Embedded 4Th Generation Intel Core™ Processor, Intel Pentium
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Embedded 4th Generation Intel® Core™ Processor, Intel® Pentium® Processor, Intel® Celeron® and Intel® Xeon® Processor E3-1200 v3 Product Families Datasheet Addendum November 2014 Number: 331059-002US Legal Lines and Disclaimers By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. 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Embedded 4th Generation Intel® Core™ Processor, Intel® Pentium® Processor, Intel® Celeron® and Intel® Xeon® Processor E3-1200 v3 Product Families Datasheet Addendum November 2014 2 Number: 331059-002US Contents 1.0 Feature Summary ......................................................................................................6 1.1 Introduction .......................................................................................................6 1.2 Related Documents..............................................................................................7 1.3 Terminology .......................................................................................................8 2.0 Interface ...................................................................................................................9 2.1 System Memory Design Guidelines ........................................................................9 2.1.1 Embedded Desktop/Workstation LGA Processor ............................................9 2.1.2 Embedded Mobile BGA Processor ................................................................9 2.1.3 Embedded U/Y Series MCP Processor ..........................................................9 2.2 System Memory Interface................................................................................... 10 2.2.1 System Memory Technology Support ........................................................ 10 2.2.1.1 DDR3L Data Transfer Rates ........................................................ 10 2.2.1.2 DDR3L SO-DIMM Modules .......................................................... 10 2.2.1.3 DDR3L DIMM Modules ............................................................... 11 2.2.1.4 DDR3L Memory Down................................................................ 11 2.2.1.5 DRAM Device Technology ........................................................... 12 2.2.2 System Memory Timing Support for BGA + ECC Processors..........................13 2.2.3 System Memory Organization Modes......................................................... 13 2.2.3.1 Single-Channel Mode................................................................. 13 2.2.3.2 Dual-Channel Mode - Intel® Flex Memory Technology Mode ...........13 2.2.3.3 Dual-Channel Symmetric Mode ................................................... 14 2.2.4 System Memory Frequency...................................................................... 14 2.2.4.1 DIMM or SODIMM Modules, Memory Down Topologies (Implementing SPD) ....................................................................................... 14 2.2.4.2 Memory Down Topologies (Not Implementing SPD) .......................15 2.2.5 Technology Enhancements of Intel® Fast Memory Access ............................ 15 2.2.5.1 Just-in-Time Command Scheduling.............................................. 15 2.2.5.2 Command Overlap .................................................................... 15 2.2.5.3 Out-of-Order Scheduling ............................................................ 15 2.2.6 Data Scrambling .................................................................................... 15 2.2.7 DRAM Clock Generation........................................................................... 16 2.2.8 DDR3L Reference Voltage Generation........................................................ 16 2.3 Lane Reversal and Polarity Inversion Support........................................................ 16 3.0 Signal Description ...................................................................................................17 3.1 System Memory Interface for the Processor .......................................................... 17 4.0 Electrical Specifications ...........................................................................................20 4.1 Signal Groups ................................................................................................... 20 4.1.1 AC Specifications.................................................................................... 20 4.2 Voltage and Current Specification ........................................................................ 23 5.0 Package...................................................................................................................25 5.1 Processor Pin and Signal Information ................................................................... 25 5.2 Package Mechanical Drawing............................................................................... 25 5.3 Processor Listing ............................................................................................... 26 6.0 Thermal...................................................................................................................28 6.1 Thermal Design Power (TDP) ............................................................................. 28 6.2 Junction Temperature Specification ..................................................................... 29 6.3 Package Turbo Parameters ................................................................................. 29 7.0 ECC Memory Configuration ......................................................................................30 7.1 Registers Summary ........................................................................................... 30 7.2 Error Syndrome – ERRSYND field in ECCERRLOG0 .................................................30 Embedded 4th Generation Intel® Core™ Processor, Intel® Pentium® Processor, Intel® Celeron® and Intel® Xeon® Processor E3-1200 v3 Product Families November 2014 Datasheet Addendum Number: