Auto 10-Bit, 8-Bit Voltage-Output Smart Dacs W/NVM, PMBUS I2C
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DAC53701-Q1, DAC43701-Q1 www.ti.com DAC53701-Q1,SLASEW8 DAC43701-Q1– OCTOBER 2020 SLASEW8 – OCTOBER 2020 DACx3701-Q1 Automotive, 10-Bit and 8-Bit, Voltage-Output Smart DACs With Nonvolatile Memory and PMBus™ Compatible I2C Interface With GPI Control 1 Features 3 Description • AEC-Q100 qualified for automotive applications: The automotive-grade, 10-bit DAC53701-Q1 and 8-bit – Temperature grade 1: –40°C to +125°C, TA DAC43701-Q1 (DACx3701-Q1) are a pin-compatible • 1 LSB INL and DNL (10-bit and 8-bit) family of buffered voltage-output smart digital-to- • Wide operating range analog converters (DACs). These devices consume very low power, and are available in a tiny 8-pin – Power supply: 1.8 V to 5.5 V WSON package. The feature set combined with the • General-purpose Input (GPI) based function trigger tiny package and low power make the DACx3701-Q1 2 • PMBus™ compatible I C interface an excellent choice for applications such as – Standard, fast, and fast mode plus automotive tail plus brake light, license plate light – Four slave address options configured using fade-in fade-out, and PWM expansion for interior light. the broadcast address These devices have nonvolatile memory (NVM), an – 1.62-V VIH with VDD = 5.5 V internal reference, a PMBus-compatible I2C interface, • User-programmable nonvolatile memory (NVM/ and a general-purpose input. The DACx3701-Q1 EEPROM) operates with either an internal reference or with the – Save and recall all register settings power supply as a reference, and provides a full-scale • Programmable waveform generation: Square, output of 1.8 V to 5.5 V. triangular, and sawtooth The DACx3701-Q1 are smart DAC devices because • Pulse-width modulation (PWM) output using of their advanced integrated features. With force- triangular waveform and FB pin sense output, GPI based function trigger, PWM • Digital slew rate control output, and NVM capabilities, smart DACs enable • Internal reference system performance and control without the use of • Very low power: 0.2 mA at 1.8 V software. • Flexible startup: High impedance or 10K-GND Device Information (1) • Tiny package: 8-pin WSON (2 mm × 2 mm) PART NUMBER PACKAGE BODY SIZE (NOM) ADVANCE INFORMATION ADVANCE 2 Applications DAC53701-Q1 WSON (8) 2.00 mm × 2.00 mm • Rear light DAC43701-Q1 • Headlight (1) For all available packages, see the package option • Interior light addendum at the end of the data sheet. Functional Block Diagram Automotive Brake Light With the DACx3701-Q1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, Copyrightintellectual © 2020 Texas property Instruments matters Incorporated and other important disclaimers. ADVANCE INFORMATION for preproductionSubmit products; Document subject Feedback to change 1 without notice. Product Folder Links: DAC53701-Q1 DAC43701-Q1 DAC53701-Q1, DAC43701-Q1 SLASEW8 – OCTOBER 2020 www.ti.com Table of Contents 1 Features............................................................................1 8.4 Device Functional Modes..........................................17 2 Applications.....................................................................1 8.5 Programming............................................................ 19 3 Description.......................................................................1 8.6 Register Map.............................................................24 4 Revision History.............................................................. 2 9 Application and Implementation.................................. 32 5 Device Comparison Table...............................................3 9.1 Application Information............................................. 32 6 Pin Configuration and Functions...................................3 9.2 Typical Applications.................................................. 32 7 Specifications.................................................................. 4 10 Power Supply Recommendations..............................37 7.1 Absolute Maximum Ratings ....................................... 4 11 Layout...........................................................................37 7.2 ESD Ratings .............................................................. 