Electrical Design Platform on Engineering Cloud
Electrical Design Platform on Engineering Cloud
Takeo Nakamura Kiyokazu Moriizumi Toshiro Sato Shuichiro Yamada
The conventional requirements of monozukuri (manufacturing) included needs for high performance, miniaturization, low costs and fast development. In addition to these, product development has come to require businesses to fulfill their social responsibilities in areas such as business continuity and consideration for the environment and safety. In order to respond to these changes in technologies and the business environment, it is essential to introduce development processes and a development environment that allow for effective governance of development overall. Fujitsu has integrated the know-how of monozukuri cultivated over many years, and built Flexible Technical Computing Platform (FTCP) as the integrated design development environment. It has provided it to customers in development sections, manufacturing sections and repair sections as “Engineering Cloud.” This paper describes an overview of FTCP. It also covers the features of and linkage between CAD for designing printed circuit boards, a key component of the electrical design platform; a simulation environment for analyzing noise and such like; and a standard component database which supports them. Moreover, it also describes the merits of providing FTCP in a cloud environment by using Engineering Cloud, and the shift of customers’ existing development environments to the cloud.
1. Introduction social responsibilities. In these technology Monozukuri (manufacturing) is becoming and market environments, standardized and more and more difficult every year with the governed product development process and increasing number of factors to take into innovation of the development environment that account in product development due to the supports the process are becoming indispensable. evolution of technology and changes in the This paper describes a development business environment. These factors include environment that allows product development analog behavior of digital signals resulting lead time to be reduced and quality and from higher-speed semiconductor devices, noise performance to be improved, and is speeding margin decrease due to reduced voltage, and up the Fujitsu Group’s monozukuri. This paper miniaturization and density increase as is seen presents a design and verification environment, in smartphones. Meanwhile, there are urgent standardized standard component database and demands for a shorter time-to-market and lower approach to operation in a cloud environment costs because of global competition, and a shorter with the focus on the electrical design platform. development lead time and low-cost development are now essential. In addition, business 2. Integrated design development requirements such as business continuity, environment: FTCP consideration for the environment and safety As an environment assisting manufacturing are increasingly demanding as part of corporate innovation, Fujitsu has worked on constructing
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EMAGINE, a design environment that supports consisting of PC clusters and grid computing. development with no rework required from There are three major points in the design to manufacturing.1) electrical design environment in FTCP, and they To further evolve and integrate this are described in the following sections: environment into a development platform, we 1) Electrical CAD tools and DRCs integrating are now building Flexible Technical Computing design know-how and technology Platform (FTCP), an integrated design 2) Complete electrical simulation by making development environment that consolidates use of technical computing development know-how in manufacturing and 3) Standard component database that supports makes use of technical computing (Figure 1). the standardization of components and FTCP provides on the platform a GUI-based design verifi cation CAD environment, real-time verifi cation (Design Rule Check [DRC]) environment for signals, 3. Electrical design CAD power, heat and mechanisms and a design Electrical design CAD consists of tools that standard and standard component database support an entire range of processes from concept (library) that supports them. In this way, it design, which is the upstream area of the design assists in the development process from the process, to detail design and manufacturing upstream of the design process to manufacturing. (Figure 2). Furthermore, to perform enormous amounts These tools incorporate design and of computation for purposes including high- verifi cation know-how built up over many years accuracy analysis and simulation in short periods by Fujitsu so as to support the design of large of time, it offers technical computing resources boards for supercomputers, servers and network
LSI design CAD PCB design CAD Mechanical design CAD
LSI-CAD PT board CAD 3D-CAD
Fujitsu Group’s development platform (Integration of know-how of development sections) — Flexible Technical Computing Platform —
