Ferroelectric, Pyroelectric and Piezoelectric Effects of Hafnia and Zirconia Based Thin Films
Von der Fakultät für Elektrotechnik und Informationstechnik der Rheinisch-Westfälischen Technischen Hochschule Aachen zur Erlangung des akademischen Grades eines Doktors der Ingenieurwissenschaften, genehmigte Dissertation
vorgelegt von
Master of Science Physik Master of Science Elektrotechnik
Sergej Starschich
aus Duschanbe (Tadschikistan)
Berichter: Univ.-Prof. Dr.-Ing R. Waser Apl.-Prof. Dr.-Ing M. Heuken
Tag der mündlichen Prüfung: 22.11.2017
Diese Dissertation ist auf den Internetseiten der Hochschulbibliothek online verfügbar.
Abstract
Ferroelectric materials are of great interest for several applications. On the one hand, the ferroelectric field effect transistor (FeFET) is a promising candidate for future high density, nonvolatile memory devices. On the other hand, in the recent years the energy related applications such as pyroelectric and piezoelectric energy harvesting as well as electrocaloric cooling and electrostatic energy storage attracted wide interest. The conventional ferroelectric materials such as lead zirconatetitanate (PZT) are not completely CMOS compatible and therefore a high-density integration for memory application could not be realized up to date. Furthermore, PZT has environmental issues due to the contained lead. Ferroelectric hafnium oxide, which was first reported in 2011, can overcome the mentioned drawbacks of the conventional ferroelectrics, since it is fully CMOS compatible. The ferroelectric phase is stabilized by doping with various dopants. Furthermore, a mixture of hafnium and zirconium oxide (Hf1-xZrxO2) does also stabilize the ferroelectric phase. In this thesis, hafnia and zirconia based ferroelectrics are deposited by a novel CSD (chemicals solution deposition) process and are characterized in respect to their ferroelectric, piezoelectric and pyroelectric properties. The ferroelectric nature of hafnium oxide is shown for several dopants as well as for Hf1-xZrxO2 with different compositions and for pure ZrO2. Especially in the case of ZrO2 this is very surprising since ZrO2 was studied for many years and for several applications without revealing ferroelectric properties. In contrast to atomic layer deposition (ALD), which is most commonly used for the deposition of hafnia and zirconia based ferroelectric film, the CSD technique is appropriate for deposition of thicker films without a strong reduction of the ferroelectric response. This makes hafnia and zirconia based ferroelectrics suitable for applications, where larger film thicknesses are unavoidable such as piezoelectric and electrocaloric cooling devices.
Kurzfassung
Ferroelektrische Materialien sind für viele Anwendungsbereiche von großem Interesse. Zum einen ist der ferroelektrische Feldeffekttransistor (FeFET) ein aussichtsreicher Kandidat für zukünftige hochintegrierte nicht flüchtige Speicher. Zum anderen haben energiebezogene Anwendungen wie pyro- und piezoelektrisches Energy Harvesting, elektrokalorisches Kühlen und elektrostatische Energiespeicherung in den letzten Jahren an Bedeutung gewonnen. Die konventionellen Ferroelektrika, wie beispielsweise Blei-Zirkonat-Titanat (PZT), sind nicht CMOS-kompatibel, wodurch eine hohe Integrationsdichte für Speicheranwendungen bis heute nicht erreicht werden konnte. Des Weiteren verursacht PZT Umweltprobleme aufgrund seines Bleigehalts. Mithilfe von ferroelektrischem Hafniumoxid, von dem im Jahre 2011 erstmals berichtet wurde, können die genannten