Smartphone [ Smartphone History ] 6 Birth in the 1990S, Widespread Adoption with the Iphone

NE Handbook Series 2011 Smartphone [ Smartphone History ] 6 Birth in the 1990s, Widespread Adoption with the iPhone

[ Actual Smartphone Components ] 10 Taking Apart the iPhone 4 Click. 14 Glossary [ Components ] 14 RF Circuits 16 Application Processors 18 Liquid Crystal Panels 20 Organic Electroluminescence Panels Find. 22 CMOS Sensors 23 Pico Projectors 24 Touch Panels 26 Motion Sensors 28 NAND Flash Memory Buy. 30 DRAM 31 GPS 32 Ambient Light Sensors 33 MLCC 34 Li-Ion Rechargeable Batteries 35 USB 36 HDMI 37 SIM Cards [ Wireless Communication ] 38 GSM 39 W-CDMA 40 CDMA2000 41 Mobile WiMAX 42 LTE 44 Wireless LAN [ short-Range Communication ] 46 Bluetooth Low Energy and ANT 48 NFC 50 Wireless Power Supplies [ Operating System ] 52 Android 53 Windows Phone 7 54 iOS 55 Application Store Digi-Key is an authorized distributor for all supplier partners. New products added daily. © 2011 Digi-Key Corporation, 701 Brooks Ave. South, Thief River Falls, MN 56701, USA PR NE Handbook 2011│ SmartPhone

Q How would you assess the current smartphone Rapidly Changing Smartphones market ? Tap Digi-Key’s Potential Restle Smartphone designers did not invent snappy color graphic displays, touch screens, interconnectivity, and Smartphones are proliferating rapidly, with many companies built-in sensors such as accelerometers, GPS, and gyro- selling designs sporting a wide variety of electronic compo- scopes, but they have certainly influenced embedded device nents, including touch panels and gyroscope sensors. What designers, component manufacturers, and distributors to are the major trends in the smartphone market? How can think about and include these elements in their product smartphones be designed most effectively? And what strategy plans. Further, smartphone economies of scale have helped does components distributor Digi-Key Corp of the US have? reduce the cost of smartphone-like components. It has Nikkei Electronics interviewed Randall Restle in his new post never been easier to incorporate these components into as Director of Design Support Services and asked him about any embedded electronic device. Distributors like Digi-Key smartphone market trends, highly effective design methodol- have smartphone components in stock and available for im- ogy, and the future strategy of Digi-Key. mediate shipment.

Q How does smartphone design impact other portable devices ? Restle A newly introduced device immediately looks old and dated if it doesn’t share a smartphone’s attributes. What happened to the cell phone itself – that they instantly looked “old-fashioned” when Apple introduced its iPhone – is happening to all devices. Automobile dashboards, MP3 players, GPS units, tablet PCs, even household appliances like ranges and refrigerators are losing their knobs and con- trols in favor of touch screens overlaid on high-resolution displays. This gives these devices smooth edges that are easy to keep clean and that look new. The smartphone’s influence is pervasive.

｜ Connectivity, Size Are Critical ｜

Randall Restle Q How critical is connectivity ? Director of Design Support Services Digi-Key Corp Restle Connectivity has also become a requirement.

2 3 PR NE Handbook 2011│ SmartPhone

There are laundromats at universities in the United States form a plan of attack to include the chosen technologies. that tweet “followers” to signify a washer or dryer has Distributors like Digi-Key stock these kits and boards as completed its cycle and is available for the next user. Of well. Starting from ground zero is the hard way to go to- course, users are receiving those messages on their smart- day. The job is not to invent new technologies, but instead phones. There are other examples showing how pervasive to include technologies your customers value the most in a connectivity has become. Traveling gourmet “lunch wag- cost-effective way. ons” notify loyal followers of the meal of the day, provide a picture of the dish, provide the wagon’s location, and Finally, if the new technologies are too new or wide-rang- identify times of service for gourmet-seeking patrons who ing to fit the expertise of your development staff, there are follow their lunch with their smartphone. Additionally, third-party design service providers (DSPs) with the neces- there are kitchen appliances that include videophone and sary expertise that can augment your capabilities. These Internet browser applications. DSPs can add the unfamiliar technologies while your team focuses on what it does best, to assure the main function Smartphones have also influenced “size of performance.” of your product remains intact and is uncompromised with Many children regularly watch their favorite videos on the new features the market demands. handheld devices. Custom and semi-custom circuitry, such as complex programmable logic devices (CPLDs), have Digi-Key has strong relationships with various device made graphics in small packages as fast as, or faster than, vendors that know the cutting-edge technologies of smart- desktop equivalents with more new applications exploit- phones. Such vendors have been supplying valuable prod- ing this capability than on traditional platforms. Simply ucts for inclusion in next-generation smartphones. All of put, there is more computing horsepower per cubic unit of these products can be viewed and ordered on Digi-Key’s space in a handheld smartphone than in traditional, large Android /iPhone application. electronic devices.

｜ Effective Use of Design Kits and Houses ｜

Q What are the most important issues for effectively designing smartphones and selecting components ? Restle One might wonder how to start designing a new product given the common expectation of features inspired by hand-sized smartphones. Thankfully, many component Digi-Key Corporation suppliers offer development kits and evaluation boards to Tel：1-800-344-4539 Fax：218-681-3380（US） investigate certain technologies and allow a designer to URL：http://www.digikey.com/

4 5 Smartphone History NE Handbook 2011│ SmartPhone

Birth in the 1990s, clamshell smartphone. It functioned as a mobile phone when Widespread Adoption with the iPhone folded shut, and opened to reveal a QWERTY keyboard, cross key pad and black-and-white landscape display. The OS was GEOS, from Breadbox Computer Company of the US. The term “smartphone” is used to signify a mobile tele- The Nokia Communicator gained widespread adoption in phone that adds powerful and sophisticated functions to the business world, and was followed by the Nokia 9110 in conventional mobile phones capable of only telephony and 1998. In 2000 the Nokia 9110i was released with support short message service (SMS) text. It is often described as a for mobile phone wavebands used in the United States, and fusion of a personal digital assistant (PDA) offering memo, the terminal also evolved to use the Symbian OS. calculator and schedule functions, and a mobile phone. In 1997 Ericsson of Sweden released the GS88, a terminal The history of smartphones can be divided broadly into similar to the Nokia 9000 Communicator. The word smart- three eras: the early years of the 1990s when smartphones phone is thought to have been used for the very first time in first appeared, the era of surging use in business from material introducing this product. 2000–2007, and the most recent era of widespread use by the general public, from 2007 until the present. In Japan Business adoption (2000–2006) the introduction of i-Mode service in 1997 supported sig- In 2000 number of smartphones appeared, running gen- nificant evolution in handset functionality, and after that eral-purpose OSes designed for use in PDAs and embedded point most handsets offered in Japan fit the definition of equipment. A few of the more well-known were Symbian, smartphones. To avoid unnecessary confusion, however, this Palm OS and Windows CE. history concentrates primarily on smartphones in Europe and America. The Symbian OS was first used in the Ericsson R380 Smartphone. The tenkey pad opened up like a door, reveal- The dawn of smartphones (1990s) ing a landscape touch panel for PDA functionality. It could The very first smartphone in the world is said to be the be used as a mobile phone when closed. In 2000, Nokia fol- IBM Simon, released to the market by IBM in 1994. The ter- lowed Ericsson’s lead with smartphones running Symbian minal was provided with a stylus and touch panel, offering OS, and in fact adopted Symbian OS for all its smartphones. not only telephone conversations, but also PDA and gaming functions. The operating system (OS) was the Zaurus OS, The first smartphone to use Palm OS was the Kyocera which was then being used in PDAs from Sharp. 6035, from Kyocera of Japan. It was similar to the Ericsson R380, with the tenkey pad folding out to allow use as a Palm In 1996 Nokia released the Nokia 9000 Communicator, a PDA. The Kyocera 6035 was released in February 2001.

6 7 Smartphone History NE Handbook 2011│ SmartPhone

The Windows CE smartphone was the Microsoft Windows peared thereafter, from companies including Motorola Mo- Powered Smartphone 2002, announced by Microsoft in bility, Samsung Electronics, and Sweden-Japan joint venture 2002. The first terminal to mount the OS was the Orange Sony Ericsson Mobile Communications. SPV, sold by Microsoft itself, and manufactured by HTC of Taiwan. Later renamed Windows Mobile, a variety of termi- Even Microsoft, which had concentrated on developing nals were released to the market from companies including smartphone OS for corporate use, changed its approach as Samsung Electronics and Sharp. a result of the success of iPhone and Android technologies, disclosing Windows Mobile 6.5 and Windows Phone 7 (see The first incarnation of the popular BlackBerry, from Re- page 53), both emphasizing use by the general public. A search In Motion of Canada, appeared in 2003. It featured a terminal running Windows Mobile 6.5 was released in Octo- QWERTY keyboard, e-mail, SMS and browsing functions in ber 2009, and the Windows Phone 7 terminal appeared in an integrated implementation. October 2010.

