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Qualcomm® Snapdragon™ Embedded Platforms HW and SW Overview

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Qualcomm® Snapdragon™ Embedded Platforms HW and SW Overview Qualcomm® Snapdragon™ embedded platforms HW and SW Overview ​Ziv Kahana, Director of Engineering ​Constantine Elster, Senior Staff Engineer ​Qualcomm Israel, Ltd. ​Oct 2017 Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. Agenda 1 2 3 4 5 Chipset Hardware Development Software Eco system overview sub-systems platforms distributions and typical (DragonBoard) and features applications overview 2 Bringing Snapdragon platforms to embedded devices Identifying the challenges Mobile OEMs Embedded Customers Relationship o High touch, 1-1 o Low-touch, web-based Primary fulfillment o Direct o Distribution Minimum order o 10,000s o 100 Customers o High dependency, few o Low dependency, many Roadmap influence o Strong o Weak Engineering capability o Strong, large teams o Varied, small teams Primary support o Direct o Web-based/Contract work End-product volume o High o Low Design type o Iterative o Clean-slate 3 Snapdragon 410E and 600E embedded platforms Drawing from the mobile portfolio for a targeted, tiered offering Supported for longevity Snapdragon 600E o Available through distribution for a 1.5 GHz quad-core Qualcomm® Krait™ 300 CPU minimum of 10 years from Snapdragon 600 and 410 commercial sample in 2015 Available through Snapdragon 410E Arrow Electronics 1.2 GHz quad-core ARM v8 Cortex-A53, o 1st time Snapdragon platforms are 32/64-bit capable sold through 3rd party distribution Qualcomm Krait is a product of Qualcomm Technologies, Inc. 4 Snapdragon embedded platforms Snapdragon 410E Snapdragon 600E Application Processor - APQ8016E Application Processor - APQ8064E • 12 mm x14 mm non-PoP package size • 23 mm x 23 mm non-PoP package size • LPDDR2/3 533 MHz single channel • Dual DDR3/DDR3L up to 533MHz • Quad ARM Cortex A53 at 1.2GHz per core • Quad core Krait 28LP-LVT up to 1.5GHz Power module - PM8916 Power module - PMM8920AU • Power management and codec IC • Power Management • 6.2 mm x 6.2 mm • 13.9 mm x 12.3 mm Connectivity - WCN36x0 Connectivity – QCA9377 module • WCN3620/3660B - 802.11 b/g/n • QCA9377 - 802.11a/b/g/n/ac 1x1 DB 2.4GHz/5GHz • Bluetooth 4.x/LE • Bluetooth 4.1 • 3.3 mm x 3.5 mm • 18.0 mm x 17.0 mm module, FCC pre-certified Location - WGR7640 Location - RGR7640AU • Integrated Location (GNSS, GPS) support • Integrated Location (GNSS, GPS) support • 2.1 mm x 1.5 mm Audio - WCD9311 • Next Gen Audio Codec • 6.0 mm x 6.0 mm Ethernet (optional) - AR8151 • Ethernet connectivity APQ8016E, PM8916, WCN3620/3660B, WGR7640, APQ8064E, PMM8920AU, RGR7640, QCA9377, AR8151 and WCD9311 are products of Qualcomm Technologies, Inc. 5 Snapdragon sub-systems Chipset Interface Chipset I/F Snapdragon Memory Support Memory • PMIC / WCN / Codec busses • DDR Processors • Analog interfaces (ADCs / DACs) • eMMC • Internal memory Multimedia Air Interface • Integrated GPS modem Connectivity Multimedia • Integrated WLAN / BT modem • GPU • VFE Air Interface • Display controller Wired Connectivity • Camera controller • USB • ISP • PCIe • Audio • GPIOs • Programmable serial interfaces GPIOs / PWR (I2C / SPI / UART) Internal