Probleme aufgrund der CMOS-Kompatibilität überwunden werden. Die ferroelektrische Phase kann sowohl durch Dotierung mit verschiedenen Elementen als auch durch eine Zusammensetzung von Hafniumoxid und Zirkoniumoxid (Hf1-xZrxO2) stabilisiert werden. Im Rahmen dieser Arbeit werden auf Hafnium- und Zirconiumoxid basierte Ferroelektrika mittels einer neu entwickelten Routine zur nasschemischen Abscheidung (CSD) hergestellt und hinsichtlich ihrer ferroelektrischen, piezoelektrischen und pyroelektrischen Eigenschaften untersucht. Dabei wird gezeigt, dass sowohl eine Vielzahl von unterschiedlichen Dotierstoffen, als auch für unterschiedliche Zusammensetzungen von Hf1-xZrxO2 sowie für reines ZrO2 die ferroelektrische Phase stabilisiert werden kann. Dies ist besonders überraschend im Fall von
ZrO2, welches über Jahre hinweg für unterschiedlichste Anwendungen hin untersucht wurde und dabei keine Anzeichen für Ferroelektrizität gefunden wurden. Im Gegensatz zur Atomlagenabscheidung (ALD), welche am häufigsten zur Deposition von Hafnium- und Zirkonoxid basierten Ferroelektrika genutzt wird, ist die Abscheidung mittels CSD zur Herstellung dicker Schichten geeignet. Dadurch eigenen sich auf Hafnium- und Zirkonoxid basierte Ferroelektrika für Anwendungen, bei denen größere Schichtdicken unumgänglich sind, wie beispielsweise bei piezoelektrischen Sensoren und Aktuatoren sowie beim elektrokalorischen Kühlen.
Acknowledgements
This thesis was written during my doctoral research at the Institut für Werkstoffe der Elektrotechnik II (IWE 2) at the RWTH Aachen University. First, I would like to thank Prof. Dr. Rainer Waser for the opportunity to work in his research group in the field of novel ferroelectrics. Furthermore, I would like to thank Prof. Dr. Michael Heuken for being the co-examiner of my thesis. I am deeply grateful to Dr. Ulrich Böttger for supervising my work and for countless advices and discussions. I would like to thank my external collaboration partners for the successful cooperation. I appreciated the joint work with the NaMLab group of Dr. Uwe Schröder and Dr. Tony Schenk and the group of Prof. Dr. Alfred Kersch, Robin Materlik and Christopher Künneth from the Munich University of Applied Sciences. I express my gratitude to Dr. Theodor Schneller, and David Griesche for their support especially in the field of solution and sample preparation by use of CSD. Furthermore, I would like to thank Dr. Stephan Menzel for his support as an expert in the field of resistive switching. A big thank you goes to Petra Grewe and Daliborka Erdoglija for spending so much time for the sample preparation and characterization. I would also like to thank Jochen Heiss, Hartmut Pütz and Gisela Wasse for the support in electronics and electron microscopy. For the help and support concerning the images, I am thankful to Thomas Pössinger and Dagmar Leisten. Additionally, I appreciate the administrative support of Martina Heins and Udo Evertz. I also wish to thank my office mates Andreas Burkert, Astrid Marchewka, Inka Nielen, Camilla La Torre, Andreas Kindsmüller and Petra Grewe and all co-workers at the IWE 2 for providing a great working atmosphere. Special thanks go to Sebastian Schmelzer for supervising my Bachelor and Master thesis and for the support during the first month of my thesis. I furthermore acknowledge the helpful support of my student research assistants Bingjie Chen, Jan Lübben, Lucia Lauxmann, Maximilian Geppert, Maximilian Kühn, Nan Zhang, Parisa Jaberi, You-Ron Lin and Charlotte Böttger.
