Product Selector

EPON™ and EPI-REZ™

Our Products for America (North and South) We are the Epoxy Business of Hexion, Key Benefits one of the world’s leading suppliers of epoxy resins, curing agents, modifiers EPON resins, in thermoset systems and epoxy systems. We offer a diverse with our curing agents and modifiers, line of epoxy resins that vary in chemical offer advantages such as: structure, molecular weight, viscosity ■■ Low room temperature viscosity and functionality—providing the ■■ Long working life formulator with a multitude of options. ■■ Low moisture absorption What’s more, our products have over sixty years of innovation and success in ■■ Superior epoxy performance a wide variety of markets and end-use ■■ Flexibility Qualifying a system that applications. ■■ Reactivity offers the best balance of At our world-class technology centers ■■ High elongation performance and processability in the U.S., Europe and Asia Pacific ■■ Adjustable cure times we pursue advanced processing ■■ Good chemical and corrosion can be a significant challenge. technologies while creating new resin resistance You not only need quality products products and systems with broad performance ranges. We bring you ■■ Heat resistance from a reliable supplier, you need processing advantages such as easy ■■ Fire retardance a company that is willing to share workability at room temperature with variable cure rates, and help you create its technical expertise and that will products with special characteristics provide services to help satisfy your such as flexibility, good chemical and resistance, and superior unique requirements. That’s where performance in elevated temperature Hexion Inc. comes in. service. By continually tackling technical challenges in our application laboratories, we are able to translate real world requirements into high quality, production-oriented materials. The EPON™ and EPI-REZ™ families of resins were developed to provide superior overall performance in a variety of end-use applications. These products enable manufacturers to achieve nearly any desired performance level, while optimizing processability and strength retention at elevated temperatures. At A Glance EPON™ – Liquid Epoxy Resins and Blends 6–7 This segment of our product line represents the most widely used products in a number of industries. The most commonly used EPON Resin/V. C. HELOXY™ Modifier blends are available in several types and viscosity grades.

EPON – Epoxy Resin Solutions 8–10 These products are higher molecular weight standard or modified which are dissolved in to allow easier handling and formulation because of lower viscosity.

EPON – Solid and Powder Grade Resins 10 –11 These epoxy resins are in the molecular weight range most suitable for use in epoxy solutions, powder coating, composite and electronic applications. These products have a good balance of properties, including appropriate epoxy functionality for proper curing, good physical stability (sintering resistance), and good melt flow (low melt viscosity).

EPON – Epoxy Novolac Resins 12 These products are specifically designed to provide increased levels of thermal stability and chemical resistance, and are used in composites, structural , electronics / electrical and coating applications.

EPON – Epoxy Polyacrylates 13 These are very low viscosity resins possessing excellent wetting characteristics and rapid reaction rates with curatives over a broad temperature range.

EPON – Elastomer Modified Epoxy Resins 13 These products offer improved properties, thermal shock resistance and toughness, with good fatigue resistant properties.

EPONEX™ – Cycloaliphatic Resin 13 This segment offers a low viscosity liquid epoxy based on hydrogenated Bisphenol A for applications requiring UV resistance.

EPON and EPONOL™ – Electrical Laminating Resins 14 These products can be used to obtain fire retardance in a base epoxy resin formulation. The ultra-high molecular weight resin can be used to improve flexibility and modify the flow properties of the system.

EPON and EPIKOTE™ – Epoxy Resins for Composites 14 Epoxy resins that provide the property retention, toughness and corrosion protection required in composite applications.

■ EPI-REZ™ – Epoxy Waterborne Resins 15 These non-ionic aqueous dispersions of our epoxy resins provide benefits such as lower VOC, extended pot life, high crosslink density, high temperature performance, very good chemical resistance, B-stage capability, low color, and complete water-reducibility. Many of the Hexion EPIKURE™ Curing Agents can be used with these epoxy dispersions. In addition, since dicyandiamide is water soluble, it may be used to provide extended pot life formulations.

