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Fatigue Mechanisms in Al-Based Metallizations in Power Mosfets Roberta Ruffilli

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Fatigue Mechanisms in Al-Based Metallizations in Power Mosfets Roberta Ruffilli Fatigue mechanisms in Al-based metallizations in power MOSFETs Roberta Ruffilli To cite this version: Roberta Ruffilli. Fatigue mechanisms in Al-based metallizations in power MOSFETs. Material chem- istry. Université Paul Sabatier - Toulouse III, 2017. English. NNT : 2017TOU30256. tel-01666437v3 HAL Id: tel-01666437 https://tel.archives-ouvertes.fr/tel-01666437v3 Submitted on 23 Nov 2018 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. THTHESEESE`` En vue de l’obtention du DOCTORAT DE L’UNIVERSITE´ DE TOULOUSE D´elivr´e par : l’Universit´eToulouse 3 Paul Sabatier (UT3 Paul Sabatier) Pr´esent´ee et soutenue le 08/12/2017 par : Roberta RUFFILLI Modes de fatigue des m´etallisations `abase d’aluminium dans les composants MOSFET de puissance Fatigue mechanisms in Al-based metallizations in power MOSFETs JURY Mauro CIAPPA ETH, Zurich Rapporteur Josef LUTZ TU, Chemnitz Rapporteur Marie-Laure LOCATELLI Laboratoire LAPLACE, Toulouse Membre du Jury Michael NELHIEBEL K.A.I - Infineon, Villach Membre du Jury Stephane´ LEFEBVRE SATIE - ENS, Cachan Membre du Jury Mounira BERKANI SATIE - ENS, Cachan Directrice de Th`ese Marc LEGROS CEMES - CNRS, Toulouse Directeur de Th`ese Ecole´ doctorale et sp´ecialit´e: SDM : Physique de la mati`ere - CO090 Unit´edeRecherche: Centre d’Elaboration´ de Mat´eriauxet d’Etudes´ Structurales (CEMES-CNRS, UPR 8011) ABSTRACT This thesis, a collaboration between CEMES-CNRS, Satie laboratory (ENS Cachan) and NXP Semiconductors is motivated by the comprehension of the failure mechanisms of low voltage power MOSFET devices produced for ap- plications in the automotive industry. A limiting factor for the long-term reliability of power modules is the electro- thermal and/or thermo-mechanical aging of the metallic parts of the source: Al metallization and bonding wires. At the temperature reached during the on-off operating cycles (few hundred degrees), the difference in the coefficient of thermal expansion between the metallization and the oxide and semicon- ductor parts induces an inevitable plastic deformation in the metal, which is the softest material in the complex MOSFET architecture. We have characterized the metal microstructure before and after accelerated electro-thermal aging tests, by using specific techniques from the field of the physical metallurgy: electron and ion microscopy, grain orientation and chem- ical composition mapping. For the first time the source metallization has been characterized both away and under the bonding connections, which are one hundred times thicker than the metallization layer. The latter is a critical loca- tion for the reliability assessment because the ultrasonic bonding process may weaken the initial metallization microstructure by adding an important plas- tic deformation prior to aging. This is, however, poorly stated in the literature because of the difficulty to access the metallization under the wires without damaging their bonding, which is known to be particularly weak in case of aged modules. In order to investigate the wire-metallization interface, we have set up origi- nal sample preparations, based on ion polishing, that allowed us to disclose the metallization under the bonding wires without introducing preparation artifacts in the microstructure. The bonding process induces a severe and non- uniform plastic deformation in the metallization under the wires without re- creating a good electrical contact: small cavities and native oxide residues, have been systematically observed at the Al/Al interface, in all the analyzed mod- ules, before and after aging. The main mechanism behind the device failure is the generation and propa- gation of fatigue cracks in the aluminum metallization, associated to a local Al oxidation that prevents these crack from closing. Away and under the wire bonds, they run perpendicularly from the surface down to the silicon substrate following the grain boundaries, due to an enhanced intergranular diffusion of iii aluminum atoms. In the bonding area, the phenomenon of parallel cracking is favored by the initial imperfections in the wire-metallization bonding. Ion to- mography experiments have shown that these cracks are confined to the wire- metal interface and do not propagate in the wire despite its lower strength (pure Al, larger grain structure). Crack propagation along the Al/Al interface can cause a contact reduction between the wire and the source metallization and eventually its failure. Such discontinuities in the metal can explain the lo- cal increase in the device resistance and temperature that accelerates the aging process until failure. This study settled new, dedicated techniques and quantification methods to as- sess the aging of the metal parts of MOSFET devices. The full characterization of