Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 1 of 22

1. Purpose/Scope

1.1 This manual is designed to familiarize you with the structure of a Data Processing Center.

1.2 We would like you to understand how critical our services are for the safe operation of a data processing center.

1.3 We will also explain to you our expectation of you as a Paragon International technician, as well as cover your job assignments. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 2 of 22

2. Manual Contents

1 Purpose and Scope 1 2 Manual Contents 1 3 Introduction to Data Centers 2 4 Equipment Found in a Data Center 3 & 4 5 Why We Clean Data Centers 5 & 6 6 Job Requirements 7 7 Do's and Don’t's 8 & 9 8 Going to Work 9 9 Sub-floor Cleaning Procedures 10-12 10 Equipment Wipe-down Procedures 13 & 14 11 Equipment Vacuuming 14 12 Above Floor Clean 15 & 16 13 Concrete Seal Procedures 16 & 17 14 General Cleaning Rules to Remember 17 15 Safety 18 16 Data Center Terminology 19 Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 3 of 22

3 Introduction to Data Centers

3.1 Understanding the dynamics of the data center environment is key to proper cleaning. Data centers have the lowest federal allowable outside air intake - as low as 7.5% - to facilitate a controlled atmosphere with constant temperature and 50% humidity.

A data center has a raised floor structure consisting of two feet by two feet removable floor tiles supported by an elevated steel framework resting upon a concrete sub-floor deck. This structure forms a compartment that serves an important function: It allows a maze of data, communication, and power cables to be moved and positioned underneath the floor; and run between power supplies and equipment cabinets or from cabinet to cabinet (often times even from floor to floor). The space below the raised floor is called the sub-floor plenum, and is critical to the functioning of the data center. This space, or void, ranges in depth from 6" to 36" (with 18" and 24" being the two most common depths).

The pressurized sub-floor plenum directs cooled air to data equipment, preventing overheating and system failure. Since the air in this compartment is compressed to push a stream of air up through data units, contaminants on the concrete sub-floor may also be carried up through the ventilation openings in the raised floor; and into the components.

General guidelines state that the temperature in the sub-floor plenum should range between 64 and 70 degrees F, and the relative humidity should be between 45% and 55%.

Smoke detector heads (sometimes referred to as "sniffers") are located in the sub-floor plenum, and below and above the suspended ceiling.

Water detection systems (generally a thin, rope-like, multi-colored cable) usually run on the sub-floor deck around the perimeter of the room. Occasionally, these ropes will also run through the middle of the room as well. These ropes are highly sensitive to movement and water (even beads of sweat), and are easily set off. Caution should be exercised when vacuuming and/or sealing around these cables. This is also a reason why care must be taken to not get too much water on the floor during the mopping process.

Data processing facilities are high security buildings that usually have security guards, passkeys or codes, and closed circuit TV cameras. Access is limited to the building and especially to the computer rooms. The room is separated from outside offices and hallways by walls below the raised floor, above the raised floor, and above the drop ceiling. This is done to protect the critical environment from outside contaminant, and to prevent and regulate temperature and humidity Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 4 of 22

loss. We are not allowed to have cameras or video recording equipment on the premises of these facilities at any time, for any reason.

4 Equipment Found in a Data Center

4.1 Central Processing Unit (CPU or Mainframe)

Large machines that require tremendous power and, therefore, generate a great deal of heat (especially older units). Some are thermal units that are cooled by air and require 10 - 15 tons of cooling. Others are cooled by a chilled water/glycol mixture and require these lines to run directly to the unit. The primary manufacturers of such systems are IBM, Amdahl, Cray, Unisys, and CPC.

4.2 Direct Access Storage Device (DASD)

Cabinet type disk storage machines. Can be packed into smaller areas and are one of the nosier items in a data center. These units produce a lot of heat. They are arranged in unit, units, rows (string), and farms (multiple rows). The primary manufacturers are IBM, Amdahl, Unisys, Tandem and StorageTek.

