SIGMATEL, INC. (Exact Name of Registrant As Specified in Its Charter) Delaware 74-2691412 (State Or Other Jurisdiction of (I.R.S
Total Page:16
File Type:pdf, Size:1020Kb
Load more
Recommended publications
-
Mobile Audio IC Industry Report, 2007-2008
Mobile Audio IC Industry Report, 2007-2008 MobileaudioICismainlyappliedtomobilephoneandMP3 playersandnowitisextendedtogameconsole,hand-held navigation,digitalcameraandotherfields.However, applicationinthesefieldsisstillsmall,Comparedtothatin mobilephoneandMP3players.MobilephoneaudioICis dividedintothreecategories,namelymelodyIC,CODEC,and audioamplifierIC.TheaudioICofMP3playersmainlyadopts MP3decoderICandCODEC. MelodyICmarketprospectsarebleak.Keyglobalmobile phonemanufacturers,likeNokia,Motorola,Sony-Ericssonand Siemens,seldomadoptmelodyIC.Especiallysince2005,the fourbigproducershavegenerallyusedapplicationprocessor andcustomizedanalogbaseband toreplacemelodyIC.In earlystage,mainlyJapanesemobilephoneproducers, Samsung,LGandChinesehandsetproducersadoptedmelody ICchips.Nowadays,onlyJapanesemanufacturersstillinsist onadoptingmelodyIC,andtherestallhavegivenitup. ThereareonlyasmallnumberofaudioCODECmanufacturers,mainlyTI,AKMandWolfson Microelectronics.Audio CODECmarketentrythresholdisveryhigh,andonlythemanufacturersmasteringDELTA-SIGMAconversioncan winthemselvesaplaceinthefield.What'smore,audioCODECis mostlyappliedtocompressedmusicplayers,and especiallyahugeamountisusedinMP3anddigitalcamera.ToCODECproducers,mobilephoneisonlytheir sidelinebusiness,aboutwhichtheydon'tcaremuch,iftheyloseit.AsforMP3player,Wolfson isabsolutelythe marketdominator,monopolizingthemarket.Asfornon-portablemusicplayerslikeCDplayerandprofessional acousticsequipment,ADI,AKMandCirrussharethemarket.Wolfson isseldominvolvedinthehigh-quality audiomarket.Thesemanufacturersarecomparativelyconservative,andtheydon'tpaymuchattentiontoportable -
Offshoring in the Semiconductor Industry: a Historical Perspective
Offshoring in the Semiconductor Industry: A Historical Perspective Clair Brown and Greg Linden U.C. Berkeley Abstract: Semiconductor design is one of the many white-collar job categories considered to be at risk from offshoring by U.S. companies via investments and outsourcing. Data about this activity are scarce and hard to interpret, but there is much to be learned from looking at earlier periods in the industry’s history when other phases of the semiconductor value chain – assembly and fabrication – experienced rapid offshore expansion. This paper reviews the lessons from these earlier offshore movements of semiconductor industry jobs. Then it analyzes the current experience of the offshoring of semiconductor design based on our ongoing field research. The experience of earlier periods supports the claim by some that offshoring is a reasonable response to the competitive challenges and opportunities facing the semiconductor industry, and that the industry will adapt in ways that aren’t necessarily clear from the outset. Nevertheless, there is evidence that some U.S. chip design engineers face at least short-term displacement as a result of the industry’s current round of globalization. October 7, 2005 This is a work-in-progress with data collection still underways. An earlier version was presented at the 2005 Brookings Trade Forum on Offshoring of White-Collar Work. A revised version will be available earlier next year in the Trade Forum proceedings. Acknowledgments The authors would like to thank the Alfred P. Sloan Foundation, the Institute for Technology, Enterprise and Competitiveness (ITEC/COE), and Omron Fellowship at Doshisha University for funding, and the Institute of Industrial Relations, UC Berkeley, for administrative support. -
XPS M1210 Owner's Manual
