Nanotechnology and MEMS/MST/Micromachines (M3)

Nanotechnology and MEMS/MST/Micromachines (M3): A Global Perspective on Technology, Applications and Commercialization Sensors Expo 2007 www.sensorsexpo.com

Paper Title Highly integrated tire pressure monitoring system solution for reduced power, cost, and development time

Author and co-author names Eric Caron, Mark Shaw

Author company affiliation Freescale Semiconductor

Lead author's complete contact information: Eric Caron 2100 East Elliot Road Mail Drop: EL310 Tempe, AZ 85284 480-413- 5881 Fax: 480-413-8838 [email protected]

200-300 Word Abstract Describing the Presentation’s Content (Outline of the problem, innovation of solution, current/future applications)

Legislation requiring that tire pressure monitoring systems (TPMS) installation on all passenger cars and light duty trucks sold in the US by August 2007 has driven the automotive and semiconductor industries to a new level of integration and cost reduction. Today’s direct TPMS solution precisely measures individual tires to provide timely improperly-inflated driver warnings for improved vehicle reliability and safety. In the automotive segment the trend is to provide highly integrated TPMS chipsets