2 The Formulator’s Choice All of our products are manufactured to high standards of quality and have very specific property ranges. To help you assess the many production and performance advantages of Hexion’s complete line of resins, we’ve summarized typical properties and resin characteristics in this product bulletin. The data in this bulletin is intended to give only basic product information for quick reference—individual product technical data sheets with additional information are available for most of the products listed in the following pages. For additional information about these products, or to contact us, visit the Epoxy, Curing Agents and Modifiers section of the Hexion website at www.hexion.com/epoxy

Resin Solution Coding System Epoxy resins employ a simple three-part coding system for designating the composition of resin solutions. The coding system consists of a number indicating the epoxy resin used in the particular solution, followed by one or more letters that describe the solvent or combination of used to make up the solution. The last two numbers indicate the percent solids (by weight) of the composition. For example:

EPON™ Resin 1001-H-75 In this example, the base resin used to make this solution is the EPON Resin 1001F type. The solvent used is Monomethyl Ether (PM), as shown in the next table, and the solids content is 75 percent by weight. The coding system that is used to designate the solvents in resin solutions is shown on the next table (pg 5):

3 Solvent Coding System

Letter Solvent Name Abbr Non HAPS 1 VOC Exempt 2 Code A Acetone Yes Yes B Methyl Ethyl Ketone MEK Yes C Methyl Isobutyl Ketone MIBK D Diacetone Alcohol DAA Yes E Isopropyl Alcohol IPA Yes F n-Butyl Alcohol (Converting to Code "N") NBA Yes G n-Butyl Acetate NBAC Yes H Propylene Glycol Monomethyl Ether PGMME / PM Yes I iso-Butyl Alcohol Yes J Ethyl 3-Ethoxy Propionate EEP K t-Butyl Acetate TBAC Yes Yes L Propylene Glycol Mono n-Butyl Ether PGMnBE / PnB Yes M Monobutyl Ether EGMBE / EB Yes N n-Butyl Alcohol NBA Yes O Methyl n-Amyl Ketone MNAK Yes P n-Propyl Alcohol NPA Yes Q Propylene Glycol Monomethyl Ether Acetate PGMMEA / PMA Yes R Dimethyl Formamide DMF S Cyclohexanone Yes

T Toluene U Aromatic 100 A 100 < 5% HAPS V Dipropylene Glycol Monomethyl Ether DPGME Yes W Water Yes Yes X Xylene Y Ethylene Glycol Monopropyl Ether EGMPE / EP

1 HAP is the acronym for hazardous air pollutant as defined by the U.S. Clean Air Act Amendments of 1990. 2 VOC is the acronym for Volatile Organic Compound as defined by the U.S. 40 CFRS1.100 (s). VOC exempt solvents are classified as such by the U.S. EPA, local state and regional air quality districts.

4 Table 1: Typical Properties of EPON™ Unmodified Liquid Epoxy Resins

Product Chemical Type Viscosity Weight per Color1 Density Comments at 25 °C (P) Epoxide (max) (lb/gal) EPON 825 DGEBPA 50 – 65 175 –180 250 9.7 Ultra high purity, low viscosity liquid epoxy used for high solids coatings and specialty composites. EPON 826 DGEBPA 65 – 95 178 –186 250 9.7 Low viscosity liquid epoxy used in coatings and composite applications. EPON 827 DGEBPA 80 –100 179 –184 100 9.7 Medium viscosity liquid epoxy resin that falls between EPON 826 and EPON 828. It is used mainly in composite applications.

EPON 828 DGEBPA 110 –150 185 –192 250 9.7 Predominant liquid epoxy product, widely used in multiple applications. EPON 830 DGEBPA 170 – 225 190 –198 250 9.7 Higher molecular weight liquid epoxy. EPON 834 DGEBPA 3.5 – 9 2 230 – 280 200 9.7 Highest molecular weight liquid epoxy used in adhesives and as a modifier of liquid epoxy systems. EPON 862 DGEBPF 25 – 45 165 –173 200 9.8 Low viscosity Bisphenol F liquid epoxy used alone or in blends with other resins. Allows high solids formulations with good chemical resistance. A high performance alternative to diluted EPON 828 resins. EPON 863 DGEBPF 25 – 45 165 –174 200 9.9 Comparable performance to EPON 862 with improved crystallization resistance.

