Thin Film Metallization and Protective Top-Coat Development
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Formation of Highly Electrically Conductive Surface-Silvered Polyimide Films Under Exceptionally Mild Conditions
W&M ScholarWorks Undergraduate Honors Theses Theses, Dissertations, & Master Projects 5-2010 Formation of Highly Electrically Conductive Surface-Silvered Polyimide Films Under Exceptionally Mild Conditions Tyler Stukenbroeker College of William and Mary Follow this and additional works at: https://scholarworks.wm.edu/honorstheses Part of the Chemistry Commons Recommended Citation Stukenbroeker, Tyler, "Formation of Highly Electrically Conductive Surface-Silvered Polyimide Films Under Exceptionally Mild Conditions" (2010). Undergraduate Honors Theses. Paper 666. https://scholarworks.wm.edu/honorstheses/666 This Honors Thesis is brought to you for free and open access by the Theses, Dissertations, & Master Projects at W&M ScholarWorks. It has been accepted for inclusion in Undergraduate Honors Theses by an authorized administrator of W&M ScholarWorks. For more information, please contact [email protected]. Formation of Highly Electrically Conductive Surface-Silvered Polyimide Films Under Exceptionally Mild Conditions A thesis submitted in partial fulfillment of the requirement for the degree of Bachelors of Science in Chemistry from The College of William and Mary by Tyler Stukenbroeker Accepted for (Honors, High Honors, Highest Honors) David Thompson, Director Christopher Abelt Gary Rice Clay Clemens Williamsburg, VA May 5, 2010 Table of Contents INTRODUCTION Background of Polyimide Synthesis and Characterization 4 EXPERIMENTAL SECTION Experimental Materials 11 Characterization Techniques and Procedure 15 Room Temperature Metallization -
Silver and Gold Coating
Copyright © Tarek Kakhia. All rights reserved. http://tarek.kakhia.org Gold & Silver Coatings By A . T . Kakhia 1 Copyright © Tarek Kakhia. All rights reserved. http://tarek.kakhia.org 2 Copyright © Tarek Kakhia. All rights reserved. http://tarek.kakhia.org Part One General Knowledge 3 Copyright © Tarek Kakhia. All rights reserved. http://tarek.kakhia.org 4 Copyright © Tarek Kakhia. All rights reserved. http://tarek.kakhia.org Aqua Regia ( Royal Acid ) Freshly prepared aqua regia is colorless, Freshly prepared aqua but it turns orange within seconds. Here, regia to remove metal fresh aqua regia has been added to these salt deposits. NMR tubes to remove all traces of organic material. Contents 1 Introduction 2 Applications 3 Chemistry 3.1 Dissolving gold 3.2 Dissolving platinum 3.3 Reaction with tin 3.4 Decomposition of aqua regia 4 History 1 - Introduction Aqua regia ( Latin and Ancient Italian , lit. "royal water"), aqua regis ( Latin, lit. "king's water") , or nitro – hydro chloric acid is a highly corrosive mixture of acids, a fuming yellow or red solution. The mixture is formed by freshly mixing concentrated nitric acid and hydro chloric acid , optimally in a volume ratio of 1:3. It was named 5 Copyright © Tarek Kakhia. All rights reserved. http://tarek.kakhia.org so because it can dissolve the so - called royal or noble metals, gold and platinum. However, titanium, iridium, ruthenium, tantalum, osmium, rhodium and a few other metals are capable of with standing its corrosive properties. IUPAC name Nitric acid hydro chloride Other names aqua regia , Nitro hydrochloric acid Molecular formula HNO3 + 3 H Cl Red , yellow or gold Appearance fuming liquid 3 Density 1.01–1.21 g / cm Melting point − 42 °C Boiling point 108 °C Solubility in water miscible in water Vapor pressure 21 mbar 2 – Applications Aqua regia is primarily used to produce chloro auric acid, the electrolyte in the Wohl will process. -
The Foundations of Vacuum Coating Technology
The Foundations of Vacuum Coating Technology The Foundations of Vacuum Coating Technology Donald M. Mattox Management Plus, Inc. Albuquerque, New Mexico NOYES PUBLICATIONS WILLIAM ANDREW PUBLISHING Norwich, New York, U.S.A. i Copyright © 2003, Noyes Publications / William Andrew Publishing. All rights reserved. No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording, or by any information storage and retrieval system, without permission in writing from the Publisher. Cover Art © 2003 by Brent Beckley / William Andrew Publishing Library of Congress Catalog Card Number: 2003004260 ISBN: 0-8155-1495-6 Published in the United States of America by Noyes / William Andrew Publishing 13 Eaton Avenue Norwich, NY 13815 1-800-932-7045 www.williamandrew.com