All of these terminals aimed at corporate use, and were provided with an array of business applications. As a result, they penetrated the general consumer market very little.

The smartphone as commodity (from 2007)

Today the general public is buying and using smartphones. The change began with the released of the iPhone by Apple in June 2007. It came with a user interface (UI) capable of handling almost all operations, browsing and e-mail functions equivalent to those found in personal computers, music play apps that synched with iTunes, and more. It turned the smartphone into a device that could be used by anyone.

Following the growing trend, Google announced the An- droid software platform (see page 52) for smartphones in November 2007. The first Android-powered smartphone,

the T-Mobile G1 manufactured by HTC, was released by The 1st-generation iPhone brought T-Mobile USA in 2008. A host of Android smartphones ap- the smartphone to the general public

8 9 Actual Smartphone Components NE Handbook 2011│ SmartPhone

Taking Apart the iPhone 4 Rear cover

Apple iPhone series is driving the global smartphone market, and remains a hit worldwide: about 1.7 million 4th-gen- LCD panel, touch panel eration iPhone 4 models were sold in only three days after and case front its release in June 2010. Over a year after initial release, the fever shows no signs of abating. A survey by IDC shows total iPhone shipment from April through June 2011 as about 20.3 million units, 2.4 times the level of the same quarter in 2010. In terms of units shipped per quarter, this puts Apple into the top slot worldwide, ahead of Nokia. Home button Ambient light sensor When announcing the iPhone 4, Apple CEO Steve Jobs Video conferencing camera Vibrator stressed the thinness of the case at only 9.3mm, the high- Mute button Phone speaker Earphone jack definition 326ppi display and other hardware specs. “It’s not Power button Volume like Apple to emphasize the hardware like that,” complained Camera module one engineer in Japan, echoing similar comments by many in the field. The iPhone series introduced a whole new range of concepts into the mobile phone market that are now taken Main board for granted, but it appears to have evolved into a mature product. And, in fact, when the Japan version of the iPhone 4 (32 Gbyte spec) is broken down, it shows just how Apple’s Micro design approach is much more detailed than it used to be. SIM card

Li-polymer Design detail to the level of Japanese mobile phones rechargeable battery External connector When the iPhone 4 is disassembled, you can see how com- (charging, etc.) Chassis Speaker module ponents are packed tightly into the case, which measures (integral with part of main antenna) about 115.2mm x 58.6mm x 9.3mm (Fig. 1). Many of the engineers who took part in the breakdown agreed it looked like it had been developed by a Japanese manufacturer. Fig. 1 Inside the iPhone 4 The LCD panel module, Li-polymer rechargeable battery, and camera module are flexible boards connected to the main board. A detailed examination of the components shows signs of Photos: Hiroshi Nakamura

10 11 Actual Smartphone Components NE Handbook 2011│ SmartPhone

Uniquely-shaped Wireless LAN/ Bluetooth ④● module ③●

cooperative design tuning with component manufacturers, A4実装面

and design features to boost manufacturing yield. The main Side with A4 chip ②● ① Microprocessor，Samsung Electronics, A4 APL0398 ② Wireless LAN/Bluetooth transceiver IC, Broadcom, ⑤● board, for example, mounts a Wireless LAN/Bluetooth module BCM4329FKU8C ③ GPS receiver IC, Broadcom, BCM4750●BG ⑥● with a unique shape (Fig. 2). One mobile phone engineer com- ④ R6111 ⑤ 10C0 019A 0075 ⑥ 1240 ●● 0B mented “I’ve never seen anything like this before! Mounting ①● ⑦ Gyrosensor, STMicroelectronics, AGD1 2021 F36CS real estate was limited, and you can see how Apple drew up ⑧ 3-axis acceleration sensor, STMicroelectronics, 2016 33DH BYGBQ detailed dimensions and specs for each function block, then ⑨ NXN 04 ⑩ GSM/W-CDMA transceiver IC, Infineon Technologies, ⑨● 338S0626 ⑦● ⑧● worked with component manufacturers to implement them.” ⑪ SAW Filter, Murata Manufacturing ⑫ Power amp/duplexer module, Skyworks Solutions, SKY77459-17 ⑬ Power amp/duplexer module, TriQuint Semiconductor, Their attention to cost reduction is evident in the Li-ion TMQ676091 86mm ⑭ Power amp/antenna switch module, Skyworks Solutions, SKY77541-32 (Li-polymer) rechargeable battery. In the iPhone 4 the bat- ⑮ Power amp/duplexer module, Skyworks Solutions, SKY77452-20 tery is connected to the main board with a connector, and ⑯ Power amp/duplexer module, TriQuint Semiconductor, TQM666092 ⑫●

has a plastic sheet on it to simplify removal. In prior models, ⑰ GBA748 ⑩● 18mm 面装実リモメ・ュシッラフ ⑬● the battery was affixed to the case with strong double-sided ⑪● ⑰● tape. Many other modules in the iPhone 4 are also connected ⑮●

to the main board using connectors. The objective seems to ⑭● ⑯●

have been to reduce manufacturing cost by making it pos- ⑤● フラッシュ・メモリ実装面 sible to replace and repair components in block units. ④● ③● 18mm ②●

The main board itself is mounted with key components ①● Side with flash memory ① 32Gbit NAND flash memory, Samsung Electronics,

on both sides (Fig. 2). The board measures about 86mm x K9PFG08U5M ② Geomagnetic sensor, Asahi Kasei Microdevices,86mm 8975 18mm, with a total of 10 layers. A large number of “0402” ③ Audio decoder, Cirrus Logic, 338S0589 ④ 0525E3 ⑤ Touch panel controller IC, TI, 343S0499 components (components measuring 0.4mm x 0.2mm) are ⑥ Power supply IC, Dialog Semiconductor, 338S0867 ⑥● ⑦ AFC 9A0 91● used to boost mounting density. Of the 664 components ⑧ TG202 ⑨ Baseband processing IC, Infineon Technologies, 337S on the main board, about a third of them – 227 – are 0402 3833 ⑩ SDRAM, Intel, 36MY1EF components. Gaps between components are narrower, for ⑦● ⑪ 13F04 ⑧● the smaller board. A Japanese packaging engineer points out Fig. 2 Main board with reduced mounting area that the component spacing is as tight as used by Japanese ⑨● ⑪● Diagram shows the functions, supplying manufacturers and markings of major components on the engineers, and even tighter in a few places. It is quite pos- main board. Component functions and manufac- ⑩● turers are guesses by Nikkei Electronics, based

sible that a Japanese manufacturer is responsible for the A4実装面 on interviews, investigations, component markings combination of 10-layer board, and numerous 0402 compo- and other data. Illegible characters are indicated nents and fine-pitch connectors. by the ● mark. Photos: Hiroshi Nakamura

12 13 Glossary NE Handbook 2011│ SmartPhone

Components RF Circuits

The RF circuitry is positioned between the digital circuits When a single smartphone model is sold worldwide, differ- and the antenna, acting as a bridge between the two. ent wavebands are used for mobile communication in each nation, so that the device must offer multiple RF transceiver In the RF transmitter, the modulation circuit converts the ICs and power amp modules. The number of wavebands to input digital signal into a phase-shift carrier wave, which is be supported will increase in the future as the existing GSM amplified by the power amp. The amplified signal is filtered (page 38) and W-CDMA (page 39) communication methods to strip out extraneous noise, and then transmitted from the are joined by LTE (pages 42–43). Already the competition is antenna. intensifying to develop semiconductor products capable of utilizing multiple wavebands with a minimal number of com- In the receiver the signal from the antenna is first filtered ponents. to extract the target frequency. This is amplified in a low- noise amplifier (LNA), and phase shift used to produce the digital signal.

Baseband Generally, RF circuits use a single antenna for both recep- circuit tion and transmission. As a result, when different wavebands are used for sending and receiving in a frequency division duplex (FDD) design, the device is provided with a duplexer, which acts as a filter to prevent transmission signals from Flip side being input into the receiving circuit. Likewise, when a RF transceiver IC

single frequency is used at different times in a time division RF circuitry duplex (TDD) design, a switch is needed to select either the Module com- send or receive circuit. These are all part of the RF circuitry. bining GSM power amp and antenna When implemented in a smartphone, the RF circuit can be switch roughly split into the RF transceiver IC and the power amp module. The RF transceiver IC usually contains the modulation circuit, reception LNA and filters, which the power amp Combined W-CDMA power amp and duplexer module usually integrates transmission filters and duplexer. The iPhone 4 Mobile Communication Module In some cases, however, duplexer and filters may be imple- RF circuits for several different mobile communication standards mented in separate packages. and wavebands are implemented in multiple semiconductors.

