Vendors. Cisco TMS Cisco Call Manager Cisco Systems (Insight Global), ​San Jose, CA​ ​—UC Engineer Fuze FEB 2012 – SEP 2015 Zoom Cloud Conferencing Engineering Lead for the Advanced Cisco Experience Hangouts Meet Team supporting the Cisco Worldwide Sales Organization in rolling out WebEx Collaboration Meeting and TelePresence Cloud Conferencing Okta Solution. Architect and Partner Engineer for the rollout of and integration Teem of VBrick Content Management System. Jira Scrum master and site admin for creating group workflows for managing products, bugs, enhancements, and various types of team projects for Cisco IT, ACE, and Software Innovation Group. Infrastructure Cisco UCS Cisco Systems (Insight Global), ​San Jose, CA​ ​—Lead Video Analyst and QA Engineer VMWare FEB 2010 – OCT 2014 Lead QA Engineer and Service Manager for the ACE Endpoint Experience AWS Validation Team.
    [Show full text]
  • 2021 Logic Master Class Speaker
    Mike Sullivan CVP, INVESTOR RELATIONS Michael Sullivan is corporate vice president and head of Investor Relations. His team is responsible for investor relations and marketing communications including media relations, product and technology communications, and industry events. Mr. Sullivan joined Applied in 2009 after working at Intel Corporation for 16 years. He was Intel’s primary interface to equity analysts and the company’s largest institutional shareholders in the U.S. and Europe. He also held corporate communications positions at the company’s U.S. and European offices, where he drove corporate and competitive initiatives, new microprocessor introductions, computing platform campaigns, and flash memory PR. Mr. Sullivan is past president of the Silicon Valley chapter of NIRI, the National Investor Relations Institute. He earned his MBA at Santa Clara University and his BA in Public Relations at San Jose State University. 1 | Applied Materials Confidential Chidi Chidambaram, Ph.D. VP, ENGINEERING Chidi Chidambaram leads the process technology and foundry engineering team at Qualcomm as Vice President Engineering. Qualcomm is a leader among the fab less industry in bringing leading edge semiconductor technologies to manufacturing - Qualcomm was the first company to ship large volume products in 10 nm technology in 2017. Chidi’s team is also responsible for RF devices based on finlet and SOI transistors. Earlier Chidi developed silicon technology at Texas Instruments and was instrumental in the first embedded SiGe implementation by semiconductor Industry. Chidi is recognized as a IEEE fellow for contribution to strain engineering and Design technology co-optimization (DTCO). Chidi’s 20+ year semiconductor career has evenly straddled research and development with over 60 each of refereed articles and patents.
    [Show full text]
  • LOGIC MASTER CLASS JUNE 16, 2021 Forward-Looking Statements and Other Information
    LOGIC MASTER CLASS JUNE 16, 2021 Forward-Looking Statements and Other Information Today’s presentations contain forward-looking statements, including those regarding anticipated growth and trends in our businesses and markets, industry outlooks and demand drivers, technology transitions, our business and financial performance and market share positions, our investment and growth strategies, our development of new products and technologies, our business outlook for fiscal 2021 and beyond, the impact of the ongoing COVID-19 pandemic and responses thereto on our operations and financial results, strategic acquisitions and investments, and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation: the level of demand for our products; global economic and industry conditions; the effects of regional or global health epidemics, including the severity and duration of the ongoing COVID-19 pandemic; global trade issues and changes in trade and export license policies, including the recent rules and interpretations promulgated by the U.S. Department of Commerce expanding export license requirements for certain products sold to certain entities in China; consumer demand for electronic products; the demand for semiconductors; customers’ technology and capacity requirements; the introduction
    [Show full text]
  • Lam Research Corporation Names Thierry Fried Vice President, Europe Regional Operations
    Lam Research Corporation Names Thierry Fried Vice President, Europe Regional Operations FREMONT, Calif.-Sept. 21, 2000-Lam Research Corporation (Nasdaq: LRCX) today announced the appointment of Thierry Fried as vice president, Europe Regional Operations. Fried will report directly to Steve Newberry, president and chief operating officer for Lam. Fried has 18 years of semiconductor equipment experience. He spent the first five years of his career in the area of etch process technology followed by 13 years of increasing responsibility in sales and service management roles. Fried joins Lam from Applied Materials, Inc. where he most recently held the position of general manager for STMicroelectronics worldwide and country manager for Applied Materials, S.A.R.L. "Thierry has an excellent track record of success as a sales and service executive in the European semiconductor industry," said Newberry. "Our European customers are very important to Lam and we are proud of the long-term strategic relationships we have there. Thierry's leadership, combined with his extensive relationships with our customers, further solidifies our commitment to provide world class service and support in this important region. I am confident that he will contribute significantly to our vision to be number one in customer trust," Newberry added. Fried has a Masters degree in Chemistry from the University Grenoble, France. Lam Research Corporation is a leading supplier of front-end wafer processing equipment and services to the worldwide semiconductor manufacturing industry. The company's common stock trades on the Nasdaq National Securities Market under the symbol LRCX. Lam's World Wide Web address is http://www.lamrc.com.