Strategic tool Simulation Real-time verification Content Wiring support Electric signal Electrical design criteria check …solver Electrical Power supply …criteria check Model … Component …dedicated machine library library …criteria check Thermo fluid Knowledge management Mechanical Silence …check Collective knowledge … Logical connection check Analysis support Standards …library Logic/delay …check LSI …
Figure 1 Fujitsu’s integratedFigure design development1 environment (FTCP). Fujitsu’ s general design development environment (FTCP). 414 FUJITSU Sci. Tech. J., Vol. 48, No. 4 (October 2012) T. Nakamura et al.: Electrical Design Platform on Engineering Cloud
System level Logic circuit design Detail board design Manufacturing design Mass concept design/analysis verification/analysis verification/analysis Mass production design production
Concept design CAD Circuit design CAD Board design CAD Board design CAD
· Circuit DRC · Board DRC · Analysis linkage · Component DRC · Electrical DRC · Manufacturability DRC · Board design linkage · Manufacturability DRC · Manufacturability DRC · Concurrent design · Concurrent design · Analysis linkage · Electromechanical linkage · Analysis linkage Linkage
Signal noise analysis SignalAdviser-SI
Power noise analysis Power noise analysis Linkage SignalAdviser-PI SignalAdviser-PI Linkage
EMC-compliant DRC SignalAdviser-EMC
Standard component database
Figure 2 Design/verificationFigure 2 tools and standard component database supporting development process. Design/verification tools and standard component database supporting development process. devices and small high-density boards for mobile PCB and component shapes using a wizard. In phones and notebook PCs. addition, the PCB shape, layer configuration and component shapes can be freely changed in the 3.1 Concept design process of component layout/wiring editing, thus In the concept design process, multiple allowing designers to easily study board designs cases are compared to study the size, layer of various cases. configuration, rough layout of key components The results of design undergo an evaluation and wiring routes of a printed circuit board in terms of the component layout location, wiring (PCB) so as to select the optimum solution among route information, wiring length, power pattern, them. This is then handed to the following detail and such like. This is done by making use of design process as the board design specifications. the linkage with the signal integrity and power To prevent major rework in the subsequent integrity analysis tools, which provides design processes, concept design CAD tools for printed conditions that are used in detail design as board design and different analysis tools are used design constraint conditions. for various types of verification and evaluation including component layout/wirability, signal 3.2 Detail design integrity, power integrity, heat generation The detail design process includes characteristics and manufacturability. component selection, circuit design, wiring To make it easier to use CAD in the concept constraint design and board design. design process, which is the uppermost stream 1) Component selection of design, the concept design CAD allows a Component selection is an important design to be started simply by creating the process that has an impact on the performance,
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reliability and cost of a product and the choice and shielded wiring for preventing crosstalk of components is refi ned in a real-time search noise, equal-length wiring for differential pair of the component database described later from signals and equal-length bus wiring to reduce the circuit design CAD. An automatic collective wiring work and wiring constraint errors. In replacement function to replace end-of-life addition, a system is provided in which a real- components with alternatives and environmental time DRC constantly checks the wiring pattern regulation-ready components is provided and a during editing to ensure the wiring is in keeping system to promptly use standard components is with the design criteria and wiring constraints. realized. 3) Reduction of rework by DRC 2) Constraint-driven design and wiring support DRC to ensure adherence to Fujitsu’s In designing a board that is to handle design criteria and verify the soundness of high-speed signals, wiring in compliance with design includes about 100 items in circuit rules such as pattern wiring length and wiring design and about 200 items in board design topology is essential. For this reason, those and manufacturing design, which is shown wiring constraints must be applied to signal in Figure 3. Many of these are applied in lines on the circuit diagram in the circuit design real time simultaneously with design editing phase. Large circuits may have thousands of so as to offer functions to ensure error-free wiring constraints and, as an effi cient means of design. High-response performance is also making settings and verifying them, a function of achieved for collective DRC, which is conducted editing in a circuit topology between drivers and at breaks in the design process, to provide an receivers for signal transmission is provided. environment that allows design and verifi cation As wiring support functions to help in wiring to be conducted at the same time. The DRC a board based on the constraints, a board design environment incorporates Fujitsu’s product is equipped with functions for ensuring spacing development know-how and is reviewed and
