Offshoring in the Semiconductor Industry: a Historical Perspective Clair Brown and Greg Linden U.C

Total Page:16

File Type:pdf, Size:1020Kb

Offshoring in the Semiconductor Industry: a Historical Perspective Clair Brown and Greg Linden U.C Prepared for the 2005 Brookings Trade Forum on Offshoring of White-Collar Work Draft (May 1, 2005) Offshoring in the Semiconductor Industry: A Historical Perspective Clair Brown and Greg Linden U.C. Berkeley May 2005 Abstract: Semiconductor design is a frequently-cited example of the new wave of offshoring and foreign-outsourcing of service sector jobs.1 It is certainly a concern to U.S. design engineers themselves.2 In addition to the current wave of white-collar outsourcing, the industry also has a rich experience with offshoring of manufacturing activity. Semiconductor companies were among the first to invest in offshore facilities to manufacture goods for imports back to the U.S. A brief review of these earlier manufacturing experiences and their impact on the fortunes of the domestic industry and its workers can help to illuminate the current debates over offshoring in services. Because meaningful data about the impact of the offshoring of chip design (and even manufacturing) are limited, we rely on a more qualitative analysis for our key points. We have conducted dozens of interviews with engineers and managers at numerous semiconductor and related companies in the United States, Asia, and Europe over the past six years. Our research also incorporates the rich store of publicly available information in trade journals and company reports. This paper describes the two previous stages of offshoring semiconductor assembly jobs and of outsourcing semiconductor manufacturing and the impact they had on the U.S. semiconductor industry. We argue that the initial concern about losing domestic jobs in both stages turned out to be unfounded as the industry used the situation to its competitive advantage by becoming cost competitive (assembly stage) and by developing the fabless sector (manufacturing stage). We then analyze the on-going stage of offshoring design jobs, and compare this stage to the two that came before in order to explore the possible impact on domestic jobs and the U.S. semiconductor industry. We begin in section one with a brief description of the stages of semiconductor production and our analytical framework. Section two looks at the offshoring of assembly jobs, and section three analyzes the foreign outsourcing of manufacturing. Section four explores the offshoring of design jobs, and concludes with a discussion of what this means for the U.S. Acknowledgments The authors would like to thank the Alfred P. Sloan Foundation, the Institute for Technology, Enterprise and Competitiveness (ITEC/COE), and Omron Fellowship for funding, and the Institute of Industrial Relations, UC Berkeley, for administrative support. They are also grateful to Ben Campbell, Michael Flynn, Ron Hira, Dave Hodges, Rob Leachman, Elena Obukhova, Devadas Pillai, and Bill Van Der Vort for their valuable contributions, and to Melissa Appleyard, Hank Chesbrough, Jason Dedrick, Rafiq 1 See for example “The New Global Job Shift,” Business Week, February 3, 2003, cover story and “Another Lure Of Outsourcing: Job Expertise,” Wall Street Journal, April 12, 2004; Page B1. 2 “2004 Salary Survey: It's an outsourced world, EEs acknowledge,” EE Times, August 27, 2004. Brown and Linden - 2 Dossani, Richard Freeman, Deepak Gupta, Bradford Jensen, Ken Kraemer, Frank Levy, and Tim Sturgeon for helpful discussions. The authors are responsible for any errors. I. Introduction: The Industry and Analytical Framework In order to understand the process of outsourcing of activities in the semiconductor industry, we begin by describing the stages of production. The most important type of semiconductor, and the one which concerns us here, is the integrated circuit, or “chip,” which is basically a network of tiny wires fabricated on a surface connecting transistors that switch on and off for processing data in binary code. The development and manufacturing of semiconductors involve three primary activities in the value chain: design, fabrication (front end), test and assembly (back end). During design, the desired electronic circuits progress through a series of abstract to physical representations. During fabrication, the circuits of the chips are built up on the surface of a flat, round silicon wafer in successive layers Assembly is, typically, the process of cutting the wafer into individual chips (or die), which can number up to 1000, depending on die size, and packaging the delicate chip in a protective shell that includes connections to other components. The semiconductor industry has successively undergone phases of offshoring—first assembly, then fabrication, and now design. The economic characteristics of each step of the process differ significantly. Design is skill intensive, and requires expensive EDA (electronic design automation) tools, which tend to be licensed per design engineer Fabrication required a huge fixed investment (currently on the order of $2 billion) to build a plant (called a fab) that holds a wide variety of expensive