4.3 Tape Drives

Can be reel (older technology) or cartridge type units, but all requiring access to a tape storage area. These units require human interaction and produce a high amount of particulate. They should be separated from CPU, DASD, and print and communications equipment (preferably by walls above and below the floor). These require very little cooling but a great deal of floor space for access to load and unload tapes. The primary manufacturers are IBM, StorageTek, and Tandem.

4.4 Tape Silos

These are large (8 feet high, 144 square feet), octagonal shaped cabinets that house cartridge tapes, a robot, and electronic tape readers. A robot performs all tape mounting, so human interaction is minimal, but still necessary for loading and unloading at certain times. These units require a lot of floor space, cooling, and adequate ceiling clearance. The primary manufacturers are StorageTek, IBM, and Tandem.

4.5 Printers/Sorters

The print/sort area should be an entirely separate area from any computer equipment. These areas should have a number of unique requirements for air Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 5 of 22

filtering, floor load capacity, and sound attenuation. The impact type printers generate a lot of noise, as well as particles of carbon and paper dust.

4.6 Control Console Area

This is the room or area where all of the equipment is monitored. Here the lighting and "people comforts" are the prime importance. All operating functions are controlled from here, with system monitoring and communications being the main areas of concern. The floor is generally carpeted. 4.7 Halon 1301 and 1211

Halon is a fire suppression system that uses high-pressure storage and discharge to smother a fire. The expansion of the gas into the room cavity during discharge can toss papers, floor tiles, and ceiling tiles around the room. Halon removes the oxygen from the room and requires evacuation of the area when it discharges. It is not, however, poisonous or life threatening to humans in any other way.

4.8 HVAC Systems

Air conditioning equipment for computer facilities must perform three critical functions in order to maintain an acceptable computer environment. These functions are:

1. Temperature Control 2. Humidity Control 3. Air Quality Control

Lack of control of any of these conditions can cause problems for any computer operation.

These units are generally very large, rectangular units that sit around the perimeter of the room. Occasionally, they are also found in rows down the middle of larger rooms. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 6 of 22

5 Why We Clean Data Centers

5.1 Electrostatic Discharge (ESD)

Evidence has linked the constant movement of air and dust across concrete surfaces, combined with humidity fluctuations, as the cause of severe electrostatic discharge. Spark fires, that leave only a burn mark to show that they have occurred, are often found on unclean sub-floor decks. These electrostatic discharges can adversely affect memory chips. A voltage discharge can also directly damage the circuitry of a system, especially in terminals and microcomputers. These units can only tolerate up to a 1,000-volt discharge without being affected, yet normally a person can feel a shock only if it is greater than 3,000 volts.

5.2 Ferrous Metals on Circuit Boards

Because of the high volume of air blown over circuit boards, to cool them, both dust and tiny ferrous metal slivers are deposited on electronic components because of their magnetic properties. Because components are becoming smaller and are being packed more densely on a circuit board, the likelihood of problems is increased.

5.3 Over Humidity and Rust

At the other end of the spectrum from electrostatic discharge problems, are over humidity and rust. Rust can be found on the floor pedestals and grid, as well as in the air conditioning and computer equipment. Humidity, at its worst, causes condensation on equipment, resulting in not only rust, but also short circuits.

5.4 Head Crashes and Mechanical Wear

Today's disk drives are particularly vulnerable to dust. Because the distance between the head and the thin film disk is now down to only 12 micro-inches, (a micro-inch is 1/1,000,000 of an inch), not even dust particles can squeeze through. Read/write errors and head crashes result. Tape drives can also be affected. Airborne dust also reduces lubrication in mechanical linkages, which in turn, accelerates parts wear.