1 Platinum-Cobalt Color Scale 2 70% by weight solution in Diethylene Glycol Monobutyl Ether

Table 2: Typical Properties of EPON Modified Liquid Epoxy Resins

Product Chemical Type Viscosity Weight per Color1 Density Comments at 25 °C (P) Epoxide (max) (lb/gal) EPON 824 Modified 40 – 70 192 – 204 250 9.6 Liquid epoxy modified for low viscosity and may be used as DGEBPA an alternative to diluted EPON 828 resins. Offers improved crystal resistance. EPON 829 Modified 30 – 70 193 – 203 250 9.6 Liquid epoxy resin pre-catalyzed for subsequent DGEBPA up-staging with BPA. EPON 8280 Modified 110 –150 185 –195 250 9.7 Anti-foaming and anti-settling modified liquid epoxy resin DGEBPA for systems with fillers and pigments. EPON 8281 Modified 110 –140 182 –195 250 9.7 Anti-foaming and anti-settling modified liquid epoxy resin DGEBPA for silica filled systems. EPON 872 Modified 15 – 38 2 625 – 725 10 3 9.0 Liquid epoxy modified for flexibility and toughness. Used DGEBPA in applications where thermal shock or impact resistance is important.

1 Platinum-Cobalt Color Scale 2 75% by weight solution in Xylene 3 Gardner Color Scale

5 Table 3: Typical Properties of EPON™ Epoxy Resin Blends

Product Chemical Viscosity Weight per Color1 Density Comments Type at 25 °C (P) Epoxide (max) (lb/gal) EPON 235 DGEBPA/ 60 – 80 177–182 200 9.8 Blend of BPA and BPF liquid epoxy resins. DGEBPF It provides lower viscosity than standard LER as well as improved crystallization resistance. EPON 813 Modified 5 – 7 180 –195 75 9.5 Liquid epoxy with HELOXY 62 – DGEBPA Cresyl Glycidyl Ether, for good chemical and crystallization resistance. EPON 815C Modified 5 – 7 180 –195 250 9.4 Liquid epoxy with HELOXY 61 – DGEBPA Butyl Glycidyl Ether, providing superior wetting characteristics. EPIKOTE™ 816 Modified 1.5 – 2.1 189 – 200 200 9.4 Liquid epoxy with CARDURA E10P - glycidyl ester of DGEBPA neodecanoic acid, for good pigment wetting and resistance to filler settling. Offers good resistance to crystallization. EPON 8112 Modified 7–10 182 –190 250 9.4 Similar to EPON 815C with slightly higher viscosity. DGEBPA EPON 8131 Modified 11 –16 245 – 275 500 9.2 Liquid epoxy with HELOXY 505 – DGEBPA Castor Oil Glycidyl Ether, for flexibility in flooring and adhesive applications. EPON 8132 Modified 5 – 7 195 – 215 250 9.2 Liquid epoxy with HELOXY 8 – DGEBPA Alkyl Glycidyl Ether, utilized in a broad range of applications. EPON CS 241 Modified 22.5 – 27.5 190 – 200 250 9.6 Liquid epoxy with HELOXY 8 – DGEBPA Alkyl Glycidyl Ether. A higher viscosity version of EPON 8132. EPON CS 242 Modified 13.5 –18.5 195 – 205 50 9.4 Liquid epoxy modified with HELOXY 8 – DGEBPA Alkyl Glycidyl Ether. A medium viscosity version of EPON 8132 most often used in flooring systems. EPON CS 243 Modified 52 – 58 187–195 50 9.6 Liquid epoxy with HELOXY 8 – DGEBPA Alkyl Glycidyl Ether that provides easier handling with good overall performance. EPON CS 377 Modified 75 – 95 182 –196 200 9.6 Resin solution, 96% solids with HELOXY 65 – DGEBPA p-tert-Butyl Phenyl Glycidyl Ether. EPON 8201 Modified 50 – 65 180 –195 250 9.7 Liquid epoxy with HELOXY 62 – DGEBPA Cresyl Glycidyl Ether and modified for anti-settling and anti-foaming, primarily used in highly filled systems.

