Network/Embedded Processors

Quarter 4, 2008 SG1007Q42008 Rev 0 SECURITY AND INTEGRATED COMMUNICATIONS PROCESSORS Security Processors Product Description Packaging Speed (MHz) Rev Voltage Core (V) Voltage IO/tol (V) Status MPC184VF Security co-processor designed to interface with 32-bit PCI and 8xx system . Ideal for 252-ball MAPBGA (VF), (VM) 75 B 1.5 ±10% 3.3 ±10% VM is RoHS compliant use with MPC824x and 8xx devices. package.

MPC823 Integrated for Portable Systems (1001)

Standard Temperature: 0°C TA to 95°C TJ (Junction Temperature) Product Description Packaging Speed (MHz) Rev Temp Note SOQ MPQ POQ Additional Information (-40°C TA to 95°C TJ) MPC823 Portable System 256-ball PBGA (ZT), (VR) 66, 75, 81 B2T CZT66 0 60 300 Integrated MPU for mobile computing. 256-pin ZT is the preferred MPU package. 823E has 16 K I-cache and 8 K D-cache. VR is RoHS compliant MPC823 256-ball PBGA (VR) 66, 75, 81 B2T CVF66 0 60 300 package. MPC823E 256-ball PBGA (ZT), (VR) 66, 75 B2T CZT66 0 60 300 Removed from active portfolio. Note: Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. MPC850 Integrated Communications Processors

Standard Temperature: 0°C TA to 95°C TJ (Junction Temperature) Product Description Packaging Speed (MHz) Rev Temp Note SOQ MPQ POQ Additional Information (-40°C TA to 95°C TJ) XPC850 Low-Cost Integrated 256-ball PBGA (ZT), (VR) 50, 66, 80 BU CZT50 0 60 300 Low-cost, integrated MPU with tailored Communication Processing Communications MPU Module (CPM) including Universal Serial Bus (USB). VR is RoHS XPC850DE 256-ball PBGA (ZT), (VR) 50, 66, 80 BU CZT50 0 60 300 compliant package. XPC850SR 256-ball PBGA (ZT), (VR) 50, 66, 80 BU CZT50 0 60 300 XPC850DSL 256-ball PBGA (ZT), (VR) 50 BU CZT50 0 60 300 Note: Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. INTEGRATED COMMUNICATIONS PROCESSORS MPC860 Integrated Communications ProcessorsNote

Standard Temperature: 0°C TA to 95°C TJ (Junction Temperature) Product Description Packaging Speed (MHz) Rev Temp Note SOQ MPQ POQ Additional Information (-40°C TA to 95°C TJ) MPC855T PowerQUICC® 357-ball PGBA (ZQ), (VR) 50, 66, 80 D4 CZQ50, 66 0 44 220 Low-cost, integrated MPU with tailored CPM including Fast .

VR is RoHS compliant package. MPC860DE 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220 PowerQUICC® family with embedded 8xx core—with 4 KB I-cache and 4K D-cache, and MMUs integrated with CPM of earlier generation 68360 MPC860DP 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220 QUICC. 860P and 860DP have 16K I-cache and 8K D-cache. MPC860DT 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220 VR is RoHS compliant package. MPC860EN 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220 MPC860P 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220 MPC860SR 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220 MPC860T 357-ball PBGA (ZQ), (VR) 50, 60, 80 D4 CZQ50, 66 0 44 220 Note: Extended temperature products with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

SG1007–2 SG1007Q42008 INTEGRATED COMMUNICATIONS PROCESSORS (continued) MPC862 Integrated Communications ProcessorsNote

Standard Temperature: 0°C TA to 95°C TJ (Junction Temperature) Product Description Packaging Speed (MHz) Rev Temp Note SOQ MPQ POQ Additional Information (-40°C TA to 115°C TJ) MPC857DSL PowerQUICC® 357-ball PBGA (ZP), (ZQ), (VR) 50, 66 B n/a 0 44 220 Low-cost 857T for DSL applications. VR is RoHS compliant package. MPC857T 357-ball PBGA (ZP), (ZQ), (VR) 50, 66, 80, 100 B CZQ50, 66, 80 0 44 220 Rev B of the 862 PowerQUICC® family including simultaneous operation of the Fast Ethernet (MII) and Parallel ATM (Utopia), Utopia II Multi-Phy, Utopia MPC862P 357-ball PBGA (ZP), (ZQ), (VR) 50, 66, 80, 100 B CZQ50, 66, 80 0 44 220 Slave, and AAL2/VBR. MPC862T 357-ball PBGA (ZP), (ZQ), (VR) 50, 66, 80, 100 B CZQ50, 66, 80 0 44 220 VR is RoHS compliant package. 862 product family is now MPC qualified and is being converted to QZ (thick) package. Refer to PCN # 11230. ZQ samples are now available. Note: Extended temperature products with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. MPC866 Integrated Communications ProcessorsNote

Standard Temperature: 0°C TA to 95°C TJ (Junction Temperature)

Product Description Packaging Speed (MHz) Rev Temp Note SOQ MPQ POQ Additional Information (-40°C TA to 100°C TJ)

MPC852T PowerQUICC® 256-ball PBGA (ZT), (VR) 50, 66, 80, 100 A CVR66, CZT100, 50, 66 0 60 300 Low-cost Ethernet only. VR is RoHS compliant package.

MPC853T 256-ball PBGA (ZT), (VR) 50, 66, 80, 100 A CVR66, CZT100, 50, 66 0 60 300 Low-cost Ethernet only. HDLC support.

MPC859DSL 357-ball PBGA (ZP), (VR) 50, 66 A CZP 50, 66, 100 0 44 220 Samples and production available now. VR is RoHS compliant package.

MPC859T 357-ball PBGA (ZP), (VR) 100, 133 A CZP100 0 44 220 Low-cost PowerQUICC® with tailored CPM including Fast Ethernet. 859P = 16K I-cache and 8K D-cache. MPC859P 357-ball PBGA (ZP), (VR) 100, 133 A CZP100 0 44 220 859T = 4K I-cache and 4K D-cache. VR is RoHS compliant package.

MPC866P 357-ball PBGA (ZP), (VR) 100,133 A CZP100 0 44 220 PowerQUICC® 862 family extension in 0.18 µm offering lower power and higher performance. MPC866T 357-ball PBGA (ZP), (VR) 100,133 A CZP100 0 44 220 866P = 16K I-cache, 8K D-cache. 886T = 4K I-cache and 4K D-cache. VR is RoHS compliant package.

Note: Extended temperature products with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. MPC885 Integrated Communications ProcessorsNote

Standard Temperature: 0°C TA to 95°C TJ (Junction Temperature)

Product Description Packaging Speed (MHz) Rev Temp Note SOQ MPQ POQ Additional Information (-40°C TA to 100°C TJ) MPC870 PowerQUICC® 256-ball PGBA (ZT), (VR) 66, 80, 133 0 CZT66, 133 0 60 300 PowerQUICC® I 866 family extension in 0.18 µm with embedded 8xx core–with 8K I-cache, 8K D-cache, integrated security, two Fast Ethernet (10/100) controllers, MPC875 256-ball PGBA (ZT), (VR) 66, 80, 133 0 CZT66, 133 0 60 300 and USB. MPC880 256-ball PGBA (ZT), (VR) 66, 80, 133 0 CZP66, 133 0 44 220 MPC870 and MPC875 support Ethernet only. VR is RoHS compliant package. MPC880 and MPC885 support Ethernet and ATM. VR is RoHS compliant package. MPC885 256-ball PGBA (ZT), (VR) 66, 80, 133 0 CZP66, 133 0 44 220 Note: Extended temperature products with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

SG1007–3 SG1007Q42008 INTEGRATED COMMUNICATIONS PROCESSORS (continued) MPC823/MPC850/MPC855T/MPC857T/MPC859T/MPC860/MPC862/MPC866/MPC885 Processor Derivatives and Features Product I-Cache D-Cache (KB) 10T 10/100 ATM ESAR ATM (No of Channels) #T1/E1 USB Integrated (KB) Security HDLC SCC MPC823 2 1 Up to 2 n/a n/a n/a Up to 64 2 n/a Y n/a MPC823E 16 8 Up to 2 n/a n/a n/a Up to 64 2 n/a Y n/a MPC850 2 1 1 n/a n/a n/a n/a 1 n/a Y n/a MPC850DE 2 1 Up to 2 n/a n/a n/a n/a 2 n/a Y n/a MPC850SR 2 1 Up to 2 n/a Y n/a Up to 64 2 2 Y n/a MPC850DSL 2 1 1 n/a Y n/a n/a 2 n/a Y n/a MPC852T 4 4 Up to 2 1 n/a n/a n/a 2 n/a n/a n/a MPC853T 4 4 Up to 2 1 n/a n/a Up to 32 2 n/a n/a n/a MPC855T 4 4 1 1 Y n/a Up to 32 1 1 n/a n/a MPC857T 4 4 1 1 Y Y Up to 32 1 1 n/a n/a MPC857DSL 4 4 1 1 Y Y n/a 1 n/a n/a n/a MPC859P 16 8 1 1 Y Y Up to 32 1 1 n/a n/a MPC859T 4 4 1 1 Y Y Up to 32 1 1 n/a n/a MPC859DSL 4 4 1 1 Y Y n/a 1 n/a n/a n/a MPC860DE 4 4 Up to 2 n/a n/a n/a n/a 2 n/a n/a n/a MPC860DP 16 8 Up to 2 1 Y n/a Up to 64 2 2 n/a n/a MPC860DT 4 4 Up to 2 1 Y n/a Up to 64 2 2 n/a n/a MPC860EN 4 4 Up to 4 n/a n/a n/a n/a 4 n/a n/a n/a MPC860P 16 8 Up to 4 1 Y n/a Up to 64 4 2 n/a n/a MPC860SR 4 4 Up to 4 n/a Y n/a Up to 64 4 2 n/a n/a MPC860T 4 4 Up to 4 1 Y n/a Up to 64 4 2 n/a n/a MPC862P 16 8 Up to 4 1 Y Y Up to 64 4 2 n/a n/a MPC862T 4 4 Up to 4 1 Y Y Up to 64 4 2 n/a n/a MPC866P 16 8 Up to 4 1 Y Y Up to 64 4 2 n/a n/a MPC866T 4 4 Up to 4 1 Y Y Up to 64 4 2 n/a n/a MPC870 8 8 0 2 N N n/a 0 n/a Y N MPC875 8 8 1 2 N N Up to 32 1 1 Y Y MPC880 8 8 Up to 2 2 Y Y Up to 64 2 2 Y N MPC885 8 8 Up to 3 2 Y Y Up to 64 3 2 Y Y