www.knovel.com 10 9 8 7 6 5 4 3 2 1 This book may be purchased in quantity at discounts for education, business, or sales promotional use by contacting the Publisher. Plastics Design Library and its logo are trademarks of William Andrew Inc. Notice: To the best of our knowledge the information in this publication is accurate; however the Publisher does not assume any responsibility or liability for the accuracy or completeness of, or consequences arising from, such information. This book is intended for informational purposes only. Mention of trade names or commercial products does not constitute endorsement or recommendation for use by the Publisher. Final determination of the suitability of any information or product for any use, and the manner of that use, is the sole responsibility of the user. -
Vacuum Metallizing-Quality and Productivity Enhancements Through In-Line Technology by John H
Vacuum Metallizing-Quality and Productivity Enhancements Through In-Line Technology by John H. Durant, Durant, I.H. 1995. Yonrum Uelallizing: Quliry and Pmducfiviv Mill Lane Engineering Co. Inc., Lowell, Mass. Enhoncemnfs ntrough In-Line techno log^ Metal Finishing 9313). 27- 29. Reprinted with permission f”Elsevier Science Inc. .- acuum mating. frequently des- ically. The basecoating of lacquer fills together with virtually total exclusion ignated physical vapor deposi- in minor imperfections, which would of dust and other contaminants-for Vtion or PVD. offers an intriguing otherwise require buffing and polishing. example, for semiconductor wafer variety of solutions to application prob- The vacuum-deposited film of alumi- processing-in quantities that in- lems as well as relief from the increas- num (aluminized) may receive a trans- creased to undreamed-of levels. ingly astly business of handling, trans- parent topcoating for additional protec- Although the two applications cited porting. and disposing of the toxic and tion or perhaps color tinting. if requircd. are as diverse as one could select, they hszprdour wastes associated with vari- The use of an organic basecoat on a share in-line technology. As part sizes ws chemical plating processes. metal part, in effect, presents a surface increase or as requirements for ex- Production vacuum evaporation was that is quite similar to that of a molded tremely close process control and for a first employed by the optical industry or extruded plastic part. Thus, a mer- clean. uniform process environment in the 1930s for depositing thin magne- chant metallizer has the opportunity to tighten, the technical limitations of sium fluoride glare-resistant films on serve a wider market than would be batch systems become apparent. -
Handbook of Chemical Vapor Deposition (Cvd)
HANDBOOK OF CHEMICAL VAPOR DEPOSITION (CVD) Principles, Technology, and Applications Second Edition by Hugh O. Pierson Consultant and Sandia National Laboratories (retired) Albuquerque, New Mexico NOYES PUBLICATIONS Park Ridge, New Jersey, U.S.A. WILLIAM ANDREW PUBLISHING, LLC Norwich, New York, U.S.A. Copyright © 1999 by Noyes Publications No part of this book may be reproduced or utilized in any form or by any means, elec- tronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without permission in writing from the Publisher. Library of Congress Catalog Card Number: 99-26065 ISBN: 0-8155-1432-8 Printed in the United States Published in the United States of America by Noyes Publications / William Andrew Publishing, LLC Norwich, New York, U.S.A. 10 9 8 7 6 5 4 3 2 1 Library of Congress Cataloging-in-Publication Data Pierson, Hugh O. Handbook of chemical vapor deposition / by Hugh O. Pierson. -- 2nd ed. p. cm. Rev. ed. of: Handbook of chemical vapor deposition (CVD), c1992 Includes bibliographical references. ISBN 0-8155-1432-8 1. Chemical vapor depostion Handbooks, manuals, etc. 2. Vapor -plating Handbook, manuals, etc. I. Pierson, Hugh O. Handbook of chemical vapor deposition (CVD) II. Title. TS695.P52 1999 671.7'35--dc21 99-26065 CIP About the Author Hugh Pierson is presently a private consultant in Chemical Vapor Deposition. He was formerly the head of the Deposition Laboratory at the Sandia National Laboratories and is now retired. Since then, he has been a consultant to the U.S. State Department in South America; Ultramet in Pacoima, California; LOF in Toledo, Ohio; the Gorham Institute in Maine; REI in Whittier, California; TH Goldschmidt AG in Germany; and to many other companies. -
CVD) Developed During My Graduate Study with Professor Gordon at Harvard University