14 15 Glossary NE Handbook 2011│ SmartPhone

Components Application Processors

Application processors are ICs integrating the functions Major High-End Smartphone Application Processors Shipping in necessary to run specified applications. In smartphones, ap- 2011 and Beyond Manufac- NVIDIA Qualcomm Renesas ST- Texas plication processors usually include not only the central pro- turer Mobile Ericsson Instruments cessing unit (CPU), but also memory controller, voice codec Product Kal-El Snapdragon SH-Mobile OMAP processor, graphics processing unit (GPU), and controllers name (development APQ8064 APE5R 5430 codename) for USB and SD memory card interfaces. Some designs for CPU ARM Krait ARM ARM ARM smartphones, like the MSM8x60 series from Qualcomm, also Cortex-A (proprietary Cortex-A9 Cortex-A15 Cortex-A15 series CPU; include baseband circuits to handle mobile communication (details not instruction set disclosed) compatible digital processing. with ARMv7)

CPU cores 4 4 2 2 2 Almost all smartphone application processors use a micro-

processor instruction set compliant with the ARM architec- Max. CPU Not disclosed 2.5GHz Not disclosed 2.5GHz 2GHz operating ture defined by ARM of the UK. frequency

GPU 12-core Adreno 320 Imagination Imagination Imagination Trending toward multi-core designs, high clock rates NVIDIA GPU (200 million Technologies Technologies Technologies polygons/s PowerVR Rogue PowerVR To answer surging demand for more powerful functions draw SGX543MP (development SGX544MP performance) codename) and higher performance, the CPUs driving application pro- CMOS 40nm 28nm Not 28nm 28nm cessors are evolving rapidly toward faster clocks and multi- technology disclosed core designs. The iPhone 3G released by Apple in July 2008, Sample ship Feb. 2011 Early 2012 June 2011 2011 Second half for example, came with an application processor based on date 2011 the ARM11, running at 412MHz. The iPhone 3GS in June 2009 featured the Cortex-A8, one generation beyond the ARM11, with an operating frequency of 600MHz. The iPhone 4 in June 2010 boosted the frequency to 1GHz. The ship 2.5GHz designs before the end of 2011. NVIDIA showed Galaxy S II Android smartphone from Samsung Electronics a working demo of its new 4-core Kal-El (development code- in April 2011 uses a Cortex-A8 based dual-core CPU with an name), the next-generation Tegra chip now in development, operating frequency of 1.2GHz. adding it has “begun sample-shipping the first quad-core processor in the world for mobile applications.” A variety of The trend seems likely to continue: At Mobile World Con- smartphones and tablets mounting two to four CPU cores gress 2011 in Barcelona, Spain in February 2011, both Qual- and running at speeds of up to 2GHz are likely to appear in comm and ST-Ericsson of Switzerland announced plans to 2012.

16 17 Glossary NE Handbook 2011│ SmartPhone

Components Liquid Crystal Panels

Liquid crystal panels are display devices utilizing charac- Compared to conventional mobile phones, smartphones teristics of liquid crystal molecules such as optical anisotropy offer liquid crystal panels with larger screen sizes and bet- (birefringence) and dielectric ratio anisotropy. In conjunction ter definition. Most of the high-end smartphones shipped in with polarizers, they can express tonal images by passing or 2011 boast screen sizes of four inches or larger, with display blocking light. The liquid crystal molecules themselves do resolutions of at least 480 pixel x 800 pixel (wide VGA). not emit light, so a light source is needed, whether backlight, Even mid-range models offer at least 3-inch displays with frontlight or ambient. 320 pixel x 480 pixel (half VGA) resolution. The IPS mode is becoming more common as it minimizes the effect of touch Active matrix liquid crystal panels, using thin-film transis- input on display image appearance. tors (TFT) as the drive elements, are gaining widespread adoption in many types of electronic equipment, including One of the key reasons that high-end smartphones from TVs, mobile phones, smartphones and digital cameras. De- various vendors are offering larger displays with better reso- pending on how the liquid crystal molecules are oriented, lution, coupled with IPS mode operation, is the enormous there are a variety of display modes, such as twisted nematic success of the iPhone 4, released in 2010. The iPhone 4 has a (TN), vertical alignment (VA), in-plane switching (IPS) and 3.5-inch double VGA liquid crystal panel with 640 pixel x 960 optically compensated bend (OCB). pixel resolution. Apple emphasizes display definition, referring to this display system as the Retina display. IPS mode is well-suited to touch input because the liquid crystal molecules (a) Disassembled iPhone 4 （b）Basic principle of IPS mode (cross-section) are rotated horizontally with respect to the glass, minimizing Fingertip pressure has the effect of fingertip pressure on molecule orientation. little eﬀect on liquid crystal Glass sheet molecule orientation Japanese and Korean panel manufacturers have leveraged Liquid crystal Liquid crystal molecules their technologies for higher panel definition to take large Liquid crystal molecules rotate panel horizontally shares of the growing smartphone liquid crystal panel mar- (3.5-inch, IPS mode, ket. For VGA and better liquid crystal panels of four inches transmissive; Electrode Electrode Electric TMD manf.) field and larger, it is impossible to attain an adequate aperture ra- Front case tio without using low-temperature poly-crystalline Si (LTPS) Voltage oﬀ Voltage on TFTs as the drive devices. Japanese and Korean panel manu- iPhone 4’s Liquid Crystal Panel facturers have been investing into LTPS TFT technology and IThe IPS mode turns the supply voltage on and off to rotate liquid manufacturing lines for some time now, and their technical crystal molecules horizontally with respect to the glass, making it a good choice for use with touch input. superiority provides added value.

18 19 Glossary NE Handbook 2011│ SmartPhone

Components Organic Electroluminescence Panels

Organic electroluminescence panels are display devices displays due to their suitability in high-definition, large-size utilizing electroluminescence through organic compounds. applications. The first commercial implementation was a Electroluminescence is the phenomenon where light is emit- panel mounted in a digital camera from Eastman Kodak in ted when voltage is applied to a specific substance. The April 2003, developed jointly with Sanyo Electric. Consider- mechanism of light emission is the same as in LEDs, namely able technical obstacles, however, limited the technology to a injection and re-coupling of electrons and holes, for which few mobile telephones through 2007. reason they are often referred to as organic LEDs or OLEDs. They are viewed as the optimal choice for the next genera- The AM OLED panel began to enjoy widespread use from tion of displays, offering the response speed of self-emitting 2008, showing up in a range of mobile phones, smartphones, devices coupled with wide viewing angle and brilliant color- portable media players, digital cameras and other portable ation. equipment by offering screen size and definition competitive with LCD panels. These products all handle video, and users Depending on the mechanism used to emit the light, OLED demanded the high display performance of OLED panels. panels are grouped into two types: the active matrix (AM) Today they are making steady inroads into smartphones, type, where organic electroluminescent material emits light starting with the Galaxy S II from Samsung Electronics, while on a per-pixel basis using a thin-film transistor (TFT) sub- Sony Computer Entertainment plans to use a 5-inch AM strate, and the passive matrix (PM) type, where an electrode OLED panel in the PlayStation Vita portable game system array causes optical emission on a per-line basis. AM OLED slated for release at the end of 2011. panels are viewed as the most promising for next-generation Although adoption is increasing in mobile gear, there are few manufacturers volume-producing active matrix OLED

Through 2007 2008 and beyond panels. Samsung Mobile Display holds a monopolistic share,

Mobile equipment Mobile phones and smartphones for the leaving other manufacturers behind when it comes to capi- domestic and overseas markets (VGA class) Mobile phones for domestic market (QVGA class) tal investment scale. Samsung Mobile Display put its new ▶Improved deﬁnition ▶Gradual expansion OLED panel manufacturing line into operation in the second in applications Portable media Portable TVsDigital cameras players quarter of 2011 (April to June), handling 5.5th-generation (1300mm x 1500mm) glass sheets. The new facility is expected to boost manufacturing capacity even more.

Active Matrix OLEDs Enter the Mainstream Since 2008, active matrix OLED panels have gained widespread adoption, especially in mobile equipment and smartphones.

20 21 Glossary NE Handbook 2011│ SmartPhone

Components Components CMOS Sensors Pico Projectors

In this imaging device, the charges accumulated in the Pico projectors are miniature projectors designed for use photodiodes are converted into voltages at the pixels, ampli- with mobile equipment. Compared to desktop units, they fied and read. CMOS sensor development is heating up for offer much better portability, and can be used affixed to the use in mobile phones because of their small size and low body. power demands. The backside illumination (BSI) design is becoming the most common type of CMOS sensor for use in The smaller size is made possible by replacing the stan- smartphone cameras, because it makes it possible to capture dard ultra-high performance (UHP) lamp light source with high quality imagery with a smaller package. Six firms have LEDs and lasers, simplifying power supply and heat radiation initiated volume production: Sony, Omni Vision, Aptina Imag- mechanism, and shrinking the optical system. The display ing, Samsung Electronics, STMicroelectronics, and Toshiba. device can be the same liquid crystal on silicon (LCOS) as a CMOS sensors are fabricated by first forming the photodiode conventional projector, a digital micromirror device (DMD), (handling photoelectric conversion) on the silicon wafer, and or microelectromechanical system (MEMS) mirrors. then forming the metallization. If the wafer is illuminated from the top after the metallization is formed it is referred In 2009 the first mobile phones and compact digital cam- to as a front-side illumination design, and if from the metal- eras with onboard pico projectors were released, stimulating lization-free back side of the wafer then it is BSI. It is much high hopes for the pico projector market. If they become less likely for the metallization in BSI designs to reflect light common in portable equipment, it will mean explosive received on the sensor surface, so that for a given input they growth in shipment volume. A survey by Pacific Media Asso- output brighter imagery than front-side illumination sensors. ciates of the US estimates a market of about 17 million units in 2014 for internal pico projectors, and about 23 million when external projectors are included.