1 Platinum-Cobalt Color Scale

6 Table 4: Typical Properties of EPON™ Liquid Epoxy Solutions

Product Chemical Viscosity Weight per Color1 Density Comments Type at 25 °C (P) Epoxide (max) (lb/gal) EPON 828-X-95 DGEBPA 15 – 45 193 – 204 2 9.5 Resin solution, 95% solids in Xylene. Solution EPON 834-F-90 DGEBPA 46 –148 225 – 265 3 9.3 Resin solution, 90% solids in n-Butanol. Solution EPON 834-X-80 DGEBPA 4.5 –18 230 – 280 3 9.2 Resin solution, 80% solids in Xylene. Solution EPON 834-X-90 DGEBPA 63 – 590 230 – 280 3 9.5 Resin solution, 90% solids in Xylene. Solution EPON 836-C-75 DGEBPA 3 – 6.5 280 – 335 3 8.9 Resin solution, 75% solids in MIBK. Solution EPON 8521-MX-60 Modified 17.5 – 36 750 – 850 3 8.8 Modified resin solution, 60% solids in Ethylene Glycol DGEBPA Monobutyl Ether/Xylene, for improved surface tension Solution characteristics. EPON 872-X-75 Modified 20 – 28 625 – 700 6 8.4 Modified resin solution, 75% solids in Xylene, for DGEBPA applications needing flexibility and toughness. Solution EPON 873-CX-80 Modified 4.5 – 23 380 – 420 5 8.6 Modified resin solution, 80% solids in MIBK/Xylene, for DGEBPA applications needing flexibility, toughness and reduced Solution VOC levels. EPON 874-B-90 Modified 515 –1213 245 – 275 6 9.1 Modified resin solution, 80% solids in MEK, for DGEBPA applications needing flexibility, toughness and reduced Solution VOC levels. EPON 874-CX-90 Modified 13 – 27 245 – 275 6 9.1 Modified resin solution, 90% solids in MIBK/Xylene, for DGEBPA applications needing flexibility, toughness and reduced Solution VOC levels.

EPIKOTE™ 874L-X-90 Modified 21 – 23 230 – 270 3 9.2 Modified resin solution, 90% solids in MIBK/Xylene, for DGEBPA applications needing higher flexibiity, toughness, and Solution lower VOC levels

1 Gardner Color Scale

7 Table 5: Typical Properties of EPON™ Solid Epoxy Solutions

Product Chemical Viscosity at Weight per Color1 Density Comments Type 25 °C (P) Epoxide (max) (lb/gal) EPON 1001-A-80 DGEBPA 45 – 70 450 – 550 3 9.2 Resin solution, 80% solids in Acetone Solution (VOC Exempt). EPON 1001-B-80 DGEBPA 27–148 450 – 550 3 9.1 Resin solution, 80% solids in MEK. Solution EPON 1001-CX-75 DGEBPA 27–148 450 – 550 3 9.0 Resin solution, 75% solids in MIBK/Xylene. Solution EPON 1001-DNT-75 DGEBPA 15 – 40 500 – 575 2 9.2 Resin solution, 75% solids in Diacetone Alcohol/ Solution n-Butanol/Toluene EPON 1001-FT-75 DGEBPA 27–148 450 – 600 3 9.1 Resin solution, 75% solids in n-Butanol/Toluene. Solution EPON 1001-G-70 DGEBPA 15 – 64 450 – 500 2 9.2 Resin solution, 75% solids in n-Butyl Acetate. Solution EPON 1001-H-75 DGEBPA 36 – 388 450 – 600 3 9.2 Resin solution, 75% solids in Propylene Glycol Solution Monomethyl Ether. EPON 1001-K-65 DGEBPA 15 – 45 450 – 550 3 8.8 Resin solution, 65% solids in t-Butyl Acetate Solution (VOC-exempt). EPON 1001-O-75 DGEBPA 27–148 450 – 550 3 9.0 Resin solution, 75% solids in MNAK. Solution EPON 1001-T-75 DGEBPA 36 – 388 450 – 550 3 9.1 Resin solution, 75% solids in Toluene. Solution EPON 1001-UY-70 DGEBPA 36 – 64 450 – 500 3 9.0 Resin solution, 70% solids in Aromatic Solution 100/Ethylene Glycol Monopropyl Ether. EPON 1001-X-75 DGEBPA 36 – 388 450 – 555 3 9.1 Resin solution, 75% solids in Xylene. Solution EPON 1004-O-65 DGEBPA 27 – 99 880 – 985 3 8.7 Resin solution, 65% solids in MNAK. Solution EPON 1007-CT-55 DGEBPA 23 – 64 1,600 – 2,300 3 8.4 Resin solution, 55% solids in MIBK/Toluene. Solution EPON 1007-FMU-50 DGEBPA 27 – 64 1,600 – 2,300 3 8.3 Resin solution, 50% solids in n-Butanol/Ethylene Glycol Solution Monobutyl Ether/Aromatic 100. EPON 1007-HT-55 DGEBPA 27 – 64 1,600 –1,900 2 9.0 Resin solution, 55% solids in Propylene Glycol Solution Monomethyl Ether/Toluene. EPON 1009-DU-40 DGEBPA 11 – 27 2,300 – 3,500 1 8.3 Resin solution, 40% solids in Diacetone Alcohol/ Solution Aromatic 100. EPON 1009-MX-40 DGEBPA 6 – 23 2,300 – 3,000 1 8.3 Resin solution, 40% solids in Ethylene Glycol Solution Monobutyl Ether/Xylene.

