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Sept 13Th, 2021 PROGRAM
2021 INTERNATIONAL IMAGE SENSOR WORKSHOP Online event Sept 20-23, 2021 Paper publication date: Sept 13th, 2021 PROGRAM Monday, Sept 20th 2021 15:00 Opening Session 01 Small Pixels Session chair: TBA 15:12 The-State-of-the-Art of CMOS Image Sensors R01 Ziad Shukri, TechInsights Inc., Ottawa, Canada 15:18 A 40/22nm 200MP Stacked CMOS Image Sensor with 0.61um Pixel R02 Masayuki Uchiyama2, Geunsook Park1; Tomoyasu Tate1, Masashi Minagawa2, Shino Shimoyamada2, Zhiqiang Lin1, King Yeung1, Lien Tu1, Wu-Zang Yang3, Alan Hsiung1, Vincent Venezia1, Lindsay Grant1 1 OmniVision Technologies, Santa Clara, CA, USA 2 OmniVision Technologies Japan, Kanagawa, Japan 3 OmniVision Technologies Taiwan, Hsinchu, Taiwan 15:24 0.64μm-pitch CMOS Image Sensor with Low Leakage Current of Vertical Transfer Gate R03 Dongmo Im, Jameyung Kim, Juhee Lee, Sungbong Park, Kwansik Cho, Hyunchul Kim, Chang-Rok Moon and Hyoung-Sub Kim Semiconductor R&D Center, Samsung Electronics Co., Republic of Korea. 15:30 An application of sub-half-micron pixel with preserved color pixel concept for next- R04 generation color image acquisition Yuichiro Yamashita1, Yuichiro Yamashita1, Rihito Kuroda2,3, Shigetoshi Sugawa3, Dun Nian Yaung1 1 CMOS Image Sensor Division, Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan, R.O.C. 2 Graduate School of Engineering, Tohoku University, Sendai, Japan, 3 New Industry Creation Hatchery Center, Tohoku University, Sendai, Japan 15:36 A study on modulation transfer function and signal-to-noise ratio for Tetracell CMOS R05 image sensors with -
Omnivision Chips Power New Camera Phone Designs From
Investor Relations: Media Contact: Company Contact: Steven Horwitz Martijn Pierik Scott Foster OmniVision Technologies Impress Public Relations OmniVision Technologies Ph: 408.542.3263 Ph: 602.366.5599 Ph: 408.542.3077 [email protected] [email protected] OMNIVISION CHIPS POWER NEW CAMERA PHONE DESIGNS FROM KYOCERA WIRELESS SUNNYVALE, Calif. — May 30, 2006 — OmniVision Technologies, Inc. (NASDAQ: OVTI), one of the world’s leading suppliers of CMOS image sensors, today announced that Kyocera Wireless Corp., a leading global supplier of CDMA wireless handsets and devices, will use OmniVision CameraChips for new camera phones slated for release in the second half of 2006, including the 1.3 Megapixel K340 Series and the VGA-resolution K320 Series. “At Kyocera Wireless we believe deeply in the genius of simplicity, whether it’s the intuitive handsets we design and sell or the enabling technologies we source from companies like OmniVision,” said Jim Kelly, executive vice president and chief operating officer at Kyocera Wireless Corp. “OmniVision has done an excellent job of providing leading-edge CMOS image sensor technology in form factors that meet our exact requirements and provide the best performance and the highest image quality.” The new phones from Kyocera Wireless will feature both VGA and 1.3 Megapixel resolution cameras. Some will utilize a smart socket design that allows interchangeability between OmniVision’s VGA and 1.3 megapixel sensors, giving Kyocera Wireless extra flexibility to better meet the specific design requirements of its carriers and their customers. The Kyocera camera phone designs will serve CDMA network customers around the world including in the North American, Latin American and Indian markets. -
In Re Omnivision Technologies, Inc. Litigation 11-CV-05235-Lead