4 11.1 Layout Guidelines................................................... 37 7.3 Recommended Operating Conditions ........................4 11.2 Layout Example...................................................... 37 7.4 Thermal Information ...................................................4 12 Device and Documentation Support..........................38 7.5 Electrical Characteristics ............................................5 12.1 Documentation Support.......................................... 38 2 ADVANCE INFORMATION 7.6 Timing Requirements: I C Standard Mode ................ 7 12.2 Receiving Notification of Documentation Updates..38 7.7 Timing Requirements: I2C Fast Mode ........................7 12.3 Support Resources................................................. 38 7.8 Timing Requirements: I2C Fast Mode Plus ................8 12.4 Trademarks.............................................................38 7.9 Timing Requirements: GPI .........................................8 12.5 Electrostatic Discharge Caution..............................38 8 Detailed Description........................................................9 12.6 Glossary..................................................................38 8.1 Overview.....................................................................9 13 Mechanical, Packaging, and Orderable 8.2 Functional Block Diagram...........................................9 Information.................................................................... 38 8.3 Feature Description...................................................10 4 Revision History DATE REVISION NOTES October 2020 * Initial release. 2 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: DAC53701-Q1 DAC43701-Q1 DAC53701-Q1, DAC43701-Q1 www.ti.com SLASEW8 – OCTOBER 2020 5 Device Comparison Table DEVICE RESOLUTION DAC53701-Q1 10-bit DAC43701-Q1 8-bit 6 Pin Configuration and Functions Figure 6-1. DSG Package, 8-Pin WSON, Top View Pin Functions PIN TYPE DESCRIPTION NAME NO. AGND 5 Ground Ground reference point for all circuitry on the device External capacitor for the internal LDO. Connect a capacitor (approximately 1.5 µF) between CAP and CAP 4 Input AGND. FB 7 Input Voltage-feedback pin GPI 1 Input General-purpose input OUT 8 Output Analog output voltage from DAC ADVANCE INFORMATION ADVANCE Serial interface clock. This pin must be connected to the supply voltage with an external pullup SCL 2 Input resistor. Data are clocked into or out of the input register. This pin is a bidirectional, and must be connected to SDA 3 Input/output the supply voltage with an external pullup resistor. VDD 6 Power Analog supply voltage: 1.8 V to 5.5 V Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: DAC53701-Q1 DAC43701-Q1 DAC53701-Q1, DAC43701-Q1 SLASEW8 – OCTOBER 2020 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VDD Supply voltage, VDD to AGND –0.3 6 V Digital input(s) to AGND –0.3 VDD + 0.3 V CAP to AGND –0.3 1.65 V VFB to AGND –0.3 VDD + 0.3 V VOUT to AGND –0.3 VDD + 0.3 V Current into any pin –10 10 mA TJ Junction temperature –40 150 °C ADVANCE INFORMATION Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 Electrostatic HBM ESD classification level 2 V(ESD) V discharge Charged device model (CDM), per AEC Q100-011 ±750 CDM ESD classification level C5 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Positive supply voltage to ground (AGND) 1.71 5.5 V VIH Digital input high voltage, 1.7 V < VDD ≤ 5.5 V 1.62 V VIL Digital input low voltage 0.4 V TA Ambient temperature –40 125 °C 7.4 Thermal Information DACx3701-Q1 THERMAL METRIC(1) DSG (WSON) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 49 °C/W RθJC(top) Junction-to-case (top) thermal resistance 50 °C/W RθJB Junction-to-board thermal resistance 24.1 °C/W ΨJT Junction-to-top characterization parameter 1.1 °C/W ΨJB Junction-to-board characterization parameter 24.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 8.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: DAC53701-Q1 DAC43701-Q1 DAC53701-Q1, DAC43701-Q1 www.ti.com SLASEW8 – OCTOBER 2020 7.5 Electrical Characteristics all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.8 V ≤ VDD ≤ 5.5 V, DAC reference tied to VDD, gain = 1x, DAC output pin (OUT) loaded with resistive load