5.5 Filter Clogs and Overheating

Because most data processing centers are built with the equipment sitting on raised floor, the equipment is built to draw its cooling from the bottom of the cabinet and send heat out of the top. For this reason, filters are installed at the bottom of the cabinets to filter out dust, dirt, and ferrous metal before it gets inside the equipment. Therefore, a dirty sub-floor environment can cause these Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 7 of 22

filters to clog. When this happens, the cool air supply is significantly reduced, causing the equipment to overheat and shut down. Sometimes, this scenario can cause the piece of equipment of catch fire.

5.6 Halon Dump

Dust and other small particulate can look like smoke to sub-floor fire detectors. The electronic eye cannot distinguish between smoke particles and dust. Should the static pressure in the sub-floor be released, such as when a tile is pulled, dust-laden air can cross over several detectors on its way to the open tile, setting off the necessary number of detectors for a dump. According to the Halon Research Center, one third of the Halon dumps occur erroneously, that is over 1,000 metric tons a year. Since Halon 1301 and 1211 have been linked with the depletion of the ozone layer, DuPont and the government have limited its production. It is both cost effective and prudent to prevent such erroneous dumps by maintaining a clean sub-floor environment in data centers using this method of fire suppression.

5.7 Food, Insects, and Rodents

This common food chain can wreak havoc with electronic equipment. These live contaminants do not depend on the air plenum for movement. They move at will attracted by the warmth and protection afforded by operating equipment. This especially happens when food or beverage is dropped under the floor, drawing cockroaches, spiders, ants, and even rodents.

5.8 Employee Health

Process computer cooling is different from comfort cooling found in office spaces. This means that building codes requiring fresh air for people are often ignored. With few people and lots of equipment, probably 95% of computer rooms do not follow the fresh air requirement. Thus, computer rooms are good candidates for indoor air pollution.

5.9 Peace of Mind

It is well known that preventive maintenance is a more acceptable cost than downtime. Renee M. Robbins, assistant editor of Infosystems, said: "The cost of detecting and preventing environmental threats to a data center is often less that the cost of system downtime." He continues…"Such budgeting for an acceptable amount of unexpected downtime is a reactive and often costly approach, especially when it is possible to prevent such occurrences. Many of the causes are literally under your nose; in the air you breathe and under the floor you walk on. The trouble is, most are invisible." Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 8 of 22

6 Job Requirements

6.1 Data Center Cleaning is physically demanding work and requires good health and stamina. The following are some of the tasks you will be expected to perform as a technician:

6.2 Detailing Sensitive computer equipment.

6.2.1 Vacuuming and mopping large areas. 6.2.2 Constant lifting of 30 lbs. 6.2.3 Follow our cleaning techniques exactly as outlined in your training. 6.2.4 You should be able to work in a stooped position for extended periods of time. 6.2.5 You must model a professional look and attitude at all times.

The main purpose behind the work is to decontaminate the data center of as much particulate (from visible to microscopic) as possible. It is extremely important to exercise care since you will be working around highly sensitive equipment that is likely servicing thousands, or even millions, of people. Causing one piece of equipment to malfunction could cost millions of dollars in damages. There are special techniques that have been developed through years of experience that minimize the possibility for error; but you as an individual carry the primary responsibility to exercise care.

Your job requires displaying a professional spirit, reserving visiting to break time. This may be your first time in a data center and you may see or do things you have never done or seen before. We encourage you to never assume and to ask questions. Do not, however, unnecessarily demonstrate your inexperience in front of the customer. This can erode their confidence in our ability as a company. An experienced manager will be available to train, assist, and oversee you. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 9 of 22

7 Do's and Don'ts

7.1 Administrative

7.1.1 No smoking at the job site except in area designated by your manager during breaks and meals.

7.1.2 No consumption of alcohol prior to or during working hours.

7.1.3 Violation of policies and/or behavior contrary to the best interest of Paragon International will result in disciplinary procedures.

