Federal Register/Vol. 84, No. 242/Tuesday, December 17, 2019
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Reply Brief of Petitioners
No. 06-937 In the Supreme Court of the United States QUANTA COMPUTER, INC., QUANTA COMPUTER USA, INC., Q-LITY COMPUTER, INC., COMPAL ELECTRONICS, INC., BIZCOM ELECTRONICS, INC., SCEPTRE TECHNOLOGIES, INC., FIRST INTERNATIONAL COMPUTER, INC. AND FIRST INTERNATIONAL COMPUTER OF AMERICA, INC., PETITIONERS, V. LG ELECTRONICS, INC., RESPONDENT. ON PETITION FOR A WRIT OF CERTIORARI TO THE UNITED STATES COURT OF APPEALS FOR THE FEDERAL CIRCUIT REPLY BRIEF OF PETITIONERS TERRENCE D. GARNETT MAUREEN E. MAHONEY VINCENT K. YIP Counsel of Record PETER WIED J. SCOTT BALLENGER PAUL, HASTINGS, JANOFSKY ANNE W. ROBINSON & WALKER LLP LATHAM & WATKINS LLP 515 SOUTH FLOWER STREET 555 11TH STREET N.W. 25TH FLOOR SUITE 1000 LOS ANGELES, CA 90071 WASHINGTON, D.C. 20004 (213) 683-6000 (202) 637-2200 Counsel for Quanta Computer, Counsel for Petitioners Inc., Quanta Computer USA, Inc., Q-Lity Computer, Inc. Additional Counsel Listed on Inside Cover MAXWELL A. FOX WILLIAM J. ANTHONY, JR. PAUL, HASTINGS, JANOFSKY ERIC L. WESENBERG & WALKER LLP KAI TSENG 34 F ARK MORI BUILDING MATTHEW J. HULT P.O. BOX 577 ROWENA Y. YOUNG 12-32 AKASAKA 1-CHOME ORRICK, HERRINGTON MINATO-KU, TOKYO 107-6034 & SUTCLIFFE LLP JAPAN 1000 MARSH ROAD 813 6229 6100 MENLO PARK, CA 94025 Counsel for Quanta (650) 614-7400 Computer, Inc., Quanta Counsel for Compal Electronics, Computer USA, Inc., Q-Lity Inc., Bizcom Electronics, Inc., Computer, Inc. Sceptre Technologies, Inc. RONALD S. LEMIEUX PAUL, HASTINGS, JANOFSKY & WALKER LLP 5 PALO ALTO SQUARE 6TH FLOOR PALO ALTO, CA 94306 Counsel for First International Computer, Inc. and First International Computer of America, Inc. -
Full Partner List
Full Partner List Partnerships: Spyder Digital SIIG Franklin Electronic Solidtek SIIG BenQ America HIVI Acoustics PC Treasures Electronics) Bags & Carry Cases Research Inc. StarTech.com Gear Head Standzout StarTech.com Blue Microphones HMDX Peerless Withings Inc 3Dconnexion STM Bags Symtek Gefen StarTech.com Thermaltake BodyGuardz Honeywell Home Pentax Imaging Xavier Professional Cable Acer Symtek Targus Genius USA Targus TRENDnet Boom HP Inc. Phiaton Corp. Yamaha Adesso Inc. Targus Thermaltake Gigabyte Technology Thermaltake Turtle Beach Braven IAV Lightspeaker Philips Zagg-iFrogz AIRBAC The Joy Factory TRENDnet Griffin Technology TRENDnet U.S. Robotics BTI-Battery Tech. iHome Philips Electronics Zalman USA Aluratek Thermaltake Tripp Lite Gripcase Tripp Lite Visiontek BUQU Incipio Technologies Planar Systems zBoost American Weigh Scales Twelve South Visiontek Gyration Twelve South XFX C2G InFocus Plantronics Zmodo Technology Corp ASUS Urban Armor Gear VOXX Electronics Hawking Technologies TX Systems Zalman USA CAD Audio Innovative Office Products PNY Technologies Belkin Verbatim weBoost (Wilson HP Inc. U.S. Robotics Zotac Canon Interworks Polk Audio Data Storage Products Victorinox (Wenger) Electronics) HYPER by Sanho Verbatim Case-Mate Inwin Development Q-See BodyGuardz Aleratec Inc Zagg-iFrogz Xavier Professional Cable Corporation Viewsonic Casio IOGear QFX Canon Computers & Tablets Aluratek Incipio Technologies Visiontek Centon iON Camera Reticare inc CaseLogic Acer ASUS Computer & AV Cables Computer Accessories InFocus VisTablet -
Global Capital, the State, and Chinese Workers: the Foxconn Experience
