Institute for Materials Research University of Hasselt IMOMEC Associated Lab IMEC is constructed. reflected pulsesanimageoftheinsidedevice within thematerialaremonitored.From and thereflectionsfromdifferentinterfaces sound wavesaretransmittedthroughthedevice acoustic beamtoscanthedeviceundertest.Ultra- destructive techniquethatusesafocusedultrasonic Scanning AcousticMicroscopy(SAM)isanon- of testing non-destructive Application area: AcousticScanning Microscopy electronic assemblies inspection, etc. devices ofmicroelectronic includingplasticandceramicthe inspection packages, BGAs, Flip Chips, solderjoint The scanningacoustic microsope atIMOMECisahighspeed, highresolution scannerthat isdesignedprimarilyfor System descriptionandspecifications C-scan(area scan) Frequency UltraHigh transducer 180/230MHz scanning Pulse-echo A-scan(pointscan) 6” x6” Through 2.5to 90MHz methods Inspection B-scan modes Scan Transducer frequencies areaScan Parameter Specification transmission (line scanning scan) using SAM. device discontinuitieslikecracks,delaminationsandvoidsareeasilyspotted vendor qualificationcontrol,reliabilityandprocesscontrol.Differentinternal devices ordiscretecomponentscanbeinspectedtoperformfailureanalysis, Different componentslikeswitches,sensors,powerdevices,boardmounted automotive industryistheinspectionofmicroelectronicdevices. automotive industry.OneofthemorecommonusesSAMsystemsin A largevarietyofusesforScanningAcousticMicroscopycanbefoundinthe
Measurement examples
Some typical applications are: • Electronic plastic package evaluation • Molding compound evaluation • Electronic ceramic package evaluation • Package crack detection • Chip capacitor and resistor evaluation • Flip chip bond evaluation • Die attach evaluation
Die and die path tilt after encapsulation The B-scan image shows popcorn cracks eminating from the die pad edges
Die attach voids in the solder of the die attach The area in red indicates delamination at the mould compound to die interface in a power MOSFET after 3,000 power cycles.
IMEC Institute for Materials Research - Hasselt University Kapeldreef 75 Division IMOMEC, IMEC vzw B-3001 Leuven Wetenschapspark 1 Belgium B-3590 Diepenbeek Belgium
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