the intrinsically defective interface generated by the bonding process and the metallization degradation during electro-thermal aging indicated paths to possible improvements of current technologies and potential developments of new processes. iv RESUMÉ Cette thèse, effectuée en collaboration entre le CEMES-CNRS, le laboratoire Satie (ENS Cachan) et NXP Semiconductors est motivée par la compréhension des mécanismes de défaillance des dispositifs MOSFET pour les applications dans l’industrie automobile. Un facteur limitant de la fiabilité à long terme des modules de puissance basse tension est le vieillissement électrothermique et/ou thermo-mécanique des par- ties métalliques de la source: métallisation en aluminium (ou alliage) et fils de connexion. A cause de la différence de coefficient de dilatation thermique en- tre la métallisation les oxydes et le substrat semi-conducteur, la température atteinte pendant les cycles de fonctionnement (quelques centaines de degrés), induit une déformation plastique inévitable dans le métal, qui est le matériau le plus mou dans l’architecture complexe du MOSFET. Nous avons caractérisé la microstructure métallique avant et après les tests de vieillissement électrothermique accélérés, en utilisant des techniques spéci- fiques du domaine de la métallurgie physique: microscopie électronique et ion- ique, cartographie d’orientation de grains et de la composition chimique. Pour la première fois, la métallisation de la source a été caractérisée sous les fils de connexion, qui sont cent fois plus épais que la métallisation. Cet emplace- ment est critique pour la fiabilité du composant, car le processus de soudure par ultrasons induit une déformation plastique importante qui peut affaiblir la métallisation initiale avant le vieillissement. Ceci est peu étudié dans la lit- térature en raison de la difficulté à accéder à la métallisation sous les fils sans altérer leur interface, souvent endommagée et fragilisée dans les modules vieil- lis. Nous avons mis en place des méthodes de préparation d’échantillon, basées sur le polissage ionique, pour étudier cette interface, sans introduire d’artefacts de préparation. Le processus de soudure à froid induit une déformation plas- tique sévère et non uniforme dans la métallisation sous les fils sans parvenir à recréer un bon contact électrique: de petites cavités et des résidus d’oxyde natif, ont été systématiquement observés à l’interface Al / Al, dans tous les modules analysés, avant et après vieillissement. Le mécanisme principal de défaillance des modules est la génération et la propagation de fissures de fatigue dans l’aluminium, associée à une oxydation locale qui empêche la fermeture de ces fissures. Sous et en dehors des fils de connexion, ces fissures traversent la métallisation perpendiculairement à la surface jusqu’au substrat en silicium en suivant les joints de grains. Cette fissur- v ation est due à la diffusion intergranulaire accélérée des atomes d’aluminium. Dans la zone de soudure, le phénomène de fissuration parallèle à l’interface est favorisé par les imperfections initiales (cavités, oxyde). Les expériences de tomographie ionique ont montré que ces fissures sont confinées à l’interface fil-métal et ne se propagent pas dans le fil malgré sa plus faible résistance mé- canique (Al pur, structure à grains plus grands). La propagation de la fissure le long de l’interface Al/Al peut provoquer une diminution du contact entre le fil et la métallisation de la source et éventuellement son décollement. Les fissures dans le métal source peuvent expliquer l’augmentation locale de la résistance et de la température du module qui accélère le processus de vieil- lissement jusqu’à l’échec. Cette étude a établi de nouvelles techniques dédiées et des méthodes de quan- tification pour évaluer le vieillissement des parties métalliques des modules MOSFET. La caractérisation complète de l’interface soudée, intrinsèquement défectueuse et la dégradation de la métallisation pendant le vieillissement électrothermique ouvrent la voie à l’amélioration possible les technologies actuelles et au développement potentiel de nouveaux procédés. vi ACKNOWLEDGEMENTS I had the chance to do my phd at the CEMES laboratory and NXP Semicon- ductors thanks to an e-mail sent by Andrea Falqui, the head of the laboratory where I worked in Italy, to the former director of the CEMES, Alain Claverie. I have to thank Andrea to have supported my desire to progress, and Alain Claverie to put me in contact with my PhD supervisor, Marc Legros. When I moved to Toulouse for the first time I only knew all the things I was leaving in Italy, I was scared of my first job experience abroad, I did not speak French...and I had never eaten duck in my life! Despite these (huge!) cultural gaps, it took me really a short time to find my routine in the lab...and day after day with my grains of aluminum, FIB and TEM sessions, time flew and gave me good experiences, satisfaction and new friends.
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