Trends in RF/Wireless Packaging An Overview, 2004 Don Brown, Director Rene Douville, Technical Director International Wireless Packaging Consortium ™ TEL: 215-293-9000
[email protected] http://www.iwpc.org Outline • Thank You for your slides • About IWPC • Conclusions • Wireless Industry Overview • Portable and Mobile Wireless • Infrastructure & Broadband Equipment •MMwave • Automotive • Antennas • Shielding • Materials • Environmental Issues (RoHS) • Other Advanced Packaging Technology Options • Collaboration Thank You for your Slides • Agere • Merrimax •AMKOR • Microsoft • Arlon • Motorola • ASCOM • Motorola •BWA • Nortel • Cambridge Silicon Radio (CSR) • Ogier Electronics • Celestica • Park Nelco • Chip Pak • Perlos • Continental Temec • Philips Semiconductors •CTIA • Polyphaser • Daimler Chrysler • Raytheon • Dr. Robert Heile •RFM • Emerson & Cuming • Road Eye • Endwave • Rogers •IBM • Rosenberger • Imbera • Samsung • Infineon • Saratel •Intel • Skyworks • Kyocera • Texas Instruments • Laird Technologies • WL Gore •M/A-COM • Xytrans About IWPC IWPC Mission Founded 1998 The International Wireless Packaging Consortium, IWPC, is a pro-active organization of 115+ WIRELESS and RF PRODUCT OEM’s and their SUPPLIERS. Our mission is to facilitate communication up and down the entire wireless industry supply chain, to: – Identify/Clarify New/Existing Markets and Product/Service Opportunities – Reduce Costs – Improve performance and – Decrease time to market ... with an emphasis on packaging and interconnect technologies. Our Definition of Packaging • From sand to systems IWPC Members (as of May 2004) 3M Flextronics PCH International Aeroflex Fujitsu Quantum Devices Perlos Corp. Agere Harris Corp. Philips Agilent HEI Inc. PMC-Sierra Alcatel Hitachi Chemical Polyphaser Amkor Hittite Microwave Powerwave Tech. ANADIGICS Huber + Suhner Radio Frequency Systems Analog Devices Hughes Raytheon Andrew Corp. Hypres Renaissance Electronics Arlon Inc. IBM Research In Motion (RIM) BridgeWave Comm.