MCX38410.1177/0097700 447164412447164Pun and ChanModern China © 2012 SAGE Publications Reprints and permission: sagepub.com/journalsPermissions.nav Articles Modern China 38(4) 383 –410 Global Capital, the State, © 2012 SAGE Publications Reprints and permission: and Chinese Workers: sagepub.com/journalsPermissions.nav DOI: 10.1177/0097700412447164 The Foxconn Experience http://mcx.sagepub.com Pun Ngai1 and Jenny Chan2 Abstract In 2010, a startling 18 young migrant workers attempted suicide at Foxconn Technology Group production facilities in China. This article looks into the development of the Foxconn Corporation to understand the advent of capi- tal expansion and its impact on frontline workers’ lives in China. It also pro- vides an account of how the state facilitates Foxconn’s production expansion as a form of monopoly capital. Foxconn stands out as a new phenomenon of capital expansion because of the incomparable speed and scale of its capital accumulation in all regions of China. This article explores how the workers at Foxconn, the world’s largest electronics manufacturer, have been subjected to work pressure and desperation that might lead to suicides on the one hand but also open up daily and collective resistance on the other hand. Keywords global capital, Chinese state, student workers, rural migrant workers, Foxconn Technology Group When Time magazine nominated workers in China as the runners-up for the 2009 Person of the Year, the editor commented that Chinese workers have brightened the future of humanity by “leading the world to economic 1Hong Kong Polytechnic University, Kowloon, Hong Kong 2Royal Holloway, University of London, Surrey, UK Corresponding Author: Pun Ngai, Department of Applied Social Sciences, Hong Kong Polytechnic University, Kowloon, Hong Kong Email: [email protected] 384 Modern China 38(4) recovery” (Time, Dec. -
AMD 790GX 6 August 2008
AMD Launches World's Fastest Motherboard GPU: AMD 790GX 6 August 2008 it the best platform for unlocking maximum AMD Phenom processor performance. Built-in ATI Radeon HD 3300 graphics provide an unmatched HD and gaming experience out of the box, with flexibility to scale to high performance configurations with the addition of one or two award- winning ATI Radeon HD 4800 series discrete graphics cards. “Today’s high definition, multimedia applications demand powerful graphics and multi-core processor performance and only AMD is delivering a truly balanced platform that accelerates these AMD 790GX Chipset - Energy Efficient workloads,” said Phil Eisler, corporate vice president and general manager, AMD Chipset Division. “The AMD 790GX chipset contains several AMD innovations that further improves both AMD today announced the availability of the multi-core AMD Phenom processor performance industry’s preeminent performance desktop and motherboard ATI Radeon graphics platform, the AMD 790GX. Packing a host of performance, the result of which are versatile innovations, the AMD 790GX integrates advanced performance PCs that deliver an eye-catching performance tuning for AMD Phenom processors, visual experience.” plus ATI Radeon HD 3300 graphics - the world’s fastest motherboard graphics processor (mGPU) – Building on the momentum of the award-winning to take media aficionados beyond HD. AMD 780G chipset, the AMD 790GX offers DirectX 10 game compatibility, allowing casual gamers to In addition to AMD validation, independent testing enjoy advanced game performance, truly lifelike 3D of the AMD 790GX chipset shows significant graphics and dynamic interactivity in the latest increases in AMD Phenom processor performance game titles. -
Test Report on Terminal Compatibility of Huawei's WLAN Products
