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1. Outline of Submarine Cable Systems
NEC’s Submarine Cable System December 5, 2008 NEC Corporation Broadband Network Operations Unit Executive General Manager Masamichi Imai 1. Outline of Submarine Cable Systems 2 © NEC Corporation 2008 1-1. The History of Submarine Cables 1850:First Telegraph cable at Dover Strait 1858:First Trans-Atlantic Telegraph Cable (1876:Graham Bell invents the Telephone) 1906: Submarine Cable Tokyo-Guam 1956:First Trans-Atlantic Coaxial Cable (1963: Satellite Communications between Japan and US begins) 1964:First Trans-Pacific Coaxial Cable 1988:First Trans-Oceanic Optical Cable(1 Gb/s) 1999:Trans-Oceanic Optical Cable (640 Gb/s) 2001:Trans-Oceanic Optical Cable (1.28~Tb/s) 3 1-2. Summary of Submarine Cable Systems Station A Station B ・Burial up to sea depth of 1500m Max. Sea Depth 8,000m ・Avg 1m-3m burial (Max.15m) (at 8000m below sea level, water pressure is equivalent to holding a car on one’s thumb.) = Repeater Placed at 40Km~100km intervals ←Cables are laid in deep trenches Max. Transmission Distance 12,000~13,000km Japan to US West Coast is approx. 8,000km At least 80~100 repeaters are required. 4 1-3. Components of a Submarine Cable System Dry Side Wet Side Submarine Repeater Line Terminal Equipment Submarine Cables (inc.. fiber.) Power Feeding Equipment Supervisory System Network Protection Equipment Overall System Monitoring (SDH system) Repeater Performance Monitoring Installation Cableship 5 1-4. Technical Trends CoaxialCoaxial FiberFiber OpticsOptics Optical 40G DWDM Amplifier 10G DWDM System 2.5G DWDM 5G Single Optical Regenerator System 1.3 / 1.55 μm Coaxial Repeater System 1970 1980 1990 2000 NowNow 6 1-5. -
Leading Optical Device Manufacturers Release Common Specifications for 40 Gbit/S Solutions Based on XLMD Optical Device Multi-Source Agreement
Leading Optical Device Manufacturers Release Common Specifications for 40 Gbit/s Solutions Based on XLMD Optical Device Multi-Source Agreement Multi-Source Agreement Enables Multiple Vendors to Produce 40 Gbit/s Optical Devices Based on a Unified Standard TOKYO, JAPAN & SAN DIEGO, CA: February 21, 2008 – Eudyna Devices Inc., Mitsubishi Electric Corp., NEC Electronics Corp., Oki Electric Industry Co., Ltd., Opnext Inc. and Sumitomo Electric Industries, Ltd., today announced, in advance of OFC/NFOEC, common specifications for pigtail type optical devices based on the 40 Gbit/s Optical Device Multi-Source Agreement (XLMD-MSA*1), introduced by the six companies in March 2007. The newly available XLMD-MSA specifications detail the external-modulation laser transmitter devices with built-in driver ICs and the PIN-TIA*2 receiver devices that comply with 40 Gbit/s interface standard for SONET OC-768*3. 10 Gbit/s optical transmission interfaces are widely deployed in Metropolitan Area Networks (MAN), Local Area Networks (LAN) and Storage Area Networks (SAN). These networks currently form the backbone of broadband infrastructure, consequently increasing the popularity of 40 Gbit/s optical transmission interfaces. The XLMD-MSA aims to establish compatible sources of 40 Gbit/s optical transmitter and receiver devices embedded into the 40 Gbit/s optical transceiver modules. This agreement will accelerate the growth of the 40 Gbit/s transceiver module market, providing advanced solutions to high capacity network and storage systems. All members will promote the MSA-compliant products in order to achieve consistent customer delivery and market growth. The XLMD-MSA specifications for compatible optical devices include: Mechanical dimensions and pin assignments of pigtail type optical devices High speed electrical interface using a dual SMPM*4 connectors Optical and electrical characteristics The specifications are now available at the XLMD-MSA web site. -