Dell™ XPS™ M1210 Owner’s Manual Model PP11S www.dell.com | support.dell.com Notes, Notices, and Cautions NOTE: A NOTE indicates important information that helps you make better use of your computer. NOTICE: A NOTICE indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. CAUTION: A CAUTION indicates a potential for property damage, personal injury, or death. Abbreviations and Acronyms For a complete list of abbreviations and acronyms, see "Glossary" on page 177. ® ® If you purchased a Dell™ n Series computer, any references in this document to Microsoft Windows operating systems are not applicable. ____________________ Information in this document is subject to change without notice. © 2006 Dell Inc. All rights reserved. Reproduction in any manner whatsoever without the written permission of Dell Inc. is strictly forbidden. Trademarks used in this text: Dell, the DELL logo, Inspiron, Dell Precision, Dimension, OptiPlex, Latitude, PowerEdge, PowerConnect, PowerVault, PowerApp, Dell TravelLite, ExpressCharge, Wi-Fi Catcher, Dell MediaDirect, Strike Zone, and XPS are trademarks of Dell Inc.; Core is a trademark and Intel, Celeron, and Pentium are registered trademarks of Intel Corporation; Microsoft, Outlook, and Windows are registered trademarks of Microsoft Corporation; Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and is used by Dell under license; EMC is a registered trademark of EMC Corporation; ENERGY STAR is a registered trademark of the U.S. Environmental Protection Agency. Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products. -
Q1 Report.Pub
Volume 1 Issue 1 Fabless Fundings Methodology The Fabless Semiconductor Association (FSA) has published its first Fabless Fundings quarterly report. The Q1 2002 Fabless Fundings report is based on secondary research collected by the FSA and includes an overview of the fabless funding deals and the IPOs that occurred in 2000, 2001 and the first quarter of 2002. The fundings are listed as they occurred by month. In addition to the listing, the Fabless Fundings report segments funding activity by a variety of criteria, including (for 2000 and 2001): • The total number of fundings • The total amount of all private equity investments • The average amount per deal • The average number of deals per quarter • The average amount per quarter • The median amount per quarter • The average number of fundings per round • The average amount per round • Percent of fundings by geography For 2002, the funding activity is segmented by: • Average funding amount • The average number of deals per round • The average amount of funding per round • Percent of funding deals by geography Data was collected using information from both private and public information sources, such as Venture Economics, the funded companies’ Web sites, FSA surveys, IPO.com, press releases and industry articles posted on respective Web sites. Fabless Fundings Analysis The first edition of the FSA’s Fabless Fundings quarterly report reviews all fundings received by fabless companies in 2000, 2001 and Q1 2002. Summary of Fabless Funding In 2000, the fabless semiconductor industry experienced a banner year. Public fabless companies grew an amazing 68% in 2000, practically doubling the growth of the worldwide semiconductor industry (38%)! Because of their total focus on prod- uct and design innovation, fabless companies are quick to respond to market changes. -
I.MX23 EVK 1.7 Linux Reference Manual
i.MX23 EVK 1.7 Linux Reference Manual Document Number: 924-76389 Rev. 2009.12 01/2010 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Information in this document is provided solely to enable system and software Technical Information Center, EL516 implementers to use Freescale Semiconductor products. There are no express or 2100 East Elliot Road implied copyright licenses granted hereunder to design or fabricate any integrated Tempe, Arizona 85284 1-800-521-6274 or circuits or integrated circuits based on the information in this document. +1-480-768-2130 Freescale Semiconductor reserves the right to make changes without further notice to www.freescale.com/support any products herein. Freescale Semiconductor makes no warranty, representation or Europe, Middle East, and Africa: guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Halbleiter Deutschland GmbH Technical Information Center Freescale Semiconductor assume any liability arising out of the application or use of Schatzbogen 7 any product or circuit, and specifically disclaims any and all liability, including without 81829 Muenchen, Germany limitation consequential or incidental damages. “Typical” parameters which may be +44 1296 380 456 (English) provided in Freescale Semiconductor data sheets and/or specifications can and do +46 8 52200080 (English) +49 89 92103 559 (German) vary in different applications and actual performance may vary over time. All operating +33 1 69 35 48 48 (French) parameters, including “Typicals” must be validated for each customer application by www.freescale.com/support customer’s technical experts. -