1 Gardner Color Scale

8 Table 6: Typical Properties of EPON™ Solid Epoxy Custom Solutions

Product Chemical Viscosity Weight per Color1 Density Comments Type at 25 °C (P) Epoxide (max) (lb/gal) EPON CS 258 DGEBPA 40 – 65 2,250 – 2,455 1 8.9 Resin solution, 50% solids in Propylene Glycol Monomethyl Ether Solution Acetate. EPON CS 267 Modified 13 – 36 2,700 – 3,300 3 8.8 High molecular weight resin modified for high toughness, 65% DGEBPA solids in Propylene Glycol Monomethyl Ether Acetate/Toluene. Solution

1 Gardner Color Scale

Table 7: Typical Properties of EPON Solid Epoxy Resins – Fusion Grades

Product Chemical Solution Weight per Color2 Softening Melt Comments Type Viscosity 1 Epoxide (max) Point °C Viscosity at 25 °C (cP) at 150 °C (P) EPON 1001F DGEBPA 7.0 – 9.6 525 – 550 200 79 4 – 5 Lowest molecular weight solid epoxy used to provide improved toughness, flexibility, flow control and tack. Standard resin for coatings and pre-preg. Susceptible to sintering. Density 1.20 g/ml. EPON 1002F DGEBPA 9.2 –13.6 600 – 700 200 85 12 – 25 Slightly higher molecular weight than EPON 1001F. Better sintering resistance. Density 1.20 g/ml. EPON 1004F DGEBPA 15 – 25 800 – 950 200 96 16 – 20 Medium molecular weight solid epoxy resin containing hydroxyl groups. Often reacted with vegetable oil acids to produce epoxy ester resins. Can also add toughness, flexibility and rheology control. Density 1.20 g/ml. EPON 1007F DGEBPA 50 –100 1,700 – 2,200 200 125 ≈ 500 Moderately high molecular weight solid epoxy resin used for industrial coatings cured with urea- and phenol- formaldehyde resins. Density 1.19 g/ml. EPON 1009F DGEBPA 100 – 250 2,300 – 3,800 200 135 > 500 High molecular weight solid epoxy resin for baked industrial coatings cured with urea-formaldehyde and phenol-formaldehyde resins. Density 1.19 g/ml.

1 40% by weight solution in MEK 2 Platinum-Cobalt Color Scale

9 Table 8: Typical Properties of EPON™ Solid Epoxy Resins – Powder Coating and Molding Grades

Product Chemical Solution Weight per Color2 Softening Melt Comments Type Viscosity 1 Epoxide (max) Point °C Viscosity at 25 °C (cP) at 150 °C (P) EPON 2002 DGEBPA 10 –17 675 – 760 100 80 – 90 20 – 40 Medium low molecular weight solid epoxy resin used primarily for thin film epoxy powder coating applications. Density 1.19 g/ml. EPON 2003 DGEBPA 14 –18 725 – 825 100 90 – 95 30 – 50 Medium molecular weight solid epoxy resin used primarily for thin or thick epoxy powder coating applications. Density 1.19 g/ml. EPON 2004 DGEBPA 18 – 27 875 – 975 100 95 –105 70 –120 Medium molecular weight solid epoxy resin used primarily for thin or thick film epoxy powder coating applications. Density 1.19 g/ml. EPON 2005 DGEBPA 25 – 55 1,200 –1,400 100 110 –120 > 300 Moderately high molecular weight solid epoxy resin used primarily for intermediate and thick film epoxy powder coating applications. Density 1.19 g/ml. EPON 2014 Modified 35 – 75 750 – 850 100 100 –120 200 – 600 Moderately high molecular weight solid epoxy DGEBPA resin modified with epoxy phenol novolac used primarily in high performance powder coating applications to provide superior chemical and corrosion resistance. Density 1.19 g/ml. EPON 2024 Modified 17 – 26 850 – 950 100 95 –105 60 –120 Medium molecular weight solid epoxy resin DGEBPA modified with a flow control agent. Density 1.2 g/ml. EPON 2041 Modified 8 –12 625 – 675 100 — — Medium low molecular weight solid epoxy resin DGEBPA modified for improved flow.