Functions Internal functions • Secure Digital (SD) • Security • I2S • Debugging (e.g., JTAG) • Housekeeping • Clocks & power 6 Processors and memory Snapdragon 410E Snapdragon 600E Chipset I/F Snapdragon Memory Support Serial busses EBI0 Application Processor Application Processor Discrete stat & ctl EBI1 • Quad core Processors • Quad core Internal memory • 64-bit Cortex A53 (ARM v8) up to 1.2GHz GNSS ADC • 32-bit Krait uP (ARM v7 compliant) up to 1.5GHz App processor Secure Digital (SDC1) • 512kB L2 cache • 2MB L2 cache WLAN DACs DSP Switch WLAN ADCs BB T/RBB WCN modem Multimedia DSP DSP RPM processor LVDS • Qualcomm® Hexagon™ QDSP6 V5 core up to 691MHz • Qualcomm ® Hexagon™ QDSP6 V4 core up to 500MHz Connectivity GNSS modem HDMI 4-lane DSI SDC 4 (w/ WCN ifc.) MDP 4-lane DSI 2x I2S Mics CAMIF timing 2x I2S Spkr Supporting processors 4-lane / 1-lane CSI Supporting processors MI2S Air Interface 2-lane CSI • RPM, Cortex M3 • RPM, ARM7 2x TSIFs GPS Video front-end (VFE) • SPSS, ARM7 ) UIM GPS, Galileo, 7 Video encoders / UART Beidou, Glonass decoders I2C Connectivity Qualcomm® Adreno™ Memory GSBI(x SPI 3D graphics Memory WLAN / BT / FM Audio • LPDDR2/3, 32-bit, up to 533MHz Extra SPI chip selects • DDR3, 32-bit, dual channel (4 chip-selects), up to 4GB LPA, Codecs density, up to 533MHz • eMMC v4.5 Secure Digital (SDC2) • eMMC v4.5 • iMEM 128kB Secure Digital (SDC3) GPIOs / PWR • iMEM 256kB LMEM + 192kB MIMEM PCM (audio) MIPI SLIMbus Internal functions Thermal sensors 1x USB (UICC) Resource & PWR mgt. GP clock & PDM outs 3x USB (w/ PHY) Security JTAG PCIe Mode / config / reset Clock generation Qualcomm Hexagon and Qualcomm Adreno are products of Qualcomm Technologies, Inc. 7 Multimedia Snapdragon 410E Snapdragon 600E Chipset I/F Snapdragon Memory Support Serial busses EBI0 Display support Discrete stat & ctl EBI1 Display support Processors • 2560x1600 via 2xDSI • 2048x1536 via LVDS • 1080p external displays supported Internal memory GNSS ADC • HDMI via converter App processor or • 1080p HDMI port Secure Digital (SDC1) WLAN DACs DSP • 2048x1560 via 1xDSI Switch WLAN ADCs BB T/RBB WCN modem Image processing Multimedia Image processing RPM processor LVDS • Up to 2x CSIs • Up to 3x CSIs • 60 fps WXGA viewfinder Connectivity GNSS modem HDMI frame rate • 4-lane CSI up to 13MP • 4-lane CSI: 4-lane DSI • 2-lane CSI 8MP web cam SDC 4 (w/ WCN ifc.) • Up to 20MP in-line JPEG • 2-lane CSI 8MP web cam MDP 4-lane DSI 2x I2S Mics encode at 15 fps • 1-lane CSI 3D cam support CAMIF timing 2x I2S Spkr 4-lane / 1-lane CSI ® ® Qualcomm Adreno™ 306 GPU (400 MHz) MI2S Qualcomm Adreno™ 320 GPU (400+ MHz) Air Interface 2-lane CSI • 3D graphics accelerator 2x TSIFs • 200 M peak triangles/sec; 6.4 B vector shader GPS Video front-end (VFE) instructions/sec; 3.2 BP/sec; 3.2 B texel/sec • On-chip graphics memory (128 kB unified SRAM) ) UIM GPS, Galileo, 7 Video encoders / • On-chip graphics memory 512 KB for fast Z, color, and UART Beidou, Glonass decoders I2C stencil rendering Connectivity Adreno 3D graphics GSBI(x SPI WLAN / BT / FM Video Decode Video Encode Audio Video Decode Video Encode Extra SPI chip selects 30 fps 1080p (MPEG- 30 fps 1080p (MPEG- LPA, Codecs 30fps 1080p (MPEG-4 / MPEG-2 / 30fps @1080p Secure Digital (SDC2) 4/H.264/H.263/DivX/MPEG2/VC1/ 