Offshoring in the Semiconductor Industry: a Historical Perspective Clair Brown and Greg Linden U.C
Prepared for the 2005 Brookings Trade Forum on Offshoring of White-Collar Work Draft (May 1, 2005) Offshoring in the Semiconductor Industry: A Historical Perspective Clair Brown and Greg Linden U.C. Berkeley May 2005 Abstract: Semiconductor design is a frequently-cited example of the new wave of offshoring and foreign-outsourcing of service sector jobs.1 It is certainly a concern to U.S. design engineers themselves.2 In addition to the current wave of white-collar outsourcing, the industry also has a rich experience with offshoring of manufacturing activity. Semiconductor companies were among the first to invest in offshore facilities to manufacture goods for imports back to the U.S. A brief review of these earlier manufacturing experiences and their impact on the fortunes of the domestic industry and its workers can help to illuminate the current debates over offshoring in services. Because meaningful data about the impact of the offshoring of chip design (and even manufacturing) are limited, we rely on a more qualitative analysis for our key points. We have conducted dozens of interviews with engineers and managers at numerous semiconductor and related companies in the United States, Asia, and Europe over the past six years. Our research also incorporates the rich store of publicly available information in trade journals and company reports. This paper describes the two previous stages of offshoring semiconductor assembly jobs and of outsourcing semiconductor manufacturing and the impact they had on the U.S. semiconductor industry. We argue that the initial concern about losing domestic jobs in both stages turned out to be unfounded as the industry used the situation to its competitive advantage by becoming cost competitive (assembly stage) and by developing the fabless sector (manufacturing stage). -
Certain Audio Processing Integrated Circuits and Products Containing Same
In the Matter of Certain Audio Processing Integrated Circuits and Products Containing Same Investigation No. 337-TA-538 Publication 3991 Mayl008 J, U.S. International Trade Commission Washington, DC 20436 U.S. International Trade Commission COMMISSIONERS Daniel R. Pearson, Chairman Shara L. Aranoff, Vice Chairman Deanna Tanner Okun Charlotte R. Lane Irving A. Williamson* Dean A. Pinkert* *Commissioner Marcia E. Miller, whose term ended on September 6, 2005, participated in the decision to institute the investigation. Commissioner Shara L. Aranoff, whose term commenced on September 6, 2005, participated in all subsequent phases of the investigation. Commissioner Irving A. Williamson was sworn in on February 7, 2007, and Commissioner Dean A. Pinkert was sworn in on February 26, 2007; they did not participate in this investigation. Commissioner Stephen Koplan, whose term ended on February 6, 2007, and Commissioner Jennifer A. Hillman, whose term ended on February 23, 2007, did participate in this investigation. Address all communications to Secretary to the Commission United States International Trade Commission Washington, DC 20436 U.S. International Trade Commission Washington, DC 20436 www.usitc.gov In the Matter of Certain Audio Processing Integrated Circuits and Products Containing Same Investigation No. 337-TA-538 Publication 3991 May 2008 UNITED STATES INTERNATIONAL TRADE COMMISSION Washington, D.C. 20436 ) In the Matter of .) ) CERTAIN AUDIO PROCESSING INTEGRATED ) Inv. No. 337-TA:..iS38 CIRCUITS AND PRODUCTS CONTAINING SAME ) NOTICE OF COMMISSION FINAL DETERMINATION OF A VIOLATION OF SECTION 337 AS TO TWO PATENTS AND ISSUANCE OF A LIMITED EXCLUSION ORDER; TERMINATION OF INVESTIGATION AGENCY: U.S. International Trade Commission. ACTION: Notice.