Design Guide for Reducing Radiated and Conducted Emissions in Isolated Systems Using Silicon Labs’ Isolators
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AN1131: Design Guide for Reducing Radiated and Conducted Emissions in Isolated Systems Using Silicon Labs’ Isolators Silicon Labs isolators are designed for minimal radiated and con- ducted emissions, enabling systems to meet stringent standards KEY POINTS such as FCC Part 15, CISPR 32, and CISPR 25. • EMC standards limit the amount of radiated and conducted emissions that can All electronic circuits generate some level of radiated and conducted emissions. If these be generated by various types of electrical/ emission levels are excessive, they may interfere with the operation of nearby or electri- electronic equipment. cally connected equipment. Therefore, designers must be careful to minimize emission • Silicon Labs isolators are designed for levels from their circuits to ensure the electromagnetic compatibility of their designs. minimal radiated and conducted emissions to help meet FCC Part 15, CISPR 32, and Meeting conducted and radiated emissions standards can be both challenging and cost- CISPR 25 standards. ly if not considered early in the design cycle. Component selection and printed circuit • Galvanic isolation between circuits can board (PCB) design are key to reducing emissions and achieving first pass success result in additional electromagnetic for a given standard’s profile. This design guide begins by identifying and classifying coupling and emissions challenges. sources of radiated and conducted emissions in an isolated system and then proposes • This design guide describes techniques various techniques to attenuate these emissions. These discussions are followed by two for reducing the levels of radiated and case studies wherein emission reduction techniques are applied to circuit board designs conducted emissions in equipment that that utilize the Si88241 isolator. The first case study addresses radiated emissions, employs galvanic isolation. and the second case study addresses conducted emissions. The effectiveness of these techniques are judged using CISPR 25 radiated and conducted emissions measurement techniques, respectively. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 1 Rev. 0.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021 1 Table of Contents 1. Introduction ................................4 1.1 EMI, EMC, Radiated and Conducted Emissions, Radiated and Conducted Immunity, Coupling, and Crosstalk ................................5 1.2 Differential-Mode and Common-Mode Currents ...................6 1.3 Magnetic and Electric Fields, Near and Far Fields, Wave Impedance, Loop and Electric Dipole Radiators, and Antenna Reciprocity .......................8 1.4 General Guidelines for Minimizing Radiated and Conducted Emissions ...........9 2. Radiated and Conducted Emission Standards .................. 10 2.1 IEC CISPR EMC Standards .........................11 2.2 IEC CISPR 25 ..............................12 2.3 IEC CISPR 32 ..............................13 2.4 FCC Title 47, Part 15, Subpart B ........................13 3. Isolated Systems and Electromagnetic Compatibility (EMC)............. 14 4. Silicon Labs Isolators Are Designed to Minimize Radiated Emissions ......... 15 5. Choosing the Best Silicon Labs Isolator Option to Reduce Emissions for a Given RF Transmitter Duty Cycle........................... 16 6. Techniques for Reducing Emissions from Differential-Mode Currents ......... 18 6.1 Selecting Proper Bypass Capacitors.......................18 6.2 Choosing the Proper Bypass Capacitor Placement ..................19 6.3 Adding Embedded Bypass Capacitor Structures for Multilayer PCBs ............20 6.4 Terminating Transmission Lines ........................21 7. Techniques for Reducing Emissions from Common-Mode Currents .......... 22 7.1 Adding Capacitance Between Power Domains ...................23 7.2 Using Common-Mode Chokes to Reduce Emissions .................25 8. Controlling Emissions in Designs using Digital Isolators with Integrated DC-DC Controllers 27 8.1 Primary-Side Loop Currents .........................28 8.2 Secondary-side Loop Currents ........................28 8.3 Using Secondary-Side Snubber Circuit to Reduce Emissions Due to Ringing .........29 9. Case Study 1: CISPR 25 Radiated Emissions for an Si88241 Design.......... 31 10. Case Study 2: CISPR 25 Conducted Emissions for an Si88241 Design ........ 