Qualcomm® Snapdragon™ Embedded Platforms HW and SW Overview

Qualcomm® Snapdragon™ embedded platforms HW and SW Overview

Ziv Kahana, Director of Engineering Constantine Elster, Senior Staff Engineer Qualcomm Israel, Ltd. Oct 2017

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. Agenda 1 2 3 4 5 Chipset Hardware Development Software Eco system overview sub-systems platforms distributions and typical (DragonBoard) and features applications overview

2 Bringing Snapdragon platforms to embedded devices Identifying the challenges

Mobile OEMs Embedded Customers

Relationship o High touch, 1-1 o Low-touch, web-based Primary fulfillment o Direct o Distribution Minimum order o 10,000s o 100 Customers o High dependency, few o Low dependency, many Roadmap influence o Strong o Weak Engineering capability o Strong, large teams o Varied, small teams Primary support o Direct o Web-based/Contract work End-product volume o High o Low Design type o Iterative o Clean-slate 3 Snapdragon 410E and 600E embedded platforms Drawing from the mobile portfolio for a targeted, tiered offering

Supported for longevity

Snapdragon 600E o Available through distribution for a 1.5 GHz quad-core Qualcomm® Krait™ 300 CPU minimum of 10 years from Snapdragon 600 and 410 commercial sample in 2015

Available through Snapdragon 410E Arrow Electronics

1.2 GHz quad-core ARM v8 Cortex-A53, o 1st time Snapdragon platforms are 32/64-bit capable sold through 3rd party distribution

Qualcomm Krait is a product of Qualcomm Technologies, Inc. 4 Snapdragon embedded platforms

Snapdragon 410E Snapdragon 600E

Application Processor - APQ8016E Application Processor - APQ8064E • 12 mm x14 mm non-PoP package size • 23 mm x 23 mm non-PoP package size • LPDDR2/3 533 MHz single channel • Dual DDR3/DDR3L up to 533MHz • Quad ARM Cortex A53 at 1.2GHz per core • Quad core Krait 28LP-LVT up to 1.5GHz

Power module - PM8916 Power module - PMM8920AU • Power management and codec IC • Power Management • 6.2 mm x 6.2 mm • 13.9 mm x 12.3 mm

Connectivity - WCN36x0 Connectivity – QCA9377 module • WCN3620/3660B - 802.11 b/g/n • QCA9377 - 802.11a/b/g/n/ac 1x1 DB 2.4GHz/5GHz • Bluetooth 4.x/LE • Bluetooth 4.1 • 3.3 mm x 3.5 mm • 18.0 mm x 17.0 mm module, FCC pre-certified Location - WGR7640 Location - RGR7640AU • Integrated Location (GNSS, GPS) support • Integrated Location (GNSS, GPS) support • 2.1 mm x 1.5 mm

Audio - WCD9311 • Next Gen Audio Codec • 6.0 mm x 6.0 mm

Ethernet (optional) - AR8151 • Ethernet connectivity

APQ8016E, PM8916, WCN3620/3660B, WGR7640, APQ8064E, PMM8920AU, RGR7640, QCA9377, AR8151 and WCD9311 are products of Qualcomm Technologies, Inc. 5 Snapdragon sub-systems

Chipset Interface Chipset I/F Snapdragon Memory Support Memory • PMIC / WCN / Codec busses • DDR Processors • Analog interfaces (ADCs / DACs) • eMMC • Internal memory Multimedia Air Interface • Integrated GPS modem Connectivity Multimedia • Integrated WLAN / BT modem • GPU • VFE Air Interface • Display controller Wired Connectivity • Camera controller • USB • ISP • PCIe • Audio • GPIOs • Programmable serial interfaces GPIOs / PWR (I2C / SPI / UART) Internal Functions Internal functions • Secure Digital (SD) • Security • I2S • Debugging (e.g., JTAG) • Housekeeping • Clocks & power

6 Processors and memory

Snapdragon 410E Snapdragon 600E Chipset I/F Snapdragon Memory Support Serial busses EBI0 Application Processor Application Processor Discrete stat & ctl EBI1 • Quad core Processors • Quad core Internal memory • 64-bit Cortex A53 (ARM v8) up to 1.2GHz GNSS ADC • 32-bit Krait uP (ARM v7 compliant) up to 1.5GHz App processor

Secure Digital (SDC1) • 512kB L2 cache • 2MB L2 cache WLAN DACs DSP

Switch WLAN ADCs BB T/RBB WCN modem Multimedia DSP DSP RPM processor LVDS • Qualcomm® Hexagon™ QDSP6 V5 core up to 691MHz • Qualcomm ® Hexagon™ QDSP6 V4 core up to 500MHz Connectivity GNSS modem HDMI 4-lane DSI SDC 4 (w/ WCN ifc.)

