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Mobile RF: Market and Analysis Overview

October 2018 TechInsights has been publishing technology analysis for nearly 30 years, enabling our customers to advance their intellectual TechInsights hasproperty been publishing and product technology strategies. analysis for nearlyOur library 30 years, of reports is the enabling our customers to advance their intellectual property and product world’s largest database of reverse engineering analysis3 of 1strategies. Our library of reports is the2 world’s largest database of reverse engineering analysissemiconductor of semiconductor and andconsumer consumer products products ▪ More than ▪14,00014,000+ technical technical reports available reports for available purchase for purchase ▪ Covering 40▪ yearsCovering of technologies 40 years (1977 of to technology today) (1977 to today) ▪ Generating over 700 new reports each year ▪ Thousands of new devices every year

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▪ Consumer electronics ▪ Memory/Data storage ▪ Software Analysis ▪ Medical devices ▪ Microprocessors/Controllers ▪ Functional Testing ▪ Storage devices ▪ Wireless RF ▪ Product Teardowns & ▪ Automotive electronics ▪ Analog Costing/BOM ▪ Internet of Things ▪ Antennas ▪ Packaging/PCB & ▪ Client-side networking ▪ Power management Structural/Process ▪ Clean-Tech devices ▪ Sensors ▪ Circuit Extraction and Analysis ▪ Optoelectronics ▪ Batteries ▪ Transistor Characterization ▪ Displays ▪ Waveform Analysis ▪ Software/Firmware

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▪ 6200+ instances of Evidence of Use found in 3100+ Unique patents

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IP Landscaping

1. Companies are developing front end modules combining power amplifiers, antenna switches, filters, duplexers, multiplexors and low noise amplifiers to simplify the front end ▪ Reducing power, size and cost is key ▪ Example: Functionality of 80 discrete components delivered through two modules

2. Envelope tracking power supplies ▪ For battery life improvement (LTE and 5G)

3. 5G designs are driving front end innovation ▪ Mobile devices will need to support both LTE and 5G interfaces, making the RF front end very complicated ▪ New air interfaces, and mmWave support require new antennas, switches, tuners, filters, low noise amplifiers, power amplifiers, etc. ▪ MIMO/Carrier aggregation and diversity path support further compounds the RF components required

▪ 5G Background ▪ Higher data rates with lower latency. Low latency is important for transportation, entertainment and manufacturing applications ▪ Fixed-wireless applications will roll out by end of 2018 (Verizon, AT&T) ▪ First 5G-capable phones will appear early 2019. Announcements expected at MWC February 2019. Existing phones cannot support 5G, which requires more power and space.

▪ Example Products ▪ Fixed Wireless routers coming in 2018 from Samsung (Verizon) ▪ Moto Z3 Play, exclusive to Verizon out mid-August. 5G capability added via a “5G Moto Mod” (magnetically attached module) ▪ Other 5G phones expected in 2019: OnePlus7, Huawei Mate30, iPhone (possibly using Intel 5G)

▪ Components ▪ Qualcomm mm-wave antennas available as of July 2018 ▪ Qualcomm Snapdragon X50 mmWave 5G modem ▪ QTM052 mmWave antenna solution ▪ 19 operators and 18 handset makers plan to use the Qualcomm X50 5G Modem in their 5G trials

Source: https://semiengineering.com/foundry-challenges-in-2018/

We estimate mobile RF to be about $19B (21% of the $90B mobile IC market)

Apple A11 AP Proc Apple A11 Apple A11 Qualcomm Qualcomm HiSilicon SDM845 Qualcomm SDM845 Qualcomm Qualcomm Hi6250 (Kirin Qualcomm QualcommM Qualcomm Mediatek MDM9655 MDM9655 MDM9655 659) SDM660 SM8953 MSM8940 Samsung MT6763V Samsung (SD625) Baseband Exynos 9810 Intel Exynos 9810 Intel Intel XMM7480 XMM7480 XMM7480 (PMB9948) PMB9948 PMB9948 Qualcomm Qualcomm Qualcomm Qualcomm Qualcomm WTR5975 SDR845 WTR5975 WTR5975 SDR845 Qualcomm Hi6362 QualcommS Qualcomm Transceiver MT6177W WTR2965 DR660 WTR3925 (?) Intel Samsung Intel Intel Samsung PMB5757 Shannon 965 PMB5757 PMB5757 Shannon 965 USI P215 Qualcomm USI P215 Qualcomm Qualcomm (Qualcomm QET4100 (Qualcomm QET4100 QET4100 Envelope QET4100) QET4100) Unknown unknown unknown Unknown unknown Tracking Qorvo Samsung Samsung Qorvo QM81004 Qorvo Shannon 735 Shannon 735 QM81004 QM81004

