DOCSLIB.ORG

Competing in Artificial Intelligence Chips: China's Challenge Amid

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text

Load more

SPECIAL REPORT Competing in Artificial Intelligence Chips: China’s Challenge amid Technology War Dieter Ernst SPECIAL REPORT Competing in Artificial Intelligence Chips: China’s Challenge amid Technology War Dieter Ernst SPECIAL REPORT Competing in Artificial Intelligence Chips: China’s Challenge amid Technology War Dieter Ernst About CIGI Credits The Centre for International Governance Innovation (CIGI) is an independent, non- Director, Global Economy Robert Fay partisan think tank whose peer-reviewed research and trusted analysis influence Program Manager Heather McNorgan policy makers to innovate. Our global network of multidisciplinary researchers and strategic partnerships provide policy solutions for the digital era with one goal: to Senior Publications Editor Jennifer Goyder improve people’s lives everywhere. Headquartered in Waterloo, Canada, CIGI Publications Editor Susan Bubak has received support from the Government of Canada, the Government of Ontario Graphic Designer Brooklynn Schwartz and founder Jim Balsillie. À propos du CIGI Le Centre pour l’innovation dans la gouvernance internationale (CIGI) est un groupe de réflexion indépendant et non partisan dont les recherches homologuées par des pairs et les analyses fiables incitent les décideurs à innover. Grâce à son réseau mondial de chercheurs pluridisciplinaires et de partenariats stratégiques, le CIGI offre des solutions politiques adaptées à l’ère numérique dans le seul but d’améliorer la vie des gens du monde entier. Le CIGI, dont le siège central se trouve à Waterloo, au Canada, bénéficie du soutien du gouvernement du Canada, du gouvernement de l’Ontario et de son fondateur, Jim Balsillie. Copyright © 2020 by the Centre for International Governance Innovation The opinions expressed in this publication are those of the author and do not necessarily reflect the views of the Centre for International Governance Innovation or its Board of Directors. For publications enquiries, please contact [email protected]. This work is licensed under a Creative Commons Attribution — Non-commercial — No Derivatives License. To view this license, visit (www.creativecommons.org/licenses/by-nc-nd/3.0/). For re-use or distribution, please include this copyright notice. Printed in Canada on Forest Stewardship Council® certified paper containing 100% post-consumer fibre. Centre for International Governance Innovation and CIGI are registered trademarks. 67 Erb Street West Waterloo, ON, Canada N2L 6C2 www.cigionline.org Table of Contents vi About the Author vii Acronyms and Abbreviations 1 Executive Summary 3 Introduction 9 Competing in AI: Major Challenges 17 Contrasting America’s and China’s Different AI Development Trajectories 27 What’s Happening in China’s AI Chip Industry? 45 Conclusions 53 Works Cited About the Author Senior Fellow Dieter Ernst joined CIGI in May 2016. At CIGI, Dieter’s research explores unresolved challenges for the global governance of trade, intellectual property (IP) and innovation, addressing three issues in particular: finding out what adjustments are needed in the development and use of IP, especially patents and trade secrets, to cope with the requirements of increasingly complex and diverse global corporate networks of production and innovation; dealing with the effects of the proliferation of strategic patenting behaviour on the organization and governance of these global networks; and assessing US-China technology competition in information technology. Based in Hawaii, Dieter is an adjunct senior fellow at the East-West Center. He has served as a member of the US National Academies’ Committee on Global Approaches to Advanced Computing, as a senior adviser to the Organisation for Economic Co-operation and Development in Paris and as a research director of the Berkeley Roundtable on the International Economy at the University of California, Berkeley. Previously, Dieter was a professor of international business at the Copenhagen Business School and served as a scientific adviser to governments, private companies and international institutions, including the World Bank, the UN Conference on Trade and Development and the UN Industrial Development Organization. He holds a Ph.D. in economics from the University of Bremen. vi Special Report • Dieter Ernst Acronyms and Abbreviations 3GPP 3rd Generation Partnership Project IEEE Institute of Electrical and Electronics Engineers 5G fifth-generation IoT Internet of Things AGI artificial general intelligence IP intellectual property AGI-19 12th Conference on Artificial General Intelligence (2019) IT information technology AI artificial intelligence LOB line of business AIDP Next Generation Artificial MIC 2025 Made in China 2025 Intelligence Development Plan nm