Contents
1 Introduction 1
2 Fundamentals 3
2.1 Crystal Structure ...... 3 2.2 Ferroelectricity ...... 4 2.3 Pyroelectricity ...... 6 2.4 Piezoelectricity ...... 7 2.5 Resistive Switching ...... 8 2.6 Ferroelectric Field Effect Transistor ...... 9 2.7 Physical Basics of Sputtering ...... 11 2.8 Experimental Methods ...... 12
3 Sample Preparation 23
3.1 Electrodes and Oxide Sputtering ...... 23 3.2 Chemical Solution Deposition ...... 25
4 Ferroelectric and Piezoelectric Properties of HZO and ZrO₂ 39
4.1 Composition dependence ...... 41
4.2 Ferroelectric ZrO₂ ...... 46 4.3 Doped ZrO2 ...... 51
5 Ferroelectric Properties of Doped HfO₂ 59
5.1 Sputtered yttrium doped HfO₂ ...... 60 5.2 CSD prepared yttrium doped HfO2 ...... 64 5.3 Further Dopants ...... 68
6 Wake-up and Degradation 81
6.1 Wake-up ...... 81 6.2 Degradation and fatigue ...... 96
7 Pyroelectric Properties 101
7.1 Yttrium Doped Hafnium Oxide ...... 102 7.2 Pure Zirconium Oxide ...... 104 7.3 Figures of merit ...... 107
8 Conclusions 109
8.1 Summary ...... 109 8.2 Outlook ...... 111
Bibliography 113
1 Introduction
The first ferroelectric hysteresis was measured in 1920 by Valasek in Rochelle salt
(C4H4KNaO6) [1]. After the first evidence of ferroelectricity, further ferroelectric materials were discovered such as KH2PO4 in 1935 [2] and the first oxide based ferroelectric BaTiO3 in 1946 [3]. Ferroelectric properties have been intensively studied over the years for various applications such as microwave tunable applications [4], ferroelectric memories [5], electrocaloric coolers and several further applications [6]. Ferroelectric materials also exhibit pyroelectric and piezoelectric properties and are therefore suitable for microelectromechanical systems (MEMS) [7-9] as well as for pyroelectric sensors [10]. In recent years, ferroelectric materials became attractive for energy related applications such as electrocaloric cooling [11, 12] and also piezoelectric and pyroelectric energy harvesting [13-15]. Up to now, lead zirconate titanate (PZT) is widely used due to its outstanding ferroelectric and piezoelectric properties [16]. Nevertheless, PZT has some serious drawbacks like the containing of lead, which is prohibited in several countries because of environmental issues. Furthermore, PZT as well as other conventional ferroelectrics is not fully compatibly to CMOS technology [17]. In addition, the scaling node of 130 nm for integrated FeRAM is significantly larger compared to e.g. flash memory [18].
Ferroelectric silicon doped HfO2, which was discovered in 2007 and first reported by Boescke et al. in 2011, can overcome the mentioned drawbacks of the conventional ferroelectrics [19, 20]. The ferroelectricity is attributed to the non-centrosymmetric orthorhombic phase with a
Pca21 space group, which typically coexists with the monoclinic and the higher symmetrical tetragonal/cubic phase [19, 21-23]. It was shown, that ferroelectricity in hafnium oxide can be induced by several different dopants such as Y, Gd and Al [24-26]. Furthermore, a mixture of 2 1 Introduction
hafnium and zirconium oxide (Hf1-xZrxO2) does also stabilize the ferroelectric phase [27]. Hafnium and zirconium oxide are completely compatible with known semiconductor fabrication processes and therefore are promising candidates for future high density, nonvolatile memory devices [28-30]. Apart from the memory application, also energy related topics such as electrocaloric cooling, electrostatic energy storage and pyroelectric energy harvesting have been discussed for hafnia and zirconia based ferroelectrics [31-34]. The objective of the present work is to get a better understanding of the origin of the ferroelectric properties in hafnia and zirconia based materials. This includes the influence of different dopants on the stabilization of the ferroelectric phase as well as to understand the wake-up effect, which means the increase of the remanent polarization during initial cycling that is observed in all HfO2 and ZrO2 based ferroelectrics. The most common deposition technique for this new class of ferroelectric materials is atomic layer deposition (ALD). A drawback of ALD is the strong limitation for deposition of thicker films. This work focuses on the deposition by chemical solution deposition (CSD), which offers the possibility of depositing thicker films, which are suitable for energy related applications and MEMS. Therefore, a novel CSD process for hafnia and zirconia based ferroelectrics is developed for the first time within the scope of this work. A dopant screening is performed to investigate the influence of the dopant size and valance state on the ferroelectric properties of HfO2. Besides doped HfO2, also the Hf1-xZrxO2 system is investigated for different compositions and thicknesses, whereas a surface energy model is used to understand the origin of the stabilization of the ferroelectric phase. In addition to the ferroelectric properties, also the piezoelectric and pyroelectric properties are evaluated for the doped HfO2 as well as for the Hf1-xZrxO2 system.