1 40% by weight solution in MEK 2 Platinum-Cobalt Color Scale

Table 9: Typical Properties of EPON Solid Epoxy Resins – Electrical Grade

Product Chemical Solution Weight per Color2 Softening Melt Comments Type Viscosity 1 Epoxide (max) Point °C Viscosity cP at 25 °C at 150 °C (P) EPON 3002 Modified 7.4 – 9.5 520 – 590 500 75 – 80 6 – 8 Solid epoxy resin flake, modified for DGEBPA low melt viscosity and high reactivity. Primarily used for electrical encapsulation.

1 40% by weight solution in MEK 2 Platinum-Cobalt Color Scale

10 Table 10: Typical Properties of EPON™ and EPIKOTE™ Epoxy Novolac Resins

Product Chemical Viscosity Weight per Color1 Density Comments Type at 25 °C (P) Epoxide (max) (lb/gal) EPON 1031 TGETPE 39 2 195 – 230 18 10.4 Tetraglycidyl Ether of Tetraphenol Ethane with a functionality Flake of 3.5. Used in applications requiring high temperatures and chemical resistance. EPON 1031-A-70 TGETPE 0.5 – 2.2 195 – 230 18 9.1 EPON 1031 solution, 70 % solids in Acetone. Solution EPON HPT 154-A-85 Epoxy 5 –12 176 –181 2 9.0 EPON 154 solution, 85% solids in Acetone. Phenolic Novolac Solution EPON 154 Epoxy 310 – 400 3 176 –181 2 10.3 Epoxy phenolic novolac resin with a functionality of 3.6, Phenolic providing high chemical and temperature resistance, and Novolac dimensional stability. EPON SU-2.5 Epoxy BPA 20 – 60 3 180 – 200 6 9.8 Epoxy Bisphenol A novolac with a functionality of 2.5, Novolac providing good thermal stability and chemical resistance. Used in electrical, adhesive and composite applications. EPON SU-8 Epoxy BPA 10 – 60 4 195 – 230 6 10.0 Epoxy Bisphenol A novolac with a functionality of 8, Novolac providing rapid development of green strength, with good Flake high temperature performance. Used in electrical, adhesive and composite applications. EPON 160 Epoxy BPF 345 – 485 168 –178 3 9.9 BPF epoxy novolac with a functionality of 2.6 – a low Novolac viscosity version of EPON 154. High functionality with easy processing, good thermal stability and chemical resistance. EPON 161 Epoxy BPF 180 – 280 169 –178 3 9.9 BPF epoxy novolac with a functionality of 2.5 – a lower Novolac viscosity version of EPON 160. High functionality with easy processing, good thermal stability and chemical resistance. EPON 162 Epoxy BPF 60 – 78 166 –178 3 9.9 BPF epoxy novolac with a functionality of 2.2 – the lowest Novolac viscosity version of EPON 160. Adequate functionality with easiest processing, yet with good thermal stability and chemical resistance. EPON 164 Epoxy 35 – 50 5 200 – 240 6 10.0 Solid epoxy cresol novolac resin with a functionality of 4.1 Cresol and is used in high performance laminates, molding Novolac compounds, aerospace composites, special adhesives Flake and tooling systems. EPON 165 Epoxy 100 – 200 4 200 – 230 6 10.0 Solid epoxy cresol novolac resin with a functionality of 5.5 Cresol and is used in very high performance laminates, molding Novolac compounds, special adhesives, aerospace composites Flake and tooling systems.

1 Gardner Color Scale 2 at 120 °C 3 at 52 °C 4 at 130 °C 5 60% by weight solution in MEK 6 at 50 °C

11 Table 11: Typical Properties of EPON™ Epoxy Polyacrylates

Product Chemical Type Viscosity Equivalent Color1 Density Comments at 25 °C (cP) Weight (max) (lb/gal) EPON 8021 Epoxy 85 –115 300 – 320 1 9.2 Very low viscosity epoxy diacrylate resin that imparts high Polyacrylate reactivity and superior wetting characteristics. 13 minute gel time with TETA. EPON 8111 Epoxy 800 –1,100 300 – 320 1 9.5 Low viscosity epoxy triacrylate resin that provides rapid Polyacrylate reaction rates. Uses include high-build sealers, wear-resistant surfacing and low temperature cure applications. 2.5 minute gel time with TETA. EPON 8161 Epoxy 1,800 – 2,400 205 – 214 1 9.6 Moderate viscosity epoxy diacrylate resin with performance Polyacrylate similar to EPON 828. Applications include flooring, grouts, adhesives, casting and encapsulation systems. 27 minute gel time with TETA.