Huawei WLAN ● Wi-Fi Experience Interoperability Test Reports Test Report on Terminal Compatibility of Huawei's WLAN Products Huawei Technologies Co., Ltd. Test Report on Terminal Compatibility of Huawei's WLAN Products 1 Overview WLAN technology defined in IEEE 802.11 is gaining wide popularity today. WLAN access can replace wired access as the last-mile access solution in scenarios such as public hotspot, home broadband access, and enterprise wireless offices. Compared with other wireless technologies, WLAN is easier to operate and provides higher bandwidth with lower costs, fully meeting user requirements for high-speed wireless broadband services. Wi-Fi terminals are major carriers of WLAN technology and play an essential part in WLAN technology promotion and application. Mature terminal products available on the market cover finance, healthcare, education, transportation, energy, and retail industries. On the basis of WLAN technology, the terminals derive their unique authentication behaviors and implementation methods, for example, using different operating systems. Difference in Wi-Fi chips used by the terminals presents a big challenge to terminal compatibility of Huawei's WLAN products. Figure 1-1 Various WLAN terminals To identify access behaviors and implementation methods of various WLAN terminals and validate Huawei WLAN products' compatibility with the latest mainstream terminals used in various industries, Huawei WLAN product test team carried out a survey on mainstream terminals available on market. Based on the survey result, the team used technologies and methods specific to the WLAN field to test performance indicators of Huawei's WLAN products, including the access capability, authentication and encryption, roaming, protocol, and terminal identification. -
CES 2016 Exhibitor Listing As of 1/19/16
CES 2016 Exhibitor Listing as of 1/19/16 Name Booth * Cosmopolitan Vdara Hospitality Suites 1 Esource Technology Co., Ltd. 26724 10 Vins 80642 12 Labs 73846 1Byone Products Inc. 21953 2 the Max Asia Pacific Ltd. 72163 2017 Exhibit Space Selection 81259 3 Legged Thing Ltd 12045 360fly 10417 360-G GmbH 81250 360Heros Inc 26417 3D Fuel 73113 3D Printlife 72323 3D Sound Labs 80442 3D Systems 72721 3D Vision Technologies Limited 6718 3DiVi Company 81532 3Dprintler.com 80655 3DRudder 81631 3Iware Co.,Ltd. 45005 3M 31411 3rd Dimension Industrial 3D Printing 73108 4DCulture Inc. 58005 4DDynamics 35483 4iiii Innovations, Inc. 73623 5V - All In One HC 81151 6SensorLabs BT31 Page 1 of 135 6sensorlabs / Nima 81339 7 Medical 81040 8 Locations Co., Ltd. 70572 8A Inc. 82831 A&A Merchandising Inc. 70567 A&D Medical 73939 A+E Networks Aria 36, Aria 53 AAC Technologies Holdings Inc. Suite 2910 AAMP Global 2809 Aaron Design 82839 Aaudio Imports Suite 30-116 AAUXX 73757 Abalta Technologies Suite 2460 ABC Trading Solution 74939 Abeeway 80463 Absolare USA LLC Suite 29-131 Absolue Creations Suite 30-312 Acadia Technology Inc. 20365 Acapella Audio Arts Suite 30-215 Accedo Palazzo 50707 Accele Electronics 1110 Accell 20322 Accenture Toscana 3804 Accugraphic Sales 82423 Accuphase Laboratory Suite 29-139 ACE CAD Enterprise Co., Ltd 55023 Ace Computers/Ace Digital Home 20318 ACE Marketing Inc. 59025 ACE Marketing Inc. 31622 ACECAD Digital Corp./Hongteli, DBA Solidtek 31814 USA Acelink Technology Co., Ltd. Suite 2660 Acen Co.,Ltd. 44015 Page 2 of 135 Acesonic USA 22039 A-Champs 74967 ACIGI, Fujiiryoki USA/Dr. -
“UROP Has Long Represented the Opportunity to Discover, Innovate and Create New Knowledge. the EECS Superurop Promises MIT Un