The wake-up effect is exemplarily investigated for yttrium doped HfO2. Thereby, a strong correlation to resistive VCM (valence change mechanism) switching is pointed out for the first time, which is a significant step to understand the origin of the wake-up effect.
2 Fundamentals
2.1 Crystal Structure
All crystallized material can be classified into 32 crystal classes. These crystal classes can be subdivided in groups according to their electrostrictive, piezoelectric, pyroelectric and ferroelectric properties as shown in Figure 2.1.
Figure 2.1: Subdividing of the 32 crystal classes according to their piezoelectric, pyroelectric and ferroelectric properties. 4 2 Fundamentals
All pyroelectric materials exhibit piezoelectric properties and all ferroelectric systems show pyroelectric and piezoelectric behavior, but not vice versa. In the following subchapter, the properties of ferroelectric, pyroelectric and piezoelectric materials are described.
2.2 Ferroelectricity
Ferroelectric materials exhibit a spontaneous polarization in a non-centrosymmetric crystal structure with a polar axis. The direction of the polarization can be switched by applying an external electrical field. A model system for ferroelectricity is lead zirconate titanate (PZT) with a perovskite structure as shown in Figure 2.2.
Figure 2.2: Perovskite structure of PZT for temperatures below and above the phase
transition temperature TC.
Above the phase transition temperature TC a cubic structure is exhibited with the Ti/Zr atom in the center, resulting in a paraelectric phase. Below TC a tetragonal distortion occurs and as a consequence no stable state is maintained in the center of the cell. The center atom has thus two stable states, which is oriented along the polar axis. By switching the central atom, the polarization switches likewise. 2.2 Ferroelectricity 5
The orthorhombic crystal structure of the ferroelectric hafnium/zirconium oxide is shown in Figure 2.3. In contrast to PZT, in the orthorhombic crystal of hafnium/zirconium oxide not only one ion changes its position during polarization switching but four oxygen ions.
Hafnium/Zirconium Oxygen
P P
Figure 2.3: Orthorhombic crystal structure of ferroelectric hafnium/zirconium oxide with the two possible polarization states.
Figure 2.4: shows an idealized (black) and an exemplary (red) ferroelectric hysteresis curve with its characteristic values. The coercitive voltages VC+ and VC- are characterized by the polarity change of the polarization. For the idealized curve, the polarization completely switches at the coercitive voltages. For the exemplary curve the polarization switching is widened because of the different grains within the film, whereby every grain shows a slightly different coercitive voltage. The further increase of the polarization at higher voltages is caused by the inherent dielectric polarization that every material exhibits. From the slope of the linear part of the hysteresis the relative permittivity of the material can be extracted. The remanent polarizations Pr- and Pr-, indicate the remaining polarization if a zero electrical field is applied. 6 2 Fundamentals
Figure 2.4: A ferroelectric hysteresis curve with its characteristic values for an idealized (black) and exemplary (red) curve.
2.3 Pyroelectricity
As well as ferroelectric materials, also pyroelectric materials exhibit a spontaneous polarization in a non-centrosymmetric crystal structure with a polar axis. The difference is that the polarization cannot be switched by applying an electrical field. The pyroelectric effect is described by the change of the spontaneous polarization during a change of the temperature. A characteristic dependence of the spontaneous polarization on the temperature is illustrated in Figure 2.5. This change of the polarization with changing temperature is found for all ferroelectric materials.
