Toshiba Semiconductor (Thailand) Co

Quality And Reliability Engineering Group Quality Assurance Department Himeji Operations – Semiconductor

Semiconductor & Storage products Company

Date: September 08, 2014 Reference No.: H440-4F-004P To: PROCESS CHANGE NOTICE

Notification of assembly site transfer for multiple SMALL SIGNAL, ONE GATE LOGIC and standard CMOS LOGIC DEVICES

Dear Customer, We would like to inform you about the shift of backend production from Amkor Technology Malaysia Sdn. Bhd. (ATM) to different new backend production locations.

1. Applicable products Please refer to attached Product list

2. Content of this change The backend process for some products will be transferred. In conjunction with this change some further changes may occur as shown below Current New

Ordering Partnumber Refer to attached Product list

Frontend process location Unchanged – Japan

Backend process location Amkor Technology Malaysia Sdn. Bhd. 1. Toshiba Semiconductor (Thailand) Co., (Formerly as known as Toshiba Electronics Ltd.(TST) Malaysia) 2. Amkor Technology Philippines, Inc. (ATP) 3. Toshiba factories in Japan (JPN) (Refer to attached Product list)

Bonding wire material For some products bonding wire material is different. (Refer to attached Product list)

Lead frame For some products lead frame material is different (Refer to attached Product list)

Lead finish For some products lead finish material is different (Refer to attached Product list)

Tape&Reel For some products Tape&Reel option is different (Refer to attached Product list)

Package For some packages the dimensions are slightly different (Refer to attached Product list and package comparison files)

Others For some products chip shrink version or new design rule is utilized (Refer to attached Product list)

3. Scheduled timing of this change Please refer to attached Product list for availability of products from new backend assembly location.

4. Treatment of old Malaysia products Production in ATM will be stopped as soon as all demand can be supported from new backend assembly sites. 2

5. Additional information a) Product List

b) Package Comparison fSC vs. SOD923

c) Package Comparison TSSOPxx vs. TSSOPxxB

Your understanding for this change is highly appreciated. Yours sincerely,

Manager SPECIALIST ENGINEER

Mr. Tatsuya Maita Ms. Ikuko Kakiuchi Quality And Reliability Engineering Group Quality Assurance Department Himeji Operations – Semiconductor Semiconductor & Storage Products Company