nanometre ASICs application-specific integrated circuits OECD Organisation for Economic BIS Bureau of Industry and Security Co-operation and Development (US Department of Commerce) R&D research and development CFIUS Committee on Foreign Investment in the United States RMB renminbi CISTP China Institute for Science SASAC State-owned Assets Supervision and Technology Policy and Administration Commission CPUs central processing units SEPs standard-essential patents DARPA Defense Advanced Research SMIC Semiconductor Manufacturing Projects Agency International Corporation DoD Department of Defense SOEs state-owned enterprises DRAM dynamic random-access memory TDD time division duplex ECRA Export Control Reform Act TSMC Taiwan Semiconductor Manufacturing Company fabs semiconductor fabrication plants WIPO World Intellectual Property FDD frequency division duplex Organization FinFET fin field-effect transistor FIRRMA Foreign Investment Risk Review Modernization Act FPGAs field-programmable gate arrays GPU graphics processing unit GVCs global value chains HR Horizon Robotics IaaS infrastructure-as-a-service IC integrated circuit Competing in Artificial Intelligence Chips: China’s Challenge amid Technology War vii Executive Summary This special report assesses the challenges conducted a significant amount of AI research that China is facing in developing its artificial (some of it at the frontier), but knowledge exchange intelligence (AI) industry due to unprecedented with industry remains limited. Drawing on deep US technology export restrictions. A central integration with America’s AI innovation system, proposition is that China’s achievements in AI Chinese AI firms, in turn, have focused primarily on lack a robust foundation in leading-edge AI chips, capturing the booming domestic mass markets for and thus the country is vulnerable to externally AI applications, investing too little in AI research. imposed supply disruptions. Success in AI requires mastery of data, algorithms and computing power, To find out what is happening today in China’s which, in turn, is determined by the performance of AI chip design, capabilities and challenges are AI chips. Increasing computing power that is cost- assessed, both for the large players (Huawei, effective and energy-saving is the indispensable Alibaba and Baidu) and for a small group of AI chip third component of this magic AI triangle. “unicorns.” The report concludes with implications for China’s future AI chip development. Research on China’s AI strategy has emphasized China’s huge data sets as a primary advantage. It was assumed that China could always purchase the necessary AI chips from global semiconductor industry leaders. Until recently, AI applications run by leading-edge major Chinese technology firms were powered by foreign chips, mostly designed by a small group of top US semiconductor firms. The outbreak of the technology war, however, is disrupting China’s access to advanced AI chips from the United States.1 Drawing on field research conducted in 2019, this report contributes to the literature by addressing China’s arguably most immediate and difficult AI challenges: → How to ensure that the country’s AI developers, implementers and users have secure access to specialized semiconductors that are needed for training an algorithm and for conducting inference with an already trained algorithm? → In the face of US technology restrictions, what realistic options does China have to substitute AI chip imports from the United States through local design and fabrication or through imports from other non-US sources? The report highlights China’s challenge of competing in AI, and contrasts America’s and China’s different AI development trajectories. Starting much later than the United States, Chinese universities and public research institutes have 1 As this report goes to press, the rapid spread of the coronavirus (COVID-19), first identified in Wuhan, China, in late 2019, is further decoupling China from international trade and technology flows. Competing in Artificial Intelligence Chips: China’s Challenge amid Technology War 1 2 Special Report • Dieter Ernst Introduction China’s Next Generation Artificial Intelligence of restrictions on China’s access to advanced US Development Plan (AIDP), released by the State technology. The Commerce Department has placed Council in July 2017, provides a detailed road Huawei and China’s leading AI start-up companies map for developing an increasingly integrated on its so-called Entity List, which is basically a AI ecosystem.2 An essential part of the Made trade blacklist that bars anyone on it from buying in China 2025 (MIC 2025) plan, the AIDP seeks advanced semiconductors and software from US to use AI as a catalyst for upgrading China’s companies without the government’s
Recommended publications
  • 00 TCL Comm Contents.Ps, Page 1-26 @ Normalize