MDP 4-lane DSI 2x I2S Mics CAMIF timing 2x I2S Spkr Supporting processors 4-lane / 1-lane CSI Supporting processors MI2S • RPM, Cortex M3 Air Interface 2-lane CSI • RPM, ARM7 2x TSIFs

GPS Video front-end (VFE) • SPSS, ARM7

) UIM GPS, Galileo, 7 Video encoders / UART Beidou, Glonass decoders I2C Connectivity Qualcomm® Adreno™ Memory GSBI(x SPI 3D graphics Memory WLAN / BT / FM Audio • LPDDR2/3, 32-bit, up to 533MHz Extra SPI chip selects • DDR3, 32-bit, dual channel (4 chip-selects), up to 4GB LPA, Codecs density, up to 533MHz • eMMC v4.5 Secure Digital (SDC2) • eMMC v4.5 • iMEM 128kB Secure Digital (SDC3) GPIOs / PWR • iMEM 256kB LMEM + 192kB MIMEM PCM (audio)

MIPI SLIMbus Internal functions Thermal sensors 1x USB (UICC) Resource & PWR mgt. GP clock & PDM outs 3x USB (w/ PHY) Security JTAG PCIe Mode / config / reset Clock generation

Qualcomm Hexagon and Qualcomm Adreno are products of Qualcomm Technologies, Inc. 7 Multimedia

Snapdragon 410E Snapdragon 600E Chipset I/F Snapdragon Memory Support Serial busses EBI0 Display support Discrete stat & ctl EBI1 Display support Processors • 2560x1600 via 2xDSI • 2048x1536 via LVDS • 1080p external displays supported Internal memory GNSS ADC • HDMI via converter App processor or • 1080p HDMI port

Secure Digital (SDC1)

WLAN DACs DSP • 2048x1560 via 1xDSI

Switch WLAN ADCs BB T/RBB WCN modem Image processing Multimedia Image processing RPM processor • Up to 2x CSIs LVDS • Up to 3x CSIs • 60 fps WXGA viewfinder Connectivity GNSS modem HDMI frame rate • 4-lane CSI up to 13MP • 4-lane CSI: 4-lane DSI • 2-lane CSI 8MP web cam SDC 4 (w/ WCN ifc.) • Up to 20MP in-line JPEG • 2-lane CSI 8MP web cam MDP 4-lane DSI 2x I2S Mics encode at 15 fps • 1-lane CSI 3D cam support CAMIF timing 2x I2S Spkr 4-lane / 1-lane CSI ® ® Qualcomm Adreno™ 306 GPU (400 MHz) MI2S Qualcomm Adreno™ 320 GPU (400+ MHz) Air Interface 2-lane CSI • 3D graphics accelerator 2x TSIFs • 200 M peak triangles/sec; 6.4 B vector shader GPS Video front-end (VFE)

instructions/sec; 3.2 BP/sec; 3.2 B texel/sec • On-chip graphics memory (128 kB unified SRAM) ) UIM GPS, Galileo, 7 Video encoders / • On-chip graphics memory 512 KB for fast Z, color, and UART Beidou, Glonass decoders I2C stencil rendering Connectivity Adreno 3D graphics GSBI(x SPI WLAN / BT / FM Video Decode Video Encode Audio Video Decode Video Encode Extra SPI chip selects 30 fps 1080p (MPEG- 30 fps 1080p (MPEG- LPA, Codecs 30fps 1080p (MPEG-4 / MPEG-2 / 30fps @1080p Secure Digital (SDC2) 4/H.264/H.263/DivX/MPEG2/VC1/ 4/H.264/VP8/H.263) H.264 / H.263 / DivX / VC-1 / (MP4/H.264) Secure Digital (SDC3) Soreson/VP8) GPIOs / PWR WMV-9) 30fps @ D1 (H.263) PCM (audio) 30fps D1 @ FWVGA (H.263) MIPI SLIMbus Internal functions Thermal sensors Audio Audio 1x USB (UICC) Resource & PWR mgt. GP clock & PDM outs • 5.1 surround sound with Dolby and DTS • Dolby 7.1 surround sound with Digital Plus audio 3x USB (w/ PHY) Security JTAG • Low Power Audio Core • Low Power Audio Core PCIe Mode / config / reset Clock generation • DSP Post-Proc programmability • DSP Programmability

