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AU9360 USB Multiple Slots Flash Memory Controller TRM

Revision 1.2

© 1997-2003 Alcor Micro Corp. All Rights Reserved

Copyright Notice Copyright 1997 - 2003 Alcor Micro Corp. All Rights Reserved.

Trademark Acknowledgements The company and product names mentioned in this document may be the trademarks or registered trademarks of their manufacturers.

Disclaimer Alcor Micro Corp. reserves the right to change this product without prior notice. Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that appear in this document. Specifications are subject to change without prior notice.

Contact Information:

Web site: http://www.alcormicro.com/

Taiwan Alcor Micro Corp. 4F, No 200 Kang Chien Rd., Nei Hu, Taipei, Taiwan, R.O.C. Phone: 886-2-8751-1984 Fax: 886-2-2659-7723

Santa Clara Office Los Angeles Office 2901 Tasman Drive, Suite 206 9400 Seventh St., Bldg. A2 Santa Clara, CA 95054 Rancho Cucamonga, CA 91730 USA USA Phone: (408) 845-9300 Phone: (909) 483-9900 Fax: (408) 845-9086 Fax: (909) 944-0464

Table of Contents

1 Introduction……………………………………………………………………… 1 1.1 Description…………………………………………………………………. 1 1.2 Features…………………………………………………………………….. 1 2 Application Block Diagram…………………………………………………… 3 3 Pin Assignment…………………………………………………………………. 5 4 System Architecture and Reference Design………………………………. 9 4.1 AU9360 Block Diagram…………………………………………………… 9 4.2 Sample Schematics…………………………………………………………. 10 5 Electrical Characteristics……………………………………………………… 13 5.1 Absolute Maximum Ratings………………………………………………… 13 5.2 Recommended Operating Conditions…………………………………… 13 5.3 General DC Characteristics………………………………………………… 13 5.4 DC Electrical Characteristics for 5 volts operation………………………. 14 5.5 Crystal Oscillator Circuit Setup for Characterization…………………….. 14 5.6 USB Transceiver Characteristics………………………………………… 15 5.7 ESD Test Results…………………………………………………………… 19 5.8 Latch-Up Test Results……………………………………………………… 20 6 Mechanical Information……………………………………………………….. 23 7 Errata…………………….……………………………………………………….. 25

TABLE OF CONTENTS i

TABLE OF CONTENTS i

1.0 Introduction

1.1 Description

The AU9360 is a single chip USB flash memory reader controller which supports not only the widely used flash memory cards, such as Compact Flash (CF) card, Micro Drive (MD), SmartMedia Card (SMC), XD Picture Card, (MS), Memory Stick Duo, Memory Stick PRO, Secure Digital (SD) and Multimedia Card (MMC), but also supports NAND type flash as a USB flash disk. It can be used as removable storage disks in enormous data exchange applications between PC and PC or PC and various consumer electronic appliances.

The AU9360 reads digital data saved on while users manipulating electronic devices such as digital cameras, MP3 players, PDAs and mobile phones… etc. By the AU9360, users can transfer information such as data, graphics, texts or digital images from one electronic device to another quickly and easily. With AU9360, users’ knowledge will be further enhanced by the Plug-and-Play nature built into latest operation systems such as Windows 2000/XP and Mac OS X.

By integrating of various analog components, the AU9360 is the most powerful and most effective solution for various flash memory reader.

1.2 Features

Fully compliant with USB v1.1 specification and USB Device Class Definition for Mass Storage, Bulk-Transport v1.0 Fully compliant with Compact Flash (CF) v1.4 Specification Fully compliant with Secure Digital (SD) v1.0 Specification. Fully compliant with Memory Stick (MS) v1.3 Specification. Fully compliant with Memory Stick PRO v1.0 Specification. Fully compliant with Memory Stick ROM Format v1.0 Specification. Fully compliant with Memory Stick Duo Format v1.01 Specification. Fully compliant with Smart Media Card (SMC) Standard 2000 Specification. Support 1 piece NAND type flash memory up to 2Gbit capacity. Support Mask ROM Card capacity from 2MB to 256MB. Work with default driver from Windows ME, Windows XP, Mac OS 9, and Mac OS X. Windows 98, Windows 2000 are supported by vendor driver from Alcor.