SG1007–4 SG1007Q42008 INTEGRATED COMMUNICATIONS PROCESSORS (continued) PowerQUICC® II FamilyNote Product Description CPU/CPM/Bus Speed Rev Packaging Std Temp Note Ext Temp Note Samples SOQ MPQ POQ Additional Information (MHz) (0°C to 105°C) (-40°C to 105°C) MPC8241 PowerPC ISA 166/200/266 D=1.4 357-ball TBGA (ZQ), (VR) ———244 220 Functionality of the MPC8245 in lower cost package. MPC8241 166/200 D=1.4 357-ball TBGA (ZQ), (VR) 2 44 220 Extended Temperature 0°C to 105°C TJ. VR is RoHS compliant packages. MPC8245 PowerPC ISA 266/300 D=1.4 352-ball TBGA (ZU), (VV) — — — 1 24 144 32-bit superscalar processor core with integrated peripheral MPC8245 266/300/333/350 D=1.4 352-ball TBGA (ZU), (VV) 1 24 144T logic. Supports up to 133 MHz 64-bit memory interface and MPC8245A 400/466 D=1.4 352-ball TBGA (ZU), (VV) 1 24 144T up to 66 MHz 32-bit PCI interface, MPC8245 has the on- MPC8245 266/300 D=1.4 352-ball TBGA (ZU), (VV) 1 24 144 chip DUART and is pin-compatible with the MPC8240. VV is MPC8245 333/350 D=1.4 352-ball TBGA (ZU), (VV) 1 24 144 RoHS compliant packages. MPC8247 PowerQUICC® II (HiP7) 266/200/66 (MIB) A 516-ball PBGA (ZQ/VR) MPC8247ZQxxxA MPC8247CZQxxxA KMPC 2 40 200 Ethernet only device. 300/200/100 (PIE) 400/200/100 (TIE) 400/266/133 (TMF) MPC8248 PowerQUICC® II (HiP7) 266/200/66 (MIB) A 516-ball PBGA (ZQ/VR) MPC8248ZQxxxA MPC8248CZQxxxA KMPC 2 40 200 Ethernet only device. Integrated security. 300/200/100 (PIE) 400/200/100 (TIE) 400/266/133 (TMF) XPC8255 PowerQUICC® II (HiP3) 200/133/66 (IFB) C2 480-ball TBGA (ZU/VV) XPC8255ZUIFBC XPC8255CZUIFBC KMPC 2 21 105 Low-cost derivative of 8260. XPC8260 PowerQUICC® II (HiP3) 166/133/66 (HFB) C2 480-ball TBGA (ZU/VV) XPC8260ZUxxxC XPC8260CZUxxxC KMPC 2 21 105 Supports fast ethernet HDLC channels and OC-3 ATM up to 200/133/66 (IFB) 200 MHz CPU, 166 MHz CPM, 66 MHz Bus. 200/166/66 (IHB) MPC8250A PowerQUICC® II (HiP4) 266/166/66 (MHB) C 516-ball PBGA (ZQ/VR) MPC8250AVRIHBC MPC8250ACZQIHBC KMPC 2 40 200 Ethernet only derivative. 300/200/66 (PIB) 480-ball (ZU/VV) MPC8250AZUxxxC MPC8250ACZUxxxC 200/166/66 (IHB) MPC8255A PowerQUICC® II (HiP4) 266/166/66 (MHB) B 480-ball TBGA (ZU/VV) MPC8255AZUxxxB MPC8255ACZUxxxB KMPC 2 21 105 Low-cost ATM and Ethernet derivative. 300/300/66 (PIB) MPC8260A PowerQUICC® II (HiP4) 300/200/66 (PIB) B 480-ball TBGA (ZU/VV) MPC8260AZUxxxB MPC8260ACZUxxxB KMPC 2 21 105 Standard device. Supports fast Ethernet HDLC channels and 300/208/83 (PJD) OC-3 ATM up to 200 MHz CPU, 166 MHz CPM, 266/166/66 (MHB) 66 MHz Bus. 266/200/66 (MIB) MPC8264A PowerQUICC® II (HiP4) 300/200/66 (PIB) B 480-ball TBGA (ZU/VV) MPC8264AZUxxxB MPC8264ACZUxxxB KMPC 2 21 105 Supports TC-layer and IMA microcode in addition to standard 266/166/66 (MHB) device features. 266/200/66 (MIB) 300/208/83 (PJD) MPC8265A PowerQUICC® II (HiP4) 300/200/66 (PIB) C 480-ball TBGA (ZU/VV) MPC8265AZUxxxC MPC8265AZUxxxC KMPC 2 21 105 Supports PCI in addition to standard device features. 266/166/66 (MHB) 266/200/66 (MIB) 300/208/83 (PJD) MPC8266A PowerQUICC® II (HiP4) 300/208/83 (PJD) C 480-ball TBGA (ZU/VV) MPC8266AZUxxxC MPC8266AZUxxxC KMPC 2 21 105 Superset, supporting TC/IMA and PCI. MPC8270 PowerQUICC® II (HiP7) 333/250/83 (QLD) A 516-ball PBGA (ZQ/VR) MPC8270xxMIBA MPC8270CxxMIBA KMPC 2 21/40 105/ PCN Announcing Rev A published in Q2. 450/300/100 (UPE) 480-ball TBGA (ZU/VV) 200 266/200/66 (MIB) MPC8271 PowerQUICC® II (HiP7) 266/200/66 (MIB) A 516-ball PBGA (ZQ/VR) MPC8271ZQxxxA MPC8271CZQxxxA KMPC 2 40 200 Supports Ethernet and ATM. 300/200/100 (PIE) 400/200/100 (TIE) 400/266/133 (TMF) MPC8272 PowerQUICC® II (HiP7) 266/200/66 (MIB) A 516-ball PBGA (ZQ/VR) MPC8272ZQxxxA MPC8272CZQxxxA KMPC 2 40 200 Supports Ethernet and ATM 300/200/100 (PIE) Integrated encryption. 400/200/100 (TIE) 400/266/133 (TMF) MPC8275 PowerQUICC® II (HiP7) 266/200/66 (MIB) A 516-ball PBGA (ZQ/VR) MPC8275ZQMIBA MPC8275CxxMIBA KMPC 2 40 200 Low-cost ATM device. MPC8280 PowerQUICC® II (HiP7) 333/250/83 (QLD) A 480-ball TBGA (ZU/VV) MPC8280xxxxxA MPC8280CxxUPEA KMPC 2 21 105 450/300/100 (UPE) CPU/CPM/BUS speed for PowerQUICC® II (HIP 3/4) A = 50, B = 66, C = 75, D = 83, E = 100, F = 133, G = 150, H = 166, I = 200, J = 208, K = 233, L = 250, M = 266, N = 291, P = 300, Q = 333, R = 366, S = 375, T = 400, U = 450, V = 500, and W = 533. Note: Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