Case5:11-cv-05235-RMW Documentl05 FiIed04/23/12 Pagel of 100 1 BARRACK RODOS & BACINE STEPHEN R BASSER (121590) 2 SAMUEL M. WARD (216562) 600 West Broadway, Suite 900 3 San Diego, CA 92101 Telephone: (619) 230-0800 4 Facsimile: (619) 230-1874 S BRAN STETrER, STRANCH & JENNINGS, PLLC 6 J. Gerard Stmnch, W 7 James G. Stmnch, ifi 227 Second Avenue North, Fourth Floor 8 Nashville, TN 37201-1631 Telephone: (615) 254-8801 9 Facsimile: (615) 250-3937 10 Co-Lead Counsel for Lead Plaintiffs Oakland County Employees'Retirement System, 11 Laborers'District Council Contractors'Pension Fund of Ohio, and Woburn Retirement System and the Proposed Class 12 [Additional counsel appear on signature page] 13 14 UNITED STATES DISTRICT' COURT 15 NORTHERN DISTRICT' OF CALWORNIA 16 SAN JOSE DIVISION 17 In re OMNIVISION TECHNOLOGIES, Case No.: 5:11-cv-05235-RMW 18 INC. LITIGATION LEAD PLAINTIFFS' CONSOLIDATED 19 CLASS ACTION COMPLAINT This Document Relates to: 20 ALL ACTIONS. 21 22 23 24 25 26 27 28 LEAD PLTFS' CONS. CLASS ACHON COMPLAINT F1 Case No.: 5:11-cv-05235-RMW Case5:11-cv-05235-RMW Document105 FiIed04/23/12 Page2 of 100 TABLE OF CONTENTS 2 IINTRODUCTION.....................................................................................................................1 3 I JURISDICTION AND VENUE...............................................................................................12 4 IPARTIES................................................................................................................................13 S I FRAUDULENT SCHEME -
Micron Technology Inc
MICRON TECHNOLOGY INC FORM 10-K (Annual Report) Filed 10/25/11 for the Period Ending 09/01/11 Address 8000 S FEDERAL WAY PO BOX 6 BOISE, ID 83716-9632 Telephone 2083684000 CIK 0000723125 Symbol MU SIC Code 3674 - Semiconductors and Related Devices Industry Semiconductors Sector Technology Fiscal Year 08/30 http://www.edgar-online.com © Copyright 2011, EDGAR Online, Inc. All Rights Reserved. Distribution and use of this document restricted under EDGAR Online, Inc. Terms of Use. UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (Mark One) ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended September 1, 2011 OR TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to Commission file number 1-10658 Micron Technology, Inc. (Exact name of registrant as specified in its charter) Delaware 75-1618004 (State or other jurisdiction of incorporation or organization) (IRS Employer Identification No.) 8000 S. Federal Way, Boise, Idaho 83716-9632 (Address of principal executive offices) (Zip Code) Registrant's telephone number, including area code (208) 368-4000 Securities registered pursuant to Section 12(b) of the Act: Title of each class Name of each exchange on which registered Common Stock, par value $.10 per share NASDAQ Global Select Market Securities registered pursuant to Section 12(g) of the Act: None (Title of Class) Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. -
Omnivision Technologies, Inc 10-K
To my fellow stockholders, Fiscal 2011 was an exciting and rewarding year for OmniVision as major tasks were accomplished and many performance records were set. Our key objectives in fiscal 2011 were threefold: • Continue the successful ramp of our OmniBSI devices, • Continue the development and implementation of our OmniBSI-2 technology, and • Capitalize on the growth and expansion opportunities presented by the image sensor markets with our advanced proprietary technology. We believe we have accomplished these goals, and are now resolved to maintain the momentum we have achieved. Fiscal Year Financial Results In fiscal 2011, revenues reached $956.5 million, approaching the $1 billion mark for the first time in our company history. Our net income for fiscal 2011 was $124.5 million, or $2.11 per diluted share. All of these financial metrics showed significant, if not record, improvement over fiscal 2010. Our balance sheet further demonstrated our focus on financial performance and the company’s overall strength in a competitive market. We ended the year with cash, cash equivalents and short-term investments of $466.9 million. Technology Achievements OmniVision takes great pride in its successful record of innovation. Specifically, our expertise in implementing the OmniBSI technology has positioned OmniVision as a leading component supplier, providing image sensors to a wealth of products, including high-end smartphones, notebooks, webcams, portable multi-media devices and even commercial enterprise applications. Our portfolio of image sensors now extends from VGA up to 14 megapixels, all meeting demanding performance standards. It is this wide range of offerings, as well as the depth of our expertise, that enabled the company to ship more than 680 million CMOS image sensors last year. -