4/H.264/VP8/H.263) H.264 / H.263 / DivX / VC-1 / (MP4/H.264) Secure Digital (SDC3) Soreson/VP8) GPIOs / PWR WMV-9) 30fps @ D1 (H.263) PCM (audio) 30fps D1 @ FWVGA (H.263) MIPI SLIMbus Internal functions Thermal sensors Audio Audio 1x USB (UICC) Resource & PWR mgt. GP clock & PDM outs • 5.1 surround sound with Dolby and DTS • Dolby 7.1 surround sound with Digital Plus audio 3x USB (w/ PHY) Security JTAG • Low Power Audio Core • Low Power Audio Core PCIe Mode / config / reset Clock generation • DSP Post-Proc programmability • DSP Programmability Qualcomm Adreno is a product of Qualcomm Technologies, Inc. 8 Wired Connectivity Snapdragon 410E Snapdragon 600E Chipset I/F Snapdragon Memory Support Serial busses EBI0 USB USB Discrete stat & ctl EBI1 Processors • 3x USB 2.0 HS ports (w/ build-in PHY) • 1x USB 2.0 HS ports (w/ build-in PHY) Internal memory GNSS ADC App processor • 1x USB 2.0 FS port Secure Digital (SDC1) • 1x HSIC WLAN DACs DSP Switch WLAN ADCs BB T/RBB WCN modem Secure Digital Multimedia Secure Digital RPM processor LVDS • 4x ports • 2x ports Connectivity GNSS modem HDMI • Supports SD3.0 and MMC, eMMC4.5 NAND flash, • Supports SD3.0 and MMC, eMMC4.5 NAND flash, 4-lane DSI SD/eMMC boot SDC 4 (w/ WCN ifc.) SD/eMMC boot MDP 4-lane DSI • Different operating voltages 2x I2S Mics CAMIF timing 2x I2S Spkr PCIe 4-lane / 1-lane CSI BLSP MI2S Air Interface 2-lane CSI • 1-lane PCIe 2.0 • 6x 4-bit wide ports 2x TSIFs GPS Video front-end (VFE) • Multiplexed serial interfaces ) UIM GPS, Galileo, GSBI 7 Video encoders / • UART, I2C, SPI (master), GPIO UART Beidou, Glonass decoders • 7x 4-bit wide ports I2C Connectivity Adreno 3D graphics • Multiplexed serial interfaces GSBI(x SPI WLAN / BT / FM Audio • UART, UIM, I2C, SPI (master), GPIO GPIOs Extra SPI chip selects LPA, Codecs • 122x GPIOs Secure Digital (SDC2) • Top-level mode multiplexer GPIOs Secure Digital (SDC3) GPIOs / PWR • Input config: pullup, pulldown, keeper, no-pull PCM (audio) • 90x GPIOs • Top-level mode multiplexer • Output config: drive strength MIPI SLIMbus Internal functions Thermal sensors • Input config: pullup, pulldown, keeper, no-pull 1x USB (UICC) Resource & PWR mgt. GP clock & PDM outs Audio • Output config: drive strength 3x USB (w/ PHY) Security JTAG • DMIC • CDC PDM port PCIe • 2x MI2S (2-bit) Mode / config / reset Clock generation Audio • 4x I2S / 1x MI2S (4-bit) • PCM • SLIMbus 9 Snapdragon 410E typical application Chipset I/F Memory Support WGR7640 DATA APQ8016E LPDDR3 SDRAM SSBI SSBI Serial busses EBI0 RxLO circuit Discrete stat & ctl Processors Internal memory GNSS receiver GNSS ADC App quad-A53 uP eMMC Secure Digital (SDC1) NAND Flash WLAN DACs DSP QDSP6 Switch WLAN ADCs BBT/R WCN Modem WCN36x0 DATA Multimedia FM SSBI RPM Cortex M3 FM RF&BB Connectivity GNSS Modem Display 1 4-lane DSI WLAN RF&BB WLAN WLAN command end MDP - BT RF&BB DATA BT front CAMIF timing WLAN/BT SSBI I2C 4-lane CSI MI2S Air Interface 2-lane CSI I2C GPS Video front-end (VFE) UIM GPS, Galileo, UART ) Video encoders / 6 UART Beidou, Glonass ext. I2C decoders Input PWR Ext. I2C source SPI Connectivity Adreno 3D graphics mgmt. charge BLSP(x SPI WLAN / BT / FM r Audio Supply Output PWR Extra SPI chip selects voltages mgmt.
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