7.1.4 Punctuality is of the utmost importance. Tardiness is grounds for disciplinary action.

7.1.5 Follow all cleaning instructions.

7.2 Data Centers

7.2.1 No tank tops, shorts, or jeans with holes allowed.

7.2.2 Good personal hygiene is essential.

7.2.3 When cleaning equipment or floors, be sure to pick up any small material off o the floor (screws, nuts, plastic, pipe, wires, paper, etc.) and give them to your supervisor.

7.2.4 No idle talking or horseplay.

7.2.5 No fast movement such as running or jogging.

7.2.6 No Food or Drink is allowed in the Data Center at any time.

7.2.7 No sitting or leaning against any equipment or desks.

7.2.8 No loitering, socializing, horseplay or idle chatter will be tolerated.

7.2.9 Personnel problems and/or issues, as well as complaints should be handled away from the job site.

7.2.10 Do not ask other employees for direction. Please refer all questions to your supervisor. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 10 of 22

7.2.11 Do not do anything you are unsure of. Always ask your supervisor. (Please be discrete and do not ask questions in front of the customer)

7.2.12 If you accidentally turn off a switch or piece of equipment, TURN it back on immediately and quickly notify your supervisor.

7.2.13 Never take anything from the job site without permission. (Not even from the trash)

7.2.14 Look as if you have been doing this work all your life (stay busy).

7.2.15 Bathroom breaks will be provided. Please use this opportunity to use the facilities if needed - DO NOT WAIT UNTIL THE END OF THE BREAK TO DO SO!

7.2.16 Always remember your picture ID - it will usually be required to gain access to these buildings.

7.2.17 Proper dress is a must: In commissioned data centers all Paragon personnel must wear the provided black jumpsuits with the Paragon International logo identifying you as part of the Paragon team. In post construction sites wear blue or black denim jeans (no baggy or unnecessarily loose jeans, no holes in the jeans). You will be given a lightweight company shirt to wear over your clothing (this shirt must be tucked in). Note: Because it can sometimes be cool in the data center a long-sleeve shirt that can be worn under the jumpsuit is often recommended.

8 Going to Work (Signing In)

Upon arrival you will be required to sign in with security. This will require signing your name, company name, time in, and a telephone number. Do not write down your home telephone number. Write down the number to the Paragon International office you work out of. You will then have to present a picture ID to the guard to receive an access or ID badge. Put your badge number on the sign-in form.

8.1 During the sign-in process, you must display a professional attitude and demeanor. This is not a time for socializing or horseplay. Please keep your conversation to a minimum and your voice low.

8.2 After the sign-in process is complete, you may need to help unload the equipment. This should be done as quickly and efficiently as possible - again with a professional attitude and demeanor. The equipment will be taken to a staging area where unused equipment can be left during the cleaning processes. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 11 of 22

8.3 Customers expect a positive attitude no matter what task you are undertaking. Your attitude will reflect on the other employees, and be recognized by the customer.

8.4 Be friendly and courteous to all employees - including security personnel - at the job location.

8.5 Please refer to all Paragon International employees by name. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 12 of 22

9 Sub-floor Cleaning Procedures

9.1 Set-up

9.1.1 All technicians will need the following:

1 Vacuum 1 Vacuum Bag 2 -3 Vacuum Wands 1 Hose 1 Crevice Tool 1 Brush 1 Pair Safety Glasses

9.1.2 Once you have been given your starting point, you may set up your vacuum.

9.1.2.1 Install the vacuum bag. Double check to ensure the bag has no holes and fits securely inside the vacuum. 9.1.2.2 Connect the vacuum hose, wands, and the brush. 9.1.2.3 Do Not Plug In Your Vacuum! Your supervisor will be the only one to plug in vacuums.

9.1.3 Lag time

There may be some lag time between the time you have finished setting up your vacuum and the time your vacuum receives power. Do not use this time to socialize or lean against the wall. Be looking over the area you are going to be vacuuming for any potential problem areas. Remove any chairs or carts from the immediate area. Once your vacuum receives power, begin vacuuming off the floor surface and any flat surfaces around you until the start signal has been given.