CORPORATE DIRECTORY (As of June 28, 2000)
CORPORATE DIRECTORY (as of June 28, 2000) JAPAN TOKYO ELECTRON KYUSHU LIMITED TOKYO ELECTRON FE LIMITED Saga Plant 30-7 Sumiyoshi-cho 2-chome TOKYO ELECTRON LIMITED 1375-41 Nishi-Shinmachi Fuchu City, Tokyo 183-8705 World Headquarters Tosu City, Saga 841-0074 Tel: 042-333-8411 TBS Broadcast Center Tel: 0942-81-1800 District Offices 3-6 Akasaka 5-chome, Minato-ku, Tokyo 107-8481 Kumamoto Plant Osaka, Kumamoto, Iwate, Tsuruoka, Sendai, Tel: 03-5561-7000 2655 Tsukure, Kikuyo-machi Aizuwakamatsu, Takasaki, Mito, Nirasaki, Toyama, Fax: 03-5561-7400 Kikuchi-gun, Kumamoto 869-1197 Kuwana, Fukuyama, Higashi-Hiroshima, Saijo, Oita, URL: http://www.tel.co.jp/tel-e/ Tel: 096-292-3111 Nagasaki, Kikuyo, Kagoshima Regional Offices Ozu Plant Fuchu Technology Center, Osaka Branch Office, 272-4 Takaono, Ozu-machi TOKYO ELECTRON DEVICE LIMITED Kyushu Branch Office, Tohoku Regional Office, Kikuchi-gun, Kumamoto 869-1232 1 Higashikata-cho, Tsuzuki-ku Yamanashi Regional Office, Central Research Tel: 096-292-1600 Yokohama City, Kanagawa 224-0045 Laboratory/Process Technology Center Koshi Plant Tel: 045-474-7000 Sales Offices 1-1 Fukuhara, Koshi-machi Sales Offices Sendai, Nagoya Kikuchi-gun, Kumamoto 861-1116 Utsunomiya, Mito, Kumagaya, Kanda, Tachikawa, Tel: 096-349-5500 Yamanashi, Matsumoto, Nagoya, Osaka, Fukuoka TOKYO ELECTRON TOHOKU LIMITED Tohoku Plant TOKYO ELECTRON MIYAGI LIMITED TOKYO ELECTRON LEASING CO., LTD. 52 Matsunagane, Iwayado 1-1 Nekohazama, Nemawari, Matsushima-machi 30-7 Sumiyoshi-cho 2-chome Esashi City, Iwate 023-1101 Miyagi-gun, Miyagi -
INVESTORS GUIDE 2019 Osaka Office to Our Shareholders and Investors Fukuoka Sales Office Shinjuku Office Shinjuku Support Center Tachikawa Sales Office
TOKYO ELECTRON DEVICE LIMITED Securities code: 2760 Business Locations (As of July 1, 2019) Business Location Domestic Subsidiary Omiya Sales Office Matsumoto Sales Office Sendai Sales Office Tsukuba Sales Office Iwaki Sales Office Nagoya Sales Office Mito Sales Office Kyoto Sales Office INVESTORS GUIDE 2019 Osaka Office To Our Shareholders and Investors Fukuoka Sales Office Shinjuku Office Shinjuku Support Center Tachikawa Sales Office Engineering Center Headquarters (Yokohama) FAST CORPORATION (Yamato-city, Kanagawa prefecture) TOKYO ELECTRON DEVICE Mishima Sales Office NAGASAKI LTD. Hamamatsu Sales Office (Isahaya-city, Nagasaki prefecture) Business/Marketing location Overseas Design and development location Dalian Yokohama Ottawa Seoul Silicon Valley Shanghai Taipei Shenzhen Bangkok Wuxi Hong Kong Singapore Philippines Note on forward-looking statements This Investors Guide was prepared on July 1, 2019. Forward looking statements, including business strategies and business forecasts, were made by the Company’s management, based on information available at that time, and may be revised due to changes in the business environment. Therefore, please be advised that the Company cannot guarantee the accuracy or the reliability of the statements. For the latest information, please refer to our information releases or our website. Note also that product and service names remain the trademarks of their respective owners. Corporate Communications Dept. https://www.teldevice.co.jp World Headquarters Yokohama East Square, 1-4 Kinko-cho, Kanagawa-ku,Yokohama -
ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan
ISSM2020 –International Symposium on Semiconductor Manufacturing SPONSORSHIP December 15-16, 2020, Tokyo, Japan Shozo Saito Chairman, ISSM2020 Organizing Committee Device & System Platform Development Center Co., Ltd. Shuichi Inoue, ATONARP INC. It is our great pleasure to announce that The 28th annual International Symposium on Semiconductor Manufacturing (ISSM) 2020 will be held on December 15-16, 2020 at KFC Hall, Ryogoku, Tokyo in cooperation with e-Manufacturing & Design Collaboration Symposium (eMDC) which is sponsored by TSIA with support from SEMI and GSA. The program will feature keynote speeches by world leading speakers, timely and highlighted topics and networking sessions focusing on equipment/materials/software/services with suppliers' exhibits. ISSM continues to contribute to the growth of the semiconductor industry through its infrastructure for networking, discussion, and information sharing among the world's professionals. We would like you to cooperate with us by supporting the ISSM 2020. Please see the benefit of ISSM2020 sponsorship. Conference Overview Date: December 15-16, 2020 Location: KFC (Kokusai Fashion Center) Hall 1-6-1 Yokoami Sumidaku, Tokyo 130-0015 Japan +81-3-5610-5810 Co-Sponsored by: IEEE Electron Devices Society Minimal Fab Semiconductor Equipment Association of Japan (SEAJ) Semiconductor Equipment and Materials International (SEMI) Taiwan Semiconductor Industry Association (TSIA) Endorsement by: The Japan Society of Applied Physics Area of Interest: Fab Management Factory Design & Automated Material -
XINT N Japan 225 P JPY Index
As of December 30, 2020 XINT N Japan 225 P JPY Index JPY DE000A13PWP8 The XINT N Japan 225 P JPY Index is a price-weighted average of 225 top-rated Japanese companies listed in the First Section of the Tokyo Stock Exchange. INDEX PERFORMANCE - PRICE RETURN 130 120 110 100 90 80 70 Feb-19 May-19 Aug-19 Nov-19 Feb-20 May-20 Aug-20 Nov-20 Returns (p.a) Standard Deviation (p.a) Maximum Drawdown 3M 96.33% 3M 14.42% From 20.01.2020 6M 51.63% 6M 51.63% To 19.03.2020 1Y 16.01% 1Y 16.01% Return -31.27% Index Intelligence GmbH - Grosser Hirschgraben 15 - 60311 Frankfurt am Main Tel.: +49 69 247 5583 50 - [email protected] www.index-int.com Top 10 Constituents FFMV (JPYm) Weight % Industry Sector Fast Retailing Co Ltd 5 12.13 Retail SoftBank Group Corp 2 6.34 Telecommunications Tokyo Electron Ltd 2 5.04 Technology FANUC Corp 1 3.33 Industrial Goods & Services M3 Inc 1 3.07 Health Care Daikin Industries Ltd 1 3.01 Construction & Materials KDDI Corp 1 2.41 Telecommunications Shin-Etsu Chemical Co Ltd 1 2.37 Chemicals Terumo Corp 1 2.26 Health Care Chugai Pharmaceutical Co Ltd 1 2.17 Health Care Total 16 42.13 This information has been prepared by Index Intelligence GmbH (“IIG”). All information is provided "as is" and IIG makes no express or implied warranties, and expressly disclaims all warranties of merchantability or fitness for a particular purpose or use with respect to any data included herein. -
PUBLIC SUBMISSION Posted: November 20, 2020 Tracking No