▪ Web-based database containing Mobile OEM (55) Semi (38) almost 3 decades of semiconductor Alcatel LG ACP AG Silicon Motion Inc data from teardown analysis Apple Lumigon Airoha Technology Skyworks Asus LYF Apple Sony conducted by TechInsights BBK-Vivo Meitu Avago Spreadtrum ▪ Smartphone Teardowns 2016-2018 BBK-Oppo Meizu Broadcom STMicroelectronics (394 phones) Blackberry Micromax Cavendish Kinetics Tai-Saw Tech. BLU Microsoft Fairchild Taiyo Yuden ▪ 2016: 133 phones Coolpad Motorola HiSilicon TDK-EPC Elephone Nokia HunterSun Texas Instruments ▪ 2017: 175 phones Essential NUU Infineon Toshiba ▪ 2018: 89 phones (as of end of Sept.) Fujitsu OnePlus Intel Unichip GiONDEE Polaroid Kyocera Universal Electronics ▪ 7800 RF components catalogued Google QiKU Marvell Semi. VanChip ▪ Unique Part numbers seen HiSense Razer Maxscend WiPam HTC Samsung MediaTek Wisol ▪ RF Transceiver (50) Huawei Smartron Murata Xiaomi ▪ Baseband/Modem (14) Hyve Sony National Semi. Intex TCL Nationz Tech. ▪ Antenna tuner/Switch (279) Itel uleFone New Japan Radio ▪ Front End Module (98) Karbonn Vernee NXP Semiconductor Kodak Videocon ON Semiconductor ▪ LNA (34) Koobee Vodafone Qorvo ▪ Power Amplifier (242) KVD Wiko Qualcomm LAVA WILEYFOX RDA Micro. ▪ RF Switch (103) LeEco Xiaomi RF Micro Devices ▪ Filters (586) Lenovo ZOPO Rfaxis LePhone ZTE Samsung Letv Shoulder Electronics

▪ Values depict design wins in our library ▪ Broad range of players ▪ Integrated front end modules focused on simplifying architecture and reducing size

Source: Qualcomm Antenna Tuners RF Switch Filters Power Amplifiers LNA Front End Modules and switches Qorvo 453 Qorvo 155 Murata 2344 Skyworks 392 NXP Semiconductor 129 Skyworks 175 Sony 164 Skyworks 77 TDK 751 Qorvo 171 Infineon 117 Murata 23 Skyworks 160 Infineon 66 Taiyo Yuden 718 Broadcom 71 Wisol 55 TDK 22 Murata 153 Murata 62 Wisol 548 Murata 34 Qualcomm 44 Qorvo 20 Infineon 111 Sony 30 Qorvo 167 Airoha Technology 17 Qorvo 9 Broadcom 16 Qualcomm 53 New Japan Radio (JRC) 28 Kyocera 74 VanChip 15 HiSilicon 9 Airoha Technology 8 TDK 27 Maxscend 26 Broadcom 33 Texas Instruments 15 Skyworks 7 Qualcomm 4 Avago 14 Wisol 21 ON Semiconductor 12 Qualcomm 10 TDK 1 VanChip 3 TDK 10 Tai-Saw Samsung 6 7 HunterSun 8 Intel 1 NXP Semiconductor 2 Fairchild 3 Technology Cavendish Kinetics 2 Avago 7 Wisol 2 Qualcomm 1 Qualcomm 1 Avago 2 Maxscend 3 Nationz Technologies 7 Wisol 1 Murata 1 ON Semiconductor 1 Airoha Technology 2 Spreadtrum 6 Airoha Technology 1 Shoulder New Japan Radio (JRC) 1 Nationz 1 WiPam 6 2 Electronics Technologies HiSilicon 1 Unichip 2 RFaxis 1 VanChip 2 Intel 1 TDK 1 Broadcom 1 Apple 1 ON Semiconductor 1 STMicroelectronics 1 National RF Micro Devices 1 1 Toshiba 1 Semiconductor RDA Microelectronics 1

Source: Qualcomm

Antenna Company RF Switch Filter Power Amplifier LNA FEM Tuning/switch Murata 153 62 2344 34 23 Skyworks 160 77 392 175 Qorvo 453 155 171 20 TDK-EPC 738 22 Taiyo Yuden 713 Infineon 66 117 Sony 164 NXP Semiconductor 129 Broadcom 71 Wisol 55 Qualcomm 44 Values depict design wins While Qualcomm currently does not show many design wins in the front end, they have invested heavily in the area.

▪ Values depict design wins in our Library ▪ AP, Baseband, Transceiver are typically tightly coupled (same Source: Qualcomm vendor) ▪ Envelope Trackers Application Processor with Baseband are often the same Transceivers Qualcomm 187 vendor as MediaTek 99 Qualcomm 119 transceiver HiSilicon 38 MediaTek 96 Envelope Tracking Samsung 27 HiSilicon 45 Spreadtrum 17 Samsung 29 Qualcomm 77 Stand-alone Spreadtrum 18 Samsung 9 Applications Processor Stand-Alone Intel 5 Qorvo 8 Apple 13 Baseband Silicon Motion Inc (SMI) 5 Mediatek 3 Samsung 5 Qualcomm 11 Marvell Semiconductor 1 Universal Electronics 1 Qualcomm 1 Intel 10 Broadcom 1 Infineon 1 Samsung 3 ACP AG 1 Intel 1 Spreadtrum (UNISOC) 3 Broadcom 1 MediaTek 2

Source: Qualcomm

Stand Alone Stand Alone Application Processor Row Labels Transceiver Envelope Tracking Application Processor Baseband with Baseband Qualcomm 1 11 187 119 77 Samsung 5 3 27 29 9 MediaTek 99 96 3 HiSilicon 38 45 Qorvo 8 Apple 13 Intel 10 Spreadtrum 3 Values depict design wins Platform Leaders: Qualcomm, Samsung, Mediatek and HiSilicon.

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1500 unique RF part numbers seen

Type 2016 2017 2018 AP with Integrated BB 43 31 16 Separate Baseband 10 3 1 FEM 24 49 22 Transceivers 28 11 8 RF Switches 34 51 18 Antennae Tuners/switches 152 97 30 LNA 19 7 8 Power Amplifiers 143 75 24 RF Filters 355 159 72

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