Texas A&M University s2

TEXAS A&M UNIVERSITY Department of Electrical and Computer Engineering College Station, Texas 77843-3128 TEL (979) 845-9583 FAX (979) 845-7161 [email protected] http://amsc.tamu.edu S E M I N A R

Room 223C ZEC Thursday, February 26, 2009 3:55 - 5:10 P.M.

Power Integrity for Next-Generation ICs: Challenges and Methodologies

by Dr. Souvik Mukherjee Signal Integrity Engineer, Texas Instruments Inc. Dallas, Texas

Abstract: With high integration density of today’s electronic systems, increasing current consumption, increasing switching frequencies and reduced noise margins, maintaining high power integrity has become more challenging than ever. Common design issues include via characterizations, connector launch optimization, decoupling optimization, high-speed I/O noise analysis, backplane simulation and radiative coupling issues, among others. As a result, accurate and efficient Signal Integrity (SI), Power Integrity (PI) methodologies are critical for qualifying system-level performance for high-speed digital, RF and even mixed-signal designs. Engineering experience is not enough for emerging technologies, while trial and error is time-consuming and prohibitively expensive, either resulting in over-constrained designs that unnecessarily increase manufacturing costs or under-design leading to functional failures or loss of yield. Using sophisticated EDA tools to analyze and optimize board-package-IC design provides a more practical means to test a greater variety of potential design configurations. The objective of this presentation is to illustrate the challenges that face current designs with regards to coupled SI-PI- EMI effects in today’s electronic systems and techniques to mitigate these issues. Using realistic case studies, the seminar demonstrates today's best practices around power integrity for noise mitigation. The examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.

Souvik Mukherjee obtained his PhD in the area of RF modeling from Georgia Institute of Technology in 2007. Dr. Mukherjee joined Texas Instruments in 2007 and has since been working on different signal integrity and power delivery issues pertaining to TI’s wireless products. Dr. Mukherjee is currently with RF/Analog/Mixed-Signal Design Methodology Team where he leads the development of advanced system-level methodologies as applied to power integrity, signal integrity, electromagnetic interference (EMI) and substrate coupling issues to improve simulation predictability and design reliability. Souvik Mukherjee has published over fifteen papers in IEEE referred journals, conferences and TI symposiums. Dr. Mukherjee is a member of IEEE.