STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS SUBSIDIARIES: WAKEFIELD THERMAL SOLUTIONS INC. LOCKHART INDUSTRIES 33 Bridge Street Paramount, CA 90723-1430 Pelham, NH 03076 Tel: (603) 635-2800 SPECIALTY EXTRUSION Fax: (603) 635-1900 1580 E. Kimberly Avenue www.wakefield.com Fullerton, CA 92634 WAKEFIELD THERMAL SOLUTIONS INC. 27901 Jefferson Avenue ISO 9001:2000 Temecula, CA 92590 and QS 9000 REGISTERED WAKEFIELD THERMAL SOLUTIONS INC. 132 Sykes Road Fall River, MA 02720 LP 2004 Board Level Heat Sinks INTRODUCTION Wakefield Thermal Solutions, Inc. offers a wide range of board level power semiconductor heat sinks for surface mount and thru hole devices, including JEDEC/EIA registered outlines TO-3, TO-218, TO-247, and TO-263 (D2PAK). Also covered are MULTIWATT® and axial lead devices. These products are available in stamped aluminum, and selected stampings are manufactured from copper. A Full line catalog is also available. To receive your copy, please contact your local sales representative, phone our corporate headquarters, email us at
[email protected], or visit us on the web at www.wakefield.com. DON’T FORGET THE ACCESSORIES! Many of the heat sinks in this catalog are designed to attach to the component using Wakefield's SpeedClips™, clips integral to the heat sink, or threaded fasteners from other suppliers. Check the individual product descriptions for the appropriate mounting method. Wakefield Thermal Solutions, Inc. thermal interface materials such as DeltaBOND™, DeltaPAD™, and 120/126 Series thermal joint compounds are designed to facilitate installation and improve thermal performance. Check the full line catalog or web site for more information.