“UROP has long represented the opportunity to discover, innovate and create new knowledge. The EECS SuperUROP promises MIT undergraduates an even more intensive and sustained intellectual SuperUROP experience working with our faculty. We expect EECS majors will welcome this new opportunity with enthusiasm.” — Julie B. Norman Senior Associate Dean for Undergraduate Education Director, Office of Undergraduate Advising and Academic Programming 2012– 2013 I am thrilled to celebrate the launch of the new Advanced Undergraduate Research Program in EECS, now officially known as SuperUROP. This collaboration between EECS and the MIT UROP office evolved out of the 2012 EECS strategic plan, which included strong participation from faculty, students, and staff. The program responded to my vision for creating a high caliber undergraduate research program that would produce publication- worthy results. The Undergraduate Student Advisory Group in EECS (USAGE) strongly influenced the overall structure of the program. The SuperUROP program will provide a jump-start on graduate school, act as a startup accelerator, and be an industry-training bootcamp—all rolled “Our engineering students want a into one. The response from students has been extremely positive. We have 86 students participating this inaugural year, and expect that number will deeper understanding of the topics increase in the future. they care about, and they want to apply SuperUROP students engage in a year-long research experience and participate in a course titled “Preparation for Undergraduate Research,” which covers a range of subjects, from selecting projects and research this knowledge in a way that will lead topics in EECS to entrepreneurship and ethics in engineering. -
Giga-Byte Technology Co., Ltd. Unconsolidated Financial Statements and Report of Independent Accountants December 31, 2015 and 2014
GIGA-BYTE TECHNOLOGY CO., LTD. UNCONSOLIDATED FINANCIAL STATEMENTS AND REPORT OF INDEPENDENT ACCOUNTANTS DECEMBER 31, 2015 AND 2014 --------------------------------------------------------------------------------------------------------------- For the convenience of readers and for information purpose only, the auditors’ report and the accompanying financial statements have been translated into English from the original Chinese version prepared and used in the Republic of China. In the event of any discrepancy between the English version and the original Chinese version or any differences in the interpretation of the two versions, the Chinese-language auditors’ report and financial statements shall prevail. ~1~ GIGA-BYTE TECHNOLOGY CO., LTD. UNCONSOLIDATED FINANCIAL STATEMENTS AND REPORT OF INDEPENDENT ACCOUNTANTS DECEMBER 31, 2015 AND 2014 TABLE OF CONTENTS Pages FRONT COVER 1 TABLE OF CONTENTS 2 REPORT OF INDEPENDENT ACCOUNTANTS 3 ~ 4 UNCONSOLIDATED BALANCE SHEETS 5 ~ 6 UNCONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME 7 UNCONSOLIDATED STATEMENTS OF CHANGES IN SHAREHOLDERS’ EQUITY 8 UNCONSOLIDATED STATEMENTS OF CASH FLOWS 9 ~ 10 NOTES TO UNCONSOLIDATED FINANCIAL STATEMENTS 11 ~ 76 1. HISTORY AND ORGANIZATION 11 2. THE DATE OF AUTHORIZATION FOR ISSUANCE OF THE UNCONSOLIDATED FINANCIAL STATEMENTS AND PROCEDURES FOR AUTHORIZATION 11 3. APPLICATION OF NEW STANDARDS, AMENDMENTS AND INTERPRETATIONS 11 ~ 14 4. SUMMARY OF SIGNIFICANT ACCOUNTING POLICIES 14 ~ 23 5. CRITICAL ACCOUNTING JUDGMENTS, ESTIMATES AND KEY SOURCES OF ASSUMPTION UNCERTAINTY 23 ~ 24 6. DETAILS OF SIGNIFICANT ACCOUNTS 24 ~ 40 7. RELATED PARTY TRANSACTIONS 40 ~ 42 8. PLEDGED ASSETS 42 9. SIGNIFICANT CONTINGENT LIABILITIES AND UNRECOGNISED CONTRACT COMMITMENTS 42 10. SIGNIFICANT DISASTER LOSS 42 11. SIGNIFICANT EVENTS AFTER THE BALANCE SHEET DATE 42 ~2~ Pages 12. OTHERS 43 ~ 50 13. SUPPLEMENTARY DISCLOSURES 50 ~ 62 14. -