SG1007–5 SG1007Q42008 INTEGRATED COMMUNICATIONS PROCESSORS (continued) MPC8250/MPC8255/MPC8260/MPC8264/MPC8265/MPC8266/MPC8270/MPC8275/MPC8280 PowerQUICC® II Derivatives and Features Product I-Cache D-Cache 10T 10/100 Utopia ATM Support (No of Channels) FCC MCC #T1/E1 #T3/E3 USB PCI TC/IMA (KB) (KB) HDLC SCC MPC8247 16 16 3 2 0 64 3 2 0 2 0 Y Y N MPC8248 16 16 3 2 0 64 3 2 0 2 0 Y Y N MPC8250 16 16 Up to 4 Up to 3 0 Up to 128 4 3 1 4 1 n/a Y N MPC8255 16 16 Up to 4 Up to 2 2-CH (155 Mbps ea) Up to 128 4 2 1 4 1 n/a N N MPC8260 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2 8 2 n/a N N MPC8264 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2 8 2 n/a N Y MPC8265 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2 8 2 n/a Y N MPC8266 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2 8 2 n/a Y Y MPC8270 16 16 Up to 4 Up to 3 0 Up to 128 4 3 1 4 1 Y Y N MPC8271 16 16 3 2 1 64 3 2 0 2 0 Y Y N MPC8272 16 16 3 2 1 64 3 2 0 2 0 Y Y N MPC8275 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 128 4 3 1 4 1 Y Y N MPC8280 16 16 Up to 4 Up to 3 2-CH (155 Mbps ea) Up to 256 4 3 2 8 2 Y Y Y MPC8313 PowerQUICC® II Pro Processor Family Product Description CPU DDR/DDR2 I-Cache D-Cache 10/100/1000 USB PCI Security Local QUICC Standard Extended Packaging Samples (MHz) (MHz) Ethernet Bus Engine Temp. Temp. MPC8313 PowerQUICC® II Pro 266, 333, 333 16K 16K 1 × 16/32-bit DDR 2 (SGMII) 1 x Hi-Speed 1 × 32-bit No Yes n/a MPC8313 MPC8313C 620-ball MPC 400 (PHY) TE-PBGA MPC8313E PowerQUICC® II Pro 266, 333, 333 16K 16K 1 × 16/32-bit DDR 2 (SGMII) 1 x Hi-Speed 1 × 32-bit Yes Yes n/a MPC8313E MPC8313EC 620-ball MPC 400 (PHY) TE-PBGA MPC8314/15 PowerQUICC® II Pro Processor Derivatives and Features Product Description CPU DDR/DDR2 I-Cache D-Cache Memory Controller 10/100/1000 System Interfaces Security Local QUICC Standard Extended Packaging Samples (MHz) (MHz) Ethernet Bus Engine Temp. Temp. MPC8314E PowerQUICC® II Pro 266, 333, 266 16 K 16 K 1 x 32/64 bit DDR1/2 2 PCI-Express® - 2 x 1 Lane Yes Yes n/a PPC8314, PPC8314C, 620-ball MPC 400 up to 266 MHz (for PPC8314, PPC8314E), PPC8314E PPC8314EC TE-PBGA USB 2.0 w/ Phy, PCI MPC8315E PowerQUICC® II Pro 266, 333, 266 16 K 16 K 1 x 32/64 bit DDR1/2 2 PCI-Express® - 2 x 1 Lane Yes Yes n/a PPC8315, PPC8315C, 620-ball MPC 400 up to 266 MHz (for PPC8315, PPC8315E), PPC8315E PPC8315EC TE-PBGA SATA x 2 (PPC8315, PPC8315E) USB 2.0 w/ Phy, PCI MPC8323 PowerQUICC® II Pro Family Product Description CPU DDR QUICC Engine Packaging Std Temp Ext Temp Samples Additional Information (MHz) (MHz) (MHz) (0°C TA to 105°C TJ) (-40°C TA to 105°C TJ) MPC8321 PowerQUICC® II Pro 266, 333 266 200 516-ball PBGA (ZQ/VR) MPC8321 MPC8321C KMPC n/a MPC8321E PowerQUICC® II Pro 266, 333 266 200 516-ball PBGA (ZQ/VR) MPC8321E MPC8321EC KMPC n/a MPC8323 PowerQUICC® II Pro 266, 333 266 200 516-ball PBGA (ZQ/VR) MPC8323 MPC8323C KMPC n/a MPC8323E PowerQUICC® II Pro 266, 333 266 200 516-ball PBGA (ZQ/VR) MPC8323E MPC8323EC KMPC n/a MPC8323 PowerQUICC® II Pro Derivatives and Features Product I-Cache D-Cache Memory Controller 10/100 Ethernet USB PCI Security Local Bus QUICC Engine MPC8321 16K 16K 32-bit DDR/DDR2 3 (MII/RMII) 1 x Full/Low Speed 1 × 32-bit No Yes Yes (Ethernet, HDLC) MPC8321E 16K 16K 32-bit DDR/DDR2 3 (MII/RMII) 1 x Full/Low Speed 1 × 32-bit Yes Yes Yes (Ethernet, HDLC) MPC8323 16K 16K 32-bit DDR/DDR2 3 (MII/RMII) 1 x Full/Low Speed 1 × 32-bit No Yes Yes (Ethernet, HDLC, ATM) MPC8323E 16K 16K 32-bit DDR/DDR2 3 (MII/RMII) 1 x Full/Low Speed 1 × 32-bit Yes Yes Yes (Ethernet, HDLC, ATM) A change bar appears in the left margin to mark the location of new or revised information. SG1007–6 SG1007Q42008 INTEGRATED COMMUNICATIONS PROCESSORS (continued) MPC8349 PowerQUICC® II Pro FamilyNote Product Description CPU DDR/DDR2 Packaging Std Temp Note Ext Temp Note Samples Additional Information (MHz) (MHz) (0°C to 105°C) (-40°C to 105°C) MPC8343 PowerQUICC® II Pro 266, 400 266 620-ball PBGA (ZQ/VR) MPC8343 MPC8343C KMPC MPC samples available. MPC8343E PowerQUICC® II Pro 266, 400 266 620-ball PBGA (ZQ/VR) MPC8343E MPC8343EC KMPC MPC samples available. Integrated security. MPC8347 PowerQUICC® II Pro 266, 400, 533, 667 266, 333 620-ball PBGA (ZQ/VR) MPC8347 MPC8347C KMPC MPC samples available. 672-ball TBGA (ZU/VV) MPC8347E PowerQUICC® II Pro 266, 400, 533, 667 266, 333 620-ball PBGA (ZQ/VR) MPC8347E MPC8347EC KMPC MPC samples available. Integrated security. 672-ball TBGA (ZU/VV) MPC8349 PowerQUICC® II Pro 400, 533, 667 266, 333 672-ball TBGA (ZU/VV) MPC8349 MPC8349C KMPC MPC samples available. MPC8349E PowerQUICC® II Pro 400, 533, 667 266, 333 672-ball TBGA (ZU/VV) MPC8349E MPC8349EC KMPC MPC samples available. Integrated security. Note: Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. MPC8349 PowerQUICC® II Pro Derivatives and Features Product I-Cache D-Cache Memory Controller 10/100/1000 Ethernet USB PCI Security Local Bus Communications Engine MPC8343 32K 32K 32-bit DDR/DDR2 2 1 × Hi-Speed 1 × 32-bit, 33/66 MHz No Yes n/a MPC8343E 32K 32K 32-bit DDR/DDR2 2 1 × Hi-Speed 1 × 32-bit, 33/66 MHz Yes Yes n/a MPC8347 32K 32K 32/64-bit DDR/DDR2 2 2 × Hi-Speed 1 × 32-bit, 33/66 MHz No Yes n/a MPC8347E 32K 32K 32/64-bit DDR/DDR2 2 2 × Hi-Speed 1 × 32-bit, 33/66 MHz Yes Yes n/a MPC8349 32K 32K 32/64-bit DDR/DDR2 2 2 × Hi-Speed 2 × 32-bit or 1 × 64-bit No Yes n/a MPC8349E 32K 32K 32/64-bit DDR/DDR2 2 2 × Hi-Speed 2 × 32-bit or 1 × 64-bit Yes Yes n/a MPC8360 PowerQUICC® II Pro Family Product Description CPU DDR QUICC Engine Packaging Std Temp1 Ext Temp* Samples Additional Information (MHz) (MHz) (MHz) (0°C TA to 105°C TJ) (-40°C TA to 105°C TJ) MPC8358 PowerQUICC® II Pro 266, 400 266 300, 400 740-ball TBGA (ZU/VV) MPC8358 MPC8358C KMPC * MPC8358E PowerQUICC® II Pro 266, 400 266 300, 400 740-ball TBGA (ZU/VV) MPC8358E MPC8358EC KMPC * MPC8358/E PowerQUICC® II Pro 266, 400 266 266 668-ball PBGA (ZQ/VR) MPC8358E MPC8358EC KMPC * MPC8360 PowerQUICC® II Pro 400, 533, 667 266, 333 400, 500 740-ball TBGA (ZU/VV) MPC8360 MPC8360C KMPC * MPC8360E PowerQUICC® II Pro 400, 533, 667 266, 333 400, 500 740-ball TBGA (ZU/VV) MPC8360E MPC8360EC KMPC * 1. Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify. * Rev. 2.0 not recommended for new designs. Production available for Rev. 2.0. Samples and production now available for Rev. 2.1. MPC8360 PowerQUICC® II Pro Derivatives and Features Product I-Cache D-Cache Memory Controller 10/100/1000 Ethernet USB PCI Security Local Bus QUICC Engine MPC8358 32K 32K 1 × 32/64-bit DDR 2 Yes 1 × 32-bit, 33/66 MHz No Yes Yes MPC8358E 32K 32K 1 × 32/64-bit DDR 2 Yes 1 × 32-bit, 33/66 MHz Yes Yes Yes MPC8360 32K 32K 1 × 32/64-bit or 2Yes1 × 32-bit, 33/66 MHz No Yes Yes 2 × 32-bit DDR MPC8360E 32K 32K 1 × 32/64-bit or 2 Yes 1 × 32-bit, 33/66 MHz Yes Yes Yes 2 × 32-bit DDR MPC837x PowerQUICC® II Pro Processor Derivatives and Features Product I-Cache D-Cache Memory Controller 10/100/1000 Ethernet System Interfaces Security Local Bus QUICC Engine MPC8377E 32 K 32 K 1 x 32/64 bit DDR1/2 up to 400 MHz 2 2-x1 PCI-Express®, x2 SATA, USB 2.0, PCI Yes Yes n/a MPC8378E 32 K 32 K 1 x 32/64 bit DDR1/2 up to 400 MHz 2 (SGMII) 2-x1 PCI-Express®, USB 2.0, PCI Yes Yes n/a MPC8379E 32 K 32 K 1 x 32/64 bit DDR1/2 up to 400 MHz 2 x4 SATA, USB 2.0, PCI Yes Yes n/a