Qualcomm Adreno is a product of Qualcomm Technologies, Inc. 8 Wired Connectivity

Snapdragon 410E Snapdragon 600E Chipset I/F Snapdragon Memory Support Serial busses EBI0 USB USB Discrete stat & ctl EBI1 Processors • 3x USB 2.0 HS ports (w/ build-in PHY) • 1x USB 2.0 HS ports (w/ build-in PHY) Internal memory GNSS ADC App processor • 1x USB 2.0 FS port

Secure Digital (SDC1) • 1x HSIC WLAN DACs DSP

Switch WLAN ADCs BB T/RBB WCN modem Secure Digital Multimedia Secure Digital RPM processor • 2x ports LVDS • 4x ports Connectivity GNSS modem HDMI • Supports SD3.0 and MMC, eMMC4.5 NAND flash, • Supports SD3.0 and MMC, eMMC4.5 NAND flash, 4-lane DSI SD/eMMC boot SDC 4 (w/ WCN ifc.) SD/eMMC boot

MDP 4-lane DSI • Different operating voltages 2x I2S Mics CAMIF timing 2x I2S Spkr PCIe 4-lane / 1-lane CSI BLSP MI2S Air Interface 2-lane CSI • 1-lane PCIe 2.0 • 6x 4-bit wide ports 2x TSIFs

GPS Video front-end (VFE)

• Multiplexed serial interfaces ) UIM GPS, Galileo, GSBI 7 Video encoders / • UART, I2C, SPI (master), GPIO UART Beidou, Glonass decoders • 7x 4-bit wide ports I2C Connectivity Adreno 3D graphics • Multiplexed serial interfaces GSBI(x SPI WLAN / BT / FM Audio • UART, UIM, I2C, SPI (master), GPIO GPIOs Extra SPI chip selects LPA, Codecs • 122x GPIOs Secure Digital (SDC2) • Top-level mode multiplexer GPIOs Secure Digital (SDC3) GPIOs / PWR • Input config: pullup, pulldown, keeper, no-pull PCM (audio) • 90x GPIOs • Top-level mode multiplexer • Output config: drive strength MIPI SLIMbus Internal functions Thermal sensors • Input config: pullup, pulldown, keeper, no-pull 1x USB (UICC) Resource & PWR mgt. GP clock & PDM outs Audio • Output config: drive strength 3x USB (w/ PHY) JTAG • DMIC • CDC PDM port Security PCIe • 2x MI2S (2-bit) Mode / config / reset Clock generation Audio • 4x I2S / 1x MI2S (4-bit) • PCM • SLIMbus 9 Snapdragon 410E typical application

Chipset I/F Memory Support WGR7640 DATA APQ8016E LPDDR3 SDRAM SSBI SSBI Serial busses EBI0 RxLO circuit Discrete stat & ctl Processors Internal memory GNSS receiver GNSS ADC

App quad-A53 uP eMMC

Secure Digital (SDC1) NAND Flash WLAN DACs DSP QDSP6

Switch WLAN ADCs BBT/R WCN Modem WCN36x0 DATA Multimedia FM SSBI RPM Cortex M3

FM RF&BB Connectivity GNSS Modem Display 1

4-lane DSI

WLAN RF&BB WLAN WLAN command

end

MDP

BT RF&BB DATA BT front CAMIF timing WLAN/BT SSBI I2C 4-lane CSI MI2S Air Interface 2-lane CSI I2C GPS Video front-end (VFE)

UIM GPS, Galileo,

UART ) Video encoders / 6 UART Beidou, Glonass ext. I2C decoders Input PWR Ext. I2C source SPI Connectivity Adreno 3D graphics mgmt. charge