equipment and that meets extreme requirements of cleanliness. Assembly requires expensive test and assembly equipment, but the overall costs of plant and equipment are much lower than for the fab. Overall, worker skill requirements go up along the value chain. Semiconductors can be cost-effective to offshore in any location with adequate transportation facilities because their very high value-to-weight ratio reduces the penalty for long hauls between factory and customer or between stages of production. However, equipment costs dominate labor costs, especially for fabrication, and this has limited the attractiveness of low-cost labor locations. Even the most labor-intensive activity, chip assembly, has become more automated over time. As discussed below, other costs, including those relating to land, taxes, and government regulations, often affect decisions to offshore. The framework within which we will analyze the offshoring of the stages of the industry value chain relies on the concept of competitive advantage (Porter, 1985). A sustained advantage over rivals can be built on product (i.e., the intellectual property that defines functionality), price (i.e., the cost of production), or market attributes (i.e., new customers, customer service, brand reputation, and links to legacy products). These sources of competitive advantage provide the three principal reasons that firms offshore one of their activities: access to location-specific resources including engineering talent, cost reduction, and market development. When a firm with some non-imitable advantage moves an activity offshore to reduce its costs or improve access to resources, it improves (barring cases where the move is mismanaged) its competitive position against its rivals. In an expanding market like that for chips, the firm will grow and will hire more workers, some of whom will be in the home country and some offshore. However, some or all of the workers in the home country who were engaged in the activity that shifted offshore may lose their jobs, so that only the remaining home country workers benefit from the firm’s move offshore, along with the consumers of the lower-price products (see, for example, Garner, 2004). In addition, both exports and imports are increasing with market growth and the net impact of trade on jobs must be considered (Groshen, et al., 2005). Brown and Linden - 3 Numerous firm-level investments in a foreign location may change the location in such a way that it presents a new set of opportunities that lead to a transformation of the industry. A foreign location that is initially little more than a source of lower costs, especially labor, might develop over time as a specialized supply base. The changes can increase the value of the location to the point that the industry will eventually restructure around the new distribution of skills, and offshoring becomes the preferred mode for this activity. We will discuss below how this occurred for semiconductor assembly, but it has also taken place in other industries, such as hard disk drives (McKendrick, et al., 2000). II. Offshore Assembly: from offshoring to outsourcing Assembly was the easiest stage of production to be moved offshore. It was functionally separate from the other stages of production even when performed in close proximity to fabrication. Furthermore, assembly began with a relatively high use of less-skilled direct labor. During the 1980s, the US offshore companies switched to automation in response to a combination of increasingly intricate packaging requirements and higher equipment costs along with rising wages in some South-East Asian nations. As a result, the output per worker increased, and the typical plant still employs 1,000 or more workers. As of the mid-1990s, low-skilled workers made up about 80% of the staff of offshore assembly plants. The share of engineering and professional jobs was about 6%, and technicians made up another 13%.3 The move to offshore assembly led to a “hollowing out” of the US chip assembly sector, but kept the US chip industry cost-competitive as new rivals appeared in Europe and Japan. Over time, Asian suppliers appeared and took over a large portion of the business, so it went from offshoring to outsourcing, although most IDMs still own some assembly plants in Asia. The main lesson from this period of offshoring is that giving up one part of the value chain (at least as far as domestic production is concerned) may be necessary to “save” the domestic industry. The second lesson is that the initial moves offshore can have unforeseen dynamic consequences such as the emergence of foreign suppliers who dominate the industry segment. A. Offshoring, job loss, and competition Because of their high value-to-weight ratio, semiconductors could profitably be fabricated in the United States, air-freighted to Asia for assembly, and then returned to the United States for final testing and shipment to the customer. This system allowed the U.S. companies to take advantage of the specialized skilled and semi-skilled labor in the United States for design, fabrication, and key managerial functions while tapping the lower cost unskilled labor, land, and taxes of Asia for assembly.