    [Show full text]
  • Portfolio of Investments
    PORTFOLIO OF INVESTMENTS Columbia Seligman Premium Technology Growth Fund, September 30, 2020 (Unaudited) (Percentages represent value of investments compared to net assets) Investments in securities Common Stocks 98.9% Common Stocks (continued) Issuer Shares Value ($) Issuer Shares Value ($) Communication Services 11.0% Information Technology 84.3% Diversified Telecommunication Services 0.5% Communications Equipment 3.3% AT&T, Inc. 52,600 1,499,626 Arista Networks, Inc.(a) 7,900 1,634,747 (a) Ooma, Inc. 20,387 266,050 Cisco Systems, Inc. 54,800 2,158,572 Total 1,765,676 CommScope Holding Co., Inc.(a) 141,900 1,277,100 Entertainment 1.7% F5 Networks, Inc.(a) 24,900 3,056,973 Activision Blizzard, Inc. 63,708 5,157,163 Lumentum Holdings, Inc.(a) 9,100 683,683 Sciplay Corp., Class A(a) 60,106 974,919 Plantronics, Inc. 131,536 1,557,386 Total 6,132,082 Telefonaktiebolaget LM Ericsson, ADR 124,800 1,359,072 Interactive Media & Services 6.6% Total 11,727,533 Alphabet, Inc., Class A(a) 7,991 11,711,610 IT Services 9.2% Alphabet, Inc., Class C(a) 6,479 9,521,538 Boa Vista Servicos SA(a) 181,700 469,465 Twitter, Inc.(a) 44,381 1,974,955 DXC Technology Co. 52,100 929,985 Total 23,208,103 Fidelity National Information Services, Inc. 33,800 4,975,698 (a) Media 1.9% Fiserv, Inc. 31,900 3,287,295 Discovery, Inc., Class A(a) 186,500 4,060,105 Genpact Ltd. 52,770 2,055,391 Fox Corp., Class A 88,300 2,457,389 Global Payments, Inc.
    [Show full text]
  • Semitool, Inc. (Name of Issuer)
    SECURITIES AND EXCHANGE COMMISSION WASHINGTON, D.C. 20549 SCHEDULE 13D/A Under the Securities Exchange Act of 1934 (Amendment No. 1)* Semitool, Inc. (Name of Issuer) Common Stock (Title of Class of Securities) 816909105 (CUSIP Number) Joseph J. Sweeney Senior Vice President, General Counsel and Corporate Secretary Applied Materials, Inc. 3050 Bowers Avenue, Santa Clara, CA 95054 Tel: (408) 725-5555 (Name, Address and Telephone Number of Person Authorized to Receive Notices and Communications) December 18, 2009 (Date of Event which Requires Filing of this Statement) If the filing person has previously filed a statement on Schedule 13G to report the acquisition which is the subject of this Schedule 13D, and is filing this schedule because of §§240.13d-1(e), 240.13d-1(f) or 240.13d-1(g), check the following box. ¨ NOTE: Schedules filed in paper format shall include a signed original and five copies of the schedule, including all exhibits. See Rule 13d-7 for other parties to whom copies are to be sent. * The remainder of this cover page shall be filled out for a reporting person’s initial filing on this form with respect to the subject class of securities, and for any subsequent amendment containing information which would alter disclosures provided in a prior cover page. The information required on the remainder of this cover page shall not be deemed to be “filed” for the purpose of Section 18 of the Securities Exchange Act of 1934 (“Act”) or otherwise subject to the liabilities of that section of the Act but shall be subject to all other provisions of the Act (however, see the Notes).