BLSP (xBLSP SPI WLAN / BT / FM r Audio Supply Output PWR Extra SPI chip selects voltages mgmt. LPA, Codecs SD Secure Digital (SDC2) User interface Buttons GPIOs / PWR SPMI IC level LEDs interface Internal functions Thermal sensors Resource & PWR mgt. GP clock & PDM outs Audio Codec Audio devices 1x USB (w/ PHY) Security JTAG PM8916 Mode / config / reset Clock generation General Clocks Sensors housekeeping 10 Snapdragon 600E typical application

Chipset I/F Memory Support RGR7640 DATA APQ8064E PCDDR3 SDRAM SSBI SSBI Serial busses EBI0 RxLO circuit Discrete stat & ctl EBI1 PCDDR3 SDRAM Processors Internal memory GNSS receiver GNSS ADC

App quad-Krait uP eMMC

Secure Digital (SDC1) NAND Flash WLAN DACs DSP QDSP6

Switch WLAN ADCs BBT/R Alt. Disp. WCN ARM9 uP QCA9377 Multimedia RPM ARM7 uP LVDS HiDef Disp. Connectivity GNSS Cortex A5 uP HDMI Display 1

4-lane DSI

WLAN RF&BB WLAN SDC 4 (w/ WCN ifc.) end

MDP 4-lane DSI -

2x I2S Mics Display 2

BT RF&BB DATA BT front CAMIF timing WLAN/BT UART 2x I2S Spkr I2C 4-lane / 1-lane CSI MI2S Air Interface 2-lane CSI 2x TSIFs I2C

GPS Video front-end (VFE)

) UIM GPS, Galileo, 7 Video encoders / UART UART Beidou, Glonass ext. I2C decoders Input PWR Ext. I2C source SPI Connectivity Adreno 3D graphics mgmt. charge GSBI (xGSBI SPI WLAN / BT / FM Supply Output PWR r

Audio 7 ADCs Extra SPI chip selects voltages mgmt. LPA, Codecs 7 ADCs SD 9311 Secure Digital (SDC2) Buttons 2 Dspkrs User interface Secure Digital (SDC3) GPIOs / PWR 6 DMICs WCD PCM (audio) SSBI IC level LEDs interface MIPI SLIMbus Internal functions Thermal sensors 1x USB (UICC) Resource & PWR mgt. GP clock & PDM outs 3x USB (w/ PHY) Security JTAG PMM8920E RJ45 AR8151 PCIe Mode / config / reset Clock generation General + Mag PCIe <-> Eth Clocks Sensors housekeeping 11 DragonBoard™ 410c development board overview

A wide array of expansion Powerful processing and capability multimedia capabilities • One 40-pin low-speed (LS) • Snapdragon 410E Processor expansion connector

• Quad-core ARM Cortex A53 • One 60-pin high-speed (HS) expansion connector • Adreno 400MHz PC-class graphics • Footprint for one optional 16-pin analog expansion connector • Power management and audio codec • e.g. Stereo headset/line-out, speaker and analog line-in

Integrated connectivity

• Wi-Fi, Bluetooth, GPS • On-board Wi-Fi & GPS antennas Memory and storage • 1GB LPDDR3 • 8GB eMMC 4.5 I/O Interfaces • Micro SD card slot • HDMI full-size • USB 12 DragonBoard™ 410c – an evaluation and enablement tool

https://www.96boards.org/product/dragonboard410c/ https://www.96boards.org/products/mezzanine/

13 Software Overview HLOS supported for community and commercial use

Commercial Distributions Community Distributions

Linux Open Embedded/Yocto from Linux Debian from Linaro Qualcomm Technologies • Developed for community by Linaro • Recommended for commercial customers • Out of the box Desktop experience for evaluation • Tested and packaged by Qualcomm and fast prototyping Technologies • Upstream LTS kernels • Highly flexible and customizable • Community support through 96boards.org forums • Upstream LTS kernels • Variety of 3rd parties providing support services Linux Open Embedded/Yocto from Linaro

• Developed for community by Linaro Ubuntu Core • Highly flexible and customizable

• Recommended for commercial customers • Upstream LTS kernels • Supported on Snapdragon 410E embedded platform • Community support through 96boards.org forums • Support via 3rd parties Android

