Micro/Nano Technologies

Series Editors Zheng You Department of Precision Instrument , Xiaohao Wang Department of Precision Instrument Tsinghua University Beijing, China The series consists of five volumes: Micro/Nano Fabrication Technology, Micro Electro Mechanical Systems (MEMS), Nanomaterial, Nanomedicine, and Applica- tions of Micro-/Nanotechnologies in IT. Experienced researchers and experts are invited to contribute in each of these areas. The series is published under Springer Major Reference Works, which allow continuous online update and publication. These features allow newcomers and other readers to keep in touch with the most up- to-date information in micro-/nanotechnologies. It presents an overview of the knowledge base, as well as selected topics, and provides comprehensive and author- itative information on the field for researchers, engineers, scientists, and graduate students who are involved in different aspects of micro-/nanotechnologies. This publication will provide inspiration for innovative research and application ideas for continued growth of the field. Micro-/nanotechnologies are techniques to fabri- cate and build systems with dimensions ranging from nanometers to microns. Advances in these technologies have created many interdisciplinary research oppor- tunities and have been applied in various areas from nanomedicine to space systems. After several decades of development, a knowledge base of micro-/nanotechnologies covering all areas of research has now been created. It includes design and simula- tion, fabrication and manufacturing, packaging and assembly, device and system technologies, and application in different areas.

More information about this series at http://www.springer.com/series/13903 Qing-An Huang Editor

Micro Electro Mechanical Systems

With 1122 Figures and 126 Tables Editor Qing-An Huang Key Laboratory of MEMS of the Ministry of Education , , China

ISBN 978-981-10-5944-5 ISBN 978-981-10-5945-2 (eBook) ISBN 978-981-10-5946-9 (print and electronic bundle) https://doi.org/10.1007/978-981-10-5945-2

Library of Congress Control Number: 2018936659

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This Springer imprint is published by Springer Nature The registered company is Springer Nature Singapore Pte Ltd. The registered company address is: 152 Beach Road, #21-01/04 Gateway East, Singapore 189721, Singapore Series Preface

Micro/nano technologies are those techniques to fabricate and build systems with dimensions ranging from nanometer to micron. The advancement of these technol- ogies has been creating many interdisciplinary research opportunities and has been applied in various areas from nanomedicine to space systems. After several decades of development, a knowledge base of micro/nano technologies forms. It comes from every achievement of research and consists of design and simulation, fabrication and manufacturing, packaging and assembly, device and system technologies, and appli- cation in different areas. Main structure of the knowledge base and selected topics are shown in this series of books. This work provides a comprehensive and authoritative knowledge of the field for researchers, engineers, scientists, and graduate students who are engaged in different aspects of micro/nano technologies. The series consists of five books, which are micro/nano fabrication, MEMS, nanomaterial, nanomedicine, and applications of micro/nano technologies in IT/IoT. In the books, the latest researches of micro-nano technology are summarized; the history and roadmap of related techniques, devices, and applications are discussed. The authors invited come from China, USA, Ger- many, Great Britain, Austria, Japan, etc. Their research activities in this area are remarkable and prospective. The readership is not merely specialists in this field but also a broad range of students and researchers from other related disciplines. The Chinese Society of Micro/Nano Technology (CSMNT) has organized the Micro/Nano Technologies series in cooperation with Springer. This series would be the first systematic series of books in micro/nano technologies and provides a comprehensive and authoritative knowledge system. The series is published under Springer Major Reference, which allows continuous online update and publication. These features allow the newcomers and other content users to keep in touch with the most updated information in micro/nano technologies. It is expected that this publication will provide a new window to sparkle innovative research and applica- tion ideas for the continuous growth of the field.