Conventional front-side illumination Backside illumination (a)Samsung’s Beam (b)Fujitsu-developed F-04B Incident light Microlens

Metallization photo layer diode Light sensing photo surface diode Removed in BSI designs Mounting Projectors in Mobile Gear Capturing Every Photon with Backside Illumination (a) is the Beam smartphone from Samsung, and (b) the F-04B mo- Because there is no metallization layer between the photodiodes bile phone developed by Fujitsu for NTT DoCoMo. The projector (which handle photoelectric conversion) and the color filters in back- can be connected to the F-04B in place of the keyboard, after de- side illumination (BSI) sensors, less incoming light is lost. taching keyboard and display.

22 23 Glossary NE Handbook 2011│ SmartPhone

Components Touch Panels

Galaxy S OLED panel with uses integral “Super AMOLED” conventional touch panel design for (in-cell OLED panel Touch panels are transparent devices that can detect areas thinner display, with integral touch sensor) Front glass improved subject to finger or style pressure, mounted on top of display transparency Touch panel Front glass panels. Broadly speaking, there are five methods of detecting Touch sensor (electrode 「Galaxy S」 contact: capacitive, resistive, surface acoustic wave, infrared, pattern, etc.) OLED panel OLED panel Touch sensor (electrode and electromagnetic induction. Of these, smartphones and pattern, etc.) formed on panel tablets use either capacitive or resistive. front surface On-Cell Touch Panel The on-cell type, with touch sensor formed on the front surface of Capacitive touch panels were the trigger to the success the display panel, is becoming increasingly common. Samsung Elec- tronics has named its on-cell OLED panel the “Super AMOLED,” and of Apple’s iPhone, and the market is growing rapidly. They adopted it in the Galaxy S and other smartphones. (Diagram by Nik- are available in both surface and projected types, but smart- kei Electronics based on material courtesy Samsung Electronics) phones and tablets use projected capacitive designs. In this technology, electrode grids are formed in X and Y directions, is the Galaxy S smartphone from Samsung Electronics. The and the capacitance between the two grid changes under firm chose “on-cell” technology, where transparent electrode finger pressure. This change is detected by the controller IC, patterns or other touch sensors are formed on the OLED which then localizes the position of the change. panel surface. Compared to older designs where the touch panel was independent of the OLED panel, it is both thin- The resistive touch panel is the oldest type. The basic ner and lighter. In terms of display performance, reflectance structure is a glass sheet with a transparent conductive film has been cut to 4%, providing a significant improvement on top, followed by a spacer, and then a second transparent in outdoor readability, a common problem in OLED panels. conductive film. When the top film is touched, it shorts to The company has dubbed the integral touch sensor/OLED the lower film, and the resulting voltage drop can be used to panel the “Super AMOLED,” and has launched a marketing determine the position. program positioning it as a key element in differentiating its own smartphones from those of the competition. Development of in-cell and on-cell designs

Combinations of touch panels and display panels are be- In-cell technology, on the other hand, mounts the touch coming popular primarily in mobile equipment. They elimi- sensor devices inside the display panel pixels. Prototypes nate the need for external touch panels, making possible have been shown by several panel manufacturers for a few displays that are thinner, lighter, more readable and less years, but the technology still suffers from low display panel expensive. manufacturing yield and difficulty in ensuring accurate pressure sensing. As a result, there is very little volume produc- One representative example of this integrated technology tion under way.

24 25 Glossary NE Handbook 2011│ SmartPhone

Components Motion Sensors

The term motion sensor refers to a range of acceleration Hand wobble correction and angular velocity (gyroscopic) sensors used to detect User interface operation Detecting terminal physical motion of equipment. Based on the sensor output operations by user Smaller, cheaper products expand range of it is possible to infer how the user moved the equipment, or HDD drop application Inferred detection how far the user moved in which direction, and this data can Developments body motion in sensor fusion then be utilized in equipment operation. technology Inferring user Game operation motion Augmented Acceleration and gyroscopic sensors both change user Inferred reality (AR) motion into signals. The output of the acceleration sensor pedestrian path varies with the amplitude of the acceleration applies to the object. A 3-axis sensor, capable of measuring acceleration in three directions (up-down, left-right and front-rear) can measure motion in any direction in three-dimensional space. Gyro sensors detect the Coriolis force generated by rotating Inferred path walked in a room Walking through a virtual building objects, outputting the angular velocity. (demo by CSR) (demo by InvenSense)

Acceleration sensors were first used to detect hard disk New Applications From Multiple Sensors In the past it was common to use independent sensors for accel- drives (HDD) falling, and angular velocity sensors to cor- eration, angular velocity and geomagnetism, but now they are being rect camera hand wobble and car navigation system vehicle combined for tasks such as inferring walking and other user motion. direction. In about 2005–2007, the technology started to be used to sense deliberate user actions such as shaking or sors can be combined to detect actual user motion. Some tilting. A number of products appeared that utilized accelera- applications that are achieving increasing use are pedestrian tion sensors to detect how the user moved the equipment, dead reckoning, which estimates how a person walks in- such as the V603SH mobile phone from Sharp, Nintendo’s doors, and augmented reality (AR) to link the real world with Wii game system controller, and the first Apple iPhone. virtual space. In these 9-axis motion sensors, in addition to sensor specifications such as precision, size and cost, rising More recently smartphones and a host of other equipment importance is being assigned to what type of information are beginning to sport 3-axis acceleration sensors, angular can be extracted from sensor output, and how easily. velocity sensors and geomagnetism sensors. In fact, many products now mount three 3-axis sensors, for a total of 9-axis sensors onboard. The output from the multiple sen-

26 27 Glossary NE Handbook 2011│ SmartPhone

Components NAND Flash Memory

NAND flash memory is a type of non-volatile semiconduc- Cutting-Edge NAND (a)The Samsung Electronics 21nm design Flash Memory ▶21nm generation, tor memory that can be batch-erased and rewritten, but 3-layer The 2011 Symposia metallization retains data even when the power supply is off. It provides on VLSI Technology ▶Write speed: and Circuits, the inter- 25Mbyte/s small size, low weight and sturdiness not possible with hard ▶I/O bandwidth: national conference 400Mbyte/s disks, and is widely used today as memory in mobile phones, on semiconductor ▶Erase time: 5ms smartphones, portable music players, digital cameras, cam- circuits held in June (b) The Hynix Semiconductor 20nm design corders and more. Smartphones announced in 2011 have up 2 011, s a w t w o a n- Cross-section along bit line Cross-section along word line nouncements: (a) to 64Gbytes of NAND flash memory onboard. Samsung Electronics’ circuit technology for a 21nm design, and NAND flash memory was invented by Toshiba in 1989. (b) 20nm manufactur- Provided with an input/output serial interface made compat- ing technology from Hynix Semiconductor. ible with that used in HDDs, it was intended from the start to function as a storage medium, but the market didn’t mate- rialize. It took almost a decade, until the mid-1990s, before tronics announced a 21nm design, and Hynix Semiconductor significant market growth occurred. the technology for a 20nm chip.

The driving force behind widespread adoption was the NAND flash memory continues to surge ahead, but it seems steadily shrinking manufacturing technology. In the last few increasingly likely that geometry shrink will hit a wall in years, NAND flash memory geometry has shrunk rapidly three or four years. When the area of the memory cells (the even in comparison to other semiconductor devices. Con- units of information storage) get smaller, the number of elec- cretely, it has been achieving one generation every 15 to 18 trons that can be used in storage drops, and it becomes more months, packing twice the memory capacity into the same difficult to assure accurate information storage. A source at chip area it used to have. This meant equipment manufactur- Toshiba comments “We should be able to shrink down to ers could get double the capacity for the same component the 1Y generation (18–15nm), and even the 1Z generation cost by just waiting 15 to 18 months. Countless equipment (14–10nm), but beyond that is post-NAND.” As a result, it is manufacturers, including Apple, jumped on the opportunity. likely that the continuing increase in NAND flash memory capacity and dropping costs will stop in about 2015. Memory State-of-the-art volume-production chips currently use manufacturers intend to continue experimenting with new 19nm to 27nm manufacturing technology, with 64Gbits per technologies, such as 3D stacking of memory cells. chip. Toshiba began volume production of a 19nm-generation chip in July 2011, while in June 2011 Samsung Elec-

28 29 Glossary NE Handbook 2011│ SmartPhone

Components Components DRAM GPS

DRAM is a type of volatile semiconductor memory that The Global Positioning System is based on American orbit- stores information as capacitor charges. The access time is ing satellites circling the earth every 12 hours at an altitude a short 10ns. DRAM is not suited to long-term data storage, of 20,200km. Receivers pick up the 1.5GHz-waveband micro- because of data volatility, but it is used as main memory in a wave signals from multiple satellites, and measure the time host of equipment including servers, PCs, mobile phones and it takes for each to arrive, using this time data to calculate smartphones. precise distance and location.