Recommended publications
  • Mobile Audio IC Industry Report, 2007-2008
    Mobile Audio IC Industry Report, 2007-2008 MobileaudioICismainlyappliedtomobilephoneandMP3 playersandnowitisextendedtogameconsole,hand-held navigation,digitalcameraandotherfields.However, applicationinthesefieldsisstillsmall,Comparedtothatin mobilephoneandMP3players.MobilephoneaudioICis dividedintothreecategories,namelymelodyIC,CODEC,and audioamplifierIC.TheaudioICofMP3playersmainlyadopts MP3decoderICandCODEC. MelodyICmarketprospectsarebleak.Keyglobalmobile phonemanufacturers,likeNokia,Motorola,Sony-Ericssonand Siemens,seldomadoptmelodyIC.Especiallysince2005,the fourbigproducershavegenerallyusedapplicationprocessor andcustomizedanalogbaseband toreplacemelodyIC.In earlystage,mainlyJapanesemobilephoneproducers, Samsung,LGandChinesehandsetproducersadoptedmelody ICchips.Nowadays,onlyJapanesemanufacturersstillinsist onadoptingmelodyIC,andtherestallhavegivenitup. ThereareonlyasmallnumberofaudioCODECmanufacturers,mainlyTI,AKMandWolfson Microelectronics.Audio CODECmarketentrythresholdisveryhigh,andonlythemanufacturersmasteringDELTA-SIGMAconversioncan winthemselvesaplaceinthefield.What'smore,audioCODECis mostlyappliedtocompressedmusicplayers,and especiallyahugeamountisusedinMP3anddigitalcamera.ToCODECproducers,mobilephoneisonlytheir sidelinebusiness,aboutwhichtheydon'tcaremuch,iftheyloseit.AsforMP3player,Wolfson isabsolutelythe marketdominator,monopolizingthemarket.Asfornon-portablemusicplayerslikeCDplayerandprofessional acousticsequipment,ADI,AKMandCirrussharethemarket.Wolfson isseldominvolvedinthehigh-quality audiomarket.Thesemanufacturersarecomparativelyconservative,andtheydon'tpaymuchattentiontoportable
    [Show full text]
  • SIGMATEL, INC. (Exact Name of Registrant As Specified in Its Charter) Delaware 74-2691412 (State Or Other Jurisdiction of (I.R.S
    OP TIMIZING MULTIMEDIA S IGMA T EL® S IGMA T EL® 1601 S. Mo Pac Expressway, Suite 100 Austin, TX 78746 Sigmatel , Inc. 2005 Annual Report to Stockholders 512-381-3700 [email protected] CORPORATE PROFILE SigmaTel enables a true multimedia experience. Founded in 1993, SigmaTel designs, develops, and markets analog intensive, mixed-signal semi- conductor solutions for a wide range of digital multimedia products in the con- sumer electronics and computing markets. SigmaTel provides its customers complete, system-level solutions that include highly-integrated semiconductors, customizable firmware, reference designs, software development tools, and applications support. [ CAPITALIZING ON MARKET OPPORTUNITIES ] ENGLAND* CHINA* *USA *JAPAN KOREA* *TAIWAN *SINGAPORE TO OUR STOCKHOLDERS: Fiscal 2005 was a year of accomplishments and transi- increased performance, longer battery life and greater tion. Our strategy to improve our competitive stance has multimedia functionality we can provide, along with the been a multi-level approach based on new products, future roadmap that includes the integration of new tech- enhancing product features, strengthening intellectual nologies such as Bluetooth, WiFi, ultra wide band, GPS property, and aggressive pricing. We are focused on and others. It is essential for SigmaTel to provide the execution and integration across all product lines and highest level of innovation and performance in the mar- are confident that our strategic investments in 2005 have ket for the best value. The integration of our MPEG4 ASP positioned us to drive future growth. and H.264 video capabilities with the high performance of our audio solutions will drive product performance We reported revenue growth of 67% for the fiscal year to the next level and provide greater potential for new 2005 compared to 2004.