SG1007–7 SG1007Q42008 INTEGRATED COMMUNICATIONS PROCESSORS (continued) PowerQUICC® III Family Product Description CPU Communications I/D L2 Memory Controller 10/100/1000 System Interfaces Security Local Bus CPM Additional Information Frequency Frequency Cache Cache Ethernet (MHz) (MHz) MPC8536E PowerQUICC® III 600 to 1.5 n/a 32 K 512 KB DDR2/3 - 333 MHz to 2 PCI, PCI Express®, DMA, Yes Yes No Advanced power management, IEEE® 588 GHz 667 MHz SATA, USB, SD/MMC v2 MPC8540 PowerQUICC® III 667, 833, n/a 32 K 256 K DDR1-333 MHz 2 PCI, PCI-Express®, pRIO, No Yes No www.freescale.com 1000 I2C, DUART MPC8541E PowerQUICC® III 533, 667, n/a 32 K 256 K DDR1-333 MHz 2 2x, PCI, I2C, DUART Yes Yes Ethernet www.freescale.com 833, 1000 Only MPC8543E PowerQUICC® III 800, 1000 n/a 32 K 256 K DDR1-400 MHz, 2-eTSEC PCI, sRIO/PCI-Express®, Yes Yes No www.freescale.com DDR2-400 MHz I2C, DUART MPC8544 PowerQUICC® III 1000 333 32 K 256 K DDR1/2-544 MHz 2 PCI, Triple PCI-Express®, Yes Yes No www.freescale.com I2C, DUART MPC8545E PowerQUICC® III 800, 1000, n/a 32 K 512 K DDR1-400 MHz, 2-eTSEC PCI, PCI-Express®, Yes Yes No DPFP 1200 DDR2-400 MHz I2C, DUART MPC8547E PowerQUICC® III 1000, n/a 32 K 512 K DDR1-533 MHz, 4-eTSEC PCI, PCI-X, PCI-Express®, Yes Yes No XOR 1200,1333 DDR2-533 MHz I2C, DUART MPC8548E PowerQUICC® III 1000, n/a 32 K 512 K DDR1-533 MHz, 4-eTSEC PCI, PCI-X, PC-Express®, Yes Yes No DPFP, XOR 1200,1333 DDR2-533 MHz sRIO, I2C, DUART MPC8555E PowerQUICC® III 533, 667, 333 32 K 256 K DDR1-333 MHz 2 2x PCI, I2C, DUART Yes Yes Yes www.freescale.com 833, 1000 MPC8560 PowerQUICC® III 667, 833, 333 32 K 256 K DDR1-333 MHz 2 I2C, DUART No Yes Yes www.freescale.com 1000 MPC8567E PowerQUICC® III 800, 1000, 400 32 K 512 K DDR1-400 MHz, 3-QUICC Engine PCI, PCI-Express®, sRIO, Yes Yes QUICC QUICC Engine has 8 UCCs supporting 1200 DDR2-533 MHz I2C, DUART Engine Ethernet, ATM, and HDLC; one MCC supporting 256 HDLC channels; 8 TDMs; interworking support. Contact factory for samples. MPC8568E PowerQUICC® III 1000, 400, 533 32 K 512 K DDR1-400 MHz, 2-eTSEC, PCI, PCI-Express®, sRIO, Yes Yes QUICC QUICC Engine has 8 UCCs supporting 1200,1333 DDR2-533 MHz 3-QUICC Engine I2C, DUART Engine Ethernet, ATM, and HDLC; one MCC supporting 256 HDLC channels; 8 TDMs; interworking support. Table Lookup Unit included. Contact factory for samples. MPC8572E Dual Core 1067, 1200, n/a 32 K 1 MB Dual 64b DDR2/DDR3 4-eTSEC with Triple PCI-Express®, sRIO, Yes 32 b to No Pattern Matching Engine and Table Lookup PowerQUICC® III 1333, 1500 with ECC with ECC, up to SGMII + one I2C, DUART 150 MHz Unit included. 800 MHz data rate 10/100 MPC8610 Integrated Host 667, 800, n/a 32 K/ 256 KB Single 64b DDR1/ Connect through x8 and x4 PCI-Express®, PCI, n/a 32 b to n/a LCD controller from SXGA (1280 x 1024) Processor 1000, 1066, 32 K with ECC DDR2 with ECC, PCI or LCD Controller, 2-I2S Audio, 133 MHz, boot to QVGA (320 x 240) up to 1333 400 to 533 MHz data PCI-Express® from NAND 72 Hz. AltiVec™ power mgmt. SPI, 2-DUART, 2 I2C, 2-IrDA, rate (NOR, ROM) 32-GPIO, 2-DMA MPC8641 Integrated Host 1000, 1250, n/a 32 K/ 1 MB Dual 64b DDR1/DDR2 4-eTSEC Dual x8 PCI-Express®, n/a 32 b to n/a AltiVec™, power mgmt, protocol support: Processor 1333, 1500 32 K with ECC with ECC, 400 to 600 x4 sRIO, DUART, dual I2C 133 MHz Enet, VLAN, IPv4, IPv6, TCP, UDP, pin MHz data rate compatible with MPC8641D MPC8641D Dual Core 1000, 1250, n/a 32 K/ 1 MB per Dual 64b DDR1/DDR2 4-eTSEC Dual x8 PCI-Express®, n/a 32 b to n/a Dual core, dual AltiVec™, power mgmt, Integrated Host 1333, 1500 32 K core with with ECC, 400 to 600 x4 sRIO, DUART, dual I2C 133 MHz protocol support: Enet, VLAN, IPv4, IPv6, Processor ECC MHz data rate TCP, UDP, pin compatible with MPC8641 MPC8640 Integrated Host 1000, 1250 n/a 32 K/ 1 MB Dual 64b DDR1/DDR2 4-eTSEC Dual x8 PCI-Express®, n/a 32 b to n/a AltiVec™, power mgmt, protocol support: Processor 32 K with ECC with ECC, 500 MHz x4 sRIO, DUART, dual I2C 133 MHz Enet, VLAN, IPv4, IPv6, TCP, UDP, pin data rate compatible with MPC864x Family MPC8640D Dual Core 1000, 1250 n/a 32 K/ 1 MB per Dual 64b DDR1/DDR2 4-eTSEC Dual x8 PCI-Express®, n/a 32 b to n/a AltiVec™, power mgmt, protocol support: Integrated Host 32 K core with with ECC, 500 MHz x4 sRIO, DUART, dual I2C 133 MHz Enet, VLAN, IPv4, IPv6, TCP, UDP, pin Processor ECC data rate compatible with MPC864x Family

A change bar appears in the left margin to mark the location of new or revised information. SG1007–8 SG1007Q42008 INTEGRATED COMMUNICATIONS PROCESSORS (continued) 68K Integrated Communication ProcessorsNote Product Description Packaging Speed Rev Temp Note SOQ MPQ POQ BRICK Additional Information (MHz) (-40°C to 85°C) MC68302 Intergrated 132-pin (FC), (EH) 16, 20, 25 C CFC16, 20 0 36 144 180 68000 core with three high-performance multiprotocol serial Multiprotocol 144-pin (PV), (AG) 16, 20, 25, 33 C n/a 0 60 300 300 channels also on-chip DMA, RAM, timers, I/O, chip select, and Processor (IMP) wait state interrupt controller. 132-pin (RC) 16, 20, 25 C CRC16, 20 0 14 70 n/a MC68302V 144-pin (PV), (AG) 16 @ 3.3 V C CPV16V 0 60 300 300 EH, AG are RoHS compliant packages. MC68EN302 Intergrated 144-pin (PV), (AG) 20, 25 BT CPV20 0 60 300 300 Full 68302, plus separate IEEC 802.2 Ethernet MAC channel and Multiprotocol full DRAM controller. Processor with Ethernet Controller AG is RoHS compliant package. MC68LC302 Low-Cost 100-pin (PU), (AF) 16, 20, 25 @ 5 V CT CPU16, 20 0 84 420 420 Static EC000 Core Processor with two high-performance Intergrated 16, 20 @ 3.3 V CT CPU16V multiprotocol serial channels; also on-chip DMA, RAM, timers, Multiprotocol I/O, chip selects, and wait state interrupt controller. Processor AF is RoHS compliant package. MC68360 QUICC Quad 240-pin (EM), (AI) 25, 33 @ 5.0 V L CEM25 0 24 120 n/a CPU32 + core with System Intergration Module (SIM) and four Integrated 357-pin (ZP), (VR) L CZP25 0 44 220 n/a high-performance SCCs support numerous protocols. Two Communications SCCs support Ethernet on "EN" version. Controller 241-pin (RC) L CRC25 0 10 50 n/a MC68360V 240-pin (EM), (AI) 25 @ 3.3 V L 0 24 120 n/a AI, VR are RoHS compliant packages. 357-pin (ZP), (VR) L 0 44 220 n/a MC68EN360 240-pin (EM), (AI) 25, 33 @ 5.0 V L CEM25 0 24 120 n/a 357-pin (ZP), (VR) L CZP25 0 44 220 n/a 241-pin (RC) L CRC25 0 10 50 n/a MC68EN360V 240-pin (EM), (AI) 25 @ 3.3 V L 0 24 120 n/a 357-pin (ZP), (VR) L 0 44 220 n/a MC68MH360 240-pin (EM), (AI) 25, 33 @ 5.0 V L CEM25 0 24 120 n/a One-chip integrated and peripheral combination 357-pin (ZP), (VR) L CZP25 0 44 220 n/a with four SCCs, two serial management controllers (SMCs), and one serial peripheral interface (SPI). 241-pin (RC) L CRC25 0 10 50 n/a MC68MH360V 240-pin (EM), (AI) 25 @ 3.3 V L 0 24 120 n/a AI, VR are RoHS compliant packages. 357-pin (ZP), (VR) L 0 44 220 n/a Note: Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

Network Processors Product Description Packaging Speed Rev Throughput Power Status Targeted Applications (MHz) (Typ) MCC5E0RX266WBOB 266 MHz C-5e 840-ball CBGA (HiTCE) 266 B0 5 Gbps 9.2 W Not recommended for new designs. • Broadband Access • Wireless Infrastructure • Multiservice Platforms •Media Gateways • High-Function Routing • Metro Ethernet

SG1007–9 SG1007Q42008 PRODUCT NUMBERING C-Port Network Processor Family Product Numbering Scheme XX XXXX XX XXX X XX X PRODUCT CODE PRODUCT FAMILY PACKAGE INDICATOR SPEED BIN TEST CONDITIONS DIE REVISION PACKAGE REVISION PC ENGINEERING SAMPLES C501 C-5 NP DIE REVISION RX CERAMIC FLIPCHIP BGA 166 166 MHz L JUNCTION REVISION LEVEL OF DIE REVISION LEVEL OF PACKAGE MC PRODUCTION QUALIFICATION D0 (XC AND MC) ZU TAPE BGA 200 200 MHz TEMPERATURE MAJOR DIE SEQUENTIAL C5E0 C-5e ZP EBGA 266 266 MH QUALIFIED: 0°C TO 100°C SEQUENTIAL ALPHA z REVISION ALPHA Q500 Q-5 T TJ -40°C TO 100°C CHARACTERS W T-40°C TO 125°C M500 M-5 AND SO ON... J MINOR DIE SEQUENTIAL C3E0 C-3E (QUALIFICATION TEST REVISION NUMERIC CONDITION INDICATORS) EXAMPLE: A0, B0. MPC8xx Processor Product Numbering Scheme MPC 860 EN C ZP 66 D4 PRODUCT CODE 800 SERIES DEVICE PART/MODULE MODIFIER TEMP RANGE PACKAGE FREQUENCY DIE MASK REVISION PPC PROTOTYPE SAMPLE 823 DE DUAL CHANNEL (W/ENET) BLANK 0°C TA TO 95°C TJ |256-BALL ZT (LEAD) 50/66/80/100/133 MHz 823 B2T KXPC SAMPLE PACK (2–10) 850 DP DUAL CHANNEL (10/100, MULTI-HDLC, ATM) C-40°C TA TO 95°C TJ 357-BALL ZP (LEAD) 850 BT/BU XPC ENGINEERING PRODUCTION 852T DT DUAL CHANNEL (10/100, MULTI-HDLC, ATM) 256-BALL ZQ (LEAD-THICK) 852T A MPC QUALIFIED 853T EN FOUR CHANNEL (W/ENET) 357-BALL ZQ (LEAD-THICK) 853T A 855T P FOUR CHANNEL (10/100, MULTI-HDLC, ATM) 256-BALL VR (NO LEAD) 855T D4 857T SR FOUR CHANNEL (W/ENET, MULTI-HDLC, ATM) 357-BALL VR (NO LEAD) 857T B 857DSL T FOUR CHANNEL (10/100, MULTI-HDLC, ATM) 857DSL B 859DSL 859P A 859P 859T A 859T 859DSL A 860 860 D4 862 862 B 866 870 866 A 875 870 O 880 875 O 885 880 O 885 O MPC82xx PowerQUICC®™ II Processor Product Numbering Scheme MPC 8260 C A ZU IFB B3 PRODUCT CODE 8XXX SERIES DEVICE TEMP RANGE JUNCTION PROCESS PACKAGE CPU/CPM FREQUENCY DIE MASK REVISION PPC PROTOTYPE SAMPLE 8250 ETHERNET ONLY BLANK 0°C TA TO 105°C TJ BLANK HIP3 480-BALL ZU (LEAD) A50 B66 B KXPC SAMPLE PACK (2–10) 8255 LOW-COST (W/ATM) C-40°C TA TO 105°C TJ AHIP4480-BALL VV (NO LEAD) C75 D83 C XPC ENGINEERING PRODUCTION 8260 BASE (8280, 8270, 8275) 516-BALL VR (NO LEAD) E 100 F 133 MPC QUALIFIED 8264 IMA ENABLED BLANK HIP7 516-BALL ZQ (LEAD) G 150 H 166 I 200 J 208 8265 PCI OPTION K 233 L 250 8266 PCI + IMA M 266 N 291 8270 ETHERNET ONLY P 300 Q 333 8275 LOW-COST (W/ATM) R 366 S 375 8280 FULL FEATURE (IMA AND TC) T 400 U 450 V 500 W 533 MPC8323 PowerQUICC® II PRO Family Product Numbering Scheme MPC 8323 E C VR AF D C A PRODUCT CODE 8323 FAMILY DEVICE NUMBER ENCRYPTION ACCELERATION TEMP RANGE (JUNCTION) PACKAGE e300 CORE FREQUENCY DDR FREQUENCY QUICC ENGINE REVISION MPC QUALIFIED (8323, 8321) BLANK NOT INCLUDED BLANK 0°C TO 105°C ZQ 516-BALL PBGA (LEAD) AD 266 D 266 FREQUENCY CONTACT LOCAL FREESCALE E INCLUDED C-40°C TO 105°C VR 516-BALL PBGA (NO LEAD) AF 333 C 200 MHZ SALES OFFICE