INTRODUCTION 1 Ping-pong FIFO implementation for concurrent bus operation Support multiple sectors transfer to 4GB to optimize performance Support optional external EEPROM for USB VID, PID and string customization Support slot to slot read/write operation. Support auto-detecting slot with card inserted on Win 2000 without driver. Capable of handling 8 sets of built-in PID, VID and strings to minimize inventory control and improve lead production lead time Support 5 different LEDs for bus activity indication of 5 separated slots. Each slot can be enables/disabled by 5 independent pins to fit all the different card readers’ combinations requirement. Integrated 4 power switches and power management circuit for each slot to meet USB 500uA power consumption during suspend with card in the slot. Runs at 12MHz, built-in 48 MHz PLL Built-in 3.3V regulator 100-pin LQFP package

INTRODUCTION 2

2.0 Application Block Diagram

Following is the application diagram of a typical flash memory card reader using AU9360. By connecting the reader to a PC through USB bus, the AU9360 is acting as a bridge between the flash memory card from , MP3 player, PDA or mobile phone and PC.

Digital Camera

PC with USB Host Controller MP3 Player

PDA

USB 9-in-1 CF/MS/MD/S Flash Memory MC/SD/MMC Card Reader NAND...etc

Moble Phones

PC

APPLICATION BLOCK DIAGRAM 3

APPLICATION BLOCK DIAGRAM 4

3.0Pin Assignment The AU9360 is packed in 100-LQFP-form factor. The following figure shows signal name for each pin and the table in the following page describes each pin in detail.

GPI0 CT1 CT2 CT3 CT4 GPI3 GPON4 GPON5 GPON6 GPON7 SDWP SDCDN SDDATA SDCLK SDCMD SMDATA7 SMDATA0 MDATA1 SMDATA2 SMDATA3 EEPDATA EEPCLK SMCEN SMDATA6 SMDATA5

100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 GPI1 1 75 SMDATA4

GPI2 2 74 SMRBN

XDCDN 3 73 SMRDN

VCCA 4 72 SMCDN

GNDA 5 71 SMCLE

XTAL1 6 70 SMALE

XTAL2 7 69 SMWRN

VCC2Card 8 68 SMWPN

VCC5V 9 67 MSDATA VCC3V 10 Alcor Micro 66 MSCLK RSTN 11 65 MSBS USB_DP 12 AU9360 64 MSINS USB_DM 13 100 -PIN LQFP 63 GNDK GNDIO 14 62 VCCK ROMD7/ ROMAD14 15 61 SWAUSW ROMD6/ ROMAD13 16 60 XDWPN

ROMAD12 17 59 CFRST

ROMAD11 18 58 CFWTN

ROMAD10 19 57 CFOEN

ROMAD9 20 56 CFWEN

ROMAD8 21 55 CFWRN

ROMAD7 22 54 CFRDN

ROMAD6 23 53 CFCDN

ROMAD5 24 52 XDCEN

ROMAD4 25 51 CFD7 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 CFD2 CFD3 CFD4 CFD5 CFD6 CFD0 CFD1 CFAD3 CFAD2 CFAD1 CFAD0 CFAD9 GPON3 ROMAD3 ROMAD2 ROMAD1 ROMAD0 PWRLED ROMAD15 ROMD1/VID1 ROMD0/VID0 ROMD2 /XDSTREN ROMD2 ROMD3/XDSLOTEN MODE ROMD4/LED ROMD5/FMSLOTEN

PIN ASSIGNMENT 5

Table 3-1. Pin Descriptions

Pin Pin Name I/O Type Description 1 GPI1 I CF card slot enable 2 GPI2 I SM card slot enable 3 XDCDN I Connect to XD Card Detect 4 VCCA PWR Analog 3.3V input 5 GNDA PWR Ground 6 XTAL1 I Crystal Oscillator Input (12MHz) 7 XTAL2 O Crystal Oscillator Output (12MHz) 8 VCC2Card O Connect to Card Power 9 VCC5V PWR 5V power supply 10 VCC3V PWR Regular 3.3V output/ IO 3.3V input 11 RSTN Input Hardware reset (Active Low) 12 USB_DP I/O USB D+ 13 USB_DM I/O USB D- 14 GNDIO PWR Ground 15 ROMAD14 O Connect to External ROM Addr14 16 ROMAD13 O Connect to External ROM Addr13 17 ROMAD12 O Connect to External ROM Addr12 18 ROMAD11 O Connect to External ROM Addr11 19 ROMAD10 O Connect to External ROM Addr10 20 ROMAD9 O Connect to External ROM Addr9 21 ROMAD8 O Connect to External ROM Addr8 22 ROMAD7 O Connect to External ROM Addr7 23 ROMAD6 O Connect to External ROM Addr6 24 ROMAD5 O Connect to External ROM Addr5 25 ROMAD4 O Connect to External ROM Addr4 26 ROMAD3 O Connect to External ROM Addr3 27 ROMAD15 O Connect to External ROM Addr15 28 GPON3 O General Purpose Output pin, used as activity LED / XD card Access LED blink 29 ROMAD2 O Connect to External ROM Addr2 30 ROMAD1 O Connect to External ROM Addr1 31 ROMAD0 O Connect to External ROM Addr0 32 PWRLED O General Purpose Output pin, used as activity LED / Power LED 33 ROMD0 / VID0 I/O Connect to External ROM D0 / Selection VID/PID 34 ROMD1 / VID1 I/O Connect to External ROM D1 / Selection VID/PID ROMD2 / 35 I/O Connect to External ROM D2 / XD String Enable XDSTREN ROMD3/ 36 I/O Connect to External ROM D3 / XD card slot enable XDSLOTEN