9.2 Vacuuming Process

9.2.1 Once your supervisor assigns you the rows of tiles to clean, they will remove the first row of tiles for you to set the pattern. You will then be responsible for removing and replacing your own tiles. This will be done by removing every other tile (in a checkerboard pattern). Your supervisor will also inform you of the maximum number of tiles to be pulled at a time.

9.2.2 Make sure that no part of any equipment or desk is resting on the tile before you pull it. Again, if unsure, ask your supervisor. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 13 of 22

9.2.3 Drop (do not slam) the tile puller on the tile near the back-center of the tile. Lift and step backward, pulling the tile towards you. Set the tile on the floor in front of the area you are cleaning. Tiles should always be placed on the floor face down. This prevents the back surface of the tile from scratching other tiles. Your vacuum should remain behind the removed tile to prevent the vacuum from falling in the sub-floor.

9.2.4 Vacuum the grid and corners first.

9.2.5 Remove any large debris from the sub-floor area by hand and discard in the trash bags provided.

9.2.6 Vacuum the open area thoroughly and then vacuum under all surrounding tiles that you can safely reach. (Work from top to bottom). You may gently spread apart cables or lift them slightly to vacuum trapped dirt or remove debris. Do not tug or use much force when moving cables. Do not stand on any cables. You may not vacuum any area you cannot see. Depending on the depth of the floor, you may have to sit on the edge of the tile or even stand in the floor opening to safely reach the area you need to vacuum. Remember, we must thoroughly vacuum under all equipment in the area. If your wand becomes trapped, do not tug on the wand to free it, this may cause you to disconnect or even break a cable. If your vacuum hose becomes clogged, you may disconnect the hose from the vacuum to clear the wand but please leave the vacuum running. This will allow the vacuum to contain the particles in the vacuum bag and will not let contamination out into the room.

9.2.6.1 If needed you may remove additional floor tiles to remove any debris remaining.

9.2.7 As you are vacuuming, use your crevice tool to reach into narrow spaces and your brush to thoroughly clean the tops of cables. Please remember we are responsible for removing all debris from large pieces of trash to microscopic particles.

9.2.8 Please inform your supervisor of any loose pedestals, holes in the vapor barrier, insects, rodents or any other areas of concern. This information will be provided to the customer with the optional environmental report after the clean. We will include notes and comments from employees on this report.

9.2.9 Once you have finished cleaning the immediate area, you must replace the tiles before removing the next set of tiles. We work in a wall to wall Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 14 of 22

formation. This enables us to prevent "blow-black" and fully encapsulate contaminates as the crew moves through the room.

9.2.9.1 For this reason, you should not work ahead of your team members. If you find yourself moving ahead, fall back to help your teammates until you are all working together.

9.2.10 Once you complete the vacuum process, do not break down the vacuums. Immediately remove them from the room and await further instructions from your supervisor. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 15 of 22

10 Equipment Wipe-down Procedures

Items you will be wiping down include computer cabinets, monitors, workstations, cubicles, desks, door ledges, door jams, air handlers, etc. All accessible surfaces are to be cleaned. All surfaces over 3 feet tall will be vacuumed with backpack vacuums using stepstools or step ladders as needed.

10.1 Set-up

10.1.1 Begin by filling the mop buckets with clean, warm water and PARACLEAN data center cleaning solution. In data centers where the mop buckets need to be left outside squirt bottles should be used.

10.1.2 All squirt bottles should be filled to fill line with cleaning solution (about 3/4 full).

10.1.3 Each technician should have 2 lint free rags for wiping down.

10.2 Wipe Down Procedures

10.2.1 Equipment that has medium to heavy amounts of dirt and debris should be HEPA vacuumed first then hand wiped.

10.2.2 Begin by dampening one rag with the cleaning solution. Never spray the chemical directly onto the equipment.

10.2.3 Fold the rag into a square approximately the size of your hand. The rag should not be dangling or hanging in any way.

10.2.4 Start wiping at the top of the equipment, move across the equipment then downward (using a circular motion).

10.2.5 Continue cleaning in a circular motion until you have cleaned an area approximately 3' X 3'.

10.2.6 Next, use your dry rag to buff the area you have cleaned thoroughly removing any chemical streaks or residue.

10.2.7 Wipe all flat surfaces. Be sure to wipe out all cracks, crevices, vents and any place where dust can accumulate.

10.2.8 Completely wipe the equipment, making sure to remove any marks or smudges. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 16 of 22

10.2.9 Be sure not to wipe areas immediately around switches or buttons. Please use caution when wiping keyboards. You may wipe only the large open areas around the edge of the keyboard and underneath the keyboard.

10.3 Some pieces of equipment have plain black panels that are actually control panels. We never touch these panels as it is easy to start/stop the equipment. Your supervisor will show you how these panels look and where to watch for them.

10.4 You will only be using one rag at a time. Please do not leave the rag you are not using dangling from your pocket. Again, this is a hazard and could snag on a switch or button. The best place to keep the other rag is neatly draped over one shoulder.

10.5 Your water should be changed when it appears to be al light brown or a light gray color. DO NOT CONTINUE CLEANING WITH DIRTY WATER. The manager will appoint someone or escort you to change water. Never leave the room without notifying the manager.

10.6 One of the most commonly missed areas is around the bases of computer monitors. Be sure to wipe underneath and all the way around monitors (being careful with connections on the backside).

10.7 Team communication and observance are important to know what has and has not been done. Stay with your assigned area and pattern to prevent confusion.

11 Equipment Vacuuming

11.1 Technicians assigned to the vacuuming process should spread across the width of the room.

11.2 These technicians will be assigned to vacuum the tops of all tall cabinets. (More than three feet in height). They should also vacuum off all signs hanging from the ceiling and air-return grilles.

11.3 Remove all large debris and take to a designated storage area.

11.4 Be sure to vacuum all vents and cracks in the equipment. (Although these are being wiped, they should be vacuumed also).

11.5 Once the entire room has been wiped down, complete a wipe down inspection checking each other's work. Check to ensure that all areas were wiped down Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 17 of 22

thoroughly (including desk kick panels and edges and chairs); and that no equipment or rags have been left behind. (Rags and squirt bottles should then be placed in designated area - with a bag for dirty rags).

12 Above Floor Clean

12.1 Set-up

12.1.1 During the equipment wipe-down process, one technician should be designated to begin prepping the floor surface for cleaning.

12.1.2 This technician will first use a dust-lifter paddle with disposable dust cloths to dust the entire surface of the floor (including underneath equipment cabinets and desks).

12.1.3 The technician will then use a vacuum and perform a detailed vacuum around all-accessible equipment server cabinets, racks and air handlers, underneath desks and shelves in work station areas. Never open cabinets unless directed by the team manager.

12.2 Floor Clean

12.2.1 The floor-cleaning machine will be prepared and filled with water unless using the swing type machine.

12.2.2 Technicians will be instructed to assemble mops.

12.2.2 The supervisor will designate one technician to mop directly behind the machine. The supervisor will also designate teams of scrub and rinse moppers. Green scrub pads and squirt bottles will be distributed to the scrub moppers.

12.2.3 When floors have a heavy amount of black marks or ground in dirt, a solution of chemical and water will be mixed in a garden-type pump sprayer, when using this type of equipment. Cleaning solution may be applied by mopping method as well making sure that the solution is applied only enough to avoid drying until it is scrubbed and rinsed.

12.2.4 On dirtier floors, the scrubber will be used to first apply a light controlled amount of cleaning solution on approximately 200 square feet of the floor.