MPC8349E/MPC837xE PowerQUICC® II PRO Family Product Numbering Scheme MPC 8349 E C ZU H E B PRODUCT CODE 8349 FAMILY DEVICE NUMBER ENCRYPTION ACCELERATION TEMP RANGE (JUNCTION) PACKAGE CPU FREQUENCY DDR/DDR2 FREQUENCY DIE MASK REVISION KMPC SAMPLE PACK (2-10) (8349, 8347, 8343) BLANK NOT INCLUDED BLANK 0°C TO 105°C ZU TBGA (LEAD) AD 266 D 266 B = 3.1 MPC FULL QUAL 837x FAMILY DEVICE NUMBER E INCLUDED C-40°C TO 105°C VV TBGA (RoHS) AG 400 F 333 NONE = 1.1 PPC PROTOTYPE SAMPLE (8377, 8378, 8379) ZQ PBGA (LEAD) AJ 533 G 400 VR PBGA (RoHS) AL 667 A change bar appears in the left margin to mark the location of new or revised information. SG1007–10 SG1007Q42008 PRODUCT NUMBERING (continued) MPC8360 PowerQUICC® II Pro Product Numbering Scheme MPC 8360 E C ZU H E F A PRODUCT CODE 8360 FAMILY DEVICE ENCRYPTION ACCELERATION TEMP RANGE PACKAGE CPU FREQUENCY DDR FREQUENCY QUICC ENGINE DIE REVISION KMPC SAMPLE PACK (2-10) NUMBER BLANK NOT INCLUDED BLANK 0°C TA TO 105°C TJ (TBGA) ZQ PBGA (MPC8358 ONLY) AD 266 D 266 FREQUENCY X DIE MASK REVISION MPC FULL QUAL (8360, 8358) E INCLUDED C-40°C TA TO 105°C TJ (TBGA) VR PB FREE PBGA (MPC8358 ONLY) AG 400 F 333 D 266 BLANK 0°C TA TO 105°C TJ (PBGA) ZU TBGA AJ 533 E 300 C-40°C TA TO 105°C TJ (PBGA) VV PB FREE TBGA AL 667 G 400 H 500 MPC85XX PowerQUICC® III Processor Product Numbering SchemeNote (Standard) MPC 8548 E C PX AU J B PRODUCT CODE 85XX DEVICES SECURITY TEMP RANGE (JUNCTION) PACKAGE FREQUENCY DDR SPEED DIE REVISION KMPC SAMPLE PACK (2-10) 8540, 8555, 8541, BLANK = NOT PRESENT BLANK 0° TO 105°C PX PLASTIC LEAD AJ 533 MHZ D 266 X DIE MASK REVISION MPC FULL QUAL 8548, 8547, 8545, E = PRESENT C -40° TO 105°C VT PLASTIC PB-FREE AL 667 MHZ E 300 8543, 8544, 8572, HX HICTE LEAD AN 800 MHZ F 333 8536 VU HICTE PB-FREE AP 833 MHZ G 400 AQ 1 GHZ H 500 AR 1.067 GHZ J 533 AT 1.2 GHZ K 600 AU 1.33 GHZ L 667 AV 1.5 GHZ N 800 MPC85XX PowerQUICC® III Processor Product Numbering SchemeNote (QUICC Engine Enabled) MPC 8568 E C PX AU J F B PRODUCT CODE 85XX DEVICES SECURITY TEMP RANGE (JUNCTION) PACKAGE FREQUENCY DDR SPEED QUICC ENGINE DIE REVISION KMPC SAMPLE PACK (2-10) 8560, 8567, 8568 BLANK = NOT PRESENT BLANK 0° TO 105°C PX PLASTIC LEAD AJ 533 MHZ D 266 FREQUENCY X DIE MASK REVISION MPC FULL QUAL E = PRESENT C -40° TO 105°C VT PLASTIC PB-FREE AL 667 MHZ E 300 G 400 HX HICTE LEAD AN 800 MHZ F 333 J 533 VU HICTE PB-FREE AP 833 MHZ G 400 AQ 1 GHZ H 500 AR 1.067 GHZ J 533 AT 1.2 GHZ K 600 AU 1.33 GHZ L 667 AV 1.5 GHZ N 800 MPC85XX PowerQUICC® III Processor Product Numbering SchemeNote (8540/8560 under 1 GHz) MPC 8540 E C PX 833 L B PRODUCT CODE 85XX DEVICES SECURITY TEMP RANGE (JUNCTION) PACKAGE FREQUENCY DDR SPEED REVISION KMPC SAMPLE PACK (2-10) 8560 BLANK NOT INCLUDED BLANK 0° TO 105°C PX STANDARD PACKAGE 667, 833 MHZ J 266 A1.0 MPC FULL QUAL 8540 E INCLUDED C-40° TO 105°C VT LEAD FREE 667, 833 MHZ K 300 B2.0 L 333 C3.0 U8610WXXYYYYZ U 8610 W XX YYYY Z PRODUCT CODE DEVICE NUMBER OPERATING TEMPERATURE PACKAGE CPU FREQUENCY REVISION MC QUALIFIED PRODUCTION 8610 BLANK 0° TO 105°C VT LEAD FREE FLIP CHIP PLASTIC 667N 667 MHZ CORE WITH 333 MHZ DDR1 B SILICON REVISION 1.1 KMC SAMPLES (1333 MHZ ONLY) T-40° TO 105°C BGA 800N 800 MHZ CORE WITH 400 MHZ DDR1 1000N 800 MHZ CORE WITH 500 MHZ DDR2 1066N 1066 MHZ CORE WITH 533 MHZ DDR2 1333N 1333 MHZ CORE WITH 533 MHZ DDR2

A change bar appears in the left margin to mark the location of new or revised information. SG1007–11 SG1007Q42008 PRODUCT NUMBERING (continued) UU8641DWXXYYYYAZ UU 8641 D W XX YYYY A Z PRODUCT CODE DEVICE NUMBER NUMBER OF CORES OPERATING TEMPERATURE PACKAGE CPU FREQUENCY BUS SPEED REVISION MC QUALIFIED PRODUCTION 8641 BLANK SINGLE CORE BLANK 0° TO 105°C HX LEADED SPHERE HCTE 1000 1000 MHZ G400 MHZ B SILICON REVISION 2.0 KMC SAMPLES (1333 MHZ ONLY) D DUAL CORE T-40° TO 105°C VU LEAD FREE SPHERE HCTE 1250 1250 MHZ H500 MHZ C SILICON REVISION 2.1 1333 1333 MHZ J533 MHZ 1500 1500 MHZ K600 MHZ

MPC8641

MC 8641 D VU 1500K B PRODUCT CODE DEVICE NUMBER NUMBER OF CORES PACKAGE CORE/DDR FREQUENCY REVISION BLANK SINGLE CORE HX HICTE LEAD 1000G 1000/400, STD VOLTAGE B2.0 D DUAL CORE VU HiCTE PB FREE 1000N 1000/500, LOW VOLTAGE C2.1 1333J 1333/533 STD VOLTAGE\ 1250H 1250/500 STD VOLTAGE 1500K 1500/600 STD VOLTAGE

Note: Extended temperature devices with minimum order requirements. All package/speed combinations may not be valid—consult factory to verify.