In smartphones, DRAM capacity is usually between GPS functions have become essentially standard in smart- 512Mbyte and 1Gbyte. This is roughly half the amount com- phones, and a variety of services have launched to utilize monly found in PCs, but it is possible that capacity will reach position information, such as “foursquare” from Foursquare parity with PCs in the near future. Already DRAM manufac- Labs of the US, and “Colony Seikatsu Plus” from Colopl of turers are strengthening their approaches to mobile gear in Japan. The prices of key components are dropping steadily, preparation for the development. Smartphones and tablets too. In about 2007 a single-chip implementation of a GPS are demanding that components be thinner than ever, and baseband unit and RF unit cost 500 yen or more, but as of with improved performance, and it is likely that the logic, 2011 cost no more than 300 yen. One component manufac- DRAM and NAND flash memory current packaged in sepa- turer commented they might well drop under 200 yen. rate chips will be single-chipped as a result. Semiconductor manufacturers are now competing in technology to intercon- Increased sensitivity nect these chips, such as through-silicon vias (TSV). (faster measurement), About 2007: reduced power consumption 500 yen or more and small mounting area as prices drop

Elpida Memory and Samsung Electronics have accelerated A bout 2 010: their projects to develop TSV technology. Elpida Memory, for About 300 yen 2012: Under example, announced in June 2011 that it had begun sample- 200 yen shipping a DDR3 SDRAM package holding four 2Gbit DDR3 GPS positioning chip cost chip positioning GPS Under 100 yen SDRAM chips and an interface chip, interconnected using New applications as prices drop Navigation systems PND Digital cameras Tablet terminals Toys TSV technology. The firm claims that this is the first in the

world to use TSV technology to implement 32-bit input/ Date

output. Compared to the conventional design made with wire Dropping GPS Chip Prices bonding, a small-outline dual inline memory module (SO- A chip integrating the GPS baseband and RF units dropped under 300 yen in about 2010, and is already beginning to show up in DIMM), the new package offers major reductions in both dis- digital cameras and other products with position functions. New ap- sipation and mounting footprint. plications are being developed as costs drop.

30 31 Glossary NE Handbook 2011│ SmartPhone

Components Components Ambient Light Sensors MLCC

Ambient light sensors detect the presence and intensity Multi-layer ceramic capacitors (MLCCs) are chip-type ca- of visible light, with performance covering the range from pacitors consisting of stacks of ceramic dielectrics and metal moonlight levels of 1 lux to sunny daylight levels of 10,000 electrodes, combining smaller size with larger capacity. They lux. They are used in a variety of functions such as adjusting are used to reduce noise and set circuit constants, and are display brightness to a comfortable level, turning on room found in almost all electronic equipment. lights when it gets too dim for human eyes, and turning off unneeded lights when room brightness is adequate. The primary applications are noise suppression and assist- ing power supply. The former function is possible thanks to Formerly costly CdS cells were used, but the cadmium (Cd) the low impedance of the MLCC in high-frequency ranges. content caused them to be banned in Europe when the RoHS Concretely, high-frequency power supply noise generated directive took effect on July 1, 2006. Many nations, including in the IC is bypassed to the ground layer. This limits high- Japan, followed suit and restricted use, and as a result today frequency power supply noise to the immediate IC region, there are three main designs in use: silicon phototransistors, preventing it from escaping into the board. The latter func- photodiodes, and photodiodes with amplification circuits. tion provides the missing charge when IC operation changes abruptly, resulting in a change in power supply voltage and In smartphones, ambient light sensors are mounted near causing the supply circuit voltage to be insufficient. the displays. The objectives are to improve display readability, reduce display power consumption as much as possible, The quantity of MLCCs in electronic equipment has in- and extend battery drive time for conversation, call waiting, creased as functions become increasingly sophisticated. or games or other applications. 2G mobile phone Netbook LCD TV In sites where the sensor detects bright light, such as at 300‒400 MLCCs 700‒800 MLCCs 100‒200 MLCCs noon or indoors under bright lighting, the output intensity of the LCD panel backlight or OLED panel is maximized to improve readability. Outdoors at night or under other low-light Smartphone conditions, display brightness is lowered to conserve energy. Tablet 3D TV

400‒500 MLCCs 500‒600 MLCCs 1000‒1100 MLCCs

Sharp Rise in Onboard MLCC Quantity Increase in internal components keeping pace with rising functionality in electronic equipment.

32 33 Glossary NE Handbook 2011│ SmartPhone

Components Components Li-Ion Rechargeable Batteries USB

Li-ion rechargeable batteries use a lithium (Li) compound The Universal Serial Bus (USB) is a digital interface used to in the cathode. They were first volume-produced by Sony connect PCs and other hosts to peripheral equipment. Stan- Energy Tech (now Sony Energy Devices) of Japan in 1991. dardization is handled by the USB Implementers Forum . The batteries are widely used in a wide range of applications including notebook PCs, mobile phones, smartphones, cam- USB 1.0/1.1, the first version, appeared in Sept. 1998, corders and electric vehicles. and was tapped for use with mice and keyboards, eventually stealing away the roles formerly played by PS/2 and paral- Li-ion rechargeable batteries in smartphones are generally lel ports. In April 2000 the high-speed USB 2.0 appeared, between 1000mAh and 1500mAh, but there is strong de- competing head-on with IEEE1394 (which was making rapid mand to boost energy demand even higher. headway in the audio-visual equipment industry at the time) and driving it into a minor corner of the market. High-capacity Li-ion rechargeable battery cathodes are

3-element Li (Ni-Mn-Co) O2, lithium manganese oxide (LiMn2 USB leveraged its power supply functionality to penetrate

O4), or lithium iron phosphate (LiFePO4), while anodes are mobile equipment applications. It defined the Mini and graphite. In most designs the electrode plates are stacked. Micro connector specifications for compact mobile gear, They repeat the charge/discharge cycle by passing lithium quickly penetrating the digital camera, mobile phone and ions between the cathode and anode through the electrolyte. smartphone markets. Today it has become indispensible in PCs, mobile phones and more. The most recent version is Development is under way to increase energy density, im- USB 3.0, standardized in Nov. 2008. It features a peak data prove safety and lower cost. Sony, for example, announced a transfer rate of 5Gbit/s, more than 10 times the 480Mbit/s high-capacity design using tin in the anode, in July 2011. data rate of USB 2.0. It is already in use in a number of PCs and external hard drives. The Micro specification for mobile The new cell is a so-called “18650” size measuring 18mm equipment places a USB 2.0 Micro receptacle next to a com- in diameter by 65mm in length, and the capacity is a high pact USB 3.0 receptacle, the two aligned horizontally. 3.5Ah. This is a 25% improvement over the 2.8Ah offered by

the firm’s prior product, released in 2010. The volumetric USB 3.0 Micro B Plug USB 3.0 receptacle energy density is 723Wh/L, and mass 53.5g, for a weight The USB 3.0 Micro specification connector has two energy density of 226Wh/kg. The charging voltage is 4.3V. receptacles in a line, the USB Shipment is scheduled to start before the end of 2011. 2.0 Micro specification and the USB 3.0 compact. Photo shows prototype courtesy Hi- rose Electric. USB 2.0 receptacle