12.2.5 The solution should be allowed to set-up for approximately 2 to 3 minutes. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 18 of 22

12.2.6 With the vacuum motor sunning. the floor-cleaning machine will then be used to scrub and pre-rinse the floor (be careful that water setting is low). The machine operator should go especially slow over areas that are stained or discolored.

12.3 One technician follows immediately behind the machine to mop up remaining residue from the floor though minimal. Thoroughly ring out the mop so the mop is damp, not dripping wet. Keep the mop bucket on solid tile surfaces only.

12.3.1 Using too much water causes leakage into the sub-floor. This can be damaging to equipment, can cause electrical shorts, rust, and can even destroy the bond on the tile. There are also extremely sensitive water sensors under the floor. For these reasons, it is critical that you control the amount of water placed on the floor. Use caution when handling mop buckets they should never be filled more than half way. Mop buckets should not be left on perforated tiles or on vents.

12.4 Next, a team of scrub moppers using fresh water and PARACLEAN will rinse the floor to ensure all chemicals and water has been removed. (Keep the mop bucket on solid tile surfaces only. At this time any scuff marks and misc. adhesives shall be removed.

12.5 Finally, a team of rinse moppers will be responsible for the final rinse and quality inspection. Rinse moppers should use a side-to-side rinse method to avoid streaking the floor. The mops should be rinsed after mopping every 250 square feet to ensure no residue is left on the floor.

12.5.1 One or two technicians will be assigned to change the water for the moppers. Buckets should be changed as soon as the water becomes a light gray or light brown. These technicians are responsible for keeping a clean supply of water for the moppers. If a mopper's water is dirty, they should wait until they receive clean water. DO NOT CLEAN THE FLOOR WITH DIRTY WATER. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 19 of 22

13 Concrete Seal Procedure

13.1 Floor Preparation

13.1.1 The floor should be prepared by performing the sub-floor cleaning process. No dirt or grime should be present prior to sealing. Loose silica should be removed and the surface should be dry. Chemical residue found on the floor should be chemically treated and removed.

13.1.2 Cables capable of moving should be gently lifted and tied to the pedestals. A waterproof tape should cover water detection tape. All electrical boxes will be covered and water proofed. Not all cables can be safely lifted. The sealer application is secondary to the uptime of the data center. This may mean that some cable areas cannot safely be accessed. Otherwise, the entire sub-floor concrete deck should be sealed. Care needs to be taken to keep seal off cables, wire, conduit, etc. Only the concrete should be sealed.

13.2 Seal Procedures

13.2.1 Each technician will be given a tray and paint pan. The paint pan is placed in the tray so that if sealer leaks it will leak in to the tray and not on the floor.

13.2.2 A plastic drop cloth will be placed on the floor and the seal poured in to the individual pans from the five-gallon bucket.

13.2.3 The seal is rolled on in open areas with a small diameter roller that is about 9" long or by mopping with an open ended mop. Small paint brushes and/or foam paddles can be used for hard to reach or tight areas.

13.2.4 The seal process is carried out just like the sub-floor vacuuming process, only slower.

13.2.5 The sealer will dry to the touch in approximately 20 to 30 minutes. It takes 24 hours to permanently dry and set-up.

13.2.6 After the sealer has dried to the touch, the cables are lowered back down. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 20 of 22

13.2.7 If the seal job is to last more than one day, be sure to soak all applicators in water overnight. Pour all seal into one container. The seal is water-soluble and will easily rinse from pans and trays.

14 General Cleaning Rules to Remember

14.1 Uniforms will be worn on facility premises at all times.

14.2 No rags or tools are to be dangling from pockets.

14.3 Do not carry liquids higher than waist level.

14.4 Do not place squirt bottles on top of equipment cabinets or desks.

14.5 Avoid placing liquids on perforated tiles.

14.6 Use extreme caution when mopping over perforated tiles.

14.7 Never climb, lean against, stand or sit on equipment.

14.8 Do not lean objects against bays or frames of computer equipment.

14.9 Mop pails should never be pushed as a "free-wheeling" vehicle.

14.10 Do not plug in your own vacuum unless instructed by your manager.

14.11 Once your vacuum is plugged in, do not move the cord to another outlet unless directly instructed to do so by the manager.

