PSMC Investor Conference

2021/04/07-08 History 300mm (12”)

200mm (8”) Fab 8A • Listed company spun off Transferred at from PTC & into pure emerging stock started-up 0.18mm 0.18mm wafer Purchased market MCU process Power foundry Fab8B • Started MP MOSFET MP company () Fab P5 plan

20082009 20102011 2012 2013 2015 2017 2018 2019 2020

0.18mm 0.18mm Changed of • PMIC Merged Fab LCD driver Fab 8AD MP company name process P1/2、P3 IC process into Powerchip MP from PTC MP Semiconductor • Fab 8B MP Manufacturing Corporation PTC : Powerchip Technology Corporation (PSMC) MP : Mass production MCU : Microcontroller unit PMIC : Power management IC PSMC Capacity

Fab P1/2 FAB P3 FAB 8A

Zhunan FAB 8B

Hsinchu Science Park

200mm (8”) 300mm (12”) 8A 8B P1/2 P3

MP Start 1996 2019 2002/2005 2007

Capacity 75K *20K /40K/60K 70K 35K

Technology 180~110nm 180~28nm 30~21nm

* Fab 8B phase 1 capacity 20K(12/2020) ；Planned capacity 60K WPM Tongluo Site Plan

• Plan to invest 10 billion USD in 10 years to 300mm (12”) P5 establish a 100K WPM production base in Tongluo science park of HSP MP 2023 • Fully automatic intelligent Fab 2 • Provide 3000 job opportunities for Clean room 55,000 m - area WPM 100K • Annual output value greater than 2 billion USD after fully loaded production Technology 50~1X nm Capacity Plan From 2021 to 2025

8” Fab： PMIC/Display ～ 30k/m Discrete ～ 65k ‰ 100k/m

12” Fab： DRAM ～ 40k ‰ 55k/m NAND/NOR ～ 5k ‰ 10k/m* PMIC ～ 10k ‰ 30k/m* Display ～ 20k/m* Specialty Logic ～10k/m* CIS/FOD ～ 20k/m *Capacity expansion for advanced technology nodes in new fab. Sales Ratio by Product

Logic Line

Memory Line

‹ Logic line) – DDI/PMIC/CIS/IMC ‹ Memory line – DRAM/Flash Product Portfolio of PSMC

AP/DP Display IC DRAM(legacy) MOSFET

Specialty Logic CIS/FOD DRAM(Specialty) IGBT

DRAM(HD) PMIC NAND(SLC)

NAND(3D) MEMS

Existing Foundry Business(PSMC)

Future addition of PSMC Foundry Technology Roadmap

Panel Driver IC Image Sensor IC Power Management IC Integrated Memory Chip Pure Logic Platform

Technology node (nm) 350 180 150 130 110 90 70 50 40 30 20 10

DRAM NAND Flash NOR Flash

8” Mass Production pilot run development 12” Unique Inter-chip Technology

‹ Wide Bandwidth Specialty Memory Core WOW (wafer on wafer) with - HPC - AI Logic - Networking Chips Chip

‹ Memory Buffer WOW with Image Sensors Memory Chip ‹ DRAM Capacitors WOW with HPC Chips for Power- line Noise Control Business Focus

‹ Priority by Application Auto, Industrial, 5G/6G Infrastructure, Cellular Phone, Consumer, etc.

‹ Priority by Geography Japan, US, Eu, other Asia Region. IDMs over Design Houses. Q&A Market Trend in the New Decade

4G 5G 6G 4G 5G ‰ ‰ -2008- -2020- 3G -1998- 2G ~ 1Gbps ~ 20Gbps -1991- ~ 10Mbps SMS/MMS Internet SMS/MMS Internet Robotics 1G Access Access -1981- HD SMS/MMS Internet Video Mobile TV Video Mobile Automobile ~ 64Kbps Access Calls Calls TV HD

Video Mobile TV SMS/MMS Calls Gaming Cloud Gaming Cloud AR/VR ~ 2.4Kbps Services Computing Services Computing

Car ‰ EV ‰Smart Car PC ‰ Mobile Phone ‰ AIOT (ICE/Hybrid) Incremental average Level 4/Level 5 WAVE 1 WAVE 2 WAVE 3 WAVE 4 semiconductor content 2030 : ~2.5m MAINFRAME COMPUTER MOBILE AIoT per smart car

Level 2+ USD$ 2025 : ~2.5m Level 2 1,150-1,250 2020 : ~5m USD$ Tenths of Hundreds of USD$ 280-350 160-180 Thousands Billion Billions Billions

* Semiconductor content for infotainment, Safety & Comfort and Vehicle Electrification are not included