Windows 10 IOT Core • For hobbyist projects • Supported on DragonBoard 410c • Recommended for commercial customers • Supported on Snapdragon 410E embedded platform • Support via 3rd parties 15 Software Features (Snapdragon 410E) OS Linux Open Embedded/Yocto Morty, Kernel 4.9 -> 4.14 Wireless Connectivity WiFi STA and HostAP (supplicant and network manager layers) Bluetooth via BlueZ Stack GPS via GPSD

Wired Connectivity Flash Memory, SD Card (storage and boot) USB - storage, HID, Camera, Ethernet, Audio, 3G/4G modem GPIOs, I2C, SPI, UART (96board compliant) Display/Video/Graphics HDMI/DSI, Xorg and Wayland, OpenGL, Accelerated Video decoding and encoding (H.264 via V4L2) Audio Analog, HDMI, USB, BT via ALSA or pulseaudio Camera MIPI CSI YUV, USB Security Secure Boot Other Chromium Browser (not accelerated) Fastboot

Qualcomm Technologies tools (QPST, QRCT, QXDM) 16 Software Features (Snapdragon 600E)

OS Linux Debian Sid, Kernel 4.14 Wireless Connectivity WiFi STA and HostAP (supplicant and network manager layers) Bluetooth via BlueZ Stack

Wired Connectivity Flash Memory, SD Card USB - storage, HID, Camera, Ethernet, Audio, 3G/4G modem GPIOs, I2C, SPI, UART (96board compliant) Display/Video/Graphics HDMI, Xorg, OpenGL Audio HDMI, USB, BT via ALSA or pulseaudio Other Chromium Browser (not accelerated) Fastboot

17 Upstream and Software Updates

“Upstream First” Paradigm • Features are developed and upstreamed as early as possible

Enables generic Linux developers Open Source Easy to work with to work with our products

Major Annual Updates (~March) • Long Term Support (LTS) Kernels 4.4 4.9 4.14 … • Open Embedded / Yocto Upgrades Jethro Morty Rocko …

Minor Quarterly Feature and Fixes Updates • Cadence may be reduced in later stages of the product life 18

Linaro and 96boards

https://www.96boards.org

https://www.linaro.org

19 Ecosystem

96 boards.org Forums • https://discuss.96boards.org/c/products/dragonboard410c

3 rd party Software Providers

eInfochips Intrinsyc Inforce Computing MM Solutions

HW and SW HW and SW HW and SW Camera tuning, consulting and support consulting and support consulting and support features and support

20 Forums @96boards.org https://discuss.96boards.org/c/products/dragonboard410c

21 Online Resources

Webpage Name URLs Content / Used for • https://developer.qualcomm.com/hardware/snapdragon-410e Snapdragon 410E documentation • https://developer.qualcomm.com/hardware/snapdragon-410/tools • https://developer.qualcomm.com/hardware/snapdragon-600e Snapdragon 600E documentation Qualcomm Developer • https://developer.qualcomm.com/hardware/snapdragon-600/tools Network • https://developer.qualcomm.com/hardware/dragonboard-410c DragonBoard 410c documentation, • https://developer.qualcomm.com/hardware/dragonboard-410c/software access to public proprietary blobs (FW) for SW build reproduction • http://www.96boards.org/product/dragonboard410c/ DragonBoard 410c Product Page • https://discuss.96boards.org/c/products/dragonboard410c/ Community Forums 96boards.org • https://www.96boards.org/documentation/ConsumerEdition/DragonBoard-410c/ Getting started and installation guides • https://www.codeaurora.org/openembedded-mass-market-and-ioe-qualcomm- OpenEmbedded for Snapdragon Code Aurora snapdragon Embedded project code repository

22 Thank you

Nothing in these materials is an offer to sell any of the components or devices referenced herein. ©2017 Qualcomm Technologies, Inc. and/or its affiliated companies. All Rights Reserved. Qualcomm Snapdragon, Qualcomm Hexagon, Qualcomm Adreno, and Qualcomm Krait are products of Qualcomm Technologies, Inc. Qualcomm, Snapdragon, Adreno, Hexagon and DragonBoard are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Krait is a trademark of Qualcomm Incorporated. Other products and brand names may be trademarks or registered trademarks of their respective owners. References in this presentation to “Qualcomm” may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiaries or business units within the Qualcomm corporate structure, as applicable. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially all of its product and services businesses, including its semiconductor business, QCT.