QorIQ™ COMMUNICATIONS PLATFORMS P2 Family Product Description Number of Cores CPU Frequency I/D Cache L2 Cache Memory Controller 10/100/1000 System Interfaces Security Local Bus Additional Information (MHz) Ethernet

P2020 Dual Core P2 2 800, 1000, 32 K 512 K 64b DDR2/3 with ECC 3-eTSEC with up Three PCI Express, two Serial RapidIO, Yes Enhanced www.freescale.com 1200 with ECC to two SGMII USB 2.0, SD/MMC, SPI, 2 x I2C, 16b version DUART P2010 Single Core P2 1 800, 1000, 32 K 512 K 64b DDR2/3 with ECC 3-eTSEC with up Three PCI Express, two Serial RapidIO, Yes Enhanced www.freescale.com 1200 with ECC to two SGMII USB 2.0, SD/MMC, SPI, 2 x I2C, 16b version DUART

A change bar appears in the left margin to mark the location of new or revised information. SG1007–12 SG1007Q42008 HOST PROCESSORS Host ProcessorsNote Product Packaging Speed Apps Rev Process Core Voltage SOQ MPQ POQ Additional Information Architecture (MHz) Mode Voltage IO/tol (V) 603R Not recommended for new designs. PowerPC ISA MPC603R 255-ball CBGA (RX) 200, 266, 300 L C=2.1 Hip3 2.5 ±5% 3.3, 5 1 60 60

MPC603R 255-ball CBGA (VG) 200, 300 L C=2.1 Hip3 2.5 ±5% 3.3, 5 1 60 60

MPC603R 255-ball PBGA (ZT) 200 L C=2.1 Hip3 2.5 ±5% 3.3, 5 1 60 300

MPC603RT 255-ball CBGA (RX) 200, 266 L C=2.1 Hip3 2.5 ±5% 3.3, 5 1 1 60 745B Not recommended for new designs. PowerPC ISA MPC745B 255-ball PBGA (PX) 300 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 1 60

MPC745B 255-ball PBGA (VT) 300 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 1 60 745C Not recommended for new designs. PowerPC ISA MPC745C 255-ball PBGA (PX) 350 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 44 220

MPC745C 255-ball PBGA (VT) 350 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 44 220 755B Not recommended for new designs. PowerPC ISA MPC755B 360-ball PBGA (PX) 300 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 44 220

MPC755B 360-ball CBGA (RX) 300 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 1 44

MPC755BT 360-ball CBGA (RX) 300 L E=2.8 Hip4 2.0 ±0.1 V 3.3 0 44 220

MPC755B 360-ball PBGA (VT) 300 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 44 220 755C Not recommended for new designs. PowerPC ISA MPC755C 360-ball CBGA (RX) 350, 400 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 44 220

MPC755C 360-ball PBGA (PX) 350, 400 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 44 220

MPC755CT 360-ball CBGA (RX) 350, 400 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 1 44

MPC755C 360-ball PBGA (VT) 350, 400 L E=2.8 Hip4 2.0 ±0.1 V 3.3 1 44 220 7410 Features similar to the MPC7400 with PowerPC ISA MPC7410 360-ball HiCTE (HX) 450, 500 L E=1.4 Hip6 1.8 ±0.1 V 2.5, 3.3 1 44 220 32-/64-bit L2 bus support and direct- mapped SRAM capability. High bandwidth MPC7410 360-ball HiCTE (VU) 400, 450 N E=1.4 Hip6 1.8 ±0.1 V 2.5, 3.3 1 44 220 133 MHz 64-bit MPX/60x bus interface.

MPC7410 360-ball HiCTE (VU) 450, 500 L E=1.4 Hip6 1.8 ±0.1 V 2.5, 3.3 1 44 220

MPC7410 360-pad HiCTE (VS) 450, 500 L E=1.4 Hip6 1.8 ±0.1 V 2.5, 3.3 1 44 220 Extended temperature range MPC7410T 360-ball HiCTE (HX) 500 L E=1.4 Hip6 1.8 ±0.1 V 2.5, 3.3 1 44 220 (MPC7410T only): -40°C to 105°C.

MPC7410 360-ball CBGA (RX) 400, 450 N E=1.4 Hip6 1.5 ±0.05 V, 1.8 ±0.1 V 2.5, 3.3 1 44 220 Not recommended for new designs.

MPC7410 360-ball CBGA (RX) 400, 450, 500 L E=1.4 Hip6 1.8 ±0.1 V 2.5, 3.3 1 44 220 Not recommended for new designs.

MPC7410T 360-ball CBGA (RX) 400, 450, 500 L E=1.4 Hip6 1.8 ±0.1 V 2.5, 3.3 1 44 220 Not recommended for new designs.

MPC7410T 360-ball CBGA (RX) 400, 450 N E=1.4 Hip6 1.5 ±0.05 V, 1.8 ±0.1 V 2.5, 3.3 1 44 220 Not recommended for new designs.

SG1007–13 SG1007Q42008 HOST PROCESSORS (continued) Host ProcessorsNote (continued) Product Packaging Speed Apps Rev Process Core Voltage SOQ MPQ POQ Additional Information Architecture (MHz) Mode Voltage IO/tol (V) 7447A PowerPC ISA MPC7447A 360-ball HiCTE (HX) 600, 733, 867, 1000, 1167 N B=1.1 Hip7 1.1 V ± 50 mv 2.5 1 44 220

MPC7447A 360-ball HiCTE (HX) 1000, 1267, 1333, 1420 L B=1.1 Hip7 1.3 V ± 50 mv 2.5 1 44 220

MPC7447A 360-ball HiCTE (VU) 600, 733, 867, 1000, 1167 N B=1.1 Hip7 1.1 V ± 50 mv 2.5 1 44 220

MPC7447A 360-ball HiCTE (VU) 1000, 1267, 1333, 1420 L B=1.1 Hip7 1.3 V ± 50 mv 2.5 1 44 220

MPC7447A 360-pad HiCTE (VS) 600, 733, 867, 1000, 1167 N B=1.1 Hip7 1.1 V ± 50 mv 2.5 1 44 220

MPC7447A 360-pad HiCTE (VS) 1000, 1267, 1333, 1420 L B=1.1 Hip7 1.3 V ± 50 mv 2.5 1 44 220 Extended temperature range MPC7447AT 360-ball HiCTE (HX) 1000, 1167 N B=1.1 Hip7 1.1 ± 0.05 V 2.5 1 44 220 (MC7447AT only): -40°C to 105°C. 7448 PowerPC ISA MPC7448 360-ball HiCTE (HX) 600, 667, 867, 1000, 1250, 1267, 1400 N D=2.2 Hip8 90 nm SOI 1.0 to 1.1 ± 0.05 V 1.5, 1.8, 2.5 TBD 44 220

MPC7448 360-ball HiCTE (VU) 600, 667, 867, 1000, 1250, 1267, 1400 N D=2.2 Hip8 90 nm SOI 1.0 to 1.1 ± 0.05 V 1.5, 1.8, 2.5 TBD 44 220

MPC7448 360-pad HiCTE (VS) 600, 667, 867, 1000, 1250, 1267, 1400 N D=2.2 Hip8 90 nm SOI 1.0 to 1.1 ± 0.05 V 1.5, 1.8, 2.5 TBD 44 220

MPC7448 360-ball HiCTE (HX) 1000, 1420, 1600, 1700 L D=2.2 Hip8 90 nm SOI 1.2 to 1.3 ± 0.05 V 1.5, 1.8, 2.5 TBD 44 220

MPC7448 360-ball HiCTE (VU) 1000, 1420, 1600, 1700 L D=2.2 Hip8 90 nm SOI 1.2 to 1.3 ± 0.05 V 1.5, 1.8, 2.5 TBD 44 220

MPC7448 360-pad HiCTE (VS) 1000, 1420, 1600, 1700 L D=2.2 Hip8 90 nm SOI 1.2 to 1.3 ± 0.05 V 1.5, 1.8, 2.5 TBD 44 220 MPC7448T 360-ball HiCTE (HX) 1000, 1267, 1400 N D=2.2 Hip8 90 nm SOI 1.0 to 1.1 ± 0.05 V 1.5, 1.8, 2.5 TBD 44 220 Extended temperature range: -40°C to 105°C. 7457 PowerPC ISA MPC7457 484-ball CBGA (VG) 867, 1000 N C=1.2 Hip7 1.1 ± 0.05 V 1.8, 2.5 1 36 36

MPC7457 484-ball CBGA (VG) 867, 1000, 1267 L C=1.2 Hip7 1.3 ± 0.05 V 1.8, 2.5 1 36 36

MPC7457 484-ball CBGA (RX) 867, 1000 N C=1.2 Hip7 1.1 ± 0.05 V 1.8, 2.5 1 36 36 Not recommended for new designs.

MPC7457 484-ball CBGA (RX) 867, 1000, 1267 L C=1.2 Hip7 1.3 ± 0.05 V 1.8, 2.5 1 36 36 Not recommended for new designs.

MPC7457T 484-ball CBGA (RX) 1000 N C=1.2 Hip7 1.1 V ± 0.05 V 1.8, 2.5 0 36 180 Not recommended for new designs. Note: VU, VS, VT, VG are RoHS compliant packages.

SG1007–14 SG1007Q42008 MCF5XXX PRODUCT FAMILY Product Core Dhrys 2.1 Processor Processor Serial Timers/ DMA DRAM FEC/USB/PCI Operating Operating Temp Packaging Rev Additional Information MIPS Cache SRAM Interface, CS/ Controller Voltage Frequency @ max MHz (KB) (KB) UART GPIO (V) (MHz) MCF51JM64 V1 46 n/a 16 2SCI, 2IIC, 8/0/up to 66 n/a n/a USB 2.0 FS 2.7~5.5 50 -40°C to 80 LQFP n/a CAN 2SPI OTG +105°C 64 QFP 64 LQFP 44 LQFP MCF51JM128 V1 46 n/a 8 2SCI, 2IIC, 8/0/up to 66 n/a n/a USB 2.0 FS 2.7~5.5 50 -40°C to 80 LQFP n/a CAN 2SPI OTG +105°C 64 QFP 64 LQFP 44 LQFP MCF5208 V2 159 8 Config. I/O 16 3 UARTs 8/8/up to 50 16 DDR/SDR One 10/100 1.5, 2.5, 3.3 166 -40°C to 160-pin QFP n/a 32x32 EMAC, QSPI, I2C, +85°C 196-ball Production Q4 2005. MAPBGA MCF5234 V2 142 8 Config. 64 3 UARTs 24/8/up to 142 4-CH SDRAM 1x 10/100, 1.5, 3.3 100, 150 -40°C to 256-ball n/a 16-CH eTPU. 1x CAN +85°C MAPBGA MCF5235 V2 142 8 Config. 64 3 UARTs 24/8/up to 142 4-CH SDRAM 1x 10/100, 1.5, 3.3 100, 150 -40°C to 256-ball n/a 16-CH eTPU, Crypto Enabled. 2x CAN +85°C MAPBGA MCF5270 V2 96 8 Config. I/D 64 3 UARTs 8/8/up to 39 4-CH SDRAM One 10/100 1.5, 3.3 100 0°C to 70°C 160-pin QFP n/a 32x32 EMAC, QSPI, I2C.

