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MSR 2002 – „Einzelbeihilfe an Qimonda”

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MSR 2002 – „Einzelbeihilfe an Qimonda” EUROPÄISCHE KOMMISSION Brüssel, den 30.I.2008 K(2008)306 endg. Betreff: Staatliche Beihilfe N 872/2006 – Deutschland MSR 2002 – „Einzelbeihilfe an Qimonda” Sehr geehrter Herr Bundesminister! 1. VERFAHREN (1) Mit elektronischer Anmeldung vom 21. Dezember 2006, die am selben Tag bei der Kommission registriert wurde (A/40539), teilten die deutschen Behörden der Kommission gemäß der Einzelanmeldepflicht in Randnummer 24 des multisektoralen Regionalbeihilferahmens für große Investitionsvorhaben1 (nachstehend „MSR 2002) ihre Absicht mit, der Qimonda Dresden GmbH & Co OHG für das Investitionsvorhaben QD 2010 zur Herstellung von (DRAM2-Wafern (Speichertechnologieprodukte) in Dresden (Sachsen, Deutschland) eine regionale Investitionsbeihilfe zu gewähren. (2) Die deutschen Behörden übermittelten mit Schreiben vom 2. Februar 2007, das am selben Tag bei der Kommission eingetragen wurde (A/31060), 16. Februar 2007, das am selben Tag bei der Kommission eingetragen wurde (A/31457) und 27. März 2007, das am selben Tag bei der Kommission eingetragen wurde (A/32658), zusätzliche Informationen. (3) Mit Schreiben vom 28. März 2007 (D/51393) forderte die Kommission zusätzliche Informationen an, die von den deutschen Behörden mit einem Schreiben übermittelt wurden, das bei der Kommission am 7. Mai 2007 registriert wurde (A/33811). 1 Mitteilung der Kommission − Multisektoraler Regionalbeihilferahmen für große Investitionsvorhaben, ABl. C 70 vom 19.3.2002, S. 8, geändert mit der Mitteilung der Kommission betreffend die Änderung des multisektoralen Regionalbeihilferahmens für große Investitionsvorhaben (2002) in Bezug auf die Aufstellung einer Liste von Sektoren mit strukturellen Problemen und den Vorschlag zweckdienlicher Maßnahmen gemäß Artikel 88 Absatz 1 EG-Vertrag für die Kfz- und die Kunstfaserindustrie, ABl. C 263 vom 1.11.2003, S. 3. 2 DRAMs: Dynamic Random Access Memory − dynamische Schreib-Lesespeicher mit wahlfreiem Zugriff. Seiner Exzellenz Herrn Frank-Walter STEINMEIER Bundesminister des Auswärtigen Werderscher Markt 1 D - 10117 Berlin Commission européenne, B-1049 Bruxelles – Europese Commissie, B-1049 Brussel – Belgium Telephone: 00 32 (0) 2 299.11.11 (4) Mit Schreiben vom 6. Juli 2007 (D/52852) forderte die Kommission zusätzliche Informationen an. Mit Schreiben, die bei der Kommission am 24. August 2007 (A/36965) und am 5. Oktober 2007 (A/38119) registriert wurden, baten die deutschen Behörden die Kommission um eine Verlängerung der Frist für die Übermittlung dieser zusätzlichen Informationen, die die Kommission gewährte. Die deutschen Behörden übermittelten die zusätzlichen Informationen mit Schreiben vom 16. November 2007, das bei der Kommission am selben Tag registriert wurde (A/39465). Mit Schreiben vom 18. Dezember 2007, das am selben Tag bei der Kommission registriert wurde (A/40467), übermittelten die deutschen Behörden weitere zusätzliche Informationen. 