Independent Accountants' Review Report
(English Translation of Financial Report Originally Issued In Chinese) QUANTA COMPUTER INC. FINANCIAL STATEMENTS JUNE 30, 2012 AND 2011 (WITH INDEPENDENT AUDITORS’ REPORT THEREON) Address: No. 188 Wen Hwa 2nd Rd., Kuei Shan Hsiang , Tao Yuan Shien, Taiwan Telephone: 886-3-327-2345 - 1 - WorldReginfo - ff7f59af-5a34-4c96-b8cd-29c8690ed675 TABLE OF CONTENTS Contents Page Cover Page 1 Table of Contents 2 Independent Auditor’s Report 3 Balance Sheets 4 Statements of Income 5 Statements of Changes in Stockholders’ Equity 6 Statements of Cash Flows 7 Notes to Financial Statements 8-48 - 2 - WorldReginfo - ff7f59af-5a34-4c96-b8cd-29c8690ed675 (English Translation of Financial Report Originally Issued In Chinese) Independent Auditors’ Report To the Board of Directors and Shareholders of Quanta Computer Inc.: We have audited the accompanying balance sheets of Quanta Computer Inc. (the Company) as of June 30, 2012 and 2011, and the related statements of income, changes in stockholders’ equity, and cash flows for the six months then ended. These financial statements are the responsibility of the Company’s management. Our responsibility is to express an opinion on these financial statements based on our audits. Except as described in the following paragraph, we conducted our audits in accordance with “Rules Governing Auditing and Certification of Financial Statements by Certified Public Accountants” and auditing standards generally accepted in the Republic of China. Those regulations and standards require that we plan and perform the audit to obtain reasonable assurance about whether the financial statements are free of material misstatement. An audit includes examining, on a test basis, evidence supporting the amounts and disclosures in the financial statements. -
G262-ZR0 HPC Server - 2U DP SXM4 A100 4-GPU Features
G262-ZR0 HPC Server - 2U DP SXM4 A100 4-GPU Features • Hardware-level root of trust support • Supports NVIDIA HGX™ A100 with 4 x SXM4 GPU • Supports NVIDIA® NVLink® and NVSwitch™ technology • Up to 600GB/s GPU to GPU interconnection • Dual AMD EPYC™ 7003 Series processors • 8-Channel RDIMM/LRDIMM DDR4, 16 x DIMMs • 2 x 1Gb/s LAN ports (Intel® I350-AM2) • 1 x dedicated management port • 4 x 2.5" Gen4 U.2 NVMe/ SATA hot-swap HDD/SSD bays • Ultra-Fast M.2 with PCIe Gen4 x4 interface • 6 x Low profile Gen4 x16 expansion slots • 1 x OCP 3.0 Gen4 x16 mezzanine slot • 3000W 80 PLUS Platinum redundant power supply Specification Dimensions 2U (W448 x H86.8 x D800 mm) Backplane I/O 4 x 2.5" NVMe/ SATA hybrid ports Speed and bandwidth: PCIe Gen4 or SATA 6Gb/s Motherboard MZ62-HD5 Rev. 3.0 TPM 1 x TPM header with SPI interface CPU AMD EPYC™ 7003 Series processors Optional TPM2.0 kit: CTM010 Dual processors, 7nm technology, cTDP up to 280W Up to 64-core, 128 threads per processor Power Supply Dual 3000W 80 PLUS Platinum redundant power supply Compatible with AMD EPYC™ 7002 Series processors AC Input: 100-240V Chipset System on Chip System Aspeed® AST2500 management controller Management GIGABYTE Management Console (AMI MegaRAC SP-X) Memory 8-Channel DDR4 memory, 16 x DIMM slots RDIMM/LRDIMM modules up to 128GB supported OS Windows Server 2016 / 2019 3DS RDIMM/LRDIMM modules up to 256GB supported Compatibility RHEL 8.3 (x64) or later Memory speed: Up to 3200/ 2933 MHz SLES 12 SP5 (x64) / 15 SP2 (x64) or later Ubuntu 18.04.5 LTS (x64) / 20.04 LTS (x64) -
