Fattwin Superservers Power Rutgers University's Top Ranked New Supercomputer
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ISS 2016 Bootcamp: Intel Omni-Path Architecture
Intel® Scalable System Framework A Configurable Design Philosophy Extensible to a Wide Range of Workloads Small Clusters Through Supercomputers Compute Memory/Storage Compute and Data-Centric Computing Fabric Software Standards-Based Programmability Intel Silicon On-Premise and Cloud-Based Photonics Intel® Xeon® Processors Intel® Solutions for Lustre* Intel® Omni-Path Architecture HPC System Software Stack Intel® Xeon Phi™ Processors Intel® SSDs Intel® True Scale Fabric Intel® Software Tools Intel® Xeon Phi™ Coprocessors Intel® Optane™ Technology Intel® Ethernet Intel® Cluster Ready Program Intel® Server Boards and Platforms 3D XPoint™ Technology Intel® Silicon Photonics Intel® Visualization Toolkit 1 YANG YANGUO May 2016 Intel Confidential Agenda Quick Overview: HPC Fabrics What is Intel® 100Gb Omni-Path Architecture(OPA)? Why is Intel 100Gb OPA Summary Intel® Solutions Summit 2016 Intel Confidential 3 Intel Confidential What is Different Between Networks and Fabrics? Network: Universal interconnect designed to HPC Fabric: Optimized interconnect allows allow any-and-all systems to communicate many nodes to perform as a single system Intel® Omni-Path Architecture or Infiniband Key NETWORK (Ethernet) Attributes: Key FABRIC Attributes: . Flexibility for any application . Targeted for specific applications . Designed for universal communication . Optimized for performance and efficiency . Extensible configuration . Engineered topologies . Multi-vendor components . Single-vendor solutions Intel® Solutions Summit 2016 Intel Confidential 5 Fabric: InfiniBand* and OPA InfiniBand/OPA is a multi-lane, high-speed serial interconnect (Copper or Fiber) . Typically presented as a 4x solution . Speeds: 40Gb/s (M & Intel QDR), 56Gb/s (M FDR), 100Gb/s (EDR & Intel OPA) High bandwidth, low latency HPC interconnect for commodity servers . Ethernet switch latency is typically measured in μs, but InfiniBand/OPA is in nanoseconds . -
Intel® Core™ I7 and Intel® Core™ I5 Processor-Based Platforms for Embedded Computing
PLATFORM BRieF Intel® Core™ i7 and i5 Processors with Mobile Intel® QM57 Express Chipset Embedded Computing Intel® Core™ i7 and Intel® Core™ i5 Processor-based Platforms for Embedded Computing Product Overview developers can create one board design Based on 32nm process technology, and scale their product line with a variety Intel® Core™ i7 and Intel® Core™ i5 proces- of performance-per-watt processors using sors feature intelligent performance, the same socket. Thermal design power power efficiency, integrated graphics, and (TDP) options range from 18W to 35W. error correcting code (ECC) memory1 on industry-standard x86 architecture. When Product Highlights paired with the Mobile Intel® QM57 Express Integrated graphics engine: Supports chipset, this integrated two-chip platform enhanced graphics capabilities and perfor- provides excellent graphics, memory and mance while reducing overall platform I/O bandwidth, as well as remote manage- power requirements and footprint. ment capabilities and reliability to meet Memory Error Correction: ECC memory the requirements of a broad range of provides a high level of data integrity, embedded applications including retail and reliability, and system uptime (select SKUs). transaction solutions, gaming platforms and industrial automation equipment. Intel® Intelligent Power Technology4: Reduces idle power consumption through The processors feature dual-core proc- architectural improvements such as essing with industry-leading performance integrated power gates and automated capabilities, including Intel® Turbo Boost low-power states. Technology2 and Intel® Hyper-Threading Technology.3 Advanced Encryption Standard Intel® Turbo Boost Technology: Applica- Instructions (AES-NI) help accelerate data tions take advantage of higher speed encryption and decryption, and improve execution on demand by using available performance. -
Your Securi As Strong a Weakest
