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Blade Servers of Basic Producers Journal of the UniversityG. Elenkov, of Chemical I. Gerdjikov, Technology V. Metodiev, and Metallurgy, I. Ivanov 45, 1, 2010, 67-74 BLADE SERVERS OF BASIC PRODUCERS G. Elenkov, I. Gerdjikov, V. Metodiev, I. Ivanov University of Chemical Technology and Metallurgy Received 05 December 2009 8 Kl. Ohridski, 1756 Sofia, Bulgaria Accepted 20 February 2010 E-mail: [email protected] ABSTRACT The main objective of this paper is to investigate the diversity of blade and modular servers, produced by main world manufacturers, like HP, IBM, Sun, Dell, Intel. Another objective is to present general criteria for the comparison of server platforms, called Total Cost of Ownership TCO. Keywords: blade, server, modular server, Total Cost of Ownership. INTRODUCTION BLADE SERVERS OF FUNDAMENTAL MANUFACTURERS The company Houston-based RLX Technologies, which consisted of mostly former Compaq Computer The name blade server appeared [1] when a card Corp. employees, shipped the first modern blade server included the processor, memory, I/O and non-volatile in 2001 and in 2005 Hewlett Packard (HP) developed program storage (flash memory or small hard disk(s)). their model RLX [2]. In February 2006 Blade.org was This allowed manufacturers to package a complete established to increase the number of blade platform server, with its operating system and applications, on a solutions available for customers and to accelerate the single card blade. These blades could then operate process of bringing them to market. It is a collaborative independently within a common chassis, doing the work organization and developer community focused on ac- of multiple separate server boxes more efficiently. In celerating the development and adoption of open blade addition to the most obvious benefit of this packaging server platforms. (less space-consumption), additional efficiency benefits Nowadays the research company IDC identi- have become clear in power, cooling, management, and fied the major players in the blade market [1] as HP networking due to the pooling or sharing of common and IBM. Other companies selling blade servers in- infrastructure to support the entire chassis, rather than clude AVADirect, Sun, Egenera, Supermicro, Hitachi, providing each of these on a per server box basis. Fujitsu-Siemens, Rackable (Hybrid Blade), Verari Sys- As an illustration of a blade server, the Modular tems, Dell and Intel. The existence of great number of Server of Intel may be discussed. It is based on the so- server products submits the question of their compari- called Intel Multi-Flex Technology. The description of son, necessary to make correct choice. So, the objec- its components is given below. tive of this paper is to make an attempt to investigate Intel® Modular Server [3, 4] the diversity of server platforms, produced by main The server is shown in Fig. 1. The components world manufacturers and to present general criteria on it have characteristics as follows: for their evaluation. a) Chassis type MFSYS25 or MFSYS35: 67 Journal of the University of Chemical Technology and Metallurgy, 45, 1, 2010 Fig. 1. Intel Modular Server. Its capacity is up to 6 Server Compute Modules. d) Carrier for HDD: The chassis may be configured either as 6U rack or 14 are used in MFSYS25 and 6 are used in pedestal based, so the flexibility is ensured for the choice MFSYS35. of appropriate size. It is designed to support a lot of e) Hot Swappable I/O Fan Module (included). generations of server compute modules, thus allowing f) Hot Swappable Main Fan Module (included). fast upgrade to newer computer technology. g) Hot-Swappable Power Supply Modules: (2 b) Server Compute Module: The compute mod- included, 2 optional) N + 1 degree of redundancy. ule MFS5000SI is based on the Intel® 5000P series h) Storage Control Module (1 included, 1 op- chipset and supports Multi-Core Intel® Xeon® pro- tional): RAID 0, 1, 1e, 5, 6, 10. cessors. i) Management Module (included). MFS5000SI Features: Supports up to two Multi- j) Ethernet Switch Module (1 included, 1 op- Core Intel® Xeon® processors. Nine of the applicable tional): types of them are given in [3]. Each module features 10/100/1000GbE full- Server has 8 FB DIMM slots for up to 32 GB of duplex ports. memory. It has also integrated LSI 1064E SAS Con- ** Power Supply Requirements: troller. Server has Integrated Remote KVM, Remote A minimum of one 1000-Watt power supply Media Redirection, and Remote Serial Console. Front is required to turn on a compute module. One power panel includes video and 2 USB I/O ports. The Server supply will support 1 compute module plus all other Compute Modules support an optional dual channel modules in the system. Two power supplies will sup- gigabit Ethernet Mezzanine Expansion Card. port 2 to 3 compute modules (in any slot) plus all other c) Hard