1 Gardner Color Scale

Table 12: Typical Properties of EPON Elastomer Modified Epoxy Resins

Product Chemical Type Viscosity Weight per Color1 Density Comments at 25 °C (P) Epoxide (max) (lb/gal) EPON 58005 CTBN Modified 3,000 – 8,000 325 – 375 11 9.0 CTBN modified BPA epoxy resin with an elastomer content of DGEBPA 40%. Utilized in high performance adhesives for peel strength, thermal shock resistance, toughness and fatigue resistance. EPON 58006 CTBN Modified 1,500 – 3,000 330 – 360 11 8.9 CTBN modified BPA epoxy resin with an elastomer content of DGEBPA 40%, but a slightly lower acrylonitrile level than EPON 58005. For flexibility and fatigue resistance in adhesives and composites. EPON 58034 CTBN Modified 40 – 80 275 – 305 10 8.4 CTBN modified HELOXY 68 with an elastomer content of DGENPG 50%. Used as a low viscosity and high toughness modifier for adhesives and . EPON 58120 CTBN Modified 50 – 200 2 850 –1,050 3 — CTBN modified solid epoxy resin with an elastomer content DGEBPA of 20%. Used for adhesion, thermal shock, fatigue and impact resistance in functional pipe and thick film powder coatings as well as for electrical powders. EPON 58901 CTBN Modified 1,000 – 5,000 195 – 210 5 9.6 CTBN modified BPA epoxy resin with an elastomer content DGEBPA of 5%. Provides flexibility and tack for early green strength, and also provides flow control for adhesives, prepregs and sealants.

1 Gardner Color Scale 2 at 150 °C

Table 13: Typical Properties of EPONEX™ Cycloaliphatic Resin

Product Chemical Type Viscosity Weight per Color1 Density Comments at 25 °C (cP) Epoxide (max) (lb/gal) EPONEX 1510 Hydrogenated 1,800 – 2,500 210 – 220 80 9.1 Low viscosity Cycloaliphatic Glycidyl Ether. Used to obtain DGEBPA epoxy performance in coatings, electronics and specialty composites where improved UV resistance is a requirement.

1 Platinum-Cobalt Color Scale

12 Table 14: Typical Properties of EPON™ Electrical Laminating Resins

Product Chemical Viscosity Weight per Color1 Density Comments Type at 25 °C (cP) Epoxide (max) (lb/gal) EPON 1124-A-80 DGETBBPA 1,200 – 2,000 425 – 445 2 10.2 Acetone solution of brominated resin for flame retardant electrical laminates. Bromine content – 19.5% by weight. EPON 1163 DGETBBPA 100 –1,200 2 380 – 410 200 3 15.4 Low melting solid epoxy with 48% by weight bromine. Softening point at 64 °C. Imparts fire retardancy in laminating, casting and molding applications. EPON CS 373 Modified 100 – 600 350 – 400 3 10.0 One-pack, DICY-free, brominated epoxy resin and Brominated curing agent solution supplied as 70% by weight Epoxy solids in a blend of Methyl Ethyl Ketone (MEK) and Propylene Glycol Monomethyl Ether (PGME). Used for high Tg applications at 180 °C. Bromine content – 13.5 % by weight.

1 Gardner Color Scale 2 at 120 °C 3 Platinum-Cobalt Color Scale

Table 15: Typical Properties of EPONOL™ Ultra High Molecular Weight Resin

Product Chemical Viscosity Viscosity at Color1 Density Comments Type at 25 °C (cP) 25 °C (max) (lb/gal) (Gardner)

EPONOL 53-BH-35 DGEBPA 600 – 3,600 U - Z2 6 7.8 Ultra high molecular weight epoxy resin used for adhesives and prepreg laminates to impart flexibility and to modify flow properties of the system.

1 Gardner Color Scale

Table 16: Typical Properties of EPON and EPIKOTE™ Epoxy Resins for Composites

Product Chemical Viscosity Weight per Color1 Density Comments Type at 25 °C (cP) Epoxide (max) (lb/gal) EPON 9215 DGEBPA 3,000 – 5,000 187 – 207 1 9.6 For CIPP (Cured In Place Pipe) applications where long term physical integrity, durability and resistance to chemical attack is needed. Typically used with EPIKURE 9270.