    00 TCL Comm Contents.Ps, Page 1-26 @ Normalize

    Attraction TALKS We offer a wide range of products at entry level for different market segments, from voice phones with superior voice performance, to camera phones of high mega pixel and multimedia functions. Insisting on the moto of offering “World quality@Chinese values”, our products are attractive in terms of design, function and price Annual Report 2006 19 TCL COMMUNICATION TECHNOLOGY HOLDINGS LIMITED Directors and Senior Management EXECUTIVE DIRECTORS Mr. LI Dongsheng, 49, is the founder and Chairman of the Company. He is responsible for formulating corporate strategies and steering the development and management of the Company. He was awarded the following titles: 1994 “Distinguished Contributor to Development of PRC Electrical Appliance Industry” 1995 “National Excellent Young Entrepreneur” 2000 “Model of National Work Force” 2002 Representative of the 16th Central Committee of the Communist Party “CCTV Man of the Year in the Chinese Economy” “Annual Innovation Award” 2003 Delegate of the 10th National People’s Congress One of the most influential entrepreneurs by magazine “China Entrepreneur” Mr. Li Dongsheng 2004 “CCTV Man of the Year in the Chinese Economy” One of the worldwide most influential business leaders by Time and CNN French National Honor Metal (OFFICIER DE LA LEGION D’HONNEUR) Mr. Li has more than 20 years of experience in various aspects of the electronics industry particularly in the manufacture and sales of consumer electronic products. He is an engineer and holds a Bachelor of Science Degree from Huanan Polytechnic University. Mr. Li is also the Chairman of the Board of TCL Multimedia Technology Holdings Limited and TCL Corporation and a director of a number of subsidiaries of TCL Corporation.
  • Eurasian Journal of Social Sciences, 8(3), 2020, 96-110 DOI: 10.15604/Ejss.2020.08.03.002

    Eurasian Journal of Social Sciences, 8(3), 2020, 96-110 DOI: 10.15604/Ejss.2020.08.03.002

    Eurasian Journal of Social Sciences, 8(3), 2020, 96-110 DOI: 10.15604/ejss.2020.08.03.002 EURASIAN JOURNAL OF SOCIAL SCIENCES www.eurasianpublications.com XIAOMI – TRANSFORMING THE COMPETITIVE SMARTPHONE MARKET TO BECOME A MAJOR PLAYER Leo Sun HELP University, Malaysia Email: [email protected] Chung Tin Fah Corresponding Author: HELP University, Malaysia Email: [email protected] Received: August 12, 2020 Accepted: September 2, 2020 Abstract Over the past six years, (between the period 2014 -2019), China's electronic information industry and mobile Internet industry has morphed rapidly in line with its economic performance. This is attributable to the strong cooperation between smart phones and the mobile Internet, capitalizing on the rapid development of mobile terminal functions. The mobile Internet is the underlying contributor to the competitive environment of the entire Chinese smartphone industry. Xiaomi began its operations with the launch of its Android-based firmware MIUI (pronounced “Me You I”) in August 2010; a modified and hardcoded user interface, incorporating features from Apple’s IOS and Samsung’s TouchWizUI. As of 2018, Xiaomi is the world’s fourth largest smartphone manufacturer, and it has expanded its products and services to include a wider range of consumer electronics and a smart home device ecosystem. It is a company focused on developing new- generation smartphone software, and Xiaomi operated a successful mobile Internet business. Xiaomi has three core products: Mi Chat, MIUI and Xiaomi smartphones. This paper will use business management models from PEST, Porter’s five forces and SWOT to analyze the internal and external environment of Xiaomi. Finally, the paper evaluates whether Xiaomi has a strategic model of sustainable development, strategic flaws and recommend some suggestions to overcome them.
  • Accenture AI Inferencing in Action