2. BESCHREIBUNG DER BEIHILFEMASSNAHME (5) Die deutschen Behörden beabsichtigen, die Entwicklung in der Region Dresden zu fördern, indem sie Qimonda Dresden GmbH & Co OHG eine regionale Beihilfe für ein Investitionsvorhaben zur Herstellung von DRAM-Wafern gewähren. DRAMs (auch bekannt als „Speicherchips“) sind kleine und äußerst komplexe Mikrochips, die in Computern, Unterhaltungselektronik, Spielkonsolen, Mobilkommunikation, Haushaltsgeräten und anderen elektronischen Geräten eingesetzt werden. Durch die Investition werden voraussichtlich rund 480 neue direkte Arbeitsplätze geschaffen. (6) Dresden liegt im Freistaat Sachsen, einem Fördergebiet im Sinne von Artikel 87 Absatz 3 Buchstabe a EG-Vertrag mit einer Beihilfehöchstintensität von 35 % Bruttosubventionsäquivalent (BSÄ)3 gemäß der deutschen Fördergebietskarte für den Zeitraum 2004-20064. 2.1 Beihilfeempfänger (7) Beihilfeempfänger ist die Qimonda Dresden GmbH & Co OHG5 (nachstehend „Qimonda“), die als 100%ige Tochter der Qimonda AG zur Qimonda-Gruppe gehört. (8) Qimonda wurde mit Wirkung zum 1. Mai 2006 gegründet, als Infineon Technologies AG, München, (nachstehend „Infineon“) den Geschäftsbereich „Memory Products“ (Speicherprodukte) in die Qimonda AG ausgliederte. Bis zum 1. Mai 2006 bestand die Infineon-Gruppe aus den Geschäftsbereichen „Automotive, Industrial and Multimarket (AIM)“, „Communication solutions (COM)“ und „Memory Products (MP)“. 3 Die deutsche Fördergebietskarte 2004-2006 sieht standardmäßig eine Beihilfeobergrenze von 28 % brutto für große Unternehmen in dieser Region vor. In Ausnahmefällen ist jedoch gemäß dieser Fördergebietskarte für Großunternehmen eine Obergrenze von 35 % zulässig. Wenn bestimmte Bedingungen kumulativ erfüllt sind, kann ein regionaler Beihilfehöchstsatz von 35 % brutto zur Anwendung kommen. Auf Antrag eines Bundeslandes und mit Zustimmung des Unterausschusses des GA-Planungsausschusses können in begründeten Ausnahmefällen Maßnahmen, die einem internationalen Standortwettbewerb ausgesetzt sind, mit höheren Beihilfeintensitäten gefördert werden. Der Unterausschuss entschied am 9. November 2006, dass dem Antrag des Freistaates Sachsen in Bezug auf das Investitionsvorhaben von Qimonda in Dresden stattgegeben werden kann. Im vorliegenden Fall gilt somit ein regionaler Beihilfehöchstsatz von 35 % brutto. 4 Beschluss der Kommission vom 2. April 2003 betreffend die Maßnahme N 641/2002 − Deutsche Regionalbeihilfekarte 2004 bis 2006, ABl. C 186 vom 6.8.2003, S. 18. 5 Früher firmierte das Unternehmen als „Infineon Technologies SC 300 GmbH & CO. OHG“. 2 (9) Nach der Ausgliederung des Geschäftsbereichs MP in Qimonda ist Infineon nicht mehr auf den gleichen Märkten tätig wie Qimonda. Infineon stellt keine DRAMs her, sondern bietet Halbleiter- und Systemlösungen für ausgewählte Industrien an (z. B. die Automobil- und Industrieelektronik sowie für Anwendungen in der drahtgebundenen Kommunikation und sichere mobile Lösungen). Den deutschen Behörden zufolge stehen die beiden Unternehmen daher nicht in einem Wettbewerbsverhältnis zueinander, und es bestehen zwischen den beiden Unternehmen auch keine vertikalen Beziehungen, d. h. weder Infineon noch Qimonda sind auf vor- bzw. nachgelagerten Märkten tätig. (10) Qimonda ist eine Aktiengesellschaft, die seit dem 9. August 2006 an der NYSE notiert ist. Zum Zeitpunkt der Anmeldung hielt Infineon 85,9 % der Anteile an Qimonda6 (49,63 % über Infineon Technologies Investment B.V. (Rotterdam, Niederlande) und 