1 Gardner Color Scale

13 Table 17: Typical Properties of EPI-REZ™ Waterborne Epoxy Resin Dispersions

Product Chemical Viscosity Weight per pH Density Comments Type at 25 °C (cP) Epoxide (lb/gal) EPI-REZ 3510-W-60 DGEBPA 500 – 5,000 185 – 215 2 – 5 9.0 Waterborne dispersion of a low molecular weight Dispersion liquid Bisphenol A epoxy resin (EPON Resin 828 type). EPI-REZ 3515-W-60 DGEBPA 4,000 –15,000 225 – 275 3 – 6 9.2 Waterborne dispersion of a semi-solid Bisphenol A Dispersion epoxy resin. EPI-REZ 3520-WY-55 DGEBPA 7,000 –17,000 485 – 555 7 – 9 9.1 Waterborne dispersion of a semi-solid Bisphenol A Dispersion epoxy resin (EPON 1001 type) with an organic co-solvent. Primarily used in coatings systems EPI-REZ 3522-W-60 DGEBPA 8,000 –18,000 615 – 715 7 – 9 9.2 Waterborne dispersion of a solid Bisphenol A epoxy Dispersion resin (EPON 1002 type). Typically used in film and fiber adhesives and finishes, FRP, and electrical dip coatings. EPI-REZ 3540-WY-55 DGEBPA 7,000 –17,000 1,600 – 2,000 7–10 9.0 Waterborne dispersion of a solid Bisphenol A epoxy Dispersion resin (EPON 1007 type) with an organic co-solvent. Generally used in baked industrial finishes, fiber finishes/binders, and as a modifier for ambient cure systems. EPI-REZ 3546-WH-53 DGEBPA 1,000 –15,000 1,900 – 2,200 7–10 9.0 Waterborne dispersion of a solid Bisphenol A Dispersion epoxy resin (EPON 1007 type) similar to EPI-REZ 3540-WY-55 with a non HAPS co-solvent. EPI-REZ 5003-W-55 BPA Novolac 2,000 –15,000 195 – 215 3 – 5 9.2 Waterborne dispersion of an epoxidized Bisphenol Dispersion A novolac modified epoxy resin with an average functionality of 3 (EPON SU-3 type). Promotes wetting and adhesion to a variety of fibers and enhances chemical resistance in coatings. EPI-REZ 5520-W-60 DGEBPA 2,000 –15,000 480 – 560 3 – 5 9.2 Waterborne dispersion of a urethane-modified Dispersion Bisphenol A epoxy resin. Provides improved chemical resistance and thermal performance for fiber finishes and industrial textile applications. EPI-REZ 5522-WY-55 DGEBPA 8,000 –19,000 550 – 700 7 – 9 9.0 Waterborne dispersion of a novolac modified Dispersion Bisphenol A epoxy resin (EPON 1002 type) with an organic co-solvent. Used for high performance coatings where higher chemical resistance and corrosion protection are required. EPI-REZ 6006-W-68 OCN Novolac 500 – 2,000 230 – 270 8.5 – 9.5 9.0 Waterborne dispersion of an epoxidized o-cresylic Dispersion novolac resin with an average functionality of 6. Provides high temperature stability, abrasion and chemical resistance in coatings, composites, adhesive and electronic applications. EPI-REZ 6520-WH-53 DGEBPA 1,000 – 6,000 500 – 600 7 – 9 8.9 New Gen™ Waterborne dispersion of a solid Dispersion Bisphenol A epoxy resin (EPON 1001 type) with a non HAPS co-solvent. Provides exceptional corrosion protection for metal substrates as primers, DTM and topcoats.

Table 18: Typical Properties of EPI-REZ Water Reducible Epoxy Resins

Product Chemical Viscosity Weight per Color1 Density Comments Type at 25 °C (P) Epoxide (max) (lb/gal) EPI-REZ WD-510 Water Red. 80 –120 190 – 205 2 9.6 Water dispersible Bisphenol A epoxy resin. DGEBPA EPI-REZ WD-512 Water Red. 150 – 600 195 – 210 2 9.7 Water dispersible Bisphenol A epoxy resin. DGEBPA

1 Gardner Color Scale

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Packaging Available in bulk and drum quantities.

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