Department of Precision Instrument Zheng You Tsinghua University Xiaohao Wang Beijing, China December 2017

v Volume Preface

The acronym for micro electro mechanical systems (MEMS) was worldwide adopted in 1989. Since then, we have witnessed an increasing maturity of the MEMS industry and a rapid introduction of new products addressing applications ranging from smartphones, automobiles, aerospace, electronics instrumentation, industrial process control, appliances, biotechnology, healthcare, office equipment, and telecommunications to Internet-of-Things. MEMS devices and microsystems are now found everywhere. In China, MEMS projects have been funded by the National Science Foundation of China (NSFC) since 1989, by the Major State Basic Research Program of China (973 Program) since 1998, and by the National High Technology Research and Development Program (863 Program) since 2000. The National Key Research and Development Program of China (the newly established national R&D program in 2016) continues to support the MEMS field. Hundreds of groups from Chinese universities/institutes have been involved in the MEMS research and development, and more than 200 MEMS companies have been set up in China until 2015. China has made great progress in the MEMS field. The aim of this volume is to introduce the research and development of MEMS in China, which has not yet been globally presented in a systematic way. Because microfluidic chips are to be collected in Vol. 4: Nanomedicine and the processing and packaging of MEMS are to be collected in Vol. 1: Micro and Nano Fabrication Technology, this volume is divided into nine main parts consisting of 40 chapters. Part 1 addresses the modeling of processing, structures, and devices in MEMS. Part 2 covers the characterization and test of materials and microstructures in MEMS. Part 3 describes physical sensors such as pressure sensors, flow sensors, wind sensors, accelerometers, gyroscopes, vacuum sensors, and electric current sensors. Part 4 comprehensively discusses chemical sensors including humidity, gas, trace energetic chemicals, and biochemical sensors. Part 5 presents micro- actuators for relays, inertial switches, microgrippers, and micropumps. Part 6 specif- ically describes RF MEMS devices including switches, microwave power sensors, reconfigurable attenuators, and acoustic devices for wireless communication. Part 7 focuses on uncooled infrared focal plane array. Part 8 is devoted to power MEMS with an emphasis on direct methanol fuel cells, piezoelectric vibration energy

vii viii Volume Preface harvesters, and triboelectric . Part 9 provides implantable medical devices in which particular attention is paid to microelectrode arrays. This volume would not have been possible if the top academic authors had not taken some of their valuable time to do this work. And for this, I want to thank them most heartily. I would like to extend words of thanks and gratitude to the reviewers who selflessly gave time for carefully reviewing the chapters, to the Series Editors Zheng You and Xiaohao Wang for providing the vision in navigating the completion of the chapters, to the CSMNT secretary Jun Wang for her support in contacting the Series Editors and Springer Editors, and to the editorial team from Springer Nature, Li Shen, Lijuan Wang, Andrew Spencer, Stephen Yeung, Shanmuga Priya Kaliyamoorthy, and Pavithra Balakrishnan, for their patience in dealing with our unique and independent experts, and their persistence in contacting each of us in order to develop the logistics for the book publishing process. It is my pleasure to serve as an editor for organizing the MEMS volume in Micro/ Nano Technologies Series planned by the Chinese Society of Micro/Nano Technol- ogy (CSMNT). In turn, it is my hope that readers may enjoy the volume and gain further insights and full understanding of MEMS in China through this volume.

Key Laboratory of MEMS of the Ministry of Qing-An Huang Education, Southeast University Nanjing, Jiangsu, China December 2017 Contents

Volume 1

Part I Modeling of Processing, Structures, and Devices in MEMS ...... 1

Modeling and Simulation of Silicon Anisotropic Etching ...... 3 Zai-Fa Zhou and Qing-An Huang

Modeling and Simulation of Silicon Dry Etching ...... 27 Yan Xing

Modeling and Simulation of SU-8 Thick Photoresist Lithography .... 67 Zai-Fa Zhou and Qing-An Huang

Modeling of Electrostatically Actuated Microplates ...... 99 Libo Zhao, Zhuangde Jiang, Zhikang Li, and Yihe Zhao

Behavior Modeling and Simulation of an Inertial Sensor ...... 155 Honglong Chang, Jianbing Xie, and Ying Liu

Part II Characterization and Test of Materials and Microstructures in MEMS ...... 195