34 35 Glossary NE Handbook 2011│ SmartPhone

Components Components HDMI SIM Cards

The HDMI (High-Definition Multimedia Interface) inter- SIM cards are smart cards used to store the International face for consumer electronics pumps non-compressed high- Mobile Subscriber Identity (IMSI), which is a number iden- definition video signal, audio signal, and an equipment con- tifying mobile telephone numbers. SIM cards are issued to trol signal called CEC (consumer electronic control) through subscribers by the mobile phone operator to allow use of a single cable. It uses the Transition Minimized Differential subscriber services. A single SIM card can be inserted into Signaling (TMDS) technology developed by Silicon Image of multiple handsets to allow them to use the same telephone the US, using three pairs of data lines for transfer. The first number. version of the specification, 1.0, was released in Dec. 2002. The first use of SIM cards was in Global System for Mobile The current version 1.4 adds five new functions: onboard Communication (GSM), a second-generation (2G) mobile te- automotive applications, compact connector specification to lephony system. In Japan they were first used in 3G mobile expand range of application fields, support for “4k x 2k” im- telephones. age formats and 3D video, enhanced network functionality, and expanded audio functions. Current SIM cards are implemented as Universal Integrat- ed Circuit Cards (UICC), smart cards containing CPU, ROM, HDMI is being utilized in a growing variety of products, RAM, electrically erasable programmable ROM (EEPROM), now including flatscreen TVs, PCs, smartphones, camcorders and input/output circuits, and are capable of storing mul- and digital cameras. In smartphones, the compact Type D tiple applications internally. The SIM card function is imple- connector defined in HDMI 1.4 is becoming more commonly mented as an application on the UICC, which can also offer used. (for example) phonebook applications. Recently functions utilizing nearfield communication (NFC) are beginning to be HDMI Micro USB Connector type *1 Type A Type C Type D implemented in SIM cards, including electronic transactions About 5.55mm *2 3.2mm 2.8mm 2.94mm Height (receptacle) and public transportation tickets (see page 48). Width (receptacle) About 15mm *2 11.2mm 6.4mm 7.8mm Pins 19 19 19 5 SIM Card *3 Pin pitch (width direction) 0.5mm 0.4mm 0.4mm 0.65mm Appearance Pin rows 2 1 2 1 To prevent it from be- Insertion cycles Min. 10,000 Min. 5000 Min. 5000 Min. 10,000 ing removed or insert- *1 Type B HDMI connector also defined *2 Based on HDMI specification *3 Pin pitch in ed while power is on, height direction 0.6mm many mobile phones Type D Connector Offers Compactness on a Par with Micro USB require the battery to The newest HDMI 1.4 specification includes the new Type D con- be removed before nector, significantly smaller than prior connectors. It is about the size the SIM card can be of the current Micro USB specification. accessed.

36 37 Glossary NE Handbook 2011│ SmartPhone

Wireless Telecommunication Wireless Telecommunication GSM W-CDMA

Global System for Mobile Communications (GSM) is the Wideband Code Division Multiple Access (W-CDMA) is a second-generation (2G) mobile communication system stan- third-generation (3G) mobile communications standard. The dardized in Europe. It was originally called “Group Special 3G standard proposal submitted to the ITU by Japan was W- Mobile,” after the name of the standardization organization. CDMA, for which reason it is generally known by that name GSM is used through almost the entire world, with the excep- in Japan, but the rest of the world usually refers to it as the tion of Japan and Korea, making worldwide roaming pos- Universal Mobile Telecommunications System (UMTS), or sible. According to industry body GSMA, there were a total of just 3G. W-CDMA is the successor to the GSM standard (see 3,450,410,000 GSM-compliant handsets in use worldwide as page 38) used globally, and has been adopted by many na- of the second quarter of 2009. tions with GSM systems. It utilizes direct-spread (DS) CDMA with a maximum bandwidth of 5MHz. One of the features of GSM is that SIM cards (see page 37) can be inserted and removed freely. The SIM card itself holds The first version, Release 99, ran at 384kbit/s for both up- subscriber information, making it easier to exchange or re- link and downlink, but the standard was gradually upgraded place mobile phones. to handle faster packet data. Release 5 in March 2002 was the first to incorporate High-Speed Downlink Packet Access GSM multiplexing is implemented with frequency division (HSDPA), boosting the downlink data rate to 14.4Mbit/s duplex time division multiple access (FDD-TDMA). The first max. Release 9 in Dec. 2009 reached 84.4Mbit/s max. with version of GSM used Gaussian filtered minimum shift keying HSPA+, utilizing multi-input, multi-output (MIMO) technolo- (GMSK) modulation, with a peak data transfer rate of only gy and two carriers with multiple antennas for multiplexing. 14.4kbit/s for uplink (handset to base station) and downlink both. The standard has been upgraded since with improved The uplink data rate was boosted to a peak of 5.76Mbit/s speed and support for packet communication to handle need in Release 6 (Dec. 2004), with Enhanced Uplink (EUL). In Re- for higher throughput. lease 9 the peak speed is scheduled to be raises to 23Mbit/s, using 16-level quadrature amplitude modulation (QAM) and General packet radio service (GPRS) entered commercial two carriers. service in Europe in 2000, combining eight slots to achieve a peak downlink data rate of 171.2kbit/s. In 2003, enhanced data rates for GSM evolution (EDGE), the successor to GPRS, was launched in the United States. The EDGE data rate used 8-phase shift keying (8-PSK) modulation, faster than GMSK, to push the downlink data rate to a peak of 473.6kbit/s.

38 39 Glossary NE Handbook 2011│ SmartPhone

Wireless Telecommunication Wireless Telecommunication CDMA2000 Mobile WiMAX

CDMA2000 is a third-generation (3G) mobile communica- Mobile WiMAX is a mobile communication standard tion system developed by Qualcomm. Commercial service is compliant with IEEE802.16e. It makes use of a bandwidth offered in the United States, Japan and Korea, but in very few from 5MHz to 20MHz to offer a peak data transfer rate of European nations. Because of the low number of CDMA2000 75Mbit/s, with effective data rates of 10Mbit/s to 20Mbit/s, users, W-CDMA commands a much stronger position in the or on a par with Wireless LAN. market. The standard uses time division duplex (TDD) to run uplink CDMA2000 pre-defines a group of 1.25MHz carriers, (handset to base station) and uplink on the same frequency. referring to implementations by the number of carriers Both uplink and downlink use orthogonal frequency division used. A system using one 1.25MHz carrier wave would be multiplexing (OFDM), so there are multiple carrier waves in CDMA2000 1x, and system with three would be CDMA2000 the communication bandwidth. It also makes use of multiple 3x. Evolution Data only (1xEV-DO) defines the use of one antennas and multi-input multi-output (MIMO) multiplexing. carrier for datacom only. A series of standards has been developed, including Rel. 0, Rev. A, MC-Rev. A and Broadcast/ Mobile WiMAX2, the successor to Mobile WiMAX based Multicast Services (BCMS). on IEEE802.16m, is already complete. Mobile WiMAX2 offers a peak downlink data rate of 330Mbit/s, and 112Mbit/s Rel.0 uses quadrature phase shift keying (QPSK) or 16-lev- peak speed on the uplink. el auadrature amplitude modulation (QAM) modulation, with a peak downlink (base station to handset) data transfer rate Expanded bandwidth and multi-antenna technology proof 2.46Mbit/s, and uplink 153.6kbit/s. Rev.A reduces the vided the increase in data transfer rate. Total bandwidth is redundancy in the error correction coding to increase the made up of multiple blocks, each 20MHz wide. Two of these downlink to 3.072Mbit/s peak, and switches from binary 20MHz blocks are used to achieve 330Mbit/s. Improvements phase shift keying (BPSK) to 8-phase shift keying (8-PSK) in multi-antenna technology improved MIMO multiplexing modulation to raise the peak uplink data rate to 1.843Mbit/ from 2 to 4, while MIMO technology itself provides function- s. MC-Rev. A combines up to three Rev. A carriers, achieving ality allowing multiple handsets to communicate simultane- a peak downlink data rate of 9Mbit/s and uplink of 5Mbit/s. ously with a single base station.

BCMS, as the name indicates, is a datacom system for Under IEEE802.16e communication was stable at speeds broadcasting services. It uses the same communication of up to 120km/h, but the newer IEEE802.16m calls for method as Rel. 0, with a peak data rate of 2.4Mbit/s. There is stable communication at up to 100Mbit/s even at 350km/h. no uplink.

40 41 Glossary NE Handbook 2011│ SmartPhone

Wireless Telecommunication LTE

Long-Term Evolution (LTE) is an evolved version of W- Table 1 LTE Categories (downlink data rate in bits/s) Bandwidth CDMA, a third-generation mobile communication (3G) stan- 5MHz 10MHz 15MHz 20MHz used dard. 3GPP, the W-CDMA standardization body, included LTE Category 1 10M 10M 10M 10M within its 3GPP Release.8 standard. The LTE standard is also Category 2 37.5M 50M 50M 50M referred to as E-UTRA (evolved universal terrestrial radio ac- Category 3 37.5M 75M 100M 100M cess) / E-UTRAN (evolved universal terrestrial radio access Category 4 37.5M 75M 112.5M 150M network) because of the way it is defined in Release.8. Com- Category 5 75M 75M 225M 300M munication services using LTE launched in the United States and Japan from the end of 2010 (Fig. 1). LTE can use both frequency division duplex (FDD), where The LTE standard was intended to boost the data transfer uplink and downlink are handled on different frequencies, rate and minimize delay, achieving a peak downlink (base and time division duplex (TDD), where they use the same fre- station to handset) data rate of 300Mbit/s and a peak uplink quency with time switching. 3G itself uses FDD technology, data rate of 75Mbit/s, using a 20MHz bandwidth. Downlink and LTE was originally intended for use only in FDD systems. modulation is orthogonal frequency division multiple access As a result, the term LTE normally refers to FDD LTE imple- (OFDMA), and uplink uses single-carrier frequency-division mentations. multiple access (SC-FDMA), which is based on orthogonal frequency division multiplexing (OFDM). TDD LTE was designed with China very much in mind. It is positioned as an advanced version of the Time Division - LTE introduces the concept of categories, defining target Code Division Multiple Access (TD-SCDMA) used in China, peak data rates for each. The category with the lowest speed, and is often referred to as TD-LTE to minimize confusion Category 1, has a peak downlink data rate of 10Mbit/s, and with FDD LTE. a peak uplink data rate of 5Mbit/s (Table 1). There is very little technical difference between FDD LTE Fig. 1 LTE Datacom and TD-LTE, including frame design and modulation scheme, Card The L-02C data com and wireless communication semiconductor manufacturers munication card mar- have developed baseband processors to handle both. Equip- keted by NTT DoCo- Mo when LTE service ment manufacturers can develop products with minimal con- launched in Dec. 2010. cern for differences between FDD and TDD. Manufactured by LG Electronics.