    Accenture AI Inferencing in Action

    POV POV PUT YOUR AI SOLUTION ON STEROIDS POV PUT YOUR AI SOLUTION ON STEROIDS POINT OF VIEW POV PUT YOUR AI SOLUTION ON STEROIDS POV MATCH GPU PERFORMANCE AT HALF THE COST FOR AI INFERENCE WORKLOADS Proven CPU-based solution from Accenture and Intel boosts the performance and lowers the cost of AI inferencing by enabling an easy-to-deploy, scalable, and cost-efficient architecture AI INFERENCING—THE NEXT CRITICAL STEP AFTER AI ALGORITHM TRAINING Artificial Intelligence (AI) solutions include three main functions—identifying and preparing data, training an artificial intelligence algorithm, and using the algorithm for inferring new outcomes. Each function requires different compute recourses and deployment architecture. The choices of infrastructure components and technologies significantly impact the performance and costs associated with deploying an end-to-end AI solution. Data scientists and machine learning (ML) engineers spend significant time devising the right architecture for all stages of the AI pipeline. MODEL DATA TRAINING AND SCORING AND PREPARATION OPTIMIZATION INFERENCE Once an AI computer/algorithm has been trained through traditional or deep learning techniques, it can deliver value by interpreting data (i.e., inferring). Through inference, an AI algorithm can analyze data to: • Differentiate between various items • Identify trends and patterns that can be leveraged during decision-making • Reveal opportunities and possible solutions • Recognize voices, faces, images, etc. POV PUT YOUR AI SOLUTION ON STEROIDS POV Revealing hidden As we look to the future, AI inference will become increasingly possibilities— important to businesses operating in all segments—from health care to financial services to aerospace. And as the reliance on AI inference continues to grow, so Accenture AIP, does the importance of choosing the right AI infrastructure to support it.
  • Press Release May 25, 2021

    Press Release May 25, 2021

    Press Release May 25, 2021 NEW PAN-INDUSTRY ECO RATING SCHEME LAUNCHED FOR MOBILE PHONES • Deutsche Telekom, Orange, Telefónica, Telia Company and Vodafone unveil new consumer labelling to identify more sustainable mobile phones • Eco Rating to roll out across Europe from June 2021, including phones from 12 vendors Five of Europe’s leading mobile operators have joined forces to update and launch a new pan- industry Eco Rating labelling scheme that will help consumers identify and compare the most sustainable mobile phones and encourage suppliers to reduce the environmental impact of their devices. The Eco Rating initiative has been created jointly by Deutsche Telekom, Orange, Telefónica (operating under the O2 and Movistar brands), Telia Company and Vodafone to provide consistent, accurate information at retail on the environmental impact of producing, using, transporting and disposing of smartphones and feature phones. Eco Rating will enable operators and their customers to encourage wider rating of phones and demonstrate the demand for more sustainable electronics. A range of new consumer phones from 12 mobile phone brands will be assessed by the Eco Rating initiative, with others expected to be announced in the future. Launch partners include Bullitt Group – Home of CAT and Motorola rugged phones, Doro, HMD Global - Home of Nokia Phones, Huawei, MobiWire, Motorola / Lenovo, OnePlus, OPPO, Samsung Electronics, TCL / Alcatel, Xiaomi and ZTE. Starting from June 2021, the mobile operators will begin to introduce the distinct Eco Rating labelling at point of sale across 24 countries in Europe where they are present. Customers can learn more about the initiative and see how the rating is calculated by visiting a new website at www.ecoratingdevices.com and www.teliacompany.com/ecorating Following a detailed assessment, each mobile phone handset will be given an overall Eco Rating score out of a maximum of 100 to signal the environmental performance of the device across its entire life cycle.
  • GPU Developments 2018

    GPU Developments 2018

    GPU Developments 2018 2018 GPU Developments 2018 © Copyright Jon Peddie Research 2019. All rights reserved. Reproduction in whole or in part is prohibited without written permission from Jon Peddie Research. This report is the property of Jon Peddie Research (JPR) and made available to a restricted number of clients only upon these terms and conditions. Agreement not to copy or disclose. This report and all future reports or other materials provided by JPR pursuant to this subscription (collectively, “Reports”) are protected by: (i) federal copyright, pursuant to the Copyright Act of 1976; and (ii) the nondisclosure provisions set forth immediately following. License, exclusive use, and agreement not to disclose. Reports are the trade secret property exclusively of JPR and are made available to a restricted number of clients, for their exclusive use and only upon the following terms and conditions. JPR grants site-wide license to read and utilize the information in the Reports, exclusively to the initial subscriber to the Reports, its subsidiaries, divisions, and employees (collectively, “Subscriber”). The Reports shall, at all times, be treated by Subscriber as proprietary and confidential documents, for internal use only. Subscriber agrees that it will not reproduce for or share any of the material in the Reports (“Material”) with any entity or individual other than Subscriber (“Shared Third Party”) (collectively, “Share” or “Sharing”), without the advance written permission of JPR. Subscriber shall be liable for any breach of this agreement and shall be subject to cancellation of its subscription to Reports. Without limiting this liability, Subscriber shall be liable for any damages suffered by JPR as a result of any Sharing of any Material, without advance written permission of JPR.
  • 2019 Annual Report