Page 1 of 2 As of: 11/23/20 10:03 AM Received: November 18, 2020 Status: Posted PUBLIC SUBMISSION Posted: November 20, 2020 Tracking No. 1k4-9k60-8cjw Comments Due: December 03, 2020 Submission Type: Web Docket: PTO-C-2020-0055 Request for Comments on Discretion to Institute Trials Before the Patent Trial and Appeal Board Comment On: PTO-C-2020-0055-0001 Discretion to Institute Trials Before the Patent Trial and Appeal Board Document: PTO-C-2020-0055-0452 Comment from Japan Business Machine and Information System Industries Association Submitter Information Name: Hideaki Chishima Address: Lila Hijirizaka 7FL 3-4-10, Mita Minato-ku, Tokyo, Japan, 1080073 Email: [email protected] Phone: +81-3-6809-5495 Fax: +81-3-3451-1770 Submitter's Representative: Hideki Sanatake Organization: Japan Business Machine and Information System Industries Association General Comment Dear Sir, This post is for Japan Business Machine and Information System Industries Association (JBMIA) to submit its comments in response to solicitation of public comments by USPTO as announced in Federal Register / Docket No. PTO-C-2020-0055. The comments are attached hereto. JBMIA is a Japanese incorporated association which was renamed in 2002 from Japan Business Machine Makers Association established originally in 1960. JBMIA consists of 40 member companies engaged in business machine and information system and 5 supporting companies. Almost all of the member companies have actively filed patent applications in the USA. https://www.fdms.gov/fdms/getcontent?objectId=0900006484967b2a&format=xml&sho... 11/23/2020 Page 2 of 2 Sincerely, Hideaki Chishima (Mr) Intellectual Property Committee Secretariat Attachments JBMIA Comment (finnal) https://www.fdms.gov/fdms/getcontent?objectId=0900006484967b2a&format=xml&sho.. -
NEC Electronics and Renesas to Integrate Business Operations Establishment of the World’S Third Largest Semiconductor Company
NEC Electronics and Renesas to Integrate Business Operations Establishment of the World’s Third Largest Semiconductor Company KAWASAKI, Japan, TOKYO, Japan, April 27, 2009 -- NEC Electronics Corporation (NEC Electronics; TSE: 6723), Renesas Technology Corp. (Renesas), NEC Corporation (NEC; TSE: 6701), Hitachi, Ltd. (Hitachi; TSE: 6501 / NYSE: HIT), and Mitsubishi Electric Corporation (Mitsubishi Electric; TSE: 6503) today agreed to enter into negotiations to integrate business operations at NEC Electronics and Renesas. 1. Background and goals of business integration NEC Electronics was established in 2002, separating from NEC, and Renesas was established in 2003, integrating semiconductor units at Hitachi and Mitsubishi Electric. Both as leading semiconductor companies, NEC Electronics and Renesas provide a wide variety of semiconductor solutions, primarily specializing in microcontroller units (MCUs). In light of fierce global competition in the semiconductor market, NEC Electronics and Renesas have agreed to explore the possibility of business integration in order to further strengthen their business foundations and technological assets while increasing corporate value through enhanced customer satisfaction. By integrating the world’s two largest MCU suppliers (*1), the new company will provide one of the most competitive MCU product lineups throughout the world. NEC Electronics and Renesas both focus on the fast-growing field of system-on-chip (SoCs) products. NEC Electronics is a leading producer of SoCs for digital consumer electronics, while Renesas is a well established manufacturer of SoCs for mobile phones and automotive applications. By reinforcing the companies’ respective strengths and development resources the new company will provide globally competitive SoC products. In terms of the discrete semiconductor business, both companies will define strategies to enhance the competitiveness of analog and discrete products that generate synergies with MCUs. -