Disk Drives: modules in the system. Three power supplies will sup- Up to 14 2.5 SAS devices for MFSYS25 or up port 4 to 6 compute modules (in any slot) plus all other to 6 3.5 SAS or SATA devices for MFSYS35. modules in the system. Any additional power supplies 68 G. Elenkov, I. Gerdjikov, V. Metodiev, I. Ivanov Fig. 2. Structure of the modular server of HP. above minimum required (based on configuration) pro- Chassis HP BladeSystem c7000: vides redundancy. Slots for blade modules: Up to 16 half-height Blade Systems of HP blades or up to 8 full height blades. Interconnect bays: HP BladeSystem c-Class [6] The main reason 8 Interconnect bays with support for any I/O fabric. to consider this system of ÍÐ is that in [5] it is used as Power: Integrated in Enclosure, 3-Phase or Single Phase. a basis for comparative evaluation. Cooling: Centralized redundant fans. Up to 10 Active A. Chassis HP Blade System c3000 intended Cool fans. Height: 10 U. Management: Redundant for Midmarket and remote site. Onboard Administrator - LAN and serial access. B. Chassis HP Blade System c7000 intended C. HP ProLiant Server Blades applicable for HP For Enterprise data centers. Functional description of c3000 and c7000 are: c7000 is given in Fig. 2. HP ProLiant BL200c Server Blades: HP ProLiant Chassis HP BladeSystem c3000: BL260c G5 (Intel Xeon 5400, 5200, ìP, Core 2 and Slots for blade modules: Up to 8 half-height Celeron; 2 sockets, Quad, Dual and Single cores; up to blades or up to 4 full height blades. Mixed configura- 16 modules (c7000), 8 (c3000); 48 GB, 6 DIMM slots); tions are supported. Interconnect bays: 4 any I/O fabric. HP ProLiant BL280c G6 (Intel Xeon 5500; 2 sockets, Power: Up to 6 x 1200W (high-line) or 800 - 900W Quad and Dual cores; up to 16 modules (c7000), 8 (low-line). Cooling: Centralized redundant fans. Up to (c3000); 96 GB, 12 DIMM slots); HP ProLiant BL220c 6 Active Cool fans. Height: Rack (6U) or Tower model. G5 (Intel Xeon 5400, 5200; 2 sockets, Quad and Dual Management: Single Onboard Administrator - LAN and cores; up to 32 server nodes in 10U; 32 GB, 4 DIMM serial access. slots). 69 Journal of the University of Chemical Technology and Metallurgy, 45, 1, 2010 Fig. 3. Sample Experion Architecture. HP ProLiant BL400c Server Blades: HP ProLiant DellTM PowerEdgeTM M1000e BL460c G5 (Intel Xeon 5400; 2 sockets, Quad cores; The main reason to discuss this system of Dell is up to 10 modules (c7000); 32 GB, 8 DIMM slots); HP that in [5] it is used as a basis for comparative evalua- ProLiant BL460c G6 (Intel Xeon 5500; 2 sockets, Dual tion. and Quad cores; up to 16 modules (c7000), 8 (c3000); A. Chassis of DellTM PowerEdgeTM M1000e 192 GB, 12 DIMM slots); HP ProLiant BL465c G5 Modular Blade features: (AMD Opteron 2300; 2 sockets, Quad cores; up to 16 Dell PowerEdge M1000e blade: Form Fac- modules (c7000), 8 (c3000); 64 GB, 8 DIMM slots); tor: Size 10U, up to 16 half height or 8 full height blades. HP ProLiant BL465c G6 (AMD Opteron 2400; 2 sock- Power: 3 (non-redundant) or 6 (redundant) hot plug ets, Six cores; up to 16 modules (c7000), 8 (c3000); 64 power modules. Cooling: 9 hot-plug, redundant stan- GB, 8 DIMM slots); HP ProLiant BL490c G6 (Intel dard modules. Input/Output Modules: Up to 6 I/O. Xeon 5500; 2 sockets, Quad cores; up to 16 modules Modules with reserved lines; available switches include (c7000), 8 (c3000); 192 GB, 18 DIMM slots). Dell & Cisco 1Gb/10Gb Ethernet with modular slots, HP ProLiant BL600c Server Blades: HP ProLiant Dell 10Gb Ethernet with modular slots, Dell Ethernet BL680c G5 (Intel Xeon 7400, 7300, 7200; 2 or 4 sock- passthrough, Brocade 4Gb Fibre Channel, Brocade 8Gb ets, Six or Quad or Dual cores; up to 8 modules (c7000), Fibre Channel, Fibre Channel pass-through, Mellanox 4 (c3000); 128 GB, 16 DIMM slots); HP ProLiant DDR & QDR InfiniBand. Management Modules: 1 (stan- BL685c G5 (AMD Opteron 8300; 4 sockets, Quad cores; dard) or 2 (reserved) Chassis Management Controllers up to 8 modules (c7000), 4 (c3000); 128 GB, 8 DIMM (CMCs); by choices a switch for control of the typeKVM slots); HP ProLiant BL685c G6 (AMD Opteron 8400, may be integratedswitch with type crash cart. Man- 8300; 4 sockets, Six or Quad cores; up to 8 modules agement Features: Dynamic control of the power to the (c7000), 4 (c3000); 256 GB, 32 DIMM slots). individual blades; real time reporting for the consum- 70 G. Elenkov, I. Gerdjikov, V. Metodiev, I. Ivanov Table 1. BladeCenter H (8852) up to 16 blade modules. Part No Form Factor Power Modules Hot Swap Power, Slots, Fans 8852-4XY Rack (9U) 19in x 29in 2900w (200V-240V) P, B, B 8852-4XY Rack (9U) 19in x 29in 2900w (200V-240V) P, B, B mation of the chassis and compute modules; real time Vmware and also on up to 960 cores of SPARC, Intel monitoring for the thermal conditions; protected SSL and AMD processors; up to 45% more energy savings.
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