14.12 Pay attention to your surroundings at all times. Be aware of where your vacuum, hose, cord, and elbows are; and how close you are to equipment cabinets or cable connections.

14.13 Display a professional and courteous attitude at all times. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 21 of 22

15 Safety

15.1 General Safety Rules

All cleaning bottles must be clearly labeled. MSDS sheets are kept with the supervisor at all times. Employees should read the MSDS's and familiarize themselves with the chemicals prior to using the chemical.

15.1.1 To ensure proper mixing ratio of cleaning solutions and water, proper fill lines are marked on each cleaning bottle. DO NOT OVERFILL.

15.1.2 Safety glasses are required for all employees at all times.

15.1.3 At least 2 wet floor signs should be used in all areas where mopping procedures are used.

15.1.4 Safety cones should be placed along extension cords every 15 feet. They must also be placed in front of every doorway, alcove, elevator, and traffic area opening where extension cords are laying.

15.1.5 Always use GFI's (Ground Fault Interrupters) at wall receptacle.

15.1.6 Wash hands before break to prevent ingestion of chemicals or bacteria.

15.1.7 All areas where tiles have been removed should be clearly marked with caution tape (or proper signage warning others in the area of the missing tiles) prior to removal of the tiles.

15.1.8 Technicians may not leave the area without first replacing all tiles.

15.1.9 Be sure all tiles are replaced securely and flush back into the floor pattern.

15.1.10 When vacuuming the sub-floor always keep your vacuum behind the tiles that have been pulled. This will prevent the vacuum from being pulled into an open floor area. Technician Training Manual Originator: Mike Grabarek Revision Date: 01/08/2008 Page: 22 of 22

16 Data Center Terminology

Environment: Surroundings and conditions that may affect sensitive computer equipment. Access/Raised Floor: An elevated floor surface that allows airflow and debris to pass freely through the floor. This elevated surface raises the equipment off the sub-floor, which allows the airflow to cool the equipment. Sub-floor: Concrete floor that supports the raised floor. Micron: One millionth of a meter. Particulate: Minute quantities of solid or liquid matter. Consists of particles. HEPA Filter: Media used to produce High Efficiency Particle Air filter. HEPA filtered vacuums for the computer room are 99.97% efficient at 0.3 microns. HVAC Units: Heating, ventilating and air conditioning. Units draw air from above the floor, clean, cool, and humidify or de-humidify it, then force it under the raised floor. This keeps computers and other equipment cool and regulates humidity. Static Pressure: Pressure created by HVAC units under the floor. Causes a strong rush of air when floor tiles are lifted. Moves particulate around. Ambient Air: Room air that some machines draw from above the floor to keep cool. (Example: Personal computers). Uptime: Computers ready for job. What we are trying to protect and ensure. Downtime: Systems unable to work. What we want to avoid causing. Halon: Pressurized gas fire suppression system. Non-poisonous. 1301 and 1221 Halon Abort: Switch or button used to abort a possible Halon dump in case of accidental alarm. Plenum/Void: Area between bottom of raised floor and concrete sub-floor where forced air flows to cool computers. Encapsulate: To completely enclose. Concrete sub-floor needs to be sealed or closed over. Agglomerate: Form or gather in to a mass. Particulate tends to cloud or ball up together. Halon Bypass: Switch or control panel used to turn off the Halon system while work is being performed in the sub-floor. Humidify: To increase the amount of water vapor in the ambient atmosphere. De-humidify: To reduce the amount of water vapor in the ambient atmosphere.