    2019 Annual Report

    Toppan Merrill - Flex LTD Annual Report Combo Book - FYE 3.31.19 ED | 105212 | 09-Jul-19 16:19 | 19-11297-1.aa | Sequence: 1 CHKSUM Content: 45264 Layout: 60155 Graphics: 0 CLEAN Our Shareholders, Employees, Customers and Partners: In 1969, Joe and Barbara Ann McKenzie started a family business hand soldering electronic parts onto printed circuit boards to help Silicon Valley startups meet their dynamic capacity needs. These “board stuffers,” as they were known back then, decided to name their small company Flextronics. The McKenzies dreamed of revolutionizing the way electronic products were manufactured, not only in Silicon Valley, but all around the world. Fifty years later, we may have shortened the company name from Flextronics to Flex, but our list of achievements and milestones over the past five decades is nothing short of remarkable. Today, we have a broad portfolio of diverse customers, including some of the best-known global brands such as Cisco, Ford, IBM, Johnson & Johnson and Microsoft. From manufacturing early networking equipment and mobile devices for companies like Motorola, Nokia, Juniper and Ericsson to making Palm Pilots, Xboxes, Blackberrys, and HP printers, Flex led the transition from contract manufacturing to value-added Electronic Manufacturing Services (EMS). Our top customers come from more than a dozen different industries, providing us with a unique perspective on many of the fastest growing companies, by industry and by geography. Flex was one of the first American service manufacturers to go offshore by setting up a manufacturing facility in Singapore. The company was one of the first to innovate with full service industrial parks across Asia and eventually other geographies, to bring suppliers closer to the manufacturing line, and to support emerging “just in time” supply chain needs.
  • Attendance Audit Summary

    Attendance Audit Summary

    ATTENDANCE AUDIT SUMMARY CES® 2020 January 7-10, 2020 Las Vegas, Nevada CES.tech Letter from Consumer Technology Association (CTA)® For more than 50 years, CES® has served as a global platform for companies to share innovative technology with the world. In these challenging times, CES showcases the spirit of innovation and brings together energy and creativity that will enable technology to make the world healthier, safer, more resilient and connected. CES 2020 featured transformative technologies such as artificial intelligence, the 5G ecosystem and mobile connectivity. CES 2020 inspired and connected major industries across the globe and highlighted trends that are now more important than ever, including non-traditional tech and tech for good. We are certain that technology, including the innovations at CES, will help energize the global economy and pull the world through the current crisis to emerge safer and stronger than before. CES 2020 hosted 4419 exhibiting companies across more than 2.9 million net square feet and attracted a total attendance of 171,268, including 6517 members of media. This result aligns with our strategy of managing attendee numbers and attracting the most highly qualified attendees. CES is one of a select group of trade shows that follow the strict auditing requirements set by UFI, the Global Association of the Exhibition Industry. CES adheres to these requirements to ensure that you have the most detailed and accurate information on CES’s trade event attendance. To help you succeed and grow your business, we are proud to provide you with this independently audited attendance data in our CES 2020 Attendance Audit Summary.
  • TCL 科技集团股份有限公司 TCL Technology Group Corporation

    TCL 科技集团股份有限公司 TCL Technology Group Corporation

    TCL Technology Group Corporation Annual Report 2019 TCL 科技集团股份有限公司 TCL Technology Group Corporation ANNUAL REPORT 2019 31 March 2020 1 TCL Technology Group Corporation Annual Report 2019 Table of Contents Part I Important Notes, Table of Contents and Definitions .................................................. 8 Part II Corporate Information and Key Financial Information ........................................... 11 Part III Business Summary .........................................................................................................17 Part IV Directors’ Report .............................................................................................................22 Part V Significant Events ............................................................................................................51 Part VI Share Changes and Shareholder Information .........................................................84 Part VII Directors, Supervisors, Senior Management and Staff .......................................93 Part VIII Corporate Governance ..............................................................................................113 Part IX Corporate Bonds .......................................................................................................... 129 Part X Financial Report............................................................................................................. 138 2 TCL Technology Group Corporation Annual Report 2019 Achieve Global Leadership by Innovation and Efficiency Chairman’s
  • ​5G: Perspectives from a Chipmaker 5G Electronic Workshop, LETI Innovation Days – June 2019