    [Show full text]
  • Applied Materials Appoints Rani Borkar to Board of Directors
    Applied Materials Appoints Rani Borkar to Board of Directors December 8, 2020 SANTA CLARA, Calif., Dec. 08, 2020 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced Rani Borkar will join its Board of Directors effective Dec. 14. Ms. Borkar brings decades of expertise in semiconductor design and computing systems development to Applied and will serve on the Board’s Strategy and Investment Committee. “Rani is a well-respected technology leader and product visionary, and we look forward to her contributions as we drive growth and build long-term shareholder value for Applied Materials,” said Tom Iannotti, Chairman of the Board of Applied Materials. “Her experience in chip design and cloud computing provide valuable insights as Applied looks to expand its ecosystem engagements from materials to systems.” Ms. Borkar is currently Corporate Vice President, Azure Hardware Systems and Infrastructure at Microsoft Corporation. In this role she leads the core organizations building Microsoft’s leading cloud computing platform, including silicon, systems and supply chain. Ms. Borkar has extensive experience in cutting-edge semiconductor design having served in engineering and executive roles at IBM Corporation and Intel Corporation. At Intel, where she spent 27 years of her career, Ms. Borkar was most recently Corporate Vice President and General Manager of the Product Development Group, overseeing all processor and System-on-a-Chip (SoC) development for PC clients, servers, phones and tablets. Ms. Borkar is a member of the board for the Global Semiconductor Alliance (GSA) and serves as the Chair of the Board of Trustees at Oregon State University to help guide the state’s effort to advance economic development and innovation.
    [Show full text]
  • Lam Research, Applied Materials Set to Reap Iot Harvest
    This document is being provided publicly in the following form. Please subscribe to FSInsight.com for more. Members Area Signal from Noise Lam Research, Applied Materials Set To Reap IoT Harve Signal from Noise Lam Research, Applied Materials Set To Reap IoT Harvest June 24, 2020 Vito J. Racanelli SENIOR EDITOR & MARKET INTELLIGENCE ANALYST – Internet of Things LT growth bodes well for semi-conductor equipment maker growth – LRCX and AMAT shares near highs but at relatively undemanding valuation multiples – As new IoT demand materializes—autos, healthcare—stocks could rise 25% or more In the previous Signal From Noise (June 17, Continued IoT Growth Good News for Nordic Semiconductor), I focused on the Internet of Things (IoT), which is likely to continue growing, limited only by what uses engineers dream up for semiconductor chips. Just about any area can see increased chips use: autos, healthcare, factory automation, HVAC systems, to name a few. The IOT is rich in possibilities for the world’s consumers and for companies that provide the architecture and backbone. The IoT means most objects can be connected via the internet and local networks, giving and receiving data, from personal medical devices to mobile phones to self- driving cars. If it’s electronic, there’s probably going to be a chip needed to power it or control it. In a normal year, some 80 million cars are sold, each with more and more computing power. Only yesterday, Mercedes Benz and NVIDIA said they plan to cooperate on a new in-vehicle computer system and AI infrastructure, to be introduced in 2024.
    [Show full text]
  • Comcast/Time Warner Cable and Applied Materials/Tokyo Electron
    Rev Ind Organ (2015) 47:425–435 DOI 10.1007/s11151-015-9490-z Economics at the Antitrust Division 2014–2015: Comcast/Time Warner Cable and Applied Materials/ Tokyo Electron 1 1 1 Nicholas Hill • Nancy L. Rose • Tor Winston Published online: 4 November 2015 Ó Springer Science+Business Media New York (outside the USA) 2015 Abstract During 2014–2015, the Antitrust Division achieved enforcement suc- cesses in a wide range of matters. Many, such as the case against American Express, played out publicly in court proceedings. But two of the Division’s most significant investigations over the past year involved mergers that the parties abandoned in the face of concerns that were expressed by the Division. In each of these mergers, economic analysis played an important role in understanding their likely impact on competition. This article provides a sample of the types of issues that have been raised in recent antitrust cases that did not, ultimately, end up on the public record. Keywords Competition policy Á Mergers Á Semiconductors Á Telecommunications Á Cable systems Á Bargaining leverage 1 Introduction During 2014–2015, the Antitrust Division of the U.S. Department of Justice (DOJ) continued to achieve enforcement successes in a wide range of matters. Many of these matters, such as the case against American Express, played out publicly in court proceedings. On those cases, the Division’s web site contains a wealth of information; see www.justice.gov/atr. Some matters, however, are resolved before reaching this level of public discussion and disclosure. This year, two of the most significant matters that were reviewed by the Division involved mergers that the parties abandoned in the face of concerns that were & Nancy L.
    [Show full text]