Characterization of Residual Stress in Microelectromechanical Systems (MEMS) Devices Using Raman Spectroscopy
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Air Force Institute of Technology AFIT Scholar Theses and Dissertations Student Graduate Works 4-1-2002 Characterization of Residual Stress in Microelectromechanical Systems (MEMS) Devices Using Raman Spectroscopy LaVern A. Starman Follow this and additional works at: https://scholar.afit.edu/etd Part of the Electro-Mechanical Systems Commons Recommended Citation Starman, LaVern A., "Characterization of Residual Stress in Microelectromechanical Systems (MEMS) Devices Using Raman Spectroscopy" (2002). Theses and Dissertations. 4351. https://scholar.afit.edu/etd/4351 This Dissertation is brought to you for free and open access by the Student Graduate Works at AFIT Scholar. It has been accepted for inclusion in Theses and Dissertations by an authorized administrator of AFIT Scholar. For more information, please contact [email protected]. CHARACTERIZATION OF RESIDUAL STRESS IN MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES USING RAMAN SPECTROSCOPY DISSERTATION LaVern A. Starman Captain, USAF AFIT/DS/ENG/02-01 DEPARTMENT OF THE AIR FORCE AIR UNIVERSITY AIR FORCE INSTITUTE OF TECHNOLOGY Wright-Patterson Air Force Base, Ohio APPROVED FOR PUBLIC RELEASE; DISTRIBUTION UNLIMITED. Report Documentation Page Report Date Report Type Dates Covered (from... to) 26 Mar 02 Final Jun 00 - Mar 02 Title and Subtitle Contract Number Characterization of Residual Stress in Microelectromechanical Systems (MEMS) Devices Grant Number Using Raman Spectroscopy Program Element Number Author(s) Project Number Capt La Vern A. Starman, USAF Task Number Work Unit Number Performing Organization Name(s) and Address(es) Performing Organization Report Number Air Force Institute of Technology Graduate School of AFIT/DS/ENG/02-01 Engineering and Management (AFIT/EN) 2950 P Street, Bldg 640 WPAFB, OH 45433-7765 Sponsoring/Monitoring Agency Name(s) and Sponsor/Monitor’s Acronym(s) Address(es) AFRL/MLMR ATTN: Mr. John D. Busbee 2977 P Street Rm 215 WPAFB, OH 45433-7746 AFRL/MLPJ Sponsor/Monitor’s Report Number(s) ATTN: Lt Col William D. Cowan 2977 P Street WPAFB OH 45433-7746 Distribution/Availability Statement Approved for public release, distribution unlimited Supplementary Notes The original document contains color images. Abstract Due to the small scale of MEMS devices, the inherent residual stresses during the deposition processes can affect the functionality and reliability of the fabricated devices. Residual stress often causes device failure due to curling, buckling, or fracture. Currently, few techniques are available to measure the residual stress in MEMS devices. In this dissertation, Raman spectroscopy is used to measure and monitor the residual and induced stresses in MUMPs polysilicon MEMS devices. Raman spectroscopy was selected since it is nondestructive, fast, and provides potential in situ stress monitoring. Raman spectroscopy scans on unreleased and released MEMS fixed-fixed beams, cantilevers, and micromirror flexures were performed to obtain residual stress profiles. The profiles are compared to analytical models to assess the accuracy of Raman spectroscopy. I performed post-processing thermal anneals, phosphorous diffusions and phosphorous ion implantations to characterize the residual stress changes within MEMS devices. From post-processing experiments, the Raman residual stress profiles on MUMPs structures indicate a stress reduction by over 90%, which is verified with on-chip test structures. The reduced residual stress levels can improve the performance, reliability, and yield of the MEMS devices as they become smaller. In addition, I present the first Raman stress measurements in III-V MEMS Subject Terms Residual Stress, Raman Spectroscopy, MUMPs, MEMS, Polysilicon Report Classification Classification of this page unclassified unclassified Classification of Abstract Limitation of Abstract unclassified UU Number of Pages 297 Research sponsored in part by the Air Force Research Laboratory, Air Force Materiel Command, USAF. The United States Government is authorized to reproduce and distribute reprints notwithstanding any copyright notation thereon. The views and conclusions contained in this dissertation are those of the author and should not be interpreted as necessarily representing the o±cial policies or endorsements, either expressed or implied, of the Air Force Research Laboratory, Department of Defense, or the United States Government. AFIT/DS/ENG/02-01 CHARACTERIZATION OF RESIDUAL STRESS IN MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES USING RAMAN SPECTROSCOPY DISSERTATION Presented to the Faculty School of Engineering and Management Air Force Institute of Technology Air University Air Education and Training Command In Partial Ful¯llment of the Requirements for the Degree of Doctor of Philosophy in Electrical Engineering LaVern A. Starman, B.S.E.E., M.S.E.E. Captain, USAF April 2002 APPROVED FOR PUBLIC RELEASE; DISTRIBUTION UNLIMITED. AFIT/DS/ENG/02-01 CHARACTERIZATION OF RESIDUAL STRESS IN MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES USING RAMAN SPECTROSCOPY