Figure 2.5: A schematic first order transition of a pyroelectric material. At the temperature
TC the polarization vanishes due to a phase transition into a paraelectric phase. 2.4 Piezoelectricity 7
The polarization is reduced with rising temperature till the polarization vanishes completely by reaching the phase transition temperature TC. A change in polarization always correlates with a generation of electrical charge. Therefore, during a temperature change ΔT a charge ΔQ is generated as
∆Q =p ⋅ A ⋅∆ T , where A is the area of the device and p is the pyroelectric coefficient dP p = dT . The voltage change across a pyroelectric capacitor device is given by: d ∆V = p ⋅ ∆ T ε ε 0 r , with the thickness d, the vacuum permittivity ε0 and the relative permittivity εr.
2.4 Piezoelectricity
Piezoelectricity is present in materials that have a non-centrosymmetric crystal structure. By applying mechanical stress, the ions within the crystal are shifted against each other leading to a generation of electrical charges and therefore to a generation of an electrical field. This is called the direct piezoelectric effect. For the reverse piezoelectric effect, an electrical field is applied to the material, which leads to a mechanical deformation. As mentioned before, all ferroelectric materials also exhibit piezoelectric properties. Figure 2.6 shows an exemplarily measured (red) and an idealized (black) displacement curve. Further information about piezoelectric characteristics can be found in [35]. 8 2 Fundamentals
Figure 2.6: Exemplarily measured (red) and idealized (black) displacement curve. The red curve is measured with a double beam laser interferometer.
2.5 Resistive Switching
Resistive Random Access Memories (ReRAM) are a promising candidate for future low power, high density and cost efficient memories [36]. The information is stored in the resistance, which can be changed by applying a positive and a negative voltage, respectively. The hafnium- and zirconium oxide based systems used in this work are well known for resistive VCM (valence change mechanism) switching [37-46]. An exemplary switching curve and the corresponding model are shown in Figure 2.7. In general, an electroforming step is required, before stable resistive switching can be realized. During the electroforming step, oxygen is extracted via one of the electrodes and an oxygen deficient filament is formed [47-49]. This is realized by applying a sufficiently high voltage leading to the formation of a plug, which is shown in Figure 2.7(A). This plug mainly consists of oxygen vacancies leading to a valence change of the hafnium cations and an enhancement in the local conductivity [50-52]. Therefore, this type of resistive switching is called valence change mechanisms (VCM) [49]. In the OFF state (A) the gap between the plug and the platinum electrode leads to a high resistance. By applying a 2.6 Ferroelectric Field Effect Transistor 9 negative voltage to the platinum electrode the oxygen vacancies start to migrate to the platinum electrode (B) leading to a low resistive state (ON state) of the device (C). By applying a positive voltage this process can be reversed and the oxygen vacancies move back to the plug (D). There are several other mechanisms to switch the resistivity in different materials. Further information can be found in [53]. However, in this work the described VCM mechanism is used to get a further insight into the origin of the stabilization of the ferroelectric phase.
Figure 2.7: A characteristic resistive switching curve and the corresponding assumed model for a VCM based System. Redrawn from [54].
2.6 Ferroelectric Field Effect Transistor
The ferroelectric field effect transistor (FeFET) is a promising candidate for future nonvolatile memory devices. The ferroelectric material is embedded in the transistor and replaces the gate dielectric as shown in Figure 2.8. 10 2 Fundamentals
Gate
Ferroelectric + + + + + + + + + + − − − − − − − − − −
P
Source + + + + + + + + + + Drain n+ − − − − − − − − − − n+
p-Ge
Figure 2.8: In a ferroelectric field effect transistor the dielectric gate oxide is replaced by a ferroelectric material. The polarization of the ferroelectric material influences the threshold voltage of the transistor.