    ​5G: Perspectives from a Chipmaker 5G Electronic Workshop, LETI Innovation Days – June 2019

    ​5G: Perspectives from a Chipmaker 5G electronic workshop, LETI Innovation Days – June 2019 Guillaume Vivier Sequans communications 1 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 MKT-FM-002-R15 Outline • Context, background, market • 5G chipmaker: process technology thoughts and challenges • Conclusion 2 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 5G overall landscape • 3GPP standardization started in Sep 2015 – 5G is wider than RAN (includes new core) – Rel. 15 completed in Dec 2018. ASN1 freeze for 4G-5G migration options in June 19 – Rel. 16 on-going, to be completed in Dec 2019 (June 2020) • Trials and more into 201 operators, 80+ countries (source GSA) • Commercial deployments announced in – Korea, USA, China, Australia, UAE 3 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 Ericsson Mobility Report Nov 2018 • “In 2024, we project that 5G will reach 40 percent population coverage and 1.5 billion subscriptions“ • Interestingly, the report highlights the fact that IoT will continue to grow, beyond LWPA, leveraging higher capability of LTE and 5G 4 ©2019 Sequans Communications |5G: Perspective from a chip maker – June 2019 5G overall landscape • eMBB: smartphone and FWA market – Main focus so far from the ecosystem • URLLC: the next wave – Verticals: Industry 4.0, gaming, media Private LTE/5G deployment, … – V2X and connected car • mMTC: – LPWA type of communication is served by cat-M and NB-IoT – 5G opens the door to new IoT cases not served by LPWA, • Example surveillance camera with image processing on the device • Flexibility is key – From Network side, NVF, SDN, Slicing, etc.
  • Memory Lane and a Look Down the Road: China Progressing in NAND but Hurdles Remain

    Memory Lane and a Look Down the Road: China Progressing in NAND but Hurdles Remain

    21 July 2019 | 12:06PM EDT Made in the USA or China Memory lane and a look down the road: China progressing in NAND but hurdles remain Mark Delaney, CFA +1(212)357-0535 | [email protected] Goldman Sachs & Co. LLC Allen Chang +852-2978-2930 | [email protected] Goldman Sachs (Asia) L.L.C. We believe that China’s efforts to enter the global DRAM and NAND markets merit a Daiki Takayama +81(3)6437-9870 | deeper dive into how the memory industries have evolved over time, what impact [email protected] Goldman Sachs Japan Co., Ltd. China’s entry into other commodity tech industries (such as LEDs and solar) has had Toshiya Hari on fundamentals, where we believe the leading China-based memory companies +1(646)446-1759 | [email protected] Goldman Sachs & Co. LLC stand at present with their efforts to enter the market (and the challenges that still Satoru Ogawa +81(3)6437-4061 | exist for entering the market — with GlobalFoundries as an example that [email protected] leading-edge semi production is difficult even for well-funded efforts), and what we Goldman Sachs Japan Co., Ltd. Alexander Duval believe all this means for the stocks of the established memory, drive, and semi +44(20)7552-2995 | [email protected] equipment companies. Goldman Sachs International Timothy Sweetnam, CFA With over $150 bn of semiconductors shipped to China in 2018, per the +1(212)357-7956 | [email protected] Semiconductor Industry Association (SIA), and China domestic semi firms having Goldman Sachs & Co.
  • ITU AI/ML in 5G Challenge Open House and Roundtable No. 2 19 August 2020 Regional Hosts for Global Round 1

    ITU AI/ML in 5G Challenge Open House and Roundtable No. 2 19 August 2020 Regional Hosts for Global Round 1