32x32 EMAC, QSPI, I2C. MCF5270 V2 96 8 Config. I/D 64 3 UARTs 8/8/up to 61 4-CH SDRAM One 10/100 1.5, 3.3 100 0°C to 70°C 196-ball n/a MAPBGA MCF5271 V2 96 8 Config. I/D 64 3 UARTs 8/8/up to 39 4-CH SDRAM One 10/100 1.5, 3.3 100 -40°C to 160-pin QFP n/a Hardware Encryption, 32x32 EMAC, +85°C QSPI, I2C.

Hardware Encryption, 32x32 EMAC, MCF5271 V2 96 8 Config. I/D 64 3 UARTs 8/8/up to 61 4-CH SDRAM One 10/100 1.5, 3.3 100 0°C to 70°C 196-ball n/a 2 MAPBGA QSPI, I C. MCF5272 V2 63 1 I 4 10/100 4/8/up to 32 2-CH SDRAM MAC/ 3.3 66 -40°C to 196-ball n/a MAC, HW divide, BDM, 4 TDM GCI/ FEC, MAC +PHY +85°C MAPBGA IDL ports, software HDCL module, 2 UARTs, QSPI, 3 PWMs, 5 V tolerant I/O. USB, QSPI MCF5274 V2 159 16 Config. I/D 64 3 8/8/up to 69 4-CH DDR Two 10/100, 1.5, 2.5, 3.3 166 0°C to 70°C256-ball n/a 32 x 32 EMAC, QSPI, I2C. USB 2.0 MAPBGA Full-Sp Device MCF5274L V2 159 16 Config. I/D 64 3 8/8/up to 61 4-CH DDR One 10/100, 1.5, 2.5, 3.3 166 0°C to 70°C 196-ball n/a 32 x 32 EMAC, QSPI, I2C. USB 2.0 MAPBGA Full-Sp Device MCF5275 V2 159 16 Config. I/D 64 3 8/8/up to 69 4-CH DDR Two 10/100, 1.5, 2.5, 3.3 166 -40°C to 85°C256-ball n/a Hardware Encryption, 32 x 32 USB 2.0 MAPBGA EMAC, QSPI, I2C. Full-Sp Device MCF5275L V2 159 16 Config. I/D 64 3 8/8/up to 61 4-CH DDR One 10/100, 1.5, 2.5, 3.3 166 -40°C to 85°C 196-ball n/a Hardware Encryption, 32 x 32 USB 2.0 MAPBGA EMAC, QSPI, I2C. Full-Sp Device MCF5280 V2 63 2 I 64 3 UARTs 4 Timers, 4-CH SDRAM MAC (FEC)/n/a 3.3, 5 66, 80 -40°C to 85°C256-ball n/a Enhanced CAN 2.0B controller. I2C, QSPI, +4 DMA MAPBGA Flashless version of MCF5282. FlexCAN Timers, 7 Chip Sel., Up to 150 I/O's MCF5281 V2 54 2 I 64 3 UARTs 4 Timers, 4-CH SDRAM MAC (FEC)/n/a 3.3, 5 66, 80 -40°C to 85°C 256-ball n/a Enhanced CAN 2.0B controller, I2C, QSPI, +4 DMA MAPBGA 256 KB Flash. This product FlexCAN Timers, incorporates SuperFlash® 7 Chip Sel., Up technology licensed From SST. to 150 I/Os

SG1007–15 SG1007Q42008 MCF5XXX PRODUCT FAMILY (continued) Product Core Dhrys 2.1 Processor Processor Serial Timers/ DMA DRAM FEC/USB/PCI Operating Operating Temp Packaging Rev Additional Information MIPS Cache SRAM Interface, CS/ Controller Voltage Frequency @ max MHz (KB) (KB) UART GPIO (V) (MHz) MCF5282 V2 54 2 I 64 3 UARTs 4 Timers, 4-CH SDRAM MAC (FEC)/n/a 3.3, 5 66, 80 -40°C to 85°C256-ball n/a Enhanced CAN 2.0B controller, I2C, QSPI, +4 DMA MAPBGA 512 KB Flash. This product FlexCAN Timers, incorporates SuperFlash® 7 Chip Sel., Up technology licensed From SST. to 150 I/Os MCF5327 V3 200 16K Unified 32 3 8/6/up to 94 16-CH DDR One USB 2.0 1.5, 3.3 240 -40°C to 85°C 196-ball n/a 32 x 32 EMAC, QSPI, I2C. Cache Full-Sp Host MAPBGA One USB 2.0 Full-Sp Device MCF5328 V3 200 16K Unified 32 3 8/6/up to 94 16-CH DDR One 10/100 1.5, 3.3 240 -40°C to 85°C256-ball n/a 32 x 32 EMAC, QSPI, I2C. Cache One USB 2.0 MAPBGA Full-Sp Host One USB 2.0 Full-Sp Device MCF5329 V3 200 16K Unified 32 3 8/6/up to 94 16-CH DDR One 10/100 1.5, 3.3 240 -40°C to 85°C 256-ball n/a Hardware Encryption, 32 x 32 Cache One USB 2.0 MAPBGA EMAC, QSPI, I2C, One CAN. Full-Sp Host One USB 2.0 Full-Sp Device MCF5372 V3 150 16K Unified 32 3 8/6/up to 94 16-CH DDR One 10/100 1.5, 3.3 180 -40°C to 85°C 160 QFP n/a 32 x 32 EMAC, QSPI, I2C. Cache MCF5372L V3 200 16K Unified 32 3 8/6/up to 94 16-CH DDR One 10/100 1.5, 3.3 240 -40°C to 85°C 196-ball n/a 32 x 32 EMAC, QSPI, I2C. Cache One USB 2.0 MAPBGA Full-Sp Host One USB 2.0 Full-Sp Device MCF5373 V3 150 16K Unified 32 3 8/6/up to 94 16-CH DDR One 10/100 1.5, 3.3 180 -40°C to 85°C 160 QFP n/a Hardware Encryption, 32 x 32 Cache EMAC, QSPI, I2C. MCF5373L V3 200 16K Unified 32 3 8/6/up to 94 16-CH DDR One 10/100 1.5, 3.3 240 -40°C to 85°C 196-ball n/a Hardware Encryption, 32 x 32 Cache One USB 2.0 MAPBGA EMAC, QSPI, I2C. Full-Sp Host One USB 2.0 Full-Sp Device MCF5470 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, 1.5, 2.5, 3.3 200 0°C to 70°C 388-ball n/a DSPI, I2C, MMU, FPU PCI TEPBGA Contact an authorized sales representative for product status and additional information. MCF5471 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, 1.5, 2.5, 3.3 200 0°C to 70°C 388-ball n/a DSPI, I2C, MMU, FPU, Hardware PCI TEPBGA Encrypted. Contact an authorized sales representative for product status and additional information. MCF5472 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR One 10/100, 1.5, 2.5, 3.3 200 0°C to 70°C 388-ball n/a DSPI, I2C, MMU, FPU USB 2.0D, PCI TEPBGA Contact an authorized sales representative for product status and additional information. MCF5473 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR One10,100, 1.5, 2.5, 3.3 200 0°C to 70°C 388-ball n/a DSPI, I2C, MMU, FPU, Hardware USB 2.0D, PCI TEPBGA Encrypted. Contact an authorized sales representative for product status and additional information. MCF5474 V4e 410 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, 1.5, 2.5, 3.3 266 0°C to 70°C 388-ball n/a DSPI, I2C, MMU, FPU USB 2.0D, PCI TEPBGA Contact an authorized sales representative for product status and additional information.

SG1007–16 SG1007Q42008 MCF5XXX PRODUCT FAMILY (continued) Product Core Dhrys 2.1 Processor Processor Serial Timers/ DMA DRAM FEC/USB/PCI Operating Operating Temp Packaging Rev Additional Information MIPS Cache SRAM Interface, CS/ Controller Voltage Frequency @ max MHz (KB) (KB) UART GPIO (V) (MHz) MCF5475 V4e 410 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, 1.5, 2.5, 3.3 266 0°C to 70°C 388-ball n/a DSPI, I2C, MMU, FPU, Hardware USB 2.0D, PCI TEPBGA Encrypted. Contact an authorized sales representative for product status and additional information. MCF5480 V4e 255 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, 1.5, 2.5, 3.3 166 -40°C to 85°C 388-ball n/a Two CAN, DSPI, I2C, MMU, FPU PCI TEPBGA Contact an authorized sales representative for product status and additional information. MCF5481 V4e 255 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, 1.5, 2.5, 3.3 166 -40°C to 85°C 388-ball n/a Two CAN, DSPI, I2C, MMU, FPU, PCI TEPBGA Hardware Encrypted. Contact an authorized sales representative for product status and additional information. MCF5482 V4e 255 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR One 10/100, 1.5, 2.5, 3.3 166 -40°C to 85°C 388-ball n/a Two CAN, DSPI, I2C, MMU, FPU USB 2.0D, PCI TEPBGA Contact an authorized sales representative for product status and additional information. MCF5483 V4e 255 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR One 10/100, 1.5, 2.5, 3.3 166 -40°C to 85°C 388-ball n/a Two CAN, DSPI, I2C, MMU, FPU, USB 2.0D, PCI TEPBGA Hardware Encrypted. Contact an authorized sales representative for product status and additional information. MCF5484 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, 1.5, 2.5, 3.3 200 -40°C to 85°C 388-ball n/a Two CAN, DSPI, I2C, MMU, FPU USB 2.0D, PCI TEPBGA Contact an authorized sales representative for product status and additional information. MCF55485 V4e 308 32 I, 32 D 32 4 6/6/up to 99 16-CH DDR/SDR Two 10/100, 1.5, 2.5, 3.3 200 -40°C to 85°C 388-ball n/a Two CAN, DSPI, I2C, MMU, FPU, USB 2.0D, PCI TEPBGA Hardware Encrypted. Contact an authorized sales representative for product status and additional information.

NETWORK TRANSCEIVERS — GIGABIT SERDES TRANSCEIVERSNote Product Description Max Data Rate Power Dissipation (Typ) I/O Voltage Packaging MC926032 Quad Gigabit Ethernet Transceiver (1000 Base-X) 1.25 Gbaud 1000 mW 3.3 or 2.5 256-ball MAPBGA MC926043 Dual Gigabit Ethernet Transceiver (1000 Base-X) 1.25 Gbaud 600 mW 3.3 or 2.5 196-ball MAPBGA Notes: 1. Verification boards are available to facilitate the use and evaluation of the Quad Gigabit Transceivers 2. MC92603DVB Evaluation Board for MC92603. 3. MC92604DVB Evaluation Board for MC92604.