Component standardization (recommended ranks) Environmental response (such as RoHS) Component height DRCs for circuit design: Overlap of mounting position name (such as IC01) about 100 ESD resistance Net naming conventions (e.g., power name not to be used for signals) Circuit diagram legibility (e.g., character overlap) Withstand pressure, polarity Circuit design · Adjustment of components Component life · Electrical conditions Connection of different types of power Quality improvement (EMC, noise) · Manufacturability Prohibition of open circuit Crosstalk noise · Drawing shareability All signals unused Spacing of differential pair wiring Resistor connectivity PCB yield improvement Meander shape of differential pair wiring Bypass capacitor insufficiency Conductor spacing Required number of bypass capacitors, bypass capacitor draw-out wiring Number of fanouts Board design Resist conductor exposure Allowable current, omission of shielded wiring, via provision conditions
Assembly yield rate improvement DRCs for board/ Component spacing Marking legibility (line width, etc.) manufacturing design: Slit for board splitting about 200 Component mounting angle Solder heat resistance · EMC, noise Component gravity fall Manufacturing · Board manufacturability design Component height (inspection device) · Assembly manufacturability Electrolytic capacitor condition Different multiple-piece board (component name shared) *Rules and constraint values customized for respective technologies Mirroring check
Figure 3 DRC realizing design/manufacturingFigure 3 know-how. DRC realizing design/manufacturing know-how. 416 FUJITSU Sci. Tech. J., Vol. 48, No. 4 (October 2012) T. Nakamura et al.: Electrical Design Platform on Engineering Cloud
enhanced on a daily basis in order to keep up Electrical Design Rule Check (EDRC) system are with the latest technologies and in response to optimally combined in the respective situations feedback on failure case examples. to be utilized. These systems are incorporated into the design processes of Fujitsu’s wide- 3.3 Manufacturing design/mass ranging devices including mobile phones and the production design K computer,note)i which has allowed various noise To reduce the number of prototyping measures to be built in the upperstream phase of times and manufacturing lead time, Design For design and made significant contributions to the Manufacturing/Design For Test (DFM/DFT) elimination of design rework and cost reduction.2) in view of ease of manufacturing and testing The following describes electrical simulation processes is meticulously implemented in the systems. design phase. This includes the unification of the 4.1 Transmission waveform analysis component mounting orientation to reduce system: SignalAdviser-SI the mounting time by mounter and checks on Of signal transmission, over-Gb/s distances between components, component differential transmission, in particular, can have height conditions and allowable temperature transmission waveforms significantly affected limit to improve the solder reflow yield. In by skin effect, dielectric loss and intersymbol addition, verification of temperature distribution interference (ISI), which necessitates high- in reflow by a thermal analysis simulation is also accuracy analysis of these phenomena. Fujitsu’s conducted to ensure manufacturing quality and transmission waveform analysis system has an improve efficiency. originally developed circuit simulator engine For testing after manufacturing, boundary- integrating a highly accurate analysis function scan circuitry in accordance with Joint Test for frequency-dependent parameters to allow Action Group (JTAG) is integrated and the highly accurate analysis of these phenomena. function for automatic test pattern generation and test pad arrangement for automatic test 4.2 Power noise analysis system: equipment are provided in the design phase, SignalAdviser-PI thereby improving the testing process efficiency The existing design method of addressing and diagnosis rate. power noise with desk calculations has low accuracy, and this has made it very difficult 4. Electrical simulation to come up with a design that addresses As the signal transmission speeds on mount power/ground bounce noise. For this reason, boards increase along with the enhancement higher noise countermeasure design costs due of digital device performance, voltage decrease to excessive design and, conversely, power and mounting density increase of LSIs are in noise problems because of insufficient noise progress. This has revealed noise problems in countermeasure design have often been revealed. signal transmission and power supply systems. Fujitsu’s power noise analysis system In addition, the increase of the electromagnetic integrates functions essential to power noise interference (EMI) emission level has made it countermeasure design in addition to power difficult to clear the EMI regulation tests and impedance analysis and direct current drop ensure electrostatic discharge (ESD) resistance. In making designs to address these noise note)i The English name that RIKEN has been using for the supercomputer since July problems, various noise analysis systems and the 2010.