The ferroelectric polarization induces compensation charges in the gate electrode and in the channel between source and drain. This induced charge in the channel shifts the threshold voltage of the transistor as schematically shown in Figure 2.9. The memory window (MW) is given by the offset of the two resulting characteristic curves. To read out the stored binary information the drain current is measured at a certain gate voltage. FeFET´s were already realized with conventional ferroelectrics but they strongly suffer from the poor interface of the ferroelectric material with silicon. Therefore dielectric buffer layer are needed realize stable FeFET´s but leads to a large voltage drop over the buffer layer due to the large permittivity and remanent polarization of the ferroelectric. These issues can be overcome by doped HfO2, which shows a low permittivity and a smooth interface with silicon [30].
Gate
+ + + + + + + + + + − − − − − − − − − −
P
Source + + + + + + + + + + Drain n+ − − − − − − − − − − n+
p-Ge
Gate
− − − − − − − − −
+ + + + + + + + +
− +
P
ri urn (a.u.) Current Drain M W
− − − − − − − −
Source − Drain + + + + + + + + +
n+ − + n+
p-Ge
Gate Voltage (V)
Figure 2.9: Schematic curves for the drain current in dependence of the gate voltage for the two different polarization states. 2.7 Physical Basics of Sputtering 11
2.7 Physical Basics of Sputtering
In the scope of this work, sputtering is applied for the deposition of all electrodes and furthermore for yttrium doped hafnium oxide. Sputtering is based on the physical bombardment of the target material with ions leading to an ablation of the target material and deposition on the substrate. A schematic of the sputtering process is shown in Figure 2.10. The target and the substrate are positioned opposite of each other. Due to the relative low pressure of 10-3 to 10 -1 mbar needed for the ignition of the plasma, a vacuum system is required usually consisting of a two-stage vacuum pumping system. The process gas, mostly argon, is used to ignite a non- thermal plasma by applying a high voltage between the target and the substrate. The electric field accelerates free electrons, which ionize the gas atoms trough collisions with sufficient kinetic energy. The electrons and ions, which arise from the collision, are accelerated, leading to a cascade of further ionizations. To obtain a higher ionization rate, magnets are placed behind the target. The magnetic field extends the trajectory of the electrons leading to even more ionization for each electron and a higher electron density near the target. Sputtering can be realized by either a DC voltage or a RF voltage of usually 13.56 MHz. For the DC voltage, the ionized argon atoms are accelerated towards the cathode, where the target material is positioned. One big disadvantage of DC sputtering is that only conductive materials can be sputtered. By using an insulating material, the target is charged positively leading to a compensation of the applied voltage and therefore to a stop of the deposition process. By applying an RF voltage, also insulating materials can be sputtered. Therefore, an oscillating voltage is applied to the target where the substrate is grounded. During the negative half of the alternating voltage the target is ablated and charged positively as described for the DC voltage. During the positive half of the voltage the electrons compensate the positive charge. Due to the higher mobility of the electrons compared to ions the negative charge at the target dominates, leading to a so called self-bias. This DC self-bias voltage causes primarily the ablation of the target during RF sputtering. By adding a reactive gas like oxygen or nitrogen to the process gas, reactive sputtering can be realized. Thereby, the reactive gas is ionized which leads to a chemical reaction with the target atoms during deposition. With this technique, metallic targets can be used to deposit the metal oxides or nitrides. The titanium nitride electrodes used in this work are reactive sputtered from a titanium target. The doped hafnium oxide is sputtered from hafnium and yttrium oxide targets as well as reactively sputtered from metallic hafnium and 12 2 Fundamentals yttrium targets. For further information concerning the sputter deposition technique, the reader is advised to literature [55][56][57].
Figure 2.10: Schematic sketch of a sputter deposition process.
2.8 Experimental Methods
2.8.1 Electrical Characterization
For the characterization of ferroelectric films, electrical measurements play an important role. The remanent polarization and the coercitive electrical field can be extracted from the hysteresis as described in the fundamentals section. For all electrical measurements, a voltage is applied at the device and the current response is measured. The interpretation of the measured current is crucial, because not only the charge from the ferroelectric switching influences the resulting hysteresis but also parasitic effects such as leakage currents. For an ideal capacitor, the switched charge is defined as: