Industrial Plasma Engineering. Vol. 2, Applications to Nonthermal Plasma
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Industrial Plasma Engineering Volume 2: Applications to Nonthermal Plasma Processing This page intentionally left blank Industrial Plasma Engineering Volume 2: Applications to Nonthermal Plasma Processing J Reece Roth Department of Electrical and Computer Engineering University of Tennessee, Knoxville Institute of Physics Publishing Bristol and Philadelphia c IOP Publishing Ltd 2001 All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted in any form or by any means, electronic, mechanical, photocopying, recording or otherwise, without the prior permission of the publisher. Multiple copying is permitted in accordance with the terms of licences issued by the Copyright Licensing Agency under the terms of its agreement with the Committee of Vice-Chancellors and Principals. British Library Cataloguing-in-Publication Data A catalogue record for this book is available from the British Library. ISBN 0 7503 0544 4 hardback 0 7503 0545 2 paperback Library of Congress Cataloging-in-Publication Data are available Commissioning Editor: John Navas Production Editor: Simon Laurenson Production Control: Sarah Plenty Cover Design: Victoria Le Billon Published by Institute of Physics Publishing, wholly owned by The Institute of Physics, London Institute of Physics Publishing, Dirac House, Temple Back, Bristol BS1 6BE, UK US Office: Institute of Physics Publishing, The Public Ledger Building, Suite 1035, 150 South Independence Mall West, Philadelphia, PA 19106, USA Typeset in the UK by Text 2 Text, Torquay, Devon Printed in the UK by MPG Books Ltd, Bodmin, Cornwall Contents Contents, Volume 1: Principles viii Preface to Volume 2 ix 14 Surface Interactions in Plasma Processing 1 14.1 Industrial Plasma Processing 1 14.2 Plasma Active Species 6 14.3 Heterogeneous Interactions with Surfaces 9 14.4 Secondary Electron Emission 15 14.5 Sputtering 17 14.6 Ion Implantation in Solids 31 References 35 15 Atmospheric Pressure Plasma Sources 37 15.1 Characteristics of Industrial Plasma Sources 38 15.2 Atmospheric Pressure Corona Sources 46 15.3 Atmospheric Dielectric Barrier Discharges (DBDs) 50 15.4 The One Atmosphere Uniform Glow Discharge Plasma (OAUGDP) 55 15.5 Arcjet Plasma Sources 65 15.6 Inductively Coupled Plasma Torches 69 References 72 16 Vacuum Plasma Sources 74 16.1 Intermediate-Pressure Plasma Sources 74 16.2 Low-Pressure Plasma Sources 93 16.3 High-Vacuum Plasma Sources 108 16.4 Summary of Plasma Source Parameters 109 References 110 17 Plasma Reactors for Plasma Processing 113 17.1 Plasma Reactors for Surface Treatment 115 17.2 Plasma Reactors for Ion Implantation 139 17.3 Reactors for Ion-Beam-Induced Sputter Deposition 146 vi CONTENTS 17.4 Plasma/Cathode Sputter Deposition Reactors 157 17.5 Reactors for Plasma Chemical Vapor Deposition 167 17.6 Plasma Etching Reactors 179 References 193 18 Specialized Techniques and Devices for Plasma Processing 196 18.1 Vacuum System Operation 196 18.2 Workpiece Current Collection 200 18.3 Remote Exposure Configurations 205 18.4 Motional Averaging to Achieve Uniformity of Effect 211 18.5 Gas Flow Distribution 219 18.6 Electrohydrodynamic (EHD) Flow Control 225 References 239 19 Parametric Plasma Effects On Plasma Processing 240 19.1 The Role of the Plasma 240 19.2 Kinetic Parameters of Plasma Processing 243 19.3 RF Power Coupling 249 19.4 Sheath Thickness Above Workpiece 255 19.5 RF Sheath Phenomenology 263 19.6 Formation of Active Species 271 19.7 The Effect of Electron Magnetization on Active-Species Concentration 277 References 283 20 Diagnostics for Plasma Processing 284 20.1 Experimental Parameters 284 20.2 Gas-Phase Process Monitoring 286 20.3 Plasma Diagnostics 295 20.4 Measurement of Surface Topography 313 20.5 Measurement of Surface Composition 315 20.6 Surface Energy Related Diagnostics 318 20.7 Measurement of Electrical Properties 325 20.8 In Situ Process Monitoring 328 20.9 Endpoint Detection 332 References 333 21 Plasma Treatment of Surfaces 335 21.1 Objectives of Plasma Surface Treatment 335 21.2 Passive Plasma Cleaning 341 21.3 Active Plasma Cleaning 352 21.4 Plasma Sterilization 360 21.5 Treatment of Thin Films 369 21.6 Treatment of Polymeric or Organic Solids 376 21.7 Treatment of Fabrics and Fibers 383 References 396 CONTENTS vii 22 Surface Modification by Implantation and Diffusion 399 22.1 Ion Implantation Technology 399 22.2 Ion Implantation Dose and Depth Profiles 403 22.3 Ion-Beam Implantation 411 22.4 Plasma Ion Implantation 421 22.5 Low-Energy Plasma Thermal Diffusion Treatment 443 References 448 23 Thin-Film Deposition by Evaporative Condensation and Sputtering 451 23.1 Applications of Thin Films 451 23.2 Thin-Film Characteristics 461 23.3 Deposition by Evaporative Condensation 471 23.4 Ion-Beam Sputter Deposition 477 23.5 Plasma-Assisted Ion-Beam Sputter Deposition 490 23.6 Plasma/Cathode Sputter Deposition 495 23.7 Quality Issues in Sputter Deposition 499 References 500 24 Plasma Chemical Vapor Deposition (PCVD) 502 24.1 Thin-Film Deposition by PCVD 502 24.2 Physical and Chemical Processes in PCVD Glow Discharges 510 24.3 Characteristics of Polymeric Thin Films Formed by PCVD 517 24.4 Glow Discharge Polymerization 528 24.5 Glow Discharge Reactors for PCVD 531 24.6 Summary of Deposition Reactor Plasma Parameters 537 References 538 25 Plasma Etching 540 25.1 Survey of Plasma Etching 540 25.2 Pattern Transfer by Plasma-Related Etching 551 25.3 Control Variables for Plasma Etching 573 25.4 The Chemistry of Plasma Etching 578 25.5 Plasma Etching of Microelectronic Materials 597 25.6 Technical Issues in Plasma Etching 605 References 612 Appendices 614 A Nomenclature 614 B Physical Constants 623 C Units and Conversion Factors 624 D Useful Formulae 626 Index 628 Contents Volume 1: Principles 1 Introduction 1 2 Kinetic Theory of Gases 34 3 Motion of Charges in Electric and Magnetic Fields 54 4 Characteristics of Plasma 117 5 Electron Sources and Beams 159 6 Ion Sources and Beams 189 7 Ionizing Radiation Sources 223 8 Dark Electrical Discharges in Gases 237 9 DC Electrical Glow Discharges in Gases 283 10 DC Electrical Arc Discharges in Gases 352 11 Inductive RF Electrical Discharges in Gases 391 12 Capacitive RF Electrical Discharges in Gases 417 13 Microwave Electrical Discharges in Gases 464 Appendices 516 Preface to Volume 2 Volume 1 of this three-volume work is intended to provide a background in the principles of low temperature, partially ionized Lorentzian plasmas that are used industrially. Volumes 2 and 3 are intended to provide a description of plasma-related processes and devices that are of actual or potential commercial importance. The text assumes that the average student or practicing engineer has not recently taken a course in plasma physics, and possesses a background in physics and calculus that ended at the sophomore level. These three volumes are intended to be used as textbooks at the senior or first-year graduate level by students from all engineering and physical science disciplines, and as a reference source by practicing engineers. Use of this second volume as a textbook or reference source assumes that the reader is familiar with the material in Volume 1, or has an equivalent background in low-temperature Lorentzian plasma physics. An introduction to plasma physics and the physical processes important in industrial plasmas is contained in the first four chapters of Volume 1. Chapters 5 through 7 of Volume 1 describe the sources of ion and electron beams and ionizing radiation that are used industrially. Chapters 8 through 10 of Volume 1 describe the physics and technology of DC electrical discharges, and chapters 11 through 13 describe the physics and technology of RF plasma sources. In this second volume, chapter 14 is devoted to some aspects of materials science that are basic to plasma-processing applications. Chapters 15 and 16 are, respectively, devoted to atmospheric and vacuum plasma sources, chapter 17 to the plasma reactors (or plasma ‘tools’) frequently used industrially, and chapter 18 to specialized methods and devices used in these reactors. Chapter 19 is devoted to the effects of plasma-related parameters on the outcomes of plasma processing. Chapter 20 covers the most frequently used diagnostic methods to measure the independent input variables, the plasma parameters, and the results of plasma processing. Chapters 21 through 25 cover industrial applications categorized as non-thermal plasma processing of materials. Volume 3 will cover thermal plasma processing and plasma devices. ix x PREFACE TO VOLUME 2 Chapters in this volume will cover the melting and refining of bulk materials; subsonic and supersonic plasma aerodynamics; the use of plasmas for synthetic and destructive plasma chemistry; electrical sparking, switchgear, and coronas, all important to the electric utilities; plasma lighting devices; the applications of electrohydrodynamics to electrostatic precipitation and paint spraying; and research and development plasmas with potential for industrial applications. This second volume is not intended to be self-contained. Frequent reference is made to equations, derivations, and data discussed in Volume 1. This volume does not contain derivations from first principles of some advanced material from plasma physics or materials science. Such background can be found in other sources listed among the references at the end of the individual chapters, or in the annotated bibliography that will be included at the end of Volume 3. SI units have been used throughout the text except where conventional usage (e.g., electronvolt, Torr) has become so firmly established that non-SI units are more appropriate. Available technical dictionaries in the fields of physics, chemistry, and electrotechnology generally have an inadequate coverage of the terminology required to discuss the subject of industrial plasma engineering. In an attempt to deal with this problem and increase the value of this book as a reference source, the technical terminology, jargon, and acronyms used in the field of industrial plasma engineering are not only defined and fully discussed, but also italicized and indexed when they first appear in the text.