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analysis, and they have been applied to device design to eliminate the generation of power noise CLK problems. EMI-compliant component 4.3 EMC-compliant DRC system: IC SignalAdviser-EMC There is a need to allow EMI/ESD measures to be easily built, something that has been <
various devices ranging from mobile phones Field intensity Field intensity Field intensity to supercomputers has been constructed and utilized. In many cases of device development, Frequency Frequency it has successfully eliminated design rework resulting from defects found in EMC standard Figure 4 FigureExample 4of application of function to analyze fi eld tests with actual devices, which occurred in the intensity spectrum. past. This system features: Example of application of function to 1) Wide application to devices ranging from mobile phones to high-end servers 5.analyze Standard field intensity component spectrum. database 2) Capability of checking on ESD resistance as A standard component database is what well as EMI provides component information essential to 3) Function of weighted display/report output highly accurate and effi cient operation of the of check results electrical CAD/DRC and electrical simulation • Priorities of measures weighted and described up to now. The Fujitsu Group has important items extracted. standardized components in the Group. This has • Detail and summary reports output for easy led not only to the reduction of redundant work instructions on measures. involved in component selection and evaluation 4) EMI fi eld intensity spectrum analysis of but also to various benefi ts including cost wiring patterns reduction by centralized purchasing, reduction • Field intensity spectrum automatically of acceptance inspection work at plants and analyzed based on PCB layout data reduction of component inventory. (Figure 4). In addition, close linkage between the • Appropriate EMI countermeasure design standard component database and CAD has realized by integrating a highly accurate allowed more effi cient design using CAD and electromagnetic fi eld solver originally highly accurate DRC and simulation at an early developed. stage of design, thereby improving the effi ciency As shown in Figure 4, use of an EMI- of design, ensuring design quality and reducing compliant component based on the results of rework from downstream processes. analysis has successfully reduced the fi eld As of 2011, general-purpose electronic intensity by 10 dB. components registered in the standard component database include about 50 types and 240 000 items of ICs, LSIs and electromechanical
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components. Of these, components recommended simulation is key to reducing development lead- for use are being standardized by narrowing down time and ensuring design quality. to 17 000 drawing numbers. For each component, about 380 to 430 types of attribute information 6. Engineering Cloud are registered as component management FTCP, which has been described up to now, information, function/characteristic information, has been used internally in the Engineering quality information, manufacturing information, Cloud environment since 2011 (Figure 5).3) procurement information, environmental Engineering Cloud is a cloud environment response information and design information. centering on a desktop as a service (DaaS) The following outlines the respective types. environment intended for the field of engineering, 1) Component management information in which screen data indicating the results of Drawing numbers, manufacture/model processing by the cloud are transferred to the information and standardization information client. High-speed transfer of large quantities (recommended ranks) used for purchasing of highly accurate image data of CAD and CAE components is enabled by Remote Virtual Environment 2) Function/characteristic information Computing (RVEC), high-speed display Component-specific function information technology originally developed by Fujitsu.4) and characteristic information including rated The following explains the major benefits voltages, temperature characteristics and obtained by shifting to the cloud. frequency characteristics 1) Safe and secure environment available 3) Quality information anytime, anywhere Component-specific failure rates reflecting The design and verification tools and design the operational status of the actual products data that constitute FTCP are in the cloud, thus 4) Manufacturing information allowing the same design environment to be used Information including reflow heat resistance anytime, anywhere. For example, it is accessible information, moisture absorption control from various places such as offices, business trip information, storage management conditions and locations, plants and homes. The design data are forms of packaging not stored on client PCs and are secure because 5) Procurement information their loss and theft is avoided. Component price information, end-of- The Fujitsu Group uses the cloud to apply life (EOL) information, information about FTCP to plants and repair bases as well as sites recommended alternatives to EOL components of development and has incorporated procedures, and