    [Show full text]
  • Offshoring in the Semiconductor Industry: a Historical Perspective
    Offshoring in the Semiconductor Industry: A Historical Perspective Clair Brown and Greg Linden U.C. Berkeley Abstract: Semiconductor design is one of the many white-collar job categories considered to be at risk from offshoring by U.S. companies via investments and outsourcing. Data about this activity are scarce and hard to interpret, but there is much to be learned from looking at earlier periods in the industry’s history when other phases of the semiconductor value chain – assembly and fabrication – experienced rapid offshore expansion. This paper reviews the lessons from these earlier offshore movements of semiconductor industry jobs. Then it analyzes the current experience of the offshoring of semiconductor design based on our ongoing field research. The experience of earlier periods supports the claim by some that offshoring is a reasonable response to the competitive challenges and opportunities facing the semiconductor industry, and that the industry will adapt in ways that aren’t necessarily clear from the outset. Nevertheless, there is evidence that some U.S. chip design engineers face at least short-term displacement as a result of the industry’s current round of globalization. October 7, 2005 This is a work-in-progress with data collection still underways. An earlier version was presented at the 2005 Brookings Trade Forum on Offshoring of White-Collar Work. A revised version will be available earlier next year in the Trade Forum proceedings. Acknowledgments The authors would like to thank the Alfred P. Sloan Foundation, the Institute for Technology, Enterprise and Competitiveness (ITEC/COE), and Omron Fellowship at Doshisha University for funding, and the Institute of Industrial Relations, UC Berkeley, for administrative support.
    [Show full text]
  • XPS M1210 Owner's Manual
    Dell™ XPS™ M1210 Owner’s Manual Model PP11S www.dell.com | support.dell.com Notes, Notices, and Cautions NOTE: A NOTE indicates important information that helps you make better use of your computer. NOTICE: A NOTICE indicates either potential damage to hardware or loss of data and tells you how to avoid the problem. CAUTION: A CAUTION indicates a potential for property damage, personal injury, or death. Abbreviations and Acronyms For a complete list of abbreviations and acronyms, see "Glossary" on page 177. ® ® If you purchased a Dell™ n Series computer, any references in this document to Microsoft Windows operating systems are not applicable. ____________________ Information in this document is subject to change without notice. © 2006 Dell Inc. All rights reserved. Reproduction in any manner whatsoever without the written permission of Dell Inc. is strictly forbidden. Trademarks used in this text: Dell, the DELL logo, Inspiron, Dell Precision, Dimension, OptiPlex, Latitude, PowerEdge, PowerConnect, PowerVault, PowerApp, Dell TravelLite, ExpressCharge, Wi-Fi Catcher, Dell MediaDirect, Strike Zone, and XPS are trademarks of Dell Inc.; Core is a trademark and Intel, Celeron, and Pentium are registered trademarks of Intel Corporation; Microsoft, Outlook, and Windows are registered trademarks of Microsoft Corporation; Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and is used by Dell under license; EMC is a registered trademark of EMC Corporation; ENERGY STAR is a registered trademark of the U.S. Environmental Protection Agency. Other trademarks and trade names may be used in this document to refer to either the entities claiming the marks and names or their products.
    [Show full text]
  • Q1 Report.Pub
    Volume 1 Issue 1 Fabless Fundings Methodology The Fabless Semiconductor Association (FSA) has published its first Fabless Fundings quarterly report. The Q1 2002 Fabless Fundings report is based on secondary research collected by the FSA and includes an overview of the fabless funding deals and the IPOs that occurred in 2000, 2001 and the first quarter of 2002. The fundings are listed as they occurred by month. In addition to the listing, the Fabless Fundings report segments funding activity by a variety of criteria, including (for 2000 and 2001): • The total number of fundings • The total amount of all private equity investments • The average amount per deal • The average number of deals per quarter • The average amount per quarter • The median amount per quarter • The average number of fundings per round • The average amount per round • Percent of fundings by geography For 2002, the funding activity is segmented by: • Average funding amount • The average number of deals per round • The average amount of funding per round • Percent of funding deals by geography Data was collected using information from both private and public information sources, such as Venture Economics, the funded companies’ Web sites, FSA surveys, IPO.com, press releases and industry articles posted on respective Web sites. Fabless Fundings Analysis The first edition of the FSA’s Fabless Fundings quarterly report reviews all fundings received by fabless companies in 2000, 2001 and Q1 2002. Summary of Fabless Funding In 2000, the fabless semiconductor industry experienced a banner year. Public fabless companies grew an amazing 68% in 2000, practically doubling the growth of the worldwide semiconductor industry (38%)! Because of their total focus on prod- uct and design innovation, fabless companies are quick to respond to market changes.