Chemical Vapor Deposition of Thin Film Materials for Copper Interconnects in Microelectronics A dissertation presented by Yeung Au to The Department of Chemistry and Chemical Biology in partial fulfillment of the requirements for the degree of Doctor of Philosophy in the subject of Chemistry Harvard University Cambridge, Massachusetts May, 2012 © 2012 – Yeung Au All rights reserved. Dissertation Advisor Author Professor Roy G. Gordon Yeung Au Chemical Vapor Deposition of Thin Film Materials for Copper Interconnects in Microelectronics Abstract The packing density of microelectronic devices has increased exponentially over the past four decades. Continuous enhancements in device performance and functionality have been achieved by the introduction of new materials and fabrication techniques. This thesis summarizes the thin film materials and metallization processes by chemical vapor deposition (CVD) developed during my graduate study with Professor Gordon at Harvard University. These materials and processes have the potential to build future generations of microelectronic devices with higher speeds and longer lifetimes. Manganese Silicate Diffusion Barrier: Highly conformal, amorphous and insulating manganese silicate (MnSixOy) layers are formed along the walls of trenches in interconnects by CVD using a manganese amidinate precursor vapor that reacts with the surfaces of the insulators. These MnSixOy layers are excellent barriers to diffusion of copper, oxygen and water. Manganese Capping Layer: A selective CVD manganese capping process strengthens the interface between copper and dielectric insulators to improve the electromigration reliability of the interconnects. High selectivity is achieved by deactivating the insulator surfaces using vapors iii containing reactive methylsilyl groups. Manganese at the Cu/insulator interface greatly increases the strength of adhesion between the copper and the insulator. -
Vacuum Deposition Onto Webs, Films, and Foils This Page Intentionally Left Blank Vacuum Deposition Onto Webs, Films, and Foils
Vacuum Deposition onto Webs, Films, and Foils This page intentionally left blank Vacuum Deposition onto Webs, Films, and Foils Second Edition Charles A. Bishop AMSTERDAM G BOSTON G HEIDELBERG G LONDON NEW YORK G OXFORD G PARIS G SAN DIEGO SAN FRANCISCO G SINGAPORE G SYDNEY G TOKYO William Andrew is an imprint of Elsevier William Andrew is an imprint of Elsevier 225 Wyman street, Waltham, MA 02451, USA The Boulevard, Langford Lane, Oxford OX5 1GB, UK First edition 2007 Second edition 2011 r 2011 Elsevier Inc. All rights reserved No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, recording, or any information storage and retrieval system, without permission in writing from the Publisher. Details on how to seek permission, further information about the Publisher’s permissions policies and our arrangements with organizations such as the Copyright Clearance Center and the Copyright Licensing Agency, can be found at our website: www.elsevier.com/permissions. This book and the individual contributions contained in it are protected under copyright by the Publisher (other than as may be noted herein). Notices Knowledge and best practice in this field are constantly changing. As new research and experience broaden our understanding, changes in research methods, professional practices, or medical treatment may become necessary. Practitioners and researchers must always rely on their own experience and knowledge in evaluating and using any information, methods, compounds, or experiments described herein. In using such information or methods they should be mindful of their own safety and the safety of others, including parties for whom they have a professional responsibility. -
ANNUAL REPORT 2013 COVER Plasma Discharge in Synthetic Air
FRAUNHOFER INSTITUTE FOR SURFACE ENGINEERING AND THIN FILMS IST ANNUAL REPORT 2013 COVER Plasma discharge in synthetic air. FRAUNHOFER IST 1 FOREWORD FOREWORD Ladies and gentlemen, 1 On the left: deputy director Prof. Wolfgang Diehl. On the right: the year 2013 was a very successful year for the Fraunhofer Institute for Surface Engineering director Prof. Dr. Günter Bräuer. and Thin Films IST in many ways. We can look back on important awards and numerous new research results. We would like to take this opportunity to express our thanks to all people whose hard work and commitment made our success possible in the first place: above all the employees of the Fraunhofer IST, our partners from research and development, our