Micron Technology Inc
MICRON TECHNOLOGY INC FORM 10-K (Annual Report) Filed 10/26/10 for the Period Ending 09/02/10 Address 8000 S FEDERAL WAY PO BOX 6 BOISE, ID 83716-9632 Telephone 2083684000 CIK 0000723125 Symbol MU SIC Code 3674 - Semiconductors and Related Devices Industry Semiconductors Sector Technology Fiscal Year 03/10 http://www.edgar-online.com © Copyright 2010, EDGAR Online, Inc. All Rights Reserved. Distribution and use of this document restricted under EDGAR Online, Inc. Terms of Use. UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (Mark One) ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended September 2, 2010 OR TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to Commission file number 1-10658 Micron Technology, Inc. (Exact name of registrant as specified in its charter) Delaware 75 -1618004 (State or other jurisdiction of (IRS Employer incorporation or organization) Identification No.) 8000 S. Federal Way, Boise, Idaho 83716 -9632 (Address of principal executive offices) (Zip Code) Registrant ’s telephone number, including area code (208) 368 -4000 Securities registered pursuant to Section 12(b) of the Act: Title of each class Name of each exchange on which registered Common Stock, par value $.10 per share NASDAQ Global Select Market Securities registered pursuant to Section 12(g) of the Act: None (Title of Class) Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. -
Printmgr File
August 31, 2020 Dear Fellow Shareholder: You are cordially invited to attend the 2020 Annual General Meeting of Shareholders of Seagate Technology plc, which will be held at 5:00 p.m. Irish Standard Time on Thursday, October 22, 2020, at 10 Earlsfort Terrace, Dublin 2, D02 T380, Ireland. Due to public health concerns and continuing uncertainty in connection with COVID-19, this year we also are offering you the opportunity to virtually join the Annual General Meeting via live webcast over the Internet at 5:00 p.m. Irish Standard Time (12:00 p.m. Eastern Daylight Time). You may virtually join the Annual General Meeting and submit your questions during the meeting by visiting www.virtualshareholdermeeting.com/STX2020. In accordance with Irish law, we are required to have a principal meeting place, which is a physical location, where shareholders may attend the Annual General Meeting in person and vote. However, in light of public health concerns and travel recommendations and restrictions, we strongly advise shareholders not to attend in person at the principal meeting place, and ask that shareholders join the Annual General Meeting virtually instead. Shareholders joining virtually will not be able to vote at the meeting. Your vote is important. We encourage shareholders to cast their votes in advance of the Annual General Meeting, whether they plan to attend in person or join virtually. We continue to monitor COVID-19 developments and other circumstances. Should we determine that alternate Annual General Meeting arrangements may be advisable or required, such as changing the date, time or location of the Annual General Meeting, we will announce our decision by press release, post additional information at investors.seagate.com, and make a public filing with the U.S. -
OV48B PB V1.3
OV48B 48-megapixel product brief OmniVision's First 48 Megapixel, 0.8 µm Image Sensor lead free available in a lead-free OmniVision's OV48B is its first 48 megapixel (MP) image This sensor also features both DPHY and CPHY MIPI package sensor with the industry's smallest die size, featuring a interfaces, which enables fast frame rates using fewer pins. 0.801 µm pixel size to enable high resolution smartphone The OV48B includes 2x2 microlens phase detection cameras with a 1/2" optical format. Built on OmniVision's autofocus (ML-PDAF) to boost accuracy, especially in low PureCel®Plus stacked die technology, this sensor provides light. leading edge still image capture and video performance for both mainstream and high end smartphones. Additionally, it Output formats include: offers a wide range of features such as digital crop zoom • 48MP at 15 frames per second (fps) with remosaic and a CPHY interface, making it a versatile sensor for all • 12MP with 4-cell binning at 30 fps types of rear facing cameras in multi-camera • 4K2K video at 60 fps configurations, including main, wide angle and telephoto. • 1080p video at 240 fps • 720p video at 480 fps The OV48B integrates an on-chip 4-cell color filter array and hardware re-mosaic, which provides high quality, 48MP Find out more at www.ovt.com. Bayer output in real time. In low light conditions, this sensor can use near-pixel binning to output a 12MP image with four times the sensitivity. The OV48B can consistently capture the best quality images and videos without motion blur, as well as enabling digital crop zoom with 12MP resolution and fast mode switch. -
Case 2:19-Cv-10439-DPH-DRG ECF No. 25 Filed 04/29/19 Pageid.595 Page 1 of 59
Case 2:19-cv-10439-DPH-DRG ECF No. 25 filed 04/29/19 PageID.595 Page 1 of 59 UNITED STATES DISTRICT COURT EASTERN DISTRICT OF MICHIGAN NORTH PLATE SEMICONDUCTOR, Case No. 2:19-cv-10439-DPH-DRG LLC, Plaintiff, Judge: Hon. Denise Page Hood v. Magistrate Judge: OMNIVISION TECHNOLOGIES Hon. David R. Grand INC., TEXAS INSTRUMENTS INCORPORATED, SMART EYE INTERNATIONAL INC., SMK ELECTRONICS CORPORATION, U.S.A. Defendants. JURY TRIAL DEMANDED AMENDED COMPLAINT FOR PATENT INFRINGEMENT Plaintiff North Plate Semiconductor, LLC (“NPS” or Plaintiff”) hereby asserts a claim for patent infringement against Defendants OmniVision Technologies, Inc. (“OmniVision”), Texas Instruments Incorporated (“Texas Instruments”), Smart Eye International Inc. (“Smart Eye”), SMK Electronics Corporation, U.S.A. (“SMK”)(collectively referred to as “Defendants”), and in support thereof allege as follows: NATURE OF CASE 1. This is an action for patent infringement arising under the patent laws of the United States, 35 U.S.C. §1 et seq., specifically including 35 U.S.C. §271. Case 2:19-cv-10439-DPH-DRG ECF No. 25 filed 04/29/19 PageID.596 Page 2 of 59 2. As set forth below, Plaintiff holds the rights in U.S. Patent Nos. 6,211,509 (“the ‘509 patent”); 6,150,676 (“the ‘676 patent); 6,521,926 (“the ‘926 patent”); 7,928,483 (“the ‘483 patent”); 8,854,521 (“the ‘521 patent”); RE46123 (“the ‘123 patent”); 8,178,913 (“the ‘913 patent”) (cumulatively “Patents-in-Suit”). The United States patent laws grant the holder of a patent the right to exclude infringers from making, using, selling or importing the invention claimed in a patent, to recover damages for the infringer’s violations of these rights, and to recover treble damages where the infringer willfully infringed the patent. -
Omnivision Expands Native 1080P High Definition Camerachip™ Line-Up with 1/6-Inch Ov2722
OMNIVISION EXPANDS NATIVE 1080P HIGH DEFINITION CAMERACHIP™ LINE-UP WITH 1/6-INCH OV2722 OMNIBSI+™ PIXEL ENABLES HIGH-PERFORMANCE HD VIDEO SOLUTION FOR SMARTPHONE, TABLET, NOTEBOOK AND ULTRABOOK APPLICATIONS SANTA CLARA, Calif., — May 29, 2012 — OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today introduced the OV2722, the Company’s second-generation native 1080p high-definition (HD) CMOS image sensor, designed specifically for ultra-portable applications where high performance and low profile are critical. Using OmniVision’s new OmniBSI+ pixel architecture, the OV2722 delivers improved sensitivity and image quality with a module height of less than 3 mm, making it an ideal choice for the burgeoning smartphone, tablet and Ultrabook™ markets. “We believe that current market trends are quickly moving beyond 720p, and we are seeing strong demand for premium quality 1080p HD video sensors that can meet the criteria and specifications of online video sharing platforms such as Skype™, and unified communications platforms such as Microsoft® Lync®,” said Nick Nam, director of product marketing at OmniVision. “In addition, many high-end