    [Show full text]
  • I.MX23 EVK 1.7 Linux Reference Manual
    i.MX23 EVK 1.7 Linux Reference Manual Document Number: 924-76389 Rev. 2009.12 01/2010 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Information in this document is provided solely to enable system and software Technical Information Center, EL516 implementers to use Freescale Semiconductor products. There are no express or 2100 East Elliot Road implied copyright licenses granted hereunder to design or fabricate any integrated Tempe, Arizona 85284 1-800-521-6274 or circuits or integrated circuits based on the information in this document. +1-480-768-2130 Freescale Semiconductor reserves the right to make changes without further notice to www.freescale.com/support any products herein. Freescale Semiconductor makes no warranty, representation or Europe, Middle East, and Africa: guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Halbleiter Deutschland GmbH Technical Information Center Freescale Semiconductor assume any liability arising out of the application or use of Schatzbogen 7 any product or circuit, and specifically disclaims any and all liability, including without 81829 Muenchen, Germany limitation consequential or incidental damages. “Typical” parameters which may be +44 1296 380 456 (English) provided in Freescale Semiconductor data sheets and/or specifications can and do +46 8 52200080 (English) +49 89 92103 559 (German) vary in different applications and actual performance may vary over time. All operating +33 1 69 35 48 48 (French) parameters, including “Typicals” must be validated for each customer application by www.freescale.com/support customer’s technical experts.
    [Show full text]
  • Certain Audio Processing Integrated Circuits and Products Containing Same
    In the Matter of Certain Audio Processing Integrated Circuits and Products Containing Same Investigation No. 337-TA-538 Publication 3991 Mayl008 J, U.S. International Trade Commission Washington, DC 20436 U.S. International Trade Commission COMMISSIONERS Daniel R. Pearson, Chairman Shara L. Aranoff, Vice Chairman Deanna Tanner Okun Charlotte R. Lane Irving A. Williamson* Dean A. Pinkert* *Commissioner Marcia E. Miller, whose term ended on September 6, 2005, participated in the decision to institute the investigation. Commissioner Shara L. Aranoff, whose term commenced on September 6, 2005, participated in all subsequent phases of the investigation. Commissioner Irving A. Williamson was sworn in on February 7, 2007, and Commissioner Dean A. Pinkert was sworn in on February 26, 2007; they did not participate in this investigation. Commissioner Stephen Koplan, whose term ended on February 6, 2007, and Commissioner Jennifer A. Hillman, whose term ended on February 23, 2007, did participate in this investigation. Address all communications to Secretary to the Commission United States International Trade Commission Washington, DC 20436 U.S. International Trade Commission Washington, DC 20436 www.usitc.gov In the Matter of Certain Audio Processing Integrated Circuits and Products Containing Same Investigation No. 337-TA-538 Publication 3991 May 2008 UNITED STATES INTERNATIONAL TRADE COMMISSION Washington, D.C. 20436 ) In the Matter of .) ) CERTAIN AUDIO PROCESSING INTEGRATED ) Inv. No. 337-TA:..iS38 CIRCUITS AND PRODUCTS CONTAINING SAME ) NOTICE OF COMMISSION FINAL DETERMINATION OF A VIOLATION OF SECTION 337 AS TO TWO PATENTS AND ISSUANCE OF A LIMITED EXCLUSION ORDER; TERMINATION OF INVESTIGATION AGENCY: U.S. International Trade Commission. ACTION: Notice.
    [Show full text]