SG1007–17 SG1007Q42008 SOFTWARE AND DEVELOPMENT TOOLS 68K, ColdFire®, MPC5xx and PowerPC ISA — CodeWarrior™ Product Description Target RTOS Board Host-Target Interface Host Language Compiler Support Support Support Platforms Support Output Formats CWS-PPC-CMWFL-CX CodeWarrior™ for PowerPC ISA QNX Neutrino; n/a PowerPC ISA Windows C/C++, ELF/DWARF 1.0, PowerPC ISA RTXC from Lineo; 2000/XP EC++, and Freescale Embedix SDK from PowerPC Semiconductor Lineo, Precise MQX, ISA, S-Record ATI Nucleus Assembly CWS-PPC-LLPLT-CX CodeWarrior™ Development PowerPC ISA Linux PowerQUICC® I, II, III and CodeWarrior™ USB Tap and Ethernet Tap Linux n/a n/a Studio for PowerPC ISA, Linux Embedded Host Platform Development CWS-PPC-LLAPP-CX CodeWarrior™ Development PowerPC ISA Linux PowerQUICC® I, II, III and CodeWarrior™ USB Tap and Ethernet Tap Linux n/a n/a Studio for PowerPC ISA, Linux Embedded Host Application Development CWS-MCF-LLPLT-CX CodeWarrior™ Development M5282, M5272 Linux M5282 n/a Linux n/a n/a Studio for ColdFire® ISA, Linux Platform Development CWS-MCF-LLAPP-CX CodeWarrior™ Development M5282, M5272 Linux M5282 n/a Linux n/a n/a Studio for ColdFire® ISA, Linux Application Development CWS-MPC-5XX-CX CodeWarrior™ Development MPC555, MPC56x Quadros RTXC, MPC555PBSLK, MPC564EVB, PowerTAP, Abatron BDI 2000, P&E Microcomputer Windows C/C++, DWARF1, Studio for MPC5xx, Embedix SDK, MQX MPC565EVB CABLEPPC (BDM only), Macraigor System BDM 2000/XP Assembly DWARF2, Node-locked Embedded, ATI STABS Nucleus, OSEKturbo CWS-MPC-5500B-CX CodeWarrior™ Development MPC55xx n/a n/a n/a Windows C/C++, DWARF1, Studio for MPC55xx, Build only 2000/XP Assembly DWARF2, tools, Node-locked license STABS CWS-MCF-PROED-CX CodeWarrior™ for ColdFire®, n/a n/a n/a n/a n/a n/a n/a Professional Edition CWS-MCF-STDED-CX CodeWarrior™ for ColdFire®, n/a n/a n/a n/a n/a n/a n/a Standard Edition CWS-68K CodeWarrior™ for 68K, n/a n/a n/a n/a n/a n/a n/a Full Product For information on all available CodeWarrior™ editions, visit www.freescale.com/codewarrior or contact your local Freescale Semiconductor Sales Office or authorized Freescale Semiconductor distributor.

SG1007–18 SG1007Q42008 SOFTWARE AND DEVELOPMENT TOOLS Hardware Tools Netcommunication Hardware Tools Product Family Device Supported Part Number Description QUICCstart Evaluation Systems MPC8XX MPC885 CWH-PPC-885XN-VX MPC855 Quickstart Evaluation System MPC83XX MPC8343 CWH-PPC-8343N-VE MPC8343 Quickstart Evaluation System MPC85XX MPC8540 CWH-PPC-8540N-VE MPC8540 Quickstart Evaluation System MPC8548 CWH-PPC-8548N-VE MPC8548 Quickstart Evaluation System MPC8555 CWH-PPC-8555N-VE MPC8555 Quickstart Evaluation System MPC8641 MPC8641D PCEVALHPC-8641DE ATX form factor evaluation board for 8641D Application Development Systems M683XX MC68EN302 M68302FADS-ENA Ethernet Adaptor Card, M68302FADS comes with MC68EN302RC25 MC8610 MC8610 PPCEVALHPCD-8610E ATX Evaluation Platform for MC8610 MPC8XX MPC823 MPC823FADS MPC823 Family Application Development System (FADS) MPC850 MPC850SRFADS MPC850 Family Development System MPC860 MPC866ADS MPC860/62/66 Development System with Wiretap MPC862 MPC866ADS MPC860/62/66 Development System with Wiretap MPC7448 MPC7448 MCEVALHPC2-7448E Hardware and Software Complete Evaluation System MPC866 MPC866ADS MPC860/62/66 Development System with Wiretap MPC852T MPC852TADS MPC852T Development System with Wiretap MPC853T TBD TBD MPC885 Family MPC885ADS MPC885 Family Development System with Wiretap MPC82XX 8260/70/80 – 480-pin TBGA PQ2FADS-ZU PQ2 Family Application Development System 8260/70/80 – 516-pin PBGA PQ2FADS-VR PQ2 Family Application Development System 8272 Family MPC8272ADS 8272 Family Application Development System All PQ2 MPC8260ADS-TCOM MPC8260 T1/T3 Communication Companion Board for ADS MPC83XX MPC8313E Family MPC8313E-RDB MPC8313E Reference Design Board MPC8323E Family MPC8323xE-MDS-PB Pb-free Processor Board MPC8349E Family MPC8349EA-MDS PowerQUICC® II Pro Development System MPC8349EA-MDS-PB Pb-free Processor Board (DDR-II only) PQ-MDS-PIBE Platform Board I/O for PowerQUICC® II Pro Family PQ-MDS-PMCPCI PMC Cards for PowerQUICC® II Pro Family PQ-MDS-USB USB Cards for PowerQUICC® II Pro Family MPC8360E Family MPC8360EA-MDS-PB MDS Pb-Free Processor Board for MPC8360E Family (Rev 2.X Silicon) PQ-MDS-T1E TI/E1 Card for MPC8360E Family PQ-MDS-QOC3 QUAD OC-3 ATM Card for MPC8360E Family MPC8377E MPC8377E-MDS-PB MPC8377E Modular Development System MPC8378E MPC8378E-MDS-PB MPC8378E Modular Development System MPC8379E MPC8379E-MDS-PB MPC8379E Modular Development System

SG1007–19 SG1007Q42008 SOFTWARE AND DEVELOPMENT TOOLS Hardware Tools (continued) Netcommunication Hardware Tools (continued) Product Family Device Supported Part Number Description MPC85XX 8540 MPC8540ADS-BGA PQ3 8540 Application Development System 8548 MPC8548CDS PQ3 MPC8548E Modular Development System 8555 MPC8555CDS PQ3 MPC8555E Configurable Development System 8560 MPC8560ADS-BGA PQ3 8560 Application Development System 8568 MPC8568E-MDS-PB PQ3 MPC8568E Modular Development System 8572 PPCEVAL-DS-8572B PQ3 8572 Development System Interface Kits MPC8XX MPC8xx, MC683xx MPC860ADI-PC Application Development Interface (ADI) for IBM PC MPC885 MPC885-FLASH Flash Chip for MPC885ADS MPC850SR, MPC860SR MPC860SR-PHY ATM PHY Board for the MPC850 and MPC860 Development Systems MPC82XX All PQ2 MPC8260ADI-COP ADI to COP Converter All PQ2 MPC8260ADS-FLASH Flash Chip for 8260ADS All PQ2 MPCRCOP-3V COP Interface Microcode Packages MPC8XX MPC860, MPC855T MPC860SWSS7-DOS Signaling System 7 Microcode MPC82XX All with PQ2/PQ3 CPM MPC8260SW-FDS Fast Data Switching (FDS) All with PQ2/PQ3 CPM MPC8260SW-MSP Multiservice Platform (MSP) All with PQ2/PQ3 CPM MPC8260SW-ESS7 Enhanced SS7 (ESS7) All with PQ2/PQ3 CPM MPC8260SW-EAAL2 Enhanced AAL2 (EAAL2) Sandpoint Boards MPC824X MPC8240 PPCEVAL-SP3-8240 Sandpoint with 8240 PMC MPC8241 PPCEVAL-SP3-8241 Sandpoint with 8241 PMC MPC8245 PPCEVAL-SP3-8245 Sandpoint with 8245 PMC MPC8245 PPCDEV-SP3-8245 Sandpoint Dev with PMC MITXE Boards MPC8349E Family MPC8349E MPC8349-MITXE MPC8349 Mini-ITX System Board MPC8349-MITX-GP MPC8349 Mini-ITX System Board Industrial MPC8377E Family MPC8377E MPC8377E-RDB MPC837E Mini-ITX System Board MPC8379E Family MPC8379E MPC8379E-RDB MPC8379E Mini-ITX System Board Reference Design Boards MPC8323E Family MPC8323E MPC8323E-RDB MPC8323E Integrated Multiservice Gateway Reference Design

A change bar appears in the left margin to mark the location of new or revised information. SG1007–20 SG1007Q42008 SOFTWARE AND DEVELOPMENT TOOLS (continued) Third Party Tools and Solutions Third Party Vendor Families Supported Operating Compilers and Software Coverification Tools Emulators and Logic Boards and Support Drivers / Application Software Systems Code Generation Debuggers and Simulation Diagnostic Tools Analyzers Systems Chips Protocol Framework Components PowerQUICC® Host Proc DSP Tools Models Stacks Abatron •• • • Agilent Technologies • • • • ALT Software • • Altium • • • Apogee Software •• Artis Microsystems • • • Ashley Laurent • • Blunk Microsystems • • • Cadence CoWare • CMX Systems •• • • CodeSourcery • • • Corelis •• • • Crescent Bay Software • • Curtiss-Wright • • Data Connection • • Effnet • • Embedded Planet • • Emerson • • EmuTec • • • Enea Embedded Technologies •• • • Eureka Technology • • • Everbee Networks • • Express Logic • • • Falconstor • • Flextronics • • • Freescale •• • • • • ••••• FSMLabs • • • GDA Technologies •• • Genesi • • • Green Hills Software •• • • • • • IneoQuest Technologies • • International Test Technologies • • Intoto • IP Infusion • • Isystem • • • JMI Software •• • Jungo • • • Kadak •• • Kapersky Labs • • SG1007–21 SG1007Q42008 NOTES

SG1007–22 SG1007Q42008 NOTES

SG1007–23 SG1007Q42008 How to Reach Us:

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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved. SG1007Q42008 Rev 0 09/2008