PIN ASSIGNMENT 6

ROMD4/ 37 I/O Connect to External ROM D4/ LED Mode Selection LED MODE ROMD5/ 38 I/O Connect to External ROM D5/ Flash Slot Enable FMSLOTEN 39 CFAD9 O Connect to CF Card Addr9 40 CFAD3 O Connect to CF Card Addr3 41 CFAD2 O Connect to CF Card Addr2 42 CFAD1 O Connect to CF Card Addr1 43 CFAD0 O Connect to CF Card Addr0 44 CFD0 I/O Connect to CF Card Data0 45 CFD1 I/O Connect to CF Card Data1 46 CFD2 I/O Connect to CF Card Data2 47 CFD3 I/O Connect to CF Card Data3 48 CFD4 I/O Connect to CF Card Data4 49 CFD5 I/O Connect to CF Card Data5 50 CFD6 I/O Connect to CF Card Data6 51 CFD7 I/O Connect to CF Card Data7 52 XDCEN O Connect to XD Card Enable 53 CFCDN I Connect to CF Card Card Detect 54 CFRDN O Connect to CF Card IORD 55 CFWRN O Connect to CF Card IOWR 56 CFWEN O Connect to CF Card WE 57 CFOEN O Connect to CF Card OE 58 CFWTN I Connect to CF Card WAIT 59 CFRST O Connect to CF Card Reset ROMD6/ 60 I/O Connect to External ROM D6 / XD Write protection (protect=0, not protect=1) XDWPN ROMD7/ Connect to External ROM D7/ Software auto switch disk for win 2000 61 I/O SWAUSW (Enable=0, Disable=1). 62 VCCK PWR Core 3.3V Input 63 GNDK PWR Ground 64 MSINS I Connect to MemoryStick Card INS 65 MSBS O Connect to MemoryStick Card BS 66 MSCLK O Connect to MemoryStick Card SCLK 67 MSDATA I/O Connect to MemoryStick Card DATA 68 SMWPN I Connect to SmartMedia Card Write Protect 69 SMWRN O Connect to SmartMedia Card Write Enable 70 SMALE O Connect to SmartMedia Card Address Latch Enable 71 SMCLE O Connect to SmartMedia Card Command Latch Enable 72 SMCDN I Connect to SmartMedia Card Card Detect 73 SMRDN O Connect to SmartMedia Card Read Enable 74 SMRBN I Connect to SmartMedia Card Ready/Busy Output 75 SMDATA4 I/O Connect to SmartMedia Card Data 4 PIN ASSIGNMENT 7

76 SMDATA5 I/O Connect to SmartMedia Card Data5 77 SMDATA6 I/O Connect to SmartMedia Card Data 6 78 SMCEN O Connect to SM Card Enable 79 EEPCLK O Connect to EEPROM Serial Clock 80 EEPDATA I/O Connect to EEPROM Serial Data 81 SMDATA3 I/O Connect to SmartMedia Card Data 3 82 SMDATA2 I/O Connect to SmartMedia Card Data 2 83 SMDATA1 I/O Connect to SmartMedia Card Data 1 84 SMDATA0 I/O Connect to SmartMedia Card Data 0 85 SMDATA7 I/O Connect to SmartMedia Card Data 7 86 SDCMD I/O Connect to SD CMD 87 SDCLK O Connect to SD CLK 88 SDDATA I/O Connect to SD Data 89 SDCDN I Connect to SD Card Detect 90 SDWP I Connect to SD Write Protect 91 GPON7 O General Purpose Output pin, used as activity LED / MS card Access 92 GPON6 O General Purpose Output pin, used as activity LED / SM card Access 93 GPON5 O General Purpose Output pin, used as activity LED / CF card Access 94 GPON4 O General Purpose Output pin, used as activity LED / SD card Access 95 GPI3 I MS card slot enable 96 CT4 I ECC Selection ('0'=Disable, '1'=Enable) 97 CT3 I Connect to ground 98 CT2 I ROM Selection ('0' = Internal ROM, '1'=External ROM) 99 CT1 I Connect to ground 100 GPI0 I SD card slot enable