multi-source information which were created in paper or PDF format, 6) Environmental response information into CAD to improve work efficiency and reduce Response to the European RoHS regulations errors. and information about controlled substances 2) Facilitation of tool-data linkage contained Electric and mechanical tools and their 7) Design information design data are consolidated in one location, Simulation information including SPICE which offers the benefit of ease of electric- models, IBIS models and thermal resistance mechanical linkage in a short TAT. Tasks that In this way, promoting component required design data to be gathered for each case standardization and having timely registration in the past, such as checking on interference of component-specific attribute information in between components mounted on a PCB and the database to make it available to CAD and a housing designed with mechanical CAD and
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Engineering Cloud environment
LSI design CAD PCB design CAD Mechanical design CAD
LSI-CAD PT board CAD 3D-CAD
Fujitsu Group’s development platform (Integration of know-how of development sections) —Flexible Technical Computing Platform—
Strategic tool Simulation Real-time verification Content Electric signal Development base Wiring support Electrical Power supply Electrical design criteria check …solver Component … …criteria check Model library …dedicated machine library Thermo fluid …criteria check Mechanical Silence Knowledge management …check … Collective knowledge Logical connection check Standards …library Analysis support Logic/delay LSI …check … Plant Plant Repair base Development base Development base Development base Repair base
Figure 5 ApplicationFigure of 5 FTCP by Engineering Cloud. Application of FTCP by Engineering Cloud. radiation noise analysis and thermal analysis of large-scale computer resources required for a PCB placed in a housing, can be immediately simulation, use of a data center only as much performed. as required when required will allow the initial 3) Inheritance of existing design environment investment to be reduced and realize an effi cient Engineering Cloud is characteristically design environment. capable of migrating the existing design environment as it is to a cloud by using the cloud 7. Conclusion platform. In the shift of Fujitsu’s FTCP to the This paper has presented electrical CAD, cloud, the integrated environment built over an electrical simulation environment and a many years has been successfully migrated to component database that support them. They the cloud with the minimum cost. are key components of the electrical design Design environments currently used platform that has brought together Fujitsu’s by customers probably have various types of many years of know-how in monozukuri as know-how and system linkage incorporated. By an ICT enterprise. It has also explained that putting them on the Engineering Cloud platform, providing the platform internally via the they can be migrated to a secure and convenient Engineering Cloud environment brings further environment with the minimum switching cost. convenience and safety. To take one step further, linking and partial In addition, use of internal examples integration with Fujitsu’s FTCP in a cloud to take advantage of the Engineering Cloud will make available the standard component platform technology also in customers’ design database, DRC incorporating the customer’s environments is believed to allow the current know-how and various simulation tools. For design environment to be migrated almost as it is
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to the cloud and merits of shifting to the cloud to References be enjoyed at low cost. 1) T. Yamaguchi et al.: Integrated Design Environment to Support Innovation in We believe the key to strengthening the Manufacturing. Fujitsu Sci. Tech. J., Vol. 43, monozukuri of Japan in this age of global No. 1, pp. 87–96 (2007). 2) T. Sato et al.: LSI and PCB Unified Noise competition is to predict the future of technology Analysis CAD System. (in Japanese), IEICE and ICT environment that evolve on a daily basis Transactions C, Vol. J89-C, No. 11, pp. 817–825 (2006). and to continue to construct and maintain the 3) S. Saito et al.: Engineering Cloud: Flexible and most advanced design environment consolidating Integrated Development Environment. Fujitsu Sci. Tech. J., Vol. 47, No. 4, pp. 408–417 (2011). the company’s core competency and know-how. 4) K. Matsui et al.: Virtual Desktop Display Acceleration Technology: RVEC. Fujitsu Sci. Tech. J., Vol. 48, No. 4, pp. 469–475 (2012).
Takeo Nakamura Toshiro Sato Fujitsu Advanced Technologies Ltd. Fujitsu Advanced Technologies Ltd. Mr. Nakamura is currently engaged in Mr. Sato is currently engaged in planning and development of electrical development of electrical simulation design platform. technology.
Kiyokazu Moriizumi Shuichiro Yamada Fujitsu Advanced Technologies Ltd. Fujitsu Advanced Technologies Ltd. Mr. Moriizumi is currently engaged in Mr. Yamada is currently engaged authorization and planning of electronic in development of electrical design components used for products. platform.
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