    ITU AI/ML in 5G Challenge Open House and Roundtable No. 2 19 August 2020 Regional Hosts for Global Round 1. China 2. Spain 1 3. Spain 2 4. Brazil 5. India 6. Ireland 7. United States of America 8. Japan 9. Turkey 10. Adlik/ZTE Sponsors and Promotional Partners Sponsorship Challenge Promotion ➢ Cisco Systems and ZTE ❖ LF AI Foundation: ❖ SG Innovate (Singapore): ❖ Next Generation Mobile Networks Alliance: ITU AI/ML in 5G Challenge: Registrations We have more than 400 Registrations Over 50 countries Professionals 45% 55% Students The Grand Challenge Finale Tentative Schedule: To take place in mid- December (15 – 17 Dec, 2020) 15 Dec, 2020 16 Dec, 2020 17 Dec, 2020 Opening Ceremony Sponsor Session Invited Talk Sponsor Session Finals Presentation Sponsor Session Finals Presentation Finals Presentation Sponsor Session Finals Presentation Invited Talk Prize Presentation Invited Talk Finals Presentation Closing Ceremony Finals Presentation: Participants or teams that are invited to take part in the final conference and compete for the ITU Challenge Prizes. 10 - 15 minutes presentation including Q&A. ITU AI/ML in 5G Challenge: Prizes Participants/Teams across different problem statements will compete for the following titles and prizes: ➢ 1st prize: “ITU AI/ML in 5G Challenge Gold Champion”: 5,000 CHF ➢ 2nd prize: “ITU AI/ML in 5G Challenge Silver Champion”: 3,000 CHF ➢ 3rd prize: “ITU AI/ML in 5G Challenge Bronze Champion”: 2,000 CHF​ 3 Runners up will receive 1, 000 CHF each ITU Prizes Internship/collaboration Team-1 /job offer….. Team-2 Host-1 Team-3 Team-N Judges Final Judges Top 3 Challenge winning Teams st filter event filter - 1 prize: 5kCHF - 2nd prize: 3k - 3rd prize: 2k Team-1 3 Challenge runners up Team-2 - 1k each Host-N Team-3 Honorable mention Team-N certificates 300 CHF for winner of each problem statement Some regional hosts provide additional prizes.
  • The Match Sheet Korea Rep. China PR

    The Match Sheet Korea Rep. China PR

    East Asian Football Championship 2005 Final Competition The Match Sheet Date 31 July 2005 Time 17:00 Venue Daejeon Stadium Daejeon World Cup Stadium Weather Fair Temp. 33.5°c Humidity Wind Pitch Condition Good Match Commissioner Robert Torres Ass Ref. 1 Takahashi Yoshihisa 4th Official Ghahremani Mohsen Referee Yuichi Nishimura Ass Ref. 2 Choe Hae Il Attendance 25,374 0 1st Half 0 nd Korea Rep. 1 1 2 Half 1 1 China PR Sub. Shots Goal Name No. Pos. Pos. No. Name Goal Shots sub. No. Time 2nd 1st Ttl Ttl 1st 2nd Time. No. LEE Woon Jae 1 GK GK 22 LI Leilei YOU Kyoung Youl 2 4 ZHANG Yaokun KIM Han Yoon 3 5 LI Weifeng 1 1 1 1 KIM Jin Kyu 4 7 ZHAO Xuri 11 71 LEE Chun Soo 9 10 CHEN Tao 6 13 1 1 KIM Dong Jin 13 11 CAO Yang 8 67 1 1 KIM Sang Sik 14 16 JI Mingyi 2 2 KIM Jung Woo 15 18 GAO Lin 1 1 KIM Jin Ryong 18 25 XIE Hui 1 1 90 21 3 1 4 LEE Dong Gook 20 27 SUN Xiang 1 1 1 79 20 16 46 PARK Kyu Seon 22 28 LI Yan 1 1 KIM Young Chul 5 1 LIU Yunfei 14 67 2 2 KIM Do Heon 8 2 FENG Xiaoting PARK Chu Young 10 3 HAO Junmin 9 71 CHOI Tae Uk 11 6 ZHOU Haibin BAEK Ji Hoon 12 8 ZHENG Bin 22 46 5 5 CHUNG Kyung Ho 16 13 XU Yunlong 6 10 OH Beom Seok 17 17 ZOU Jie HONG Soon Hak 19 19 JIAO Zhe YANG Sang Min 21 20 WANG Liang 79 27 KIM Yong Dae 23 GK 21 ZHANG Yonghai 90 25 KWAK Hee Ju 29 23 LI Jian KIM Young Kwang 30 GK 29 LI Jinyu Caution (C) & Sent-off (S) Head Coach Head Coach .