Certain Graphics Processors and Products Containing the Same
UNITED STATES INTERNATIONAL TRADE COMMISSION Washington, DC NOTICE OF RECEIPT OF COMPLAINT; SOLICITATION OF COMMENTS RELATING TO THE PUBLIC INTEREST AGENCY: U.S. International Trade Commission. ACTION: Notice. SUMMARY: Notice is hereby given that the U.S. International Trade Commission has received a complaint entitled Certain Graphics Processors and Products Containing the Same, DN 3285; the Commission is soliciting comments on any public interest issues raised by the complaint or complainant’s filing pursuant to the Commission’s Rules of Practice and Procedure. FOR FURTHER INFORMATION CONTACT: Lisa R. Barton, Secretary to the Commission, U.S. International Trade Commission, 500 E Street S.W., Washington, D.C. 20436, telephone (202) 205-2000. The public version of the complaint can be accessed on the Commission's Electronic Document Information System (EDIS) at https://edis.usitc.gov, and will be available for inspection during official business hours (8:45 a.m. to 5:15 p.m.) in the Office of the Secretary, U.S. International Trade Commission, 500 E Street, S.W., Washington, D.C. 20436, telephone (202) 205-2000. General information concerning the Commission may also be obtained by accessing its Internet server at United States International Trade Commission (USITC) at https://www.usitc.gov . The public record for this investigation may be viewed on the Commission's Electronic Document Information System (EDIS) at https://edis.usitc.gov. Hearing-impaired persons are advised that information on this matter can be obtained by contacting the Commission's TDD terminal on (202) 205-1810. SUPPLEMENTARY INFORMATION: The Commission has received a complaint and a submission pursuant to § 210.8(b) of the Commission’s Rules of Practice and Procedure filed on behalf of ZiiLabs Inc., Ltd. -
IBIS Open Forum Minutes
IBIS Open Forum Minutes Meeting Date: November 20, 2014 Meeting Location: Yokohama, Japan VOTING MEMBERS AND 2014 PARTICIPANTS Altera David Banas, Kundan Chand, Hsinho Wu ANSYS Lan Chen, Minggang Hou, Jianbo Liu, Peng Wang Shulong Wu, Guoli Yin, Jizhi Zhao, Tommy Chien Elly Dong, Milkman Hsuan, Winny Huang Stanley Hangwei Kuo, James Wang Jean Yacchin Wang, Jerry Wang, Benson Peishen Wei Jack Wu, Tinghao Yeh, Tohru Watanabe*, Shigeru Sano* Applied Simulation Technology Fred Balistreri, Norio Matsui Cadence Design Systems Ambrish Varma, Brad Brim, Joy Li, Kumar Keshavan Ken Willis, Yingxin Sun, Joshua Luo, John Phillips Aileen Chen, Lanbing Chen, Zhiyu Guo, Jinsong Hu Rachel Li, Lavia Liu, Ping Liu, Yubao Meng Feng Miao, Zuli Qin, Haisan Wang, Hui Wang Yitong Wen, Clark Wu, Benny Yan Rong Zhang, Wenjian Zhang, Alex Zhao Zhangmin Zhong, Kent Ho, Thunder Lay, Skipper Liang Paddy Wu, Candy Yu, Ian Yu, Ikuo Masuko* Morihiro Nakazato* Ericsson Anders Ekholm*, Zilwan Mahmod*, Feng Shi Wenyan Xei Huawei Technologies Jinjun Li, Xiaoqing Dong, Zanglin Yuan, Han Li Haiping Cao, Yu Chen, Peng Huang, Hongxing Jiang Xueping Jiao, Aojie Li, Xusheng Liu, Zipeng Luo Longfang Lv, Luya Ma, Xiao Peng, Wenju Sheng Jianhua Wang, Shengli Wang, Huichao Weng Zhengrong Xu, Gezi Zhang, Zhenyi Zhu Infineon Technologies AG (Christian Sporrer) Intel Corporation Michael Mirmak, Jon Powell, Riaz Naseer Udy Shrivastava, Mustafa Yousuf, Jimmy Jackson Pietro Brenner, Todd Bermensolo, Denis Chen Jimmy Hsu, Cucumber Lin, Jeff Loyer, Thomas Su IO Methodology Lance Wang*, Michelle