PIN ASSIGNMENT 8

4.0 System Architecture and Reference Design

4.1 AU9360 Block Diagram

Alcor Micro – AU9360 Flash Memory Card Reader Controller Chip Block Diagram

Ⅱ USB USB CF/CF /SMC/ RAM MS/ /MS PRO/ CF Upstream SIE MMC/SD/ FM XCVR /XD Control FIFO MD Port SMC MS MS PRO MS Duo SD MMC Flash Memory (FM) Other EEPROM Processor ROM Arbitrator Control

3.3 V 3.3 V Voltage Card Regulator Power /Power Switch

12MHz XTAL EEPROM

SYSTEM ARCHITECTURE AND REFERENCE DESIGN 9

4.2 Sample Schematics

CT2: ROM Selection ('0'= Internal '1'= External ROM) CT4: ECC Selection ( '0'= Disable.'1'= Enable) GPI0: SD card slot enable SMDATA[0..7] GPI1: CF card slot enable Q3 GPI2: SM card slot enable MOSFET P CT4 CT1 CT2 CT3 GPI3 SDPWR VCC2CARD

GPI3: MS card slot enable GPI0 SMCEN EEPCLK GPON4 GPON5 GPON6 GPON7 SDWP SDCDN SDDATA SMDATA7 SMDATA0 SMDATA1 SMDATA2 SMDATA3 SMDATA6 SMDATA5 EEPDATA SDCLK SDCMD

U1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 SDCDN

CT1 CT2 CT3 CT4 Q4 VCC2CARD GPI1 1 GPI0 GPI3 75 SMDATA4

SDWP MOSFET P

GPI1 SDCLK SMDATA4 GPON4 GPON5 GPON6 GPON7 SDCDN SMCEN

GPI2 2 SDCMD 74 SMRBN EEPCLK GPI2 SDDATA SMRBN EEPDATA SMDATA7 SMDATA0 SMDATA1 SMDATA2 SMDATA3 VCC3.3 XDCDN 3 SMDATA6 SMDATA5 73 SMRDN SMPWR VCC2CARD VCC VCCA 4 XDCDN SMRDN 72 SMCDN FB F1 GNDA 5 VCCA SMCDN 71 SMCLE FB F2 R1 C1 C2 XTAL1 6 GNDA SMCLE 70 SMALE C3 C4 XTAL2 7 XTAL1 SMALE 69 SMWRN SMCDN 1UF 8 XTAL2 SMWRN 68 SMWPN 0.1UF 10UF 0.1UF VCC5V 9 VCC2CARD SMWPN 67 MSDATA J1 1.5K 10 VCC5V MSDATA 66 MSCLK VCC3V MSCLK Q5 1 11 65 MSBS CFPWR MOSFET P VCC 2 R2 39 12 RSTN MSBS 64 MSINS DATA- 3 R3 39 13 USB_DP Au9360 100pin MSINS 63 GNDKR4 MSPWR VCC2CARD DATA+ 4 14 USB_DM GNDK 62 VCCK GND 5 ROMAD14 15 GNDIO VCCK 61 ROMD7/SWAUSW FGND1 ROMAD13 16 ROMAD14 ROMD7/SWAUSW 60 ROMD6/XDWPN ROMAD12 17 ROMAD13 ROMD6/XDWPN 59 CFRST MSINS R8 100K ROMAD11 18 ROMAD12 CFRST 58 CFWTN 100K ROMAD10 19 ROMAD11 CFWTN 57 CFOEN C22 ROMAD9 20 ROMAD10 CFOEN 56 CFWEN ROMAD8 21 ROMAD9 CFWEN 55 CFWRN 0.1UF ROMAD7 22 ROMAD8 CFWRN 54 CFRDN ROMAD6 23 ROMAD7 CFRDN 53 CFCDN ROMAD5 24 ROMAD6 CFCDN 52 XDCEN ROMAD4 25 ROMAD5 XDCEN 51 CFD7 ROMAD4 CFD7 VCC

Optional,if external rom selected ROMAD3 ROMAD15 GPON3 ROMAD2 ROMAD1 ROMAD0 PWRLED ROMD0/VID0 ROMD1/VID1 ROMD2/XDSTREN ROMD3/XDSLOTEN MODE ROMD4/LED ROMD5/FMSLOTEN CFAD9 CFAD3 CFAD2 CFAD1 CFAD0 CFD0 CFD1 CFD2 CFD3 CFD4 CFD5 CFD6 R9 100K 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VCC2CARD U2 ROMAD0 10 11 ROMD0/VID0 MOSFET P ROMAD1 9 A0 D0 12 ROMD1/VIC1 ROMAD2 8 A1 D1 13 ROMD2/XDSTREN Q7 ROMAD3 GPON3 ROMAD2 ROMAD1 ROMAD0 PWRLED CFAD1 ROMAD15 CFAD9 CFAD3 CFAD2 CFAD0 CFD0 CFD1 CFD2 CFD3 CFD5 CFD6 CFD4 ROMAD3 7 A2 D2 15 ROMD3/XDSLOTEN CFCDN R5 100K Q1 ROMAD4 6 A3 D3 16 ROMD4/LED MODE 9012 ROMAD5 5 A4 D4 17 ROMD5/FMSLOTEN ROMD0/VID0 ROMD1/VID1 ROMD2/XDSTREN A5 D5 3 ROMD3/XDSLOTEN MODE ROMD4/LED ROMAD6 4 18 ROMD6/XDWPN ROMD5/FMSLOTEN ROMAD7 3 A6 D6 19 ROMD7/SWAUSW R7 100K 2 Q2 CFPWR ROMAD8 25 A7 D7 ROMAD9 24 A8 9013 A9

ROMAD10 21 1 ROMAD11 23 A10 ROMAD12 2 A11 ROMAD13 26 A12 ROMAD14 27 A13 ROMAD15 1 A14 VCC3.3 18PF A15 22 C5 XTAL1 OE/VPP 20 PWRLED FB F3 VCCA R10 CE Y1 VCC VCC3.3 C6 C7 12MHZ W27E512 18PF 1M VCC5V FB F4 VCCK 0.1UF 0.1UF C8 XTAL2 FB F5 GNDA C9 C10 C11

Disclaimer: This schematic is for reference only. 0.1UF 0.1UF 0.1UF FB F6 GNDK Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that Size Document Number Rev A4 appear in this document. Specifications are subject to Au9360 9 in 1 demostration schematics 2.41 change without notice. Date:Saturday, April 05, 2003 Sheet 13of

SYSTEM ARCHITECTURE AND REFERENCE DESIGN 10

VCC3.3 SDPWR SDPWR CFPWR JP4 R11 R12 R14 1 2 CFD3 CFD4 3 GND CFdata3 4 CFD5 SDPWR CFD6 5 CFdata4 CFdata5 6 CFD7 CFdata6 CFdata7 CT1 7 8 10K 10K 100K JP1 CFOEN 9 CE1N CFaddr10 10 CFAD9 1 11 -OE CFaddr9 12 9 CT2 SW2 2 13 CFaddr8 CFaddr7 14 SDCMD 1 3 15 VCC CFaddr6 16 SDCDN 2 CFAD3 17 CFaddr5 CFaddr4 18 CFAD2 SDCD C12 CFAD1 19 CFaddr3 CFaddr2 20 CFAD0 3 CFD0 21 CFaddr1 CFaddr0 22 CFD1 SDCLK 4 CT3 47PFCFD2 23 CFdata0 CFdata1 24 TP C13 5 CFCDN 25 CFdata2 IOIS16 26 SDDATA 6 1 27 CDN CDN 28 CFPWR 0.1UF 7 CT4 SW4 2 29 CFdata11 CFdata12 30 SDWP 8 3 31 CFdata13 CFdata14 32 SDWP 33 CFdata15 CE2N 34 CFRDN C23 1 CFWRN 35 VS1 IORDN 36 CFWEN SD SOCKET GPI0 SW5 2 INTRQ 37 IOWRN WEN 38 18PF TP 3 39 INTRQ VCC 40 TP CFRST 41 CSEL VS2 42 CFWTN C14 C15 1 43 RESET WAITN 44 GPI1 SW6 2 45 INDACK REGN 46 47PF 47PF 3 47 SPKR STSCHG 48 MSPWR C16 49 CFdata8 CFdata9 50 1 CFdata10 GND GPI2 SW7 2 0.1UF C17 CF CONNECTOR JP2 3 47PF MSBS VSS 1 BS GPI3 SW8 2 MSDATA VCC 3 SDIO MSINS RESERVED INS MSCLK RESERVED SCLK VCC C19 VSS R16 MS SOCKET 0.1UF 10K Optional SMPWR VCC3.3 VCC3.3 JP3 R17 VCC3.3 1 12 D1 GPON3 2 GND VCC 13 SMCLE SMDATA4 U3 3 CLE D4 14 SMALE SMDATA5 D2 GPON4 10K 8 1 4 ALE D5 15 SMWRN SMDATA6 7 VCC A0 2 5 -WE D6 16 SMWPN SMDATA7 D3 GPON5 EEPCLK 6 WP A1 3 06 -WP D7 17 SMDATA0 EEPDATA 5 SCL A2 4 07 D0 LVD 18 SMDATA1 D4 GPON6 SDA GND 08 D1 GND 19 SMDATA2 SMRBN C20 24C02 or compatible 09 D2 R/-B 20 SMDATA3 SMRDN D5 GPON7 10 D3 -RE 21 SMCEN1 0.1UF 11 GND -CE 22 VCC3.3 SMCDN R22 330 D6 PWRLED -CD VCC R23 470K SMC CONNECTOR C21

0.1UF

Disclaimer: This schematic is for reference only. SMPWR R25 47K Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any error that Size Document Number Rev A4 appear in this document. Specifications are subject to Au9360 9 in 1 demostration schematics 2.41 change without notice. Date:Saturday, April 05, 2003 Sheet 23of

ELECTRICAL CHARACTERISTICS 11

VCC3.3 XDPWR JP5 VCC2CARD 1 SMDATA[0..7] 2 NC U4 3 VCC 29 12 SMDATA[0..7] 1 4 D7 30 I/O0 VCC 37 ROMD0/VID0 SW9 2 5 D6 31 I/O1 VCC 3 6 D5 32 I/O2 7 D4 41 I/O3 1 8 D3 42 I/O4 ROMD1/VID1 SW10 2 9 D2 43 I/O5 3 VCC2CARD 10 D1 44 I/O6 11 D0 I/O7 1 12 GND 7 SMRBN ROMD2/XDSTREN SW11 2 13 -WP R/B 8 SMRDN SMWRN 3 14 -WE RE 9 FMCEN SMALE 15 ALE CE 16 SMCLE SMCLE 1 16 CLE 6 CLE 17 SMALE VCC2CARD XDCEN1 ROMD3/XDSLOTEN SW12 2 17 -CE 13 GND ALE 18 SMWRN SMRDN 3 18 -RE 36 VSS WE 19 SMRBN 19 R/-B VSS WP 1 20 GND XDCDN K9F5608U0A-YCB0 ROMD4/LED MODE SW13 2 -CD 3 HEADER 19

1 ROMD5/FMSLOTEN SW14 2 3

1 ROMD6/XDWPN SW15 2 3

1 ROMD7/SWAUSW SW16 2 XDPWR Q6 3 MOSFET P VCC2CARD U5 SMCEN 1 15 FMCEN XDCEN 2 A Y0 14 XDCEN1 3 B Y1 13 SMCEN1 XDCDN VCC2CARD C Y2 12 Y3 11 6 Y4 10 4 G1 Y5 9 5 G2A Y6 7 G2B Y7 74HC138 or compatable

Internal ROM only Pin 16 connect to vcc2card Pin 8 connect to GND VID0: Selection VID/PID VID1: Selection VID/PID XDSTREN: XD slot string enable (disable=0, enable=1) XDSLOTEN: XD card slot enable LED MODE: LED Mode Enable(Single LED=1, 5 LED=0) FMSLOTEN: Flash slot enable (disable=0, enable=1) XDWPN: XD Write protect (proect=0, not protect=1) Size Document Number Rev A Au9360 9 in 1 demostration schematics SWAUSW: Software auto switch disk for win 2000 (Enable=0, Disable=1) 2.41 Date:Friday, April 11, 2003 Sheet 33of

ELECTRICAL CHARACTERISTICS 12

5.0 Electrical Characteristics

5.1 Absolute Maximum Ratings

SYMBOL PARAMETER RATING UNITS VCC Power Supply -0.3 to 6.0 V VIN Input Voltage -0.3 to VCC+0.3 V VOUT Output Voltage -0.3 to VCC+0.3 V ˚ TSTG Storage Temperature -40 to 125 C

5.2 Recommended Operating Conditions

SYMBOL PARAMETER MIN TYP MAX UNITS VCC Power Supply 4.5 5.0 5.5 V VIN Input Voltage 0 VCC V O TOPR Operating Temperature -5 85 C

5.3 General DC Characteristics

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS IIL Input low current no pull-up or pull-down -1 1 µA IIH Input high current no pull-up or pull-down -1 1 µA IOZ Tri-state leakage current -10 10 µA CIN Input capacitance 4 ρF COUT Output capacitance 4 ρF CBID Bi-directional buffer capacitance 4 ρF