Your security is only as strong as it’s weakest link. LAST WORDS Our business is protecting yours Glimpses at how technology has changed—and changed our lives. That’s why Dell and Kensington provide employee compliance services such as viral posters and e-reminders to ensure that every employee uses their What is this? laptop lock. Talk to Dell who’ll be able to help you make your security investments work harder for you. Here’s a Visit: www.logon-lockon.com memory. MicroSaver Laptop Lock Dell# 461-10054 1984 2010 The IBM AT 4GB is no big is introduced deal for personal and has 256k computers. of RAM. KE6442 Dell Compliance Ad UK.indd 1 5/14/10 11:15:44 AM Courtesy of Computer History Museum So, that’s 256,000 bytes We’ll give you a hint: it’s not a piece of compared to 4,000,000,000 furniture. It is a device based on technology. bytes, a 15,000-fold Let us know what you think this is, and email increase! your answer to [email protected] We’ll reveal the answer in the next issue of Catalyst and recognise the winner. 1980 2010 Lighten up. 1981: Adam Osborne introduces the Osborne I, the first successful portable computer. It weighs 25 pounds. 2010: The lightest netbooks can weigh less than 3 pounds. My, you’ve changed! Experts in laptop protection for over 25 years; Targus offers business Dell N.V., Zone 3 Doornveld 130, 1731 Asse-Zellik, Terms and Conditions of Sales, Service and Finance apply and are available on HYPERLINK “http://www.dell.be/business” www.dell.be/business. -
Securing and Consolidating Industrial Automation Systems Based on Intel® Architecture Using Open Source Technology
White Paper Intel® Trusted Execution Technology and Intel® Virtualization Technology Design House and Platform Solutions Securing and Consolidating Industrial Automation Systems Based on Intel® Architecture Using Open Source Technology Using open source components, Intel demonstrates how Intel® Trusted Execution Technology and Intel® Virtualization Technology complement existing security measures for networked industrial systems based on Intel® Architecture. Executive Summary This paper presents an overview of the importance of security for today’s connected industrial automation systems and highlights the benefits of Intel® Trusted Execution Technology (Intel® TXT) and Intel® Virtualization Technology (Intel® VT) in complementing existing security measures. Furthermore, a demonstration system (a product separation industrial machine) using open source technology is described with a procedure that may be considered to set up the system. “This demonstration of a security solution for Background industrial automation Industrial automation systems are unknown security vulnerabilities in increasingly connected to each other the operating system and application systems uses open source in a manufacturing environment as software in order to access confidential technology with Intel® part of the Internet of Things (IoT) data or to manipulate processes in concept where real-time information connected systems. The potential Architecture. By designing from connected devices can be consequences of a security breach on security into its processors, -
Intel® AMT Configuration Utility User Guide
Intel® AMT Configuration Utility User Guide Version 11.0 Document Release Date: December 17, 2015 License Intel®Setup and Configuration Software (Intel® SCS) is furnished under license and may only be used or copied in accordance with the terms of that license. For more information, refer to the “Exhibit A” section of the “Intel(R) SCS License Agreement.rtf”, located in the Licenses folder. Legal Information No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel technologies' features and benefits depend on system configuration and may require enabled hardware, specific software, or services activation. Performance varies depending on system configuration. Check with your system manufacturer or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. Intel® AMT should be used by a knowledgeable IT administrator and requires enabled systems, software, activation, and connection to a corporate network. Intel AMT functionality on mobile systems may be limited in some situations. Your results will depend on your specific implementation. Learn more by visiting Intel® Active Management Technology. -
Intel® NUC 9 Pro Kit Product Brief