33 10.1 Conducted Emissions Measurements without any Added EMC Components ........34 10.2 The Y Capacitor .............................35 10.3 Further Optimization ...........................35 10.3.1 Overlapping Inner Ground Planes and Optimized PCB Layout ............35 10.3.2 Optimized Snubber Design ........................35 10.3.3 Lower Capacitance Transformer ......................36 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 Rev. 0.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021 2 10.3.4 Common Mode Choke on the Input .....................36 10.4 Optimized Board First Pass Test Results .....................37 11. Summary ............................... 39 12. References............................... 40 13. Document Change List .......................... 41 Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 3 Rev. 0.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021 3 AN1131: Design Guide for Reducing Radiated and Conducted Emissions in Isolated Systems Using Silicon Labs’ Isolators • Introduction 1. Introduction The first section of this design guide provides a very high-level introduction to some of the concepts associated with electromagnetic interference (EMI) and electromagnetic compliance (EMC). Although detailed discussions of these topics are beyond the scope of this document, the goal is to introduce the concepts and make the techniques presented in the subsequent sections more intuitive. For more information about EMI and EMC topics, see Section 12. References. Section 2. Radiated and Conducted Emission Standards provides an introduction to EMC standards. Section 3. Isolated Systems and Electromagnetic Compatibility (EMC) discusses how isolation of circuits and power domains within equipment can effect emissions. Section 4. Silicon Labs Isolators Are Designed to Minimize Radiated Emissions explains how Silicon Labs isolator products are designed to minimize emissions, and Section 5. Choosing the Best Silicon Labs Isolator Option to Reduce Emissions for a Given RF Transmitter Duty Cycle provides guidance on selection of Silicon Labs isolators based on signal duty cycle. Section 6. Techniques for Reducing Emissions from Differential-Mode Currents and Section 7. Techniques for Reducing Emissions from Common-Mode Currents discuss general methods for reducing emissions from common-mode and from differential-mode circuits, respectively. Section 8. Controlling Emissions in Designs using Digital Isolators with Integrated DC-DC Controllers provides guidelines for controlling emissions from designs using digital isolators with integrated dc-dc controllers. To wrap things up, two case studies are presented: Section 9. Case Study 1: CISPR 25 Radiated Emissions for an Si88241 Design, which illustrates reduction in radiated emissions for an Si88241-based design, and Section 10. Case Study 2: CISPR 25 Conducted Emissions for an Si88241 Design, which demonstrates reductions in conducted emissions for an Si88241-based design. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 Rev. 0.2 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • July 26, 2021 4 AN1131: Design Guide for Reducing Radiated and Conducted Emissions in Isolated Systems Using Silicon Labs’ Isolators • Introduction 1.1 EMI, EMC, Radiated and Conducted Emissions, Radiated and Conducted Immunity, Coupling, and Crosstalk Electronic equipment can unintentionally radiate and/or conduct a broad spectrum of energy from within the equipment out into the surrounding environment. Radiated emissions are unintentional energy that escape the equipment in the form of electric, magnetic, or electromagnetic fields. Conducted emissions are unintentional energy carried out of the equipment on the equipment's power cables or attached signal cables. This emitted energy can couple into nearby victim equipment, resulting in unwanted signals (noise) within the victim that can interfere with its operation. The noise generated in the victim equipment as a result of these radiated or conducted emissions can be considered electromagnetic interference (EMI). The ability of the victim equipment to operate in the presence of radiated energy or conducted energy is referred to as the equipment's radiated immunity or conducted immunity, respectively. Electromagnetic compatibility (EMC) refers to the ability of electronic equipment to operate without interfering with other equipment (without emitting excessive radiated or conducted energy) and to operate correctly within its intended operating environment (which will include some level of radiated or conducted energy from other sources). There are national and international EMC standards both for the maximum levels of radiated or conducted emissions