42 43 Glossary NE Handbook 2011│ SmartPhone

Wireless Telecommunication Wireless LAN

Wireless LAN was originally a general term applied to Other even faster communication standards are on the wireless implementations of Ethernet-based networks, but horizon: as of July 2011, the IEEE802.11ad standard is al- today it usually refers specifically to the IEEE802.11 series most complete, while IEEE802.11ac is still being worked on. of standards. The IEEE802.11 series is also called “Wi-Fi,” 802.11ad will use the 60GHz waveband for a peak data rate after the Wi-Fi Alliance industry group promoting multi- of 7Gbit/s, while 802.11ac is planned to offer at least 1Gbit/ vendor interoperability and improved name recognition. s using the 2.4GHz and 5GHz wavebands.

Sharing Internet access via tethering function The IEEE802.11 series has two wavebands, one the 2.4GHz band and the other the 5GHz band. Standards in the Smartphones have appeared supporting IEEE802.11b/ 2.4GHz waveband are 802.11, with a peak data transfer rate g or IEEE802.11b/g/n. The 802.11n implementation does of 2Mbit/s, 802.11b at 11Mbit/s and 802.11g at 54Mbit/s. not support MIMO, so that the data rate is about the same as IEEE802.11a uses the 5GHz waveband, with a peak data rate that offered by 802.11g. of 54Mbit/s. Recently, smartphones are offering a “Wireless LAN tether- IEEE802.11n can utilize both wavebands. Using a ing” function. This makes it possible to use the smartphone maximum channel width of 40MHz (20MHz up through as a Wireless LAN access point (base station), so that porta- IEEE802.11g), and multiplexing up to four signals with 4x4 ble game system, tablets and other terminals equipped with multi-input multi-output (MIMO) technology, it can reach a Wireless LAN functionality can connect to the Internet via data transfer rate of 600Mbit/s. mobile communication.

Major IEEE802.11 Series Standards A wireless tethering function was made available to An- Standard Description droid smartphones in May 2010, with the release of Android IEEE802.11 2.4GHz waveband, peak data rate 2Mbit/s 2.2, while the iPhone supported it in iOS 4.3 released March

IEEE802.11a 5GHz waveband, peak data rate 54Mbit/s 2011. In some cases, however, Wireless LAN tethering is dis- abled by the mobile phone operator. IEEE802.11b 2.4GHz waveband, peak data rate 11 Mbit/s

IEEE802.11g 2.4GHz waveband, peak data rate 54Mbit/s

IEEE802.11i Highly secure standard. Standardized by the Wi-Fi Alliance as WPA/WPA2 IEEE802.11n 2.4GHz or 5GHz waveband, peak data rate 600Mbit/s

44 45 Glossary NE Handbook 2011│ SmartPhone

Short-Range Communication Bluetooth Low Energy and ANT

Bluetooth Low Energy (generally, Bluetooth LE) and ANT of Feb. 2011, and has already gained a number of adoptions, are both ultra-low power communication technologies capa- primarily in speed sensors inside sports watches or running ble of being driven for about two years off button batteries. shoes. They are appropriate for applications such as small sensor equipment and remote controllers (Fig.). The ANT protocol is based on a specific set of communication network topologies and access control methods, and has Bluetooth LE is a new communication standard added to no physical layer. The Open Systems Interconnection (OSI) Bluetooth v4.0, which was issued in the summer of 2010. It reference model covers from level 2 though parts of level is expected to begin showing up in smartphones at about the 5. The maximum packet length for data send and receive is end of 2011. only a few tens of bytes, holding the effective peak data rate down to 20kbit/s. Like the version of Bluetooth used to connect headsets and mobile phones it uses 2.4GHz, but it only operates in- Even so, the protocol stack software needed to implement termittently. Concretely, instead of maintaining the session ANT functionality is very small. According to the ANT+ Alli- continuously as in Bluetooth, it only connects every few ms ance, the protocol stack will fit neatly into about 2Kbytes of or s, terminates the session as soon as communication is memory. complete, and transitions to sleep mode to conserve power. Max. current consumption 1000 (imposed by equipment) Millimeter waves for uncompressed Bluetooth LE communication is implemented through two high-deﬁnition Notebook PC types of devices, a Bluetooth v4.0 device running conven- video transfer Wireless LAN Smartphone, (IEEE802.11a/b/g/n) tional Bluetooth technology, and a Bluetooth LE device with 100 intermittent sensor net only the low energy specification. Bluetooth v4.0 devices are terminal Bluetooth intended for use in equipment with relatively high-capacity Wireless headset or headphone

batteries, such as smartphones or PCs, while Bluetooth LE Watch, wearable sensor, 10 etc. driven by button battery devices will probably be small sensors. In communication the BLE/ANT Bluetooth v4.0 device is the host, sending commands to the Watch, etc. driven by Current consumption at peak output (mA) peakoutput at consumption Current Bluetooth LE device and collecting resulting information. solar cells

1 10k 100k 1M 10M 100M １G Peak data rate (bit/s) ANT, on the other hand, is a proprietary scheme created Positioning Bluetooth Low Energy (BLE) and ANT by Dynastream Innovations of Canada. The ANT+ Alliance Compared to conventional communication methods, speed is low but promoting the specification had 385 corporate members as corresponding power consumption at peak output is extremely low.

46 47 Glossary NE Handbook 2011│ SmartPhone

Short-Range Communication NFC

Near Field Communication (NFC) is a short-range wireless FeliCa Mifare

Encryption and Deﬁned Deﬁned Freely selectable technology, good up to about 10cm, using the 13.56MHz other high-level by Sony by NXP middleware NFC waveband. The data transfer rate is 106kbit/s, 212kbit/s, International ISO18092 ISO14443 A ISO14443 B ISO15 6 9 3 424kbit/s or 848kbit/s. standards （Type A）（Type B）

Conﬁguration Frequencies 13 . 5 6 MHz

Range 10cm NFC was standardized in Dec. 2003 as ISO/IEC 18092 Communication IC telephone Electronic family (dubbed “NFC IP-1”), by Sony and Philips Semiconductors Examples of Suica, Edy, cards, registry, IC tags for domestic adoption Osaifu (e-money) TASPO employee ID, distribution, retail (now NXP Semiconductors). NFC IP-1 is the heart of the Fe- cigarette ID card student ID liCa non-contact IC developed by Sony, and the communica- NFC Specifications tion core of NXP’s Mifare. Applications are needed to handle Communication standards such as FeliCa, Mifare, ISO/IEC14443 e-money and other encryption processing, and the transac- Type B, and ISO/IEC15693 are defined for NFC. tions themselves, but these are implemented independently. The Mifare communication core has been standardized as ISC/IEC 14443 Type A and is often just called “Type A” as a to read the product information from an RFID tag on a prod- result. uct, or replenish the cash balance in a transportation fare card. In Jan. 2005 ISO/IEC 21481 was standardized, combining NFC IP-1 with the ISO/IEC 14443 Type B near field wireless The peer-to-peer mode is used to swap data between two technology operating in the 13.56MHz band, and the ISO/ pieces of NFC-capable equipment. One application might IEC 15693 standard for radio frequency identification (RFID) be to exchange owner name card information or photos be- tags. The new standard was called NFC IP-2. tween two mobile phones, for example.

NFC has three communication modes: the card emulation At a minimum, a communication antenna and communica- mode, the reader/writer emulation mode, and the peer-to- tion control IC are needed to implement NFC functions in a peer mode. In the card emulation mode, as the name sug- smartphone. A “secure element” chip is also required, to hold gests, it operates as a non-contact IC card in applications the encryption and application processing circuits needed such as transportation fare cards or e-money cards. with the card emulation function. The secure element may be implemented by mounting it in the handset, or putting it In the reader/writer emulation mode it enables mobile in the SIM card. Some products mount the entire assembly phones or other equipment to operate as RFID tag or card from antenna to secure element in a micro SD card, which reader/writers. For example, a mobile phone could be used can be slotted into the handset to enable NFC capability.

48 49 Glossary NE Handbook 2011│ SmartPhone

Short-Range Communication Wireless Power Supplies

Technology to transmit electric power by wireless, without resonance is utilized to transfer electricity over distances power cords... By eliminating wiring and charging terminals, from tens of cm to several meters. Electric field coupling of- this technology makes it easier to design waterproof, dust- fers only a short range, but has the advantage that efficiency proof products and minimizes breakdown risk. remains high even if transmitter and receiver plates are not perfectly aligned in the horizontal plane. A variety of wireless power supply technologies are being researched now, depending on the specific principle of op- Electromagnetic induction has the clear lead in commer- eration. In addition to the electromagnetic induction method cial use. The constituent technologies were developed de- chosen for NTT DoCoMo smartphones, there are also the cades ago and often overlooked, but now it is in the market magnetic resonance method, the electric field coupling development stage. Especially intriguing is the Qi standard method and the electric wave reception method. The electro- drawn up by the Wireless Power Consortium (WPC), a group magnetic induction method is quite old, originally proposed developing industry standards for non-contact charging. by inventor Nikola Tesla at the start of the 20th century, and Since the establishment of the consortium in Dec. 2008 the is already used in products such as electric toothbrushes number of corporate members has steadily grown, and in and cordless phones. Magnetic resonance has attracted con- July 2010 it released its first standard, for systems with 5W sidered attention following its announcement by a research max. output. Equipment with Qi standard compliance cer- team under Marin Soljacic of the Massachusetts Institute of tification can be used in any non-contact charging system, Technology (MIT) in 2006. In this technology, magnetic field regardless of vendor.

Table 1 Major Wireless Power Supply Types Type Electromagnetic induction Magnetic resonance Electric field coupling Electric wave reception Magnetic flux Magnetic flux Description Magnetic flux Magnetic flux Electric waveElectric wave Electric wave Electric wave SecondarySecondary Secondary Secondary Electrode Electrode coil coil coil coil Electrode Electrode

Resonator RectifierResonator Rectifier Resonator RectifierResonator Rectifier MagneticMagnetic field field Magnetic field Magnetic field PrimaryPrimary Primary Primary PrimaryPrimary coil coil SecondarySecondary coil Primarycoil coil PrimarySecondary coil coil Secondary coil coil coil coil coil Range Several mm to about 10cm Several cm to several m Several mm to several cm Tens of cm to several m (for household appliances) Transferred power Several W to several kW Several W to several kW Several W to several hundred W 1W max. Electricity utilization 70% –90% 40% –60% (remainder heat (magnet- 60% –90% Very low efficiency (remainder mostly heat) ic field) and electric waves (electric (remainder heat) (remainder electric waves) field)) Frequency 10kHz to several hundred kHz Several hundred kHz to tens of MHz Several hundred kHz to several MHz Medium-frequency waves to microwaves Companies in the Many, including Powermat, Nagano Japan Radio, Qualcomm, Takenaka, Murata Mfg., etc. Intel, Nihon Dengyo Kosaku, Powercast, field Sanyo Electric, Seiko Epson, Sony, WiTricity, etc. etc. and Showa Aircraft Industry

50 51 Glossary NE Handbook 2011│ SmartPhone

Operating System Operating System Android Windows Phone 7

Android is the operating system for smartphones and oth- Windows Phone 7 is the smartphone operating system de- er equipment announced by Google in Nov. 2007. It incor- veloped by Microsoft and announced in Feb. 2010. The ker- porates everything necessary for smartphone development, nel is Windows Embedded Compact 7, originally developed from the Linux kernel to middleware, a Web browser and for use in embedded applications. The application software the user interface. Originally it was only for smartphones, development environment consists of Silverlight for Web- but today it is also used in tablets and even TVs. based applications, and Microsoft XNA for game development. One unique feature of Android is that the operating system is open sourse, which means that manufacturers work- The key differences from Android are that the operating ing on smartphones and other Internet-enabled equipment system is not free, and hardware requirements are much can complete development faster and cheaper than ever. As stiffer. Windows Phone 7 requires an electrostatic display of July 15, 2011, the latest version of Android for smart- panel with a minimum resolution of 800dots x 480dots and phones was 2.3, and 3.1 for tablets. The next version, to be at least four press-sensitive points; A-GPS; sensors for accel- released in the 4th quarter of 2011 and codenamed “Ice eration, ambient light, proximity and geomagnetism; a cam- Cream Sandwich,” will integrate the two. era with at least 5 million pixels resolution; 256Mbyte RAM and 8Gbyte flash memory minimum; a DirectX 9-capable Applications running on Android are basically developed graphics processing unit (GPU); and a Qualcomm MSM7x30 in Java. These Java apps run in the Dalvik VM virtual ma- or MSM8x55 CPU running at 800MHz or better. chine provided by Google. Through Windows Mobile 6, the prior version, the operat- The whole project started in Aug. 2005, when Google ing system was aimed at corporate users, but the target is acquired tech start-up Android, a company developing soft- now general users. The user interface has been changed to ware for mobile phones. Android was founded in Oct. 2003 match, offering single finger-driven operation, and the Win- by Andy Rubin, a co-founder of American handset manufac- dows Marketplace for Mobile application market has been turer Danger (acquired by Microsoft in 2008) and the man opened. who is still in charge of Android business at Google. In Feb. 2011 Nokia announced that it would adopt Win- dows Phone 7 as the operating system for its entire line of smartphones.

52 53 Glossary NE Handbook 2011│ SmartPhone

Operating System Operating System iOS Application Store

The iOS operating system from Apple was developed for The term “application store” is used to signify online ser- use in embedded applications, and is used in the iPhone vices selling and distributing applications for smartphones. smartphone, iPod touch portable media player, and Apple The apps are developed by individuals and companies, and TV set-top box. Unlike other smartphone operating systems registered in application stores with price and description. such as Google’s Android or Microsoft’s Windows Phone 7, Smartphone users can search for and obtain desired apps iOS is available only for Apple products, with no third-party from the stores. licensing. The system offers advantages for both developers and In reality, iOS is a version of Mac OS X, the operating sys- users. Apps can now be developed by anyone, regardless of tem for Apple’s computers, customized for the needs of mo- company scale and including individuals, and sold world- bile gear. A program module has been added for the touch- wide. Users can compare a wide range of apps in the ap- panel user interface, while compatibility with older Mac OS plication store and easily obtain the one they like best. The versions and various UNIX functions have been deleted. In advantages to both parties combine to increase the utility addition, while iOS is designed for use in the ARM archi- and attractiveness of the smartphone platform, contributing tecture, Mac OS X is designed to run on Intel-architecture to rising smartphone sales. microprocessors. Apple’s App Store led the way

The iOS operating system has four layers. The bottommost The pioneer in application stores was the App Store, is the Core OS, and the second layer provides critical Core opened by Apple with the release of the iPhone 3G in July Services for smartphone operation, such as call control and 2008. According to a July 2011 news release by Apple, App position acquisition. Layer 3 is Media, handling multimedia Store now lists over 425,000 apps, with over 15 billion apps including audio and video, and layer 4 is Cocoa Touch, pro- downloaded to iPhones and other devices. A variety of appli- viding the basic functionality required for application devel- cation stores have been opened in its footsteps by operating opment, including the user interface. system developers and Internet service providers, including Google’s Android Market, Microsoft’s Windows Marketplace Applications are primarily written in Apple’s own Objec- for Mobile, and Amazon.com’s Amazon Appstore for An- tive-C development language, and executed in native code droid. under iOS. Developed applications are, in principle, only available through the App Store application store run by In fact, the same sort of application store existed for con- Apple. ventional mobile phones as well, but faced problems such as different software execution environments in different

54 55 Glossary

Operating System

Major Application Stores

Store name App Store Android Windows Amazon Marke Marketplace Appstore for for Mobile Android Operator Apple Google Microsoft Amazon.com Terminal operating iOS Android Windows Amazon.com system Phone Service start July 2008 Oct. 2008 Oct. 2010 March 2011 Developer Standard: US$25 US$99/ US$99/year registration fee US$99/year year Enterprise: US$299/year Income split 7： 3 7： 3 7： 3 7： 3 (developer:operator) App certification Yes Yes Yes Yes Supported terminals iPhone, iPod Android Windows Android Touch, iPad Phone 7

handsets (which meant a smaller user pool for a given app), and complex contractual procedures with each carrier to distribute apps. As a result, the idea never took off. The situation is different with smartphones because there are many terminals with the same execution environment, regardless of operator, and significant profit is possible. Development is also easier than it was, with significant improvements in development tools and required information. NE Handbook Series 2011 Smartphone

Publisher Nikkei Business Publications, Inc. 1-17-3 Shirokane, Minato-ku, Tokyo 108+8646 Japan Published September, 2011 Editor Nikkei Electronics Design Nikkei BP Consulting Printing Dai Nippon Printing Sponsored by Digi-Key Corporation