cameras are required to have extremely small form factors so that they can fit inside next- generation smartphones, tablets, notebooks and Ultrabooks. The OV2722 is specifically crafted to meet these stringent performance requirements and design specifications, making it the ideal choice for these high-end devices.” The OV2722 is a 1/6-inch native 1080p HD CMOS image sensor, offering full field of view video with optimized image quality, sensitivity, color reproduction and clarity without scaling or cropping. Built on the new 1.4-micron OmniBSI+ pixel, the OV2722 offers significant performance improvements over the first generation, OmniBSI™-based OV2720, including a 60 percent increase in full-well capacity, a 10 percent increase in quantum efficiency and a 10 percent improvement in low-light performance. -
Anti-Slavery Performance in 2016 | First Edition
Corporate Compliance with the California Transparency in Supply Chains Act: 1 Anti-Slavery Performance in 2016 Copyright © Development International 2017 When citing this publication please use the following information: Authors: Chris N. Bayer and Jesse H. Hudson Title: Corporate Compliance with the California Transparency in Supply Chains Act: Anti-Slavery Performance in 2016 Version: First Edition Date published: March 7, 2017 The views expressed in this report are solely those of the authors. Furthermore, the information contained in this document should not be construed as legal advice. In case of questions please contact: Chris N. Bayer, PhD at <[email protected]>. Funded by: iPoint-systems gmbh www.ipoint-systems.com Corporate Compliance with the California Transparency in Supply Chains Act: 2 Anti-Slavery Performance in 2016 Foreword “With every dollar that we spend, we vote for the world we want.” – Diane Osgood, Economist and expert on social impact economics As UN Goodwill Ambassador against trafficking and slavery in 2005, my first trip was to visit Lake Volta in Ghana – the second largest man-made lake in the world. When children’s dead bodies began washing up on the lake’s shores, locals raised alarm and took action. I met with them, and with children who’d been bought, sold, beaten, famished, raped, abused and forced to dive in fear of their lives, to catch fish larger than their arm-span, and disentangle nets caught on the branches of trees that no one bothered to clear from the lake. And as I walked away, I uneasily asked if the fish was ever sold in Europe. -
2017 International Image Sensor Workshop
2017 INTERNATIONAL IMAGE SENSOR WORKSHOP Grand Prince Hotel Hiroshima May 30th - June 2nd, 2017 Hiroshima, Japan PROGRAM Tuesday, May 30th 2017 08:00-08:30 Registration Welcome 08:30-08:45 Opening Session 01 Stacked Image Sensors Session chair: Yusuke Oike (Sony) Dun-Nien Yaung (TSMC) 08:45-09:00 An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor R1 Y. Kagawa 1 , N. Fujii 2 , K. Aoyagi 2 , Y. Kobayashi 1 , S. Nishi 1 , N. Todaka 1 , S. Takeshita 1 , J. Taura 1 , H. Takahashi 2 , Y. Nishimura 2 , K. Tatani 2 , M. Kawamura 1 , H. Nakayama 1 , T. Nagano 2 , K. Ohno 2 , H. Iwamoto 2 , S. Kadomura 1 , T. Hirayama 2 . 1 Sony Semiconductor Manufacturing, Japan; 2 Sony Semiconductor Solutions, Japan 09:00-09:15 A 3D Stacked Programmable Image Processing Engine in a 40nm Logic Process with a Detector Array in a 45nm CMOS Image Sensor Technologies R2 Biay ‐ Cheng Hseih 1 , Keith Honea 1 , Sami Khawam 1 , Sergio Goma 1 , RJ Lin 2 , Chin ‐ Hao Chang 2 , Charles Liu 2 , Shang ‐ Fu Yeh 2 , Hong ‐ Yi Tu 2 , Kuo ‐ Yu Chou 2 , Calvin Chao 2 . 1 Qualcomm Technologies Inc., USA; 2 TSMC, Taiwan, ROC 09:15-09:30 1.0um Pixel Improvements with Hybrid Bond Stacking Technology R3 V.C. Venezia, C. Shih, W.Z. Yang, Y. Zang, Z. Lin, Lindsay Grant, and Howard Rhodes. Omnivision Technologies, USA 09:30-09:45 Development of Vertical Thin Poly-Si Channel Structured TG for 3D CIS Pixel Applications R4 Young-Jun Kwon 1 , Sung-Kun Park 1 , Sung-Wook Cho 1 , Kyoung-In Lee 1 , Sung-Man Kim 1 , Chris Hong 1 , In-Wook Cho 1 , Jae-Hyun Park 2 , and Kyung-Dong Yoo 2 .