customers from industry, our sponsors, colleagues and friends. Thank you for a trusting cooperation. We provide you with a selection of the most important developments of the Fraunhofer IST in the annual report at hand. We hope you enjoy the reading and are looking forward to your ideas for cooperation in future. Prof. Dr. Günter Bräuer Prof. Wolfgang Diehl 3 FRAUNHOFER IST CONTENT Foreword 3 Mechanical and automotive engineering 33 Optics and electronics 63 The Fraunhofer IST in Networks 101 Hard work for thin films 34 Uniform coatings on the EOSS® platform 64 The Fraunhofer-Gesellschaft at a glance 103 Highlights 2013 6 Carbon coatings for applications in fusion reactors 36 PECVD coatings for optical coating systems 66 Fraunhofer Group for Light & Surfaces 104 Thermoresistive thin-film sensor system Scratch-resistant -
Methods for Electroplating Metals on Nonconducting Materials
U. 3 » DEPARTMENT OF COMMERCE NATIONAL BUREAU OF STANDARDS WASHINGTON 25, D.C. Revised Letter November Circular 1953 LC1013 METHODS FOR ELECTROPLATING METALS ON NONCONDUCTING MATERIALS The following information is based principally on pub- lished papers and not on any extensive experience by this Bureau. The details of the various methods may require modification for specific products. Some knowledge of and experience in electroplating are desirable before attempting to conduct these operations on even a small commercial scale. GENERAL PRINCIPLES It is necessary to render the surface impervious and conducting before electroplating is applied. It is customary to first electrodeposit copper, upon which other metals may then be plated. A coating of clear lacquer is usually applied to the final surface to resist tarnish. RENDERING THE SURFACE IMPERVIOUS Glass and plastics are practically impervious to water. Wood may be rendered impervious by applying at least two coats of a good spar varnish. Plaster and leather articles such as baby shoes may be immersed in melted, paraffin or beeswax, heated to about 212 °F, until the bubbling caused by release of air or moisture nearly ceases. They are then re- moved and allowed to drain and to cool. RENDERING THE SURFACE CONDUCTING 1. Silvering. Glass and plastics are coated with silver by chemical reduction (similar to the silvering of glass mirrors). The solutions and methods are described in NBS Circular 3&9, a copy of which may be purchased for 10 cents (stamps not accepted) from the Superintendent of Documents, Government Printing Office, Washington 25, D. C. 2. Copper or silver powder. -
Improvements in Processing and Stretchability of Super Gas
IMPROVEMENTS IN PROCESSING AND STRETCHABILITY OF SUPER GAS BARRIER MULTILAYER THIN FILMS A Dissertation by FANGMING XIANG Submitted to the Office of Graduate and Professional Studies of Texas A&M University in partial fulfillment of the requirements for the degree of DOCTOR OF PHILOSOPHY Chair of Committee, Jaime C. Grunlan Committee Members, Hong Liang Jodie Lutkenhaus Xinghang Zhang Head of Department, Andreas A. Polycarpou May 2015 Major Subject: Mechanical Engineering Copyright 2015 Fangming Xiang ABSTRACT Polymeric materials with gas barrier equivalent to metalized plastics have become increasingly important for food packaging, electronic device encapsulation, and vacuum insulation. Early attempts to develop alternative gas barrier materials have focused on thick (>10 μm) polymer/clay composites produced using physical mixing, but only limited improvement was achieved due to aggregation and random orientation of clay platelets. Layer-by-layer (LbL) assembly is a simple yet powerful bottom-up fabrication technique, which allows assembly of thin films with designed microstructure under ambient conditions. These multilayer thin films have many desirable properties: mechanical flexibility, transparency, and impermeability. This dissertation sought to further improve the processing and properties of high gas barrier thin films produced using LbL assembly. The influence of deposition time on gas barrier of polymer/clay multilayer thin films composed of polyethylenimine (PEI), poly(acrylic acid) (PAA), and clay was investigated. Multilple PEI/PAA bilayers (BL) were deposited between clay layers to construct multilayer assemblies with quadlayer (QL), hexalayer (HL), and octalayer (OL) sequences. Regardless of film structure, polymer/clay multilayer thin films prepared using shorter dipping time were thicker and exhibited better gas barrier than samples prepared using longer dipping time in the first few layers.