Quick Print Station (ASK-300)
Tentative The Best All-in-one System! You can start a photo business easily with this affordable, all-in-one solution. Small Initial Investment Compact Size Variety of Photo Finishing Formats Small Initial Investment Variety of Photo Finishing Formats All-in-one solution at an affordable price. Standard, ID and template The kiosk includes: ready photo formats available. Printer Photo formatting selection is Order terminal easy for everyone, using the Fujifilm software on-screen step-by-step guide. Compact Size & Easy Maintenance High Quality Prints Increase Shop’s Efficiency Outstanding image quality is realized by matching our This compact system is suitable for any retail environment. Image IntelligenceTM processing technology* with Easy loading of paper and replacing of ink ribbons in less than FUJIFILM Quality Thermal Photo Paper. 3 minutes. Adjustable display angle FUJIFILM Dye-sublimation Compact Kiosk System "Quick Print Station" Specifications Display 10.4 inch Touch Panel Display (800 x 600 pixel) OS: Windows XP Embedded (English) PC Unit CPU: Intel Atom N455 (1.6GHz) Memory: DDR3 SO-DIMM (1GB) HDD: 160GB (SATA) 275 mm Wireless LAN: Option Wireless BlueTooth (IEEE 802.15.1) : Option 445 mm Device (LAN port) Option Optical External Device (CD/DVD) Option (USB Connection) 170 mm PC Dimensions (W x D x H) 275 x 295 x 70-275 mm/10.8 x 11.6 x 2.8-10.8 inch (DPC Portable) Weight (approx.) 3.5 kg/7.7 lb Input media SD Memory Card, MicroSD Card, Memory Stick, 275 mm 446 mm Memory Stick Micro, xD-Picture Card, CompactFlash, USB Flash Memory Power Consumption 100-240V AC50/60 Hz Consumables Lineup Interface USB 2.0 x 4 ports (Type A) Print size Description Number of prints per Box Printing speed (approx) Standard Print 3.5 x 5 inch T RL-CF900 900 prints 11.2 seconds/print ID Photo 4 x 6 inch T RK-CF800 800 prints 12.3 seconds/print Frame photo 5 x 7 inch T R2L-CF460 460 prints 19.0 seconds/print Service & Function Edit (Crop, Rotate) 6 x 8 inch T R68-CF400 400 prints · Not include data transfering time. -
Owner's Manual
Owner’s Manual BL00004970-200 EN Introduction Thank you for your purchase of this product. Be sure that you have read this manual and understood its contents be- fore using the camera. Keep the manual where it will be read by all who use the product. For the Latest Information The latest versions of the manuals are available from: http://fujifilm-dsc.com/en/manual/ The site can be accessed not only from your computer but also from smartphones and tablets. It also contains information on the software license. For information on fi rmware updates, visit: http://www.fujifilm.com/support/digital_cameras/software/ ii P Chapter Index Menu List iv 1 Before You Begin 1 2 First Steps 27 3 Basic Photography and Playback 45 4 Movie Recording and Playback 51 5 Taking Photographs 57 6 The Shooting Menus 101 7 Playback and the Playback Menu 159 8 The Setup Menus 185 9 Shortcuts 221 10 Peripherals and Optional Accessories 233 11 Connections 251 12 Technical Notes 265 iii Menu List Camera menu options are listed below. Shooting Menus Menu List Adjust settings when shooting photos or movies. N See page 101 for details. H IMAGE QUALITY SETTING P G AF/MF SETTING P IMAGE SIZE 102 FOCUS AREA 114 IMAGE QUALITY 103 AF MODE 115 RAW RECORDING 103 AF-C CUSTOM SETTINGS 116 FILM SIMULATION 104 STORE AF MODE BY ORIENTATION 119 1⁄3 1⁄3 B & W ADJ. ab(Warm/Cool) 105 AF POINT DISPLAYyz 119 GRAIN EFFECT 105 NUMBER OF FOCUS POINTS 120 COLOR CHROME EFFECT 105 PRE-AF 120 WHITE BALANCE 106 AF ILLUMINATOR 120 DYNAMIC RANGE 108 FACE/EYE DETECTION SETTING 121 D RANGE PRIORITY -