INTEL® NUC 9 PRO A COMPACT WORKSTATION FOR ALL YOUR CREATIVE TASKS Render faster, visualize more with full-powered GPUs INTEL NUC TO SUPPORT DESKTOP CREATE AT WILL, INTEL® NUC 1ST GRAPHICS MORE WORKSTATON BANDWIDTH WITH 24/7/365 8X THUNDERBOLT™ 31 Behind every creator is a workhorse like the Intel® FEATURES IDEAL FOR NUC 9 Pro kit, a compact workstation with room for • Intel Xeon processor • Content creation the latest desktop graphics. Powered by the Intel® • Intel Core i7 vPro processor • AI development and inference NUC 9 Pro Compute Element, this first-ever Intel NUC • HDMI* 2.0a • Edge analytics workstation is built to handle demanding content • Two Thunderbolt 3 ports • Data visualization creation, data analysis, and AI development and • Four USB 3.1 ports • CAD • Supports 3x 4K displays inference tasks. (additional displays supported with The Intel NUC 9 Pro Compute Element, powered by an add-in graphics card) AVAILABLE SKUs an Intel® Xeon® or Intel® Core™ i7 vPro® processor, • Intel® Wi-Fi 6 • Intel® NUC Kit • Bluetooth* 5 • Intel® NUC Compute Element delivers top-end performance—all in a 5 liter chassis • Two Intel® Gigabit LAN ports small enough to sit behind a monitor. Plus, there are • Dual-slot PCIe x16 slot two Thunderbolt™ 3 ports for fast data transfers and • 3-year limited warranty 500 watts of onboard power for a dual-slot PCIe* x16 graphics card. Whether you’re visualizing a financial quantitative analysis or using AutoCAD to design a new building, the Intel NUC 9 Pro gives you the power to create. Intel NUC 9 Pro: Uncompromised -
Product Change Notification
Product Change Notification Change Notification #: 116422 - 00 Change Title: For select Intel® SSD DC S4500 Series and Intel® SSD DC S4600 Series SKUs, PCN 116422-00, Product Discontinuance, End of Life Date of Publication: August 31, 2018 Key Characteristics of the Change: Product Discontinuance Forecasted Key Milestones: Last Product Discontinuance Order Date: December 31, 2018 Last Product Discontinuance Shipment Date: April 30, 2019 Description of Change to the Customer: Intel is announcing the End of Life timeline for the Intel® SSD DC S4500 Series and Intel® SSD DC S4600 Series SKUs listed in the products affected table list in the PCN announcement. The Intel® SSD DC S4500 Series and Intel® SSD DC S4600 Series products listed on the "Products Affected/Intel Ordering Codes" table below will be discontinued and unavailable for additional orders after the December 31, 2018. Effective April 30, 2019 Intel will stop shipping Intel® SSD DC S4500 Series and Intel® SSD DC S4600 Series hardware. Customer Impact of Change and Recommended Action: While Intel will make commercially reasonable efforts to support last time order quantities, it is recommended for customers to transition to the next generation of products - Intel® SSD D3-S4510 Series and D3-S4610 Series. Please contact your local Intel Field Sales representative if you have any further questions about this End of Life notice. Page 1 of 3 PCN #116422 - 00 Products Affected / Intel Ordering Codes: Product Name Product Code MM# Intel® SSD DC S4500 Series (240GB, 2.5in SATA 6Gb/s, -
Product Change Notification
Product Change Notification Change Notification #: 116497 - 00 Change Title: Select Intel® SSD 760p Series, Intel® SSD DC P4101 Series, Intel® SSD E 6100P Series, PCN 116497-00, Label, Label Update Date of Publication: September 25, 2018 Key Characteristics of the Change: Label Forecasted Key Milestones: Date Customer Must be Ready to Receive Post-Conversion Material: December 24, 2018 Description of Change to the Customer: The Intel® SSD 760p Series, Intel® SSD DC P4101 and Intel® SSD E 6100P Series SKUs listed in the Products Affected Table below will have the following label changes: 1. Outer Box: • Add extra information ("Model") and linear barcode on the label with no change to current box label format and location. Page 1 of 3 PCN #116497 - 00 2. White/Brown Box Label: • Add extra information and linear barcode on the label. Customer Impact of Change and Recommended Action: The change in labeling only affects the label. There is no form, fit, function or visible change to the products listed in the Products Affected/Intel Order Codes table. Please contact your local Intel Field Sales Representative if you have any further questions about these changes. Products Affected / Intel Ordering Codes: Marketing Name Product Code MM# Intel® SSD E 6100p Series (128GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) SSDPEKKR128G801 963756 Generic Single Pack Intel® SSD E 6100p Series (256GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) SSDPEKKR256G801 963758 Generic Single Pack Intel® SSD E 6100p Series (128GB, M.2 80mm PCIe 3.0 x4, 3D2, TLC) SSDPEKKR128G810 963759 Generic -
System Design for Telecommunication Gateways