Online Test Microstructures of the Mechanical Properties for Micromachined Multilayered Films ...... 197 Zai-Fa Zhou, Qing-An Huang, Xin-Ge Guo, and Yi-Fan Gu

Online Test Microstructures of the Thermophysical Properties of MEMS Conducting Films ...... 237 Hai-Yun Liu, Zai-Fa Zhou, and Qing-An Huang

Fracture Properties of MEMS/NEMS Thin Films ...... 303 Jinling Yang and Quan Yuan

ix x Contents

Part III Physical Microsensors ...... 323

High Temperature Silicon Pressure Sensors ...... 325 Zhuangde Jiang, Yulong Zhao, Libo Zhao, and Tingzhong Xu A Micromachined Silicon Resonant Pressure Sensor ...... 387 Junbo Wang, Deyong Chen, Bo Xie, Jian Chen, Lin Zhu, and Yulan Lu A Micromachined Vibratory Gyroscope ...... 421 Qiancheng Zhao, Chunhua He, Jian Cui, and Guizhen Yan A Double Differential Torsional MEMS Accelerometer with Improved Temperature Robustness ...... 461 Dingbang Xiao, Xuezhong Wu, Qingsong Li, and Zhanqiang Hou Micromachined Gas Inertial Sensors ...... 517 Rong Zhu A Micromachined Thermal Wind Sensor ...... 539 Zhenxiang Yi, Ming Qin, and Qing-An Huang Integrated Vacuum Microsensor Systems in CMOS Technology ..... 577 Jiaqi Wang and Zhenan Tang Micro Thermal Flow Sensor ...... 595 Rong Zhu Passive MEMS DC Electric Current Sensors ...... 625 Dong F. Wang, Huan Liu, Xuesong Shang, Weikang Xian, Yipeng Hou, Xu Yang, Toshihiro Itoh, and Ryutaro Maeda

Volume 2

Part IV Chemical Microsensors ...... 657

Microcalorometers for Detection of Trace Energetic Chemicals ...... 659 Zheyao Wang and Wenzhou Ruan Biochemical Sensors Based on Piezoresistive Microcantilevers ...... 689 Xiaomei Yu and Rui Zhao Micro-Heater-Based Gas Sensors ...... 717 Tie Li, Lei Xu, and Yuelin Wang Picogram-Order Mass Sensors via Cantilever-Based Micro-/ Nanostructures ...... 753 Dong F. Wang, Xu Du, Xiaodong Li, Di Zhou, Cao Xia, Guowen Zheng, Shenglai Wan, and Xin Wang Contents xi

Micromachined Humidity Sensors ...... 787 Jianqiu Huang and Qing-An Huang Piezoelectric Micro/Nano Mechanical Devices for Frequency Control and Chemical Sensing ...... 817 Wei Pang, Menglun Zhang, and Ji Liang Microsensors and Systems for Water Quality Determination ...... 847 Shanhong Xia, Jianhua Tong, Chao Bian, Jizhou Sun, and Yang Li

Part V Microactuators ...... 905

Electrostatic Comb-Drived Actuator for MEMS Relay/Switch ...... 907 Jiahao Zhao and Yongfeng Gao MEMS Actuators Driven by Lorentz Force ...... 929 Jinling Yang and Jinying Zhang A MEMS Inertial Switch Based on Nonsilicon Surface Micromachining Technology ...... 945 Zhuoqing Yang, Guifu Ding, Yan Wang, and Xiaolin Zhao A Rotary Microgripper ...... 997 Honglong Chang and Yongcun Hao Traveling-Wave Micropumps ...... 1017 Guohua Liu and Wei Zhang

Part VI RF MEMS ...... 1037

RF MEMS Switch ...... 1039 Li-Feng Wang, Qing-An Huang, and Lei Han A Microwave Power Sensor ...... 1077 Zhiqiang Zhang and Xiaoping Liao A Micromachined Reconfigurable Attenuator ...... 1117 Zewen Liu and Xin Guo High-Performance Acoustic Devices for Wireless Communication and Sensor Applications ...... 1149 Changjian Zhou, Xiangguang Tian, and Tian-Ling Ren

Part VII Optical MEMS ...... 1195

Silicon-Based Optical Sensor: Uncooled Infrared Focal Plane Array Based on Bi-Materials Cantilever Microstructures ...... 1197 Tianchun Ye, Dapeng Chen, Shali Shi, and Binbin Jiao xii Contents

Part VIII Power MEMS ...... 1265

MEMS Direct Methanol Fuel Cells ...... 1267 Yufeng Zhang, Weijian Yuan, Rui Xue, and Xiaowei Liu MEMS Piezoelectric Vibration Energy Harvesters ...... 1297 Licheng Deng, Zhiyu Wen, and Xingqiang Zhao Triboelectric Nanogenerators ...... 1335 Chi Zhang and Zhong Lin Wang

Part IX Implantable Medical Devices ...... 1377

Microelectrode Array ...... 1379 Renxin Wang, Huaiqiang Yu, and Zhihong Li Electrodes for Nerve Recording and Stimulation ...... 1413 Jing-Quan Liu, Hong-Chang Tian, Xiao-Yang Kang, and Ming-Hao Wang Electrode Array for Neural Interfaces ...... 1437 Weihua Pei and Hongda Chen Index ...... 1467 About Series Editors

Zheng You is currently a professor in the Department of Precision Instrument in Tsinghua University, Beijing, China. He is also serving as the director of Micro-Nano Technology Research Center at Tsinghua University, the director of State Key Laboratory of Precision Measure- ment Technology and Instruments, and vice president of National Institute for Nano-Technology and Engineer- ing. He has been elected as an academician of Chinese Academy of since 2013 and president of Chinese Society of Micro-Nano Technology (CSMNT). Prof. Zheng You’s main research interests fall in micro-nano technology, MEMS, satellite technology, and measurement and instruments. Prof. You has published 322 papers and 32 research reports, holds 12 Chinese invention patents, among which over 114 papers are retrieved and embodied by the SCI or EI journals. He developed the first micro satellite in China and rewarded with numerous awards including the Second-class National Scientific and Tech- nical Advance Awards, the First-class Scientific and Technical Awards of China Instrument and Control Society, the First-class and the Second-class Scientific and Technical Advance Awards of the Education Min- istry, the First-class and Second-class Scientific and Technical Advance Award of the Beijing Municipality, and Second-class Science Technology and Industry Awards for National Defense.

xiii xiv About Series Editors

Xiaohao Wang is currently a professor in the Depart- ment of Precision Instrument, Tsinghua University. He also serves as associate dean of Education and director of the Division of Advanced Manufacturing, Graduate School at Shenzhen, Tsinghua University, and executive secretary general of the Chinese Society of Micro-Nano Technology (CSMNT). Prof. Xiaohao Wang received a bachelor degree and a Ph.D. both from Tsinghua University in 1994 and 1999, respectively. During 1998 to 2001, he joined the Depart- ment of Precision Instrument in Tsinghua University as an assistant professor and was promoted to associate professor in 2001. During 2007 to 2008, he was a visiting scholar at Technische Universitaet Berlin. In 2010, he became a professor of the Department of Precision Instrument in Tsinghua University. Prof. Xiaohao Wang’s research interests cover MEMS-based sensors, actuators, ionizing sources and portable mass spectrometer, ion mobility spectrometer, and high-field asymmetric waveform ion mobility spec- trometer. He has published over 200 technical papers and applied tens of patents in the area of MEMS and the portable instrumentation. About the Editor

Qing-An Huang received the B.S. degree from the Hefei University of Technology, Hefei, China, in 1983; the M.S. degree from , Xi’an, China, in 1987; and the Ph.D. degree from Southeast Univer- sity, Nanjing, China, in 1991, all in electronics engineer- ing. His Ph.D. research was focused on micromachined GaAs piezoelectric sensors. He joined the Department of Electronic Engineering, Southeast University, after graduation, where he became a Full Professor in 1996, and was appointed as the Chang-Jiang Scholar by the Ministry of Education in 2004. He was a visiting scholar at the Hong Kong University of Science and Technology from 1997 to 1998, and a senior visiting scholar (1 month) at the Berkeley Sensor and Actuator Center, University of California at Berkeley in 2017. He has been the Founding Director of the Key Laboratory of MEMS (the Ministry of Education) with the Southeast Univer- sity since 2001. He has authored a book entitled Silicon Micromachining Technology (Science Press, 1996), authored or coauthored 4 international book chapters, over 200 peer-reviewed international journals/confer- ence papers, and holds over 100 Chinese patents. Dr. Huang was a TPC member of TRANSDUCERS from 2009 to 2017 and IEEE SENSORS Conference from 2002 to 2015. He was the conference Co-chair of the SPIE Microfabrication and Micromachining Pro- cess Technology and Devices (Proceedings of SPIE, Vol. 4601, 2001), the TPC Co-chair of the 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS, Kyoto, Japan, 2012), and the TPC Co-chair of the 6th Asia-Pacific Conference of Transducers and Micro/Nano

xv xvi About the Editor

Technologies (APCOT, Nanjing, China, 2012). He served as the Steering Committee Chair of APCOT from 2012 to 2014 and the Founding Chairman of IEEE ED/SSC Nanjing Chapter from 2008 to 2014. He has been serving as the Editor-in-Chief of the Chi- nese Journal of Sensors and Actuators since 2005. He is an Editorial Board Member of the Journal of Micro- mechanics and Microengineering. Dr. Huang served as the Head of Expert Group of Micro/Nano Fabrication Branch under the National High Technology Research and Development Program of China during 2011 to 2015, the member of Expert Group of Microelectromechanical Systems Branch under the National High Technology Research and Development Program during 2001 to 2005, and the member of Evaluation Expert Group of the Information Department under the National Natural Science Foun- dation of China during 2010 to 2011. Dr. Huang is a Fellow of the IEEE. He was a recipient of the National Outstanding Youth Science Foundation Award of China in 2003. Contributors

Chao Bian Institute of Electronics, Chinese Academy of Sciences, Beijing, China Honglong Chang MOE Key Laboratory of Micro/Nano Systems for Aerospace, Northwestern Polytechnical University, Xi’an, China Northwestern Polytechnic University, Xi’an, China Dapeng Chen Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), Beijing, China Deyong Chen State Key Laboratory of Transducer Technology, Institute of Elec- tronics, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China Hongda Chen State Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing, China Jian Chen State Key Laboratory of Transducer Technology, Institute of Electron- ics, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China Jian Cui National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, , Beijing, China Licheng Deng College of Electronic and Opticl Engineering and College of Micro- electronics, of Posts and Telecommunications, Nanjing, China Defense Key Disciplines Lab of Novel Micro-Nano Devices and System Technol- ogy, University, Chongqing, China Guifu Ding National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Jiao Tong University (SJTU), Shanghai, China Xu Du Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, University, Changchun, China

xvii xviii Contributors

Yongfeng Gao Tsinghua University, Beijing, China Yi-Fan Gu Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China Xin Guo Tsinghua University, Beijing, China Xin-Ge Guo Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China Lei Han Southeast University, Nanjing, Jiangsu, China Yongcun Hao Northwestern Polytechnic University, Xi’an, China Chunhua He National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China Yipeng Hou Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, , Changchun, Jilin, China Zhanqiang Hou of Defense Technology, Changsha, China Jianqiu Huang Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, Jiangsu, China Qing-An Huang Key Laboratory of MEMS of the Ministry of Education, South- east University, Nanjing, Jiangsu, China Toshihiro Itoh Department of Human and Engineered Environmental Studies, University of Tokyo, Chiba, Japan Zhuangde Jiang State Key Laboratory for Manufacturing Systems Engineering, Collaborative Innovation Center of Nano Science and Technology, Xi’an Jiaotong University, Xi’an, , China International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an Jiaotong University, Xi’an, Shaanxi, China Binbin Jiao Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), Beijing, China Xiao-Yang Kang Shanghai Jiao Tong University, Shanghai, China Qingsong Li National University of Defense Technology, Changsha, China Tie Li Science and Technology on Micro-system Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shang- hai, China Xiaodong Li Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, China Yang Li Institute of Electronics, Chinese Academy of Sciences, Beijing, China Contributors xix

Zhihong Li National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China Zhikang Li State Key Laboratory for Manufacturing Systems Engineering, Col- laborative Innovation Center of Suzhou Nano Science and Technology, Xi’an Jiaotong University, Xi’an, Shaanxi, China International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an Jiaotong University, Xi’an, Shaanxi, China Ji Liang State Key Laboratory of Precision Measuring Technology and Instru- ments, University, Tianjin, China Xiaoping Liao Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China Guohua Liu Key Laboratory of Photo-electronic Thin Film Devices and Technol- ogy of Tianjin, College of Electronic Information and Optical Engineering, , Tianjin, China Hai-Yun Liu Department of Electronics and Information Engineering, Hohai Uni- versity, Nanjing, Jiangsu, China Huan Liu Micro Engineering and Micro Systems Laboratory, School of Mechan- ical Science and Engineering, Jilin University, Changchun, Jilin, China Jing-Quan Liu Shanghai Jiao Tong University, Shanghai, China Xiaowei Liu MEMS Center, Harbin Institute of Technology, Harbin, China Ying Liu School of Arts and Sciences, Shaanxi University of Science and Tech- nology, Xi’an, China Zewen Liu Tsinghua University, Beijing, China Yulan Lu State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China Ryutaro Maeda Ubiquitous MEMS and Micro Engineering Research Center, AIST Tsukuba, Ibaraki, Japan Wei Pang State Key Laboratory of Precision Measuring Technology and Instru- ments, , Tianjin, China Weihua Pei State Key Laboratory of Integrated Optoelectronics, Institute of Semi- conductors, Chinese Academy of Sciences, Beijing, China CAS Center for Excellence in Brain Science and Intelligence Technology, Beijing, China University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing, China xx Contributors

Ming Qin Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China Tian-Ling Ren Institute of Microelectronics, Tsinghua University, Beijing, China Wenzhou Ruan Tsinghua University, Beijing, China Xuesong Shang Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, Jilin, China Shali Shi Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), Beijing, China Jizhou Sun Institute of Electronics, Chinese Academy of Sciences, Beijing, China Zhenan Tang School of Microelectronics, Dalian University of Technology, Dalian, China Hong-Chang Tian Shanghai Jiao Tong University, Shanghai, China Xiangguang Tian Institute of Microelectronics, Tsinghua University, Beijing, China Jianhua Tong Institute of Electronics, Chinese Academy of Sciences, Beijing, China Shenglai Wan Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, China Dong F. Wang Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, Jilin, China Research Center for Ubiquitous MEMS and Micro Engineering, AIST, Tsukuba, Japan Jiaqi Wang Institute of Microelectronics, Dalian University of Technology, Dalian, China Junbo Wang State Key Laboratory of Transducer Technology, Institute of Elec- tronics, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China Li-Feng Wang Southeast University, Nanjing, Jiangsu, China Ming-Hao Wang Shanghai Jiao Tong University, Shanghai, China Renxin Wang Science and Technology on Electronic Test and Measurement Lab- oratory, North University of China, Taiyuan, China Xin Wang Micro Engineering and Micro Systems Laboratory, School of Mechan- ical Science and Engineering, Jilin University, Changchun, China Contributors xxi