36,85 % über Infineon Technologies AG, (München, Deutschland)). Die übrigen Anteile werden von verschiedenen Aktionären gehalten. Mittelfristig plant Infineon im Rahmen seiner Konzernstrategie die Beteiligung an Qimonda weiter zurückzuführen und damit die Kontrolle aufzugeben. Den deutschen Behörden zufolge werden die Qimonda-Aktien nicht unbedingt nur an der NYSE gehandelt, sondern unter Umständen auch an einzelne Investoren oder Investorengruppen verkauft. Die deutschen Behörden versicherten, dass zum Zeitpunkt der Anmeldung keine konkreten Verhandlungen mit Investoren geführt wurden. (11) Qimonda ist ausschließlich in der Entwicklung, Produktion und Vermarktung von DRAMs tätig. Das Unternehmen verfügt über Produktionsstätten auf drei Kontinenten. Das so genannte „Front-end manufacturing“ findet statt in Dresden (Deutschland), Richmond (Virginia, USA), Taiwan und China, das „Back-end manufacturing“ in Malacca (Malaysia), Suzhou (China), Porto (Portugal) und Dresden (Deutschland). Im Geschäftsjahr 2005/2006 zählte die Qimonda-Gruppe 11 802 Mitarbeiter in ihren Niederlassungen und Werken weltweit (4 684 in Deutschland). (12) Das Geschäftsjahr von Qimonda läuft vom 1. Oktober bis zum 30. September. Die Qimonda-Daten für das Geschäftsjahr 2005/2006 sind im konsolidierten Gesamtumsatz des Infineon-Konzerns enthalten. In der nachstehenden Tabelle ist der Umsatz von Infineon im Geschäftsjahr 2005/2006 ausgewiesen. Infineon (Konzern) Umsatz (in Mio. Geschäftsjahr: 2005/2006 EUR) Deutschland 1 348 EWR 2 696 Weltweit 7 929 2.2 Das Investitionsvorhaben Bestehende DRAM-Produktionsanlagen von Qimonda und Infineon in Dresden (13) In Dresden stellt Qimonda derzeit in drei Produktionsanlagen Speicherchip-Wafer her, die mit Modul 1, Modul 2 und Modul 3 bezeichnet werden. 6 Informationen in den Medien zufolge hält Infineon gegenwärtig 78,6 % der Anteile an Qimonda. 3 (14) Modul 1 und Modul 2 sind Produktionsanlagen auf der Basis der 200mm-Wafer- Technologie7. Die Module 1 und 2 wurden 1996 fertig gestellt und verbleiben auch nach der Ausgliederung des Speichergeschäfts in die Qimonda weiterhin bei Infineon. Die Fertigungskapazitäten der Module 1 und 2 werden derzeit zur Hälfte von Infineon zur Herstellung von Logikchips (z. B. Mikrocontroller, Transceiver, Sensoren) für den Automobilsektor und für Anwendungen in der Industrieelektronik, auf Chip-Karten und in der Kommunikation genutzt. Die andere Hälfte wird – aufgrund eines Liefervertrages8 – von Qimonda zur Fertigung von 110nm9-DRAMs genutzt. Die Produktionskapazität der Module 1 und 2 entspricht rund […]* WSPW10 (umgerechnet in 300mm-Äquivalente). (15) Modul 3, bei dem es sich um Anlagen für die Produktion von DRAM-Wafern auf der Basis der 300mm-Wafer-Technologie handelt, ist Eigentum von Qimonda. Der Bau von Modul 3 wurde 2003 abgeschlossen und mit einer regionalen Investitionsbeihilfe gefördert11. Modul 3 wird gegenwärtig ausschließlich von Qimonda zur Herstellung von DRAMs genutzt und weist eine Produktionskapazität von rund [...] WSPW auf. Die gegenwärtig in Modul 3 gefertigten 90nm-DRAM-Wafer sind der Anmeldung zufolge in absehbarer Zeit nicht mehr wettbewerbsfähig. Den deutschen Behörden zufolge ist eine Volumenproduktion
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