ELECTRICAL CHARACTERISTICS 13

5.4 DC Electrical Characteristics for 5 volts operation

( Under Recommended Operating Conditions and VCC=4.5v ~ 5.5v , Tj= -40OC to + 85OC ) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIL Input Low Voltage TTL 0.8 V VIL Input Low Voltage CMOS 0.3*VCC V VIL Schmitt input Low Voltage TTL 1.10 V VIL Schmitt input Low V oltage CMOS 1.84 V VIH Input High Voltage TTL 2.2 V VIH Input Hight Voltage CMOS 0.7*VCC V VIH Schmitt input High Voltage TTL 1.87 V VIH Schmitt input High Voltage CMOS 3.22 V VOL Output low voltage IOL=2, 4, 8, 12, 16, 24 mA 0.4 V VOH Output high voltage IOH=2, 4, 8, 12, 16, 24 mA 3.5 V RI Input Pull-up/down resistance Vil=0V or Vih=VCC 50 KΩ

5.5 Crystal Oscillator Circuit Setup for Characterization

The following setup was used to measure the open loop voltage gain for crystal oscillator circuits. The feedback resistor serves to bias the circuit at its quiescent operating point and the AC coupling capacitor, Cs, is much larger than C1 and C2.

ELECTRICAL CHARACTERISTICS 14

5.6 USB Transceiver Characteristics

RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS LIMITS UNIT MIN MAX VCC DC supply voltage 3.0 3.6 V

VI DC input voltage range 0 5.5 V

VI/O DC input range for I/Os 0 VCC V

VO DC output voltage range 0 VCC V ˚ TAMB Operating ambient temperature See DC and AC 0 70 C range in free air characteristics for individual device

ABSOLUTE MAXIMUM RATINGS (Notes 1 and 2)

In accordance with the Absolute Maximum Rating System, Voltages are referenced to GND (Ground=0v) SYMBOL PARAMETER CONDITIONS LIMITS UNIT MIN MAX

VCC DC supply voltage -0.5 +6.5 V

IIK DC input diode current Vi<0 -50 mA

VI DC input voltage Note 3 -0.5 +5.5 V

VI/O DC input voltage range for I/Os -0.5 Vcc V +0.5

IOK DC output diode current Vo> Vcc or Vo<0 +/-50 mA

VO DC output voltage Note 3 -0.5 Vcc V +0.5

IO DC output source sink current for Vo=0 to Vcc +/-15 mA VP/VM and RCV pins

IO DC output source or sink current Vo= 0 to Vcc +/-50 mA for D+/D- pins

ICC, IGND DC Vcc or GND current +/-100 mA ˚ TSTO Storage temperature range -60 +150 C

PTOT Power dissipation per package mW

NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 2. The performance capability of a high performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150˚C. 3. The input and output voltage ratings may be exceeded if the input and output clamp current ratings are observed.

ELECTRICAL CHARACTERISTICS 15

DC ELECTRICAL CHARACTERISTICS

Over recommended operating conditions. Voltages are referenced to GND (Ground=0V).

LIMITS SYMBOL PARAMETER TEST CONDITIONS -40˚C to +85˚C UNIT MIN TYP MAX VHYS Hysteresis on inputs Vcc=3.0V to 3.6V (Note 3) 0.3 0.4 0.5 V VIH HIGH level input Vcc=3.0V to 3.6V (Note 3) 1.5 2.0 V VIL LOW level input Vcc=3.0V to 3.6V (Note 3) 0.8 1.1 V RoH Output impedance (HIGH state) Note 2 28 34 43 ohm RoL Output impedance (LOW state) Note 2 28 35 43 ohm VOH HIGH level output Vcc=3.0V Io=6mA 2.2 2.7 V (Note 3) Vcc=3.0V Io=4mA 2.4 Vcc=3.0V Io=100µA 2.8 VOL LOW level output Vcc=3.0V Io=6mA 0.3 0.7 V (Note 3) Vcc=3.0V Io=4mA 0.4 Vcc=3.0V Io=100µA 0.2 IQ Quiescent supply current Vcc=3.6V VI=Vcc or GND 330 600 µA Io=0 Isup Supply current in suspend Vcc=3.6V VI=Vcc or GND 70 µA Io=0 IFS Active supply current (Full Vcc=3.3V 9 14 mA Speed) ILS Active supply current (Low Vcc=3.3V 2 mA Speed) ILeak Input leakage current Vcc=3.6V VI=5.5V or GND, +/- +/-0.5 µA not for I/O Pins 0.1 IOFF 3-state output OFF-state current Vi=Vih or ViL; Vo=Vcc or +/-10 µA GND

NOTES: 1. All typical values are at Vcc=3.3V and Tamb=25˚C. 2. This value includes an external resistor of 24 ohm +/-1%. See "Load D+ and D-" diagram for testing details. 3. All signals except D+ and D-.

ELECTRICAL CHARACTERISTICS 16

AC ELECTRICAL CHARACTERISTICS

GND=0V, tR = tF =3.0 ns; CL =50 pF; RL=500 Ohms SYMBOL PARAMETER WAVEFORM UNIT

LIMITS (TAMB)

0˚C to +25˚C 0˚C to +70˚C MIN TYP MAX MIN MAX tpLH VMO/VPO to D+/D- 1 0 12 0 14 ns tpHL Full Speed 0 12 0 14 trise Rise and Fall Times 2 4 9 20 4 20 ns tfall Full Speed 4 9 20 4 20 tRFM Rise and Fall Time 90 110 90 110 % Matching Full Speed tpLH VMO/VPO to D+/D- 1 120 300 300 ns tpHL Low Speed 120 300 300 trise Rise and Fall Times 2 75 300 75 300 ns tfall Low Speed 75 200 75 200 tRFM Rise and Fall Time 70 130 70 130 % Matching Low Speed tpLH D+/D- to RCV 3 9 16 16 ns tpHL 9 16 16 tpLH D+/D- to VP/VM 1 4 8 8 ns tpHL 4 8 8 tpHZ 12 12 ns tpZH OE# to D+/D- RL = 4 12 12 tpLZ 500ohm 10 10 tpZL 10 10 tsu Setup for SPEED 5 0 ns Vcr Crossover point1 3 1.3 2.0 1.3 2.0 V

NOTES: 1. The crossover point is in the range of 1.3V to 2.5V for the low speed mode with a 50 pF capacitance.

ELECTRICAL CHARACTERISTICS 17

ELECTRICAL CHARACTERISTICS 18

5.7 ESD Test Results

Test Description: ESD Testing was performed on a Zapmaster system using the Human- Body-Model (HBM) and Machine-Model (MM), according to MIL-STD 883 and EIAJ IC- 121 respectively. • Human-Body-Model stresses devices by sudden application of a high voltage supplied by a 100pF capacitor through 1.5k-ohm resistance. • Machine-Model stresses devices by sudden application of a high voltage supplied by a 200pF capacitor through very low (0 ohm) resistance.

Test Circuit & Condition - Zap Interval: 1 second - Number of Zaps: 3 positive and 3 negative at room temperature - Criteria: I-V Curve Tracing

ESD Data Model Mode S/S Target Results HBM Vdd, Vss, I/C 15 6000V PASS MM Vdd, Vss, I/C 15 200V PASS

ELECTRICAL CHARACTERISTICS 19

5.8 Latch-Up Test Results

Test Description: Latch-Up testing was performed at room ambient using an IMCS-4600 system which applies a stepped voltage to one pin per device with all other pins open except Vdd and Vss which were biased to 5Volts and ground respectively. Testing was started at 5.0V (Positive) or 0V (Negative), and the DUT was biased for 0.5 seconds. If neither the PUT current supply nor the device current supply reached the predefined limit (DUT=00mA, Icc=100mA), then the voltage was increased by 0.1Volts and the pin was tested again. This procedure was recommended by the JEDEC JC-40.2 CMOS Logic standardization committee.

Notes: 1. DUT: The device under test. 2. PUT: The pin under test.

Test Circuit: Positive Input/Output Overvoltage/Overcurrent

ELECTRICAL CHARACTERISTICS 20

Test Circuit: Negative Input/Output Overvoltage/Overcurrent

Supply Overvoltage Test

Latch-Up Data Mode Voltage (V)/Current (mA) S/S Results + 11.0 5 Pass Voltage - 11.0 5 Pass + 200 5 Pass Current - 200 5 Pass Vdd - Vxx 9.0 5 Pass

ELECTRICAL CHARACTERISTICS 21

MECHANICAL INFORMATION 22

6.0 Mechanical Information

Following table shows the dimensions of the AU9360 100-pin LQFP. Measurements are in inches. The illustration is just an example for LQFP but not for AU9360 real size.

body size lead A1 A2 L1 b c e D1 E1 count 14 14 100 0.1 1.4 1 0.2 0.127 0.5

A1 stand-off A2 body thickness L1 lead length b lead width c lead thickness e lead pitch

MECHANICAL INFORMATION 23

MECHANICAL INFORMATION 24

7.0 Errata

Record History

12/23/2002 CT3 should change connection from high to low. Shuttle 9360 chip using 24 MHz is not working, so we let the CT3 connect to high for using 12 MHz. After firmware changed (code: 911218), 24 MHz is working fine and we used 24MHz to tape out. So the schematic should change to use 24 MHz. Data book updated to version1.1

03/26/2003 AU9360 controller chip improved to support Memory Stick PRO. Data book was then updated the version to 1.2 to add information on Memory Stick PRO. Modified parts are descriptions, features, pin names, diagrams and schematics.

MECHANICAL INFORMATION 25