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MSM8953 (14 X 12 Mm) Qualcomm Technologies, Inc MSM8953 (14 x 12 mm) Device Specification (Advance Information) 80-P6190-1 Rev. A Qualcomm Technologies, Inc. Device description Key features (see Section 1.2 for details) The MSM™ device uses the advanced 14 nm FinFET Advanced RF techniques with WTR3925 process for lower active power dissipation and faster peak Downlink carrier aggregation (DL-CA) CPU performance. It includes a customized 64-bit ARM Uplink carrier aggregation (UL-CA) Cortex A-53 octa-core applications processor non-package- on-package (non-PoP) LPDDR3 SDRAM memory. Two 4-lane DSI D-PHY 1.1, FHD (1920 × 1200) 60 fps Video 4k at 30 fps, 1080p at 60 fps, 2560 buffer width (10 layers blending), VESA DSC 1.1 Adreno GPU with NOTE In this document, MSM8953 refers only to UBWC the 14 × 12 mm package. Three 4-lane CSI (4 + 4 + 4) D-PHY 1.2 at 2.1 Gbps per lane The latest air interface standards are supported, including: Dual 14-bit image signal processing (ISP): 13 MP and LTE up to Cat 7 (FDD and TDD), including 2 × 20 CA 13 MP; 24 MP at 30 fps ZSL with dual-ISP; 13 MP WCDMA up to Rel-10 HSPA+, including 4C-HSDPA+ 30 ZSL with single-ISP and HSPDA 2 + 1 CA Support for USB 3.0, eMMC 5.1, and SD 3.0 TD-SCDMA up to DC-HSPA+ 64 QAM Low-power Qualcomm sensor core (SSC) with QDSP6 to GSM, GPRS, and EDGE support always-on use cases CDMA up to 1X Advanced and 1xEV-DOrB WLAN 802.11 b/g/n/ac, DBS, Bluetooth 4.1, and FM with WCN3615, WCN3660B, and WCN3680B Key processor and memory characteristics include: Non-PoP high-speed memory and LPDDR3 SDRAM Customized octa-core applications processor designed for 933 MHz clock Eight high performance (target 2.2 GHz) cores Qualcomm® Hexagon™ QDSP6 with dual Hexagon vector processor (HVX-512) designed for 850 MHz turbo Qualcomm® Adreno™ 506 graphics processing unit (GPU) with 64-bit addressing; designed for 650 MHz MSM8953 high-level block diagram and 792 NSP package drawing LPDDR3 Tx DACs EBI 1 SDRAM MIPI_RFFEs Memory support Bus interfaces Connectivity SDC1 eMMC Flash dsc Discrete stat & ctl 4-ln MIPI_DSI Display Ext Display RFIC(s) 4-ln MIPI_DSI Bridge Multimedia Rx front ends 4-ln MIPI_CSI Application-specific RFFE Application-specific Chipset & CCI (I2C + timing) Rear MIPI_RFFEs & dsc 4-ln MIPI_CSI RFFE I/Fs Front 4-ln MIPI_CSI WLAN DAC & ADC Depth dsc BT & FM SSBIs JTAG debug WLAN command UART Internal functions I2C BLSP (x8) Clock circuits cxo WLAN Rx/Tx SPI Wireless Conn Peripherals Keypad buttons Processors / sensors SPMI Octa Cortex A53 P Accelerometer dsc LPA QDSP6 Geomagnetic Connectivity Gyros I2C Modem QDSP6 I2C dsc UIM1 Pressure UIM2 SD/ MI2S RPM Cortex M3 P Proximity MMC Dual-voltage UIM (x2) SPI Temperature Air Interfaces Ambient light SDC2 Haptics GSM LTE Near field comm SS 3.0 USB w/ PHY Audio PDM CDMA GNSS PDM (audio) Power Management WCDMA WCN Audio TD-SCDMA dsc I2C MIPI SLIMbus NFC MSM8953 (optional) Confidential and Proprietary – Qualcomm Technologies, Inc. NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to: [email protected]. Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies, Inc. or its affiliated companies without the express approval of Qualcomm Configuration Management. Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of Qualcomm Technologies, Inc. Qualcomm Adreno, Fluence, MSM, Qualcomm Hexagon, Qualcomm RF360, and Qualcomm Snapdragon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Other Qualcomm products referenced herein are products of Qualcomm Technologies, Inc. or its subsidiaries. © 2016 Qualcomm Technologies, Inc. All rights reserved. Contents 1 Introduction . 3 2 Pin definitions . 9 3 Electrical specifications . 46 4 Mechanical information . 47 5 Carrier, storage, and handling information . 53 6 PCB mounting guidelines . 54 7 Part reliability . 55 8 Revision history . 56 80-P6190-1 Rev. A Confidential and Proprietary – Qualcomm Technologies, Inc. 2 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 1 Introduction Document updates See the Revision history for details on the changes included in this revision. 