Technical Bulletin
TECHNICAL BULLETIN [Issue No.] T10-0028E [Page] 1/6 [Title] List of valid devices applicable for GOT900 series [Date of Issue] Oct., '05 [Relevant Models] GOT-A900 series Thank you for your continued support of Mitsubishi Graphic Operation Terminal GOT900 series. The peripheral devices listed in this bulletin have been concluded by Mitsubishi to be applicable for the GOT900 series. Compatible product A product that satisfies the requirements to be interfaced with Mitsubishi products. (Note that satisfaction of Mitsubishi specifications is not guaranteed.) Therefore, make sure to comply with the specifications for that product when using it together with Mitsubishi products. 1. Printers for GOT (compatible product) Cautions y Do not use the ESC/P raster-specific printer for the GOT. y Set hard copy function to "Monochrome" when using the GOT with a monochrome type printer. y When printing Chinese characters, use the printer that supports GB (simplified characters) or BIG5 (traditional) code, and includes the relevant fonts. Please refer to the applicable printer models below: Manufacturer Model LQ-2080C (BIG5-compatible) Seiko Epson Corporation LQ-1600K (GB-compatible) Oki Electric Industry Co., Ltd 5530SC (GB-compatible) Hewlett-Packard Development Company, L.P. HP LaserJet1150, HP LaserJet1300 2. PC cards for GOT "Compact Flash PC card" (compatible product) For GOTs compatible with compact flash PC cards, refer to the technical bulletin T10-0029 "Compatibility with commercially available flash PC cards". (Please note that some GOTs are incompatible with compact flash PC cards.) The GOT flash PC card (A9GTMEM-*MF) is applicable to A985GOT-V, A985GOT, A97*GOT and A960GOT. -
NOTICE of FISCAL YEAR 2018 (The 55Th FY) ANNUAL GENERAL MEETING of SHAREHOLDERS
㻝㻌 World Headquarters 3-1 Akasaka 5-chome, Minato-ku Tokyo 107-6325, Japan ISIN JP3571400005 Tel:+81-3-5561-7000 SEDOL 6895675 TSE 8035 May 28, 2018 NOTICE OF FISCAL YEAR 2018 (the 55th FY) ANNUAL GENERAL MEETING OF SHAREHOLDERS To Our Shareholders: We are pleased to announce that the 55th Annual General Meeting of Shareholders (the “AGM”) of Tokyo Electron Ltd. (“TEL”) will be held on Tuesday, June 19, 2018, at 10:00 a.m. Japan standard time, at PALACE HOTEL TOKYO, located at 1-1 Marunouchi 1-chome, Chiyoda-ku, Tokyo. Shareholders will also be asked to vote upon the following Agenda: 1: Election of Twelve Corporate Directors 2: Payment of Bonuses to Corporate Directors for the 55th Fiscal Year 3: Issuance of Share Subscription Rights as Stock-Based Compensation to Corporate Directors 4: Issuance of Share Subscription Rights as Stock-Based Compensation to Executives of the Company and its Subsidiaries 5: Introduction of a Stock Compensation System as Medium-term Performance-linked Compensation for Corporate Directors of the Company As part of our ongoing effort to improve the quality of communications with our foreign investors and to increase the participation of those investors and to exercise your voting rights at the AGM, Tokyo Electron Ltd. has appointed IR Japan, Inc. as our Global Information Agent in connection with the shareholder meeting. We realize that many shareholders do not vote at Japanese Shareholders Meeting due to the volume of meetings and timing concerns. Therefore, we attach special importance to your vote, and hope that you will continue to distinguish yourselves from many institutions, who, unfortunately, do not participate.