DISSERTATION LaVern A. Starman, B.S.E.E., M.S.E.E. Captain, USAF Approved: ^^r1"^ oiti/f'/äoöfi >o\ James A. Lott, PhD, Committee Chairman Date Professor of Electrical Engineering -^j$$tr^^^ 1= * - z**^ Mäher S. Amer, PhD, Committee Member Date Assistant Professor of Materials Science and Engineering Lt Col William D. Cowan, PhD, Committee Member Date 'SlrNForce Researcl\Lahoratory Col Donald R. Kitchen, PhD, Committee Member Date Head, D^artm^rbof Electrical and<7orftputer Engineering 4fT_ <T2L Lt Col Michael A. Marciniak, PhD, Committee Member Date Assisj^j^Jfeefeseor o&Engineering Physics ^r 2QGZ~-- William F. Bailey, PW, Dean's Representative Date Associate Professor/of Engineering Physics Accepted: ^> ^ /JjjL / £ ^ '„ Robert A. Calico, Jr. Date v Dean, Graduate School of Engineering and Management Acknowledgements Without the constant love, support, prayers, and understanding of my won- derful wife and son, this dissertation research e®ort would not have been possible. Despite my many absences from home, both physically and mentally, my heart and thoughts were always with you. I would like to thank my Mom, as well as my Parents In-Law, for understanding the many months between visits and the constant love and support you provided my family in my absence. I would also like to thank our friends, Lynn, Ginge, Ryan, Leslie, Chris, Randy, and Dina who called or emailed us numerous times to lend their support. I truly appreciate all the support and prayers you provided. I owe a huge debt of gratitude to my research advisor and committee chairman, Lt Col James Lott, who's persistence and guidance permitted my transfer into AFIT to pursue my doctoral degree. Although this was a relatively new research area, I appreciate your constant encouragement and leadership you provided to enable me to ful¯ll my research endeavors. I am also thankful to the other members of my research committee, Lt Col Bill Cowan for your constant support, encouragement and willingness to share your vast knowledge in the area of MEMS and MEMS research. Lt Col Mike Marciniak for your assistance with providing insight in many of the physics issues. I'd also like to thank Col Donald Kitchen for his enthusiasm and willingness to join my committee late in the research period. Finally, a very special thanks to Dr. Maher Amer for the continuous use of his Raman spectroscopy system. Without your generosity and sincere indebtedness, this research would not have been possible. I also appreciated your time spent addressing many of my Raman spectroscopy questions and concerns. Thanks also go to my Deans Representative, Dr. William Bailey, for serving on my committee. I'd like to thank all the members of AFIT's Microgroup for your support and assistance throughout my research. A special thanks goes to Capt Eddie Ochoa for iii his endless knowledge and support in answering my many programming questions, providing suggestions and lab assistance during my research. I want to especially thank Dr. Tom Nelson, Mr. Bill Siskaninetz, and the entire MEMS group at AFRL for all your assistance, expertise and usage of the SND cleanroom. A special thanks goes to Dr. Becky Cortez for taking the time to perform the SEM imagery necessary for this research and Dr. Tom Nelson for performing the reflectivity measurements. Most of the work in this dissertation would not have been possible without the credit card and procurement expertise of Mr. Charlie Powers. Technicians Rick Patton and Bill Trop were indispensable in providing assistance before, during, and after AFIT's laboratory move to minimize research delays. I also must recognize several people outside AFIT for their contributions to my research. Mr. Dave Koester at Microelectronics Center of North Carolina was ex- tremely forthcoming with details of the MUMPsr processes. Dr. Nelsimar Vandelli and others at CoventorWare for your endless knowledge and suggestions to improve FEM modelling of MEMS devices and Ralph Sinclair at Implant Sciences for your quick turnaround of all implants. I appreciate the funding and support provided by Lt Col William Cowan and John Busbee from the Laser Laser Hardening and Materials Research branches of the Air Force Research Laboratory. I thank these organizations for their ¯nancial support. Finally, I would like to dedicate this work to my father who passed away during my doctoral studies. I appreciate the time and memories we shared and for instilling the work ethics necessary for ful¯llment of my doctoral degree. I know you would be proud of me. We miss and love you, May God Bless you. - LaVern A. Starman iv Table of Contents Page Acknowledgements . iii List of Figures . x List of Tables . xviii Abstract . xix I. Introduction . 1-1 1.1 Introduction . 1-1 1.2 Problem Statement and Approach . 1-2 1.3 MEMS Background . 1-3 1.4 Stress Characterization and Measurement Techniques 1-4 1.5 Research Accomplishments . 1-8 1.6 Dissertation Organization . 1-10 Bibliography . 1-12 II. MEMS Modelling and Foundry Fabrication Processes . 2-1 2.1 Chapter Overview . 2-1 2.2 Multi-User MEMS Process (MUMPsr) . 2-2 2.2.1 MUMPsr Fabrication Process . 2-2 2.2.2 MUMPsr Bu®ered Oxide Etch. 2-4 2.3 Sandia Ultra-planar Multi-level MEMS Technology .