80-P6190-1 Rev. A Confidential and Proprietary – Qualcomm Technologies, Inc. 3 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION MSM8953 (14 x 12 mm) Device Specification (Advance Information) Introduction 1.1 Functional block diagram Qualcomm RF360™ WTR3925 MSM8953 front-end components Memory support Tx DACs ANT_0 RF Processors LPDDR3 QFE2550 antenna tuner(s) MIPI_RFFEs EBI SDRAM WAN transmitters SSBIs Octa Cortex A53 core (non-PoP) ANT_n Bus interfaces QFE1040 switch WLAN Internal memory MIPI_RFFE Hexagon DSP V56 QFE4320 PA/switch Support SPMI Chipset & RFFE I/Fs RF fb dsc Connectivity SDC1 Flash QFE2340 HB PA dsc Discrete status & control LPASS QDSP6 eMMC GNSS QFE2101 PA power tracker Modem QDSP6 Primary WAN RF receivers 4-ln MIPI_DSI Display Rx front ends QPA4373/4351 PA RPMCortexM3P External GPS SDE 4-ln MIPI_DSI Bridge Display Application-specific RFFE QPA4340 PA WLAN DACs Air Interfaces and other components as needed 4-ln MIPI_CSI Rear BB t/r switch WLAN ADCs MIPI_RFFEs dsc GSM processing CAMIF timing & I2C GSM/GPRS/EDGE 4-ln MIPI_CSI Connectivity 4-ln MIPI_CSI Depth Front UART CDMA processing WCN3615/ Qcamera I2C I2C SPI WCN3660B/WCN3680B data (x8) 1x to 1xEV-DOrA BLSP dsc SPI UART SSBI Rx SSBI Video Front-end FM RF & BB data Keypad buttons WCDMA processing from General clks &clk Video core sensors dsc I2C SPI hskeeping Bluetooth SSBI R99 to HSPA+ 42/11 SSBI extra SPI chip selects HEVC & others, RF & BB Rx / Tx BB USB-C TM Qtv, Qcamcorder, WLAN / BT (switched) Snapdragon Sense LTE processing Peripherals Detection Qvideophone / sensors Support & I/Os front-end WLAN/BT WLAN RF command ID 3D Fingerprint WLAN Rel 10 Cat7 with CA WLAN BT FM Multimedia Accelerometer others IC-level SPMI SS SS/HS USB (3.0/2.0) Geomagnetic power-on interfaces dsc UIM1 TD-SCDMA processing Adreno 506 graphics Gyros Pressure Dual-voltage UIM (x2) TM User Vibration motor UIM2 4.2/2.2 Audio: Fluence Proximity Indicators interfaces noise cancellation Temperature PDM (audio) Chemical GNSS Gen8C Lite tech, HD Audio, LPA Audio Ambient light WCD9326/WCD9335 dsc Haptics Audio codec SD/MMC SDC2 GPS, Galileo, GPIOs/PWR & GND Near field comm devices Glonass, BeiDou DACs SLIM MIPI SLIMbus PMI8952 Output supply Audio bus devices ADCs Mode/config/resets & PM8953 pwr mgt voltages WLAN/BT/FM ctls I2C MI2S/PCM (x2) DMICs JTAG/QDSS system Input SPI power pwr mgt MBHC debug WSA8810/ WSA8815 I2S Internal functions Audio codec Resource & pwr mgt GP clock & pdm outs MIC bias / det T/R clks I2C external SVA, ANC** SWR Security & QFPROM Thermal sensors Clock generation cxo sources SMB1358 Battery WSA8810/ WSA8815 I2C Audio configurations: charger Default: PM8953 codec (optional) Option 2: PM8953 + WSA8810/WSA8815 **Note: ANC supported only on WCD9335 Option 3: WCD9326/WCD9335 + WSA8810/WSA8815 Figure 1-1 MSM8953 functional block diagram and example application 80-P6190-1 Rev. A Confidential and Proprietary – Qualcomm Technologies, Inc. 4 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION MSM8953 (14 x 12 mm) Device Specification (Advance Information) Introduction 1.2 MSM8953 features NOTE Some of the hardware features integrated within the MSM8953 must be enabled by software. Refer to the latest revision of the applicable software release notes to identify the enabled MSM8953 features. Table 1-1 MSM8953 features Feature MSM8953 capability Processors Applications ARM Cortex-A53 microprocessor cores designed for 2.2 GHz 64-bit processor Octa-core: one quad with 1 MB L2 cache + one quad with 512 kB L2 cache Primary boot processor Modem system ADSP: Hexagon DSP V56 850 MHz 768 kB L2 caches MSM8953: DSDS RPM system Cortex M3: Modem power manager (MPM) MPM coordinates shutdown/wakeup, clock rates, and VDDs Memory support System memory via EBI Non-PoP LPDDR3 SDRAM; 32-bit wide; up to 933 MHz Graphics internal memory 136 kB unified SRAM pool on-chip memory (GMEM) External memory via SDC eMMC v5.1/SD3.0 flash devices RF support RF operating bands Defined by WTR device Air interfaces GSM Yes CDMA Yes WCDMA Yes TD-SCDMA Yes LTE Yes WLAN/BT/FM Yes: all (with WCN3680B/WCN3660B) NFC Yes GNSS: Qualcomm® IZat™ engine Gen 8C Lite; Support for three bands concurrently: GPS, BeiDou, and GLONASS or GPS, BeiDou, and Galileo Multimedia Display interfaces FHD (1920 × 1200) 60 fps; 16/18/24 bpp RGB MIPI_DSI Dual MIPI DSI four-lane General display features Wi-Fi display: 1080p 30 fps (UBWC) FHD + 1080p 30 fps external wireless display 80-P6190-1 Rev. A Confidential and Proprietary – Qualcomm Technologies, Inc. 5 MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION MSM8953 (14 x 12 mm) Device Specification (Advance Information) Introduction Table 1-1 MSM8953 features (cont.) Feature MSM8953 capability Camera interfaces Qcamera Number of CSIs Three; 2.1 Gbps per lane Primary (CSI0) Four-lane; supports CMOS and CCD sensors Up to 24 MP sensors Secondary (CSI1) Four-lane; supports CMOS and CCD sensors Up to 24 MP sensors Tertiary (CSI2) Four-lane; supports CMOS and CCD sensors Up to 24 MP sensors Configurations supported Pixel manipulations, camera modes, image effects, and post-processing techniques, including defective pixel correction General camera features I2C controls Mobile display processor SDE515
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