P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS Alexander Bachmutsky Nokia Siemens Networks, USA A John Wiley and Sons, Ltd., Publication P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come SYSTEM DESIGN FOR TELECOMMUNICATION GATEWAYS Alexander Bachmutsky Nokia Siemens Networks, USA A John Wiley and Sons, Ltd., Publication P1: OTE/OTE/SPH P2: OTE FM BLBK307-Bachmutsky August 30, 2010 15:13 Printer Name: Yet to Come This edition first published 2011 C 2011 John Wiley & Sons, Ltd Registered office John Wiley & Sons Ltd, The Atrium, Southern Gate, Chichester, West Sussex, PO19 8SQ, United Kingdom For details of our global editorial offices, for customer services and for information about how to apply for permission to reuse the copyright material in this book please see our website at www.wiley.com. The right of the author to be identified as the author of this work has been asserted in accordance with the Copyright, Designs and Patents Act 1988. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, except as permitted by the UK Copyright, Designs and Patents Act 1988, without the prior permission of the publisher. -
Intel Vpro® Platform Vs. AMD* Pro Out-Of-Band Management White
INTEL vPro® vs. AMD® PRO* OUT-OF-BAND MANAGEMENT WHITE PAPER MARCH 2020 Deborah Mrazek Senior UX Strategist Colin Bay Chief Research Officer concreteUX.com OUT-OF-BAND MANAGEMENT (OOBM) PLATFORM COMPARISON DASH IT administrators and decision-makers seek the best solution for managing their networked endpoints for both wired and Wi-Fi connected devices when powered off or the OS isn’t running COMPETITIVE (i.e., out-of-band management). Hired by Intel as a third party, we put management of the Intel vPro® platform to the test in the ASSESSMENT hands of some pretty savvy IT administrators, then asked them to compare its capabilities with AMD PRO—you’ll want to hear what they had to say. They had some compelling ideas about which of these two platforms most capably and robustly meets the growing need for remote, in-band, and out-of-band endpoint management. THIRD-PARTY TESTING FINDS AMD® PRO MANAGEABILITY LAGS This white paper investigates and compares manageability aspects of the AMD PRO and Intel vPro platforms, with a focus on functionality, usability, and standards adherence. AMD ® BEHIND INTEL VPRO PLATFORM suggests that AMD PRO is more robust and more compatible than Intel vPro technology. We found stark differences. We’ll show you why. We’ll present user experience test findings, expert reviews, and analyses that spotlight the Intel vPro platform’s advantages, particularly in critical areas like security, features, and out-of-band management over Wi-Fi—one of the biggest advantages of the Intel vPro platform. We’ll also address knowledge gaps in customer understanding. -
Operacn´I Syst´Emy
S´arkaˇ Vavreˇckov´a Operaˇcn´ısyst´emy pˇredn´aˇsky Slezsk´auniverzita v Opavˇe Filozoficko-pˇr´ırodovˇedeck´afakulta Ustav´ informatiky Opava, posledn´ıaktualizace 25. kvˇetna2017 Anotace: Tento dokument je urˇcenpro studenty druh´ehoroˇcn´ıkuIVT na Ustavu´ infor- matiky Slezsk´euniverzity v Opavˇe. Obsahuje l´atkuprob´ıranouna pˇredn´aˇsk´ach pˇredmˇetu Operaˇcn´ısyst´emy. Prob´ıran´al´atka navazuje na pˇredmˇet Praktikum z operaˇcn´ıch syst´em˚u. Pˇredpokl´ad´ase z´akladn´ıorientace v adres´aˇrov´estruktuˇrea textov´emreˇzimu UNIXov´ych syst´em˚u,nejd˚u- leˇzitˇejˇs´ıch konfiguraˇcn´ıch souborech, z´akladypˇr´ıstupov´ych opr´avnˇen´ıv UNIXov´ych syst´e- mech. Doplnˇen´ımtˇechto skript jsou skripta pro cviˇcen´ı(dva soubory { pro Windows a Linux). Operaˇcn´ısyst´emy { pˇredn´aˇsky RNDr. S´arkaˇ Vavreˇckov´a,Ph.D. Dostupn´ena: http://vavreckova.zam.slu.cz/opsys.html Ustav´ informatiky Filozoficko-pˇr´ırodovˇedeck´afakulta v Opavˇe Slezsk´auniverzita v Opavˇe Bezruˇcovo n´am.13, Opava S´azenov syst´emu LATEX Tato inovace pˇredmˇetu Operaˇcn´ısyst´emy je spolufinancov´anaEvropsk´ymsoci´aln´ımfondem a St´atn´ım rozpoˇctem CR,ˇ projekt ˇc.CZ.1.07/2.3.00/0 9.0197, Pos´ılen´ıkonkurenceschopnosti v´yzkumu a v´yvoje " informaˇcn´ıch technologi´ıv Moravskoslezsk´emkraji\. Pˇredmluva Co najdeme v tˇechto skriptech Tato skripta jsou urˇcenapro studenty informatick´ych obor˚una Ustavu´ informatiky Slezsk´euniverzity v Opavˇe.Na pˇredn´aˇsk´ach pˇredmˇetuOperaˇcn´ısyst´emy prob´ır´amepˇredevˇs´ımteoretick´ekoncepty sou- visej´ıc´ıse strukturou operaˇcn´ıch syst´em˚u,rol´ıjednotliv´ych ˇc´ast´ıj´adraa mechanismy spr´avyproces˚u, pamˇetia zaˇr´ızen´ı,ovˇsemkaˇzd´et´emaje n´aslednˇevztaˇzenona konkr´etn´ıoperaˇcn´ısyst´emy (obvykle Windows a Linux). -
Intel SSD 750 Series Evaluation Guide
Intel® Solid State Drive 750 Series Evaluation Guide September 2016 Order Number: 332075-002US Intel® Solid State Drive 750 Series Ordering Information Contact your local Intel sales representative for ordering information. Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. All documented performance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.