Yan Wang National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University (SJTU), Shanghai, China Yuelin Wang Science and Technology on Micro-system Laboratory, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sci- ences, Shanghai, China Zheyao Wang Tsinghua University, Beijing, China Zhong Lin Wang Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China School of Material Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA Zhiyu Wen Defense Key Disciplines Lab of Novel Micro-Nano Devices and System Technology, , Chongqing, China Xuezhong Wu National University of Defense Technology, Changsha, China Cao Xia Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, China Shanhong Xia Institute of Electronics, Chinese Academy of Sciences, Beijing, China Weikang Xian Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, Jilin, China Dingbang Xiao National University of Defense Technology, Changsha, China Bo Xie State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China Jianbing Xie MOE Key Laboratory of Micro/Nano Systems for Aerospace, North- western Polytechnical University, Xi’an, China Yan Xing Southeast University, Nanjing, China Lei Xu School of Information Science and Technology, University of Science and Technology of China, Hefei, China Tingzhong Xu State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Collaborative Innovation Center of Suzhou Nano Science and Tech- nology, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an, China Rui Xue MEMS Center, Harbin Institute of Technology, Harbin, China xxii Contributors

Guizhen Yan National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China Jinling Yang Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China State Key Laboratory of Transducer Technology, Shanghai, China School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China Xu Yang Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, Jilin, China Zhuoqing Yang National Key Laboratory of Science and Technology on Micro/ Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University (SJTU), Shanghai, China Tianchun Ye Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), Beijing, China Zhenxiang Yi Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China Huaiqiang Yu Research Institute, China Electronics Technology Group Corpora- tion, Chongqing, China Xiaomei Yu National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Haidian , Beijing, China Quan Yuan Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China State Key Laboratory of Transducer Technology, Shanghai, China Weijian Yuan MEMS Center, Harbin Institute of Technology, Harbin, China Chi Zhang Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China Jinying Zhang Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China State Key Laboratory of Transducer Technology, Shanghai, China School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China Menglun Zhang State Key Laboratory of Precision Measuring Technology and Instruments, Tianjin University, Tianjin, China Contributors xxiii

Wei Zhang Key Laboratory of Photo-electronic Thin Film Devices and Technol- ogy of Tianjin, College of Electronic Information and Optical Engineering, Nankai University, Tianjin, China Yufeng Zhang MEMS Center, Harbin Institute of Technology, Harbin, China Zhiqiang Zhang Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China Jiahao Zhao Tsinghua University, Beijing, China Libo Zhao State Key Laboratory for Manufacturing Systems Engineering, Collab- orative Innovation Center of Suzhou Nano Science and Technology, Xi’an Jiaotong University, Xi’an, Shaanxi, China International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an Jiaotong University, Xi’an, Shaanxi, China Qiancheng Zhao National Key Laboratory of Science and Technology on Micro/ Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China Rui Zhao Science and Technology on Electronic Test and Measurement Labora- tory, School of Instrument and Electronics, North University of China, Taiyuan, , China Xiaolin Zhao National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University (SJTU), Shanghai, China Xingqiang Zhao School of Information and Control, Nanjing University of Infor- mation Science and Technology, Nanjing, China Yihe Zhao State Key Laboratory for Manufacturing Systems Engineering, Collab- orative Innovation Center of Suzhou Nano Science and Technology, Xi’an Jiaotong University, Xi’an, Shaanxi, China International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an Jiaotong University, Xi’an, Shaanxi, China Yulong Zhao State Key Laboratory for Manufacturing Systems Engineering, Inter- national Joint Laboratory for Micro/Nano Manufacturing and Measurement Tech- nologies, Collaborative Innovation Center of Suzhou Nano Science and Technology, School of Mechanical Engineering, Xi’an Jiaotong University, Xi’an, China Guowen Zheng Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, China Changjian Zhou School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China Di Zhou Micro Engineering and Micro Systems Laboratory, School of Mechanical Science and Engineering, Jilin University, Changchun, China xxiv Contributors

Zai-Fa Zhou Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, Jiangsu, China Lin Zhu State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, China University of Chinese Academy of Sciences, Beijing, China Rong Zhu State Key Laboratory of Precision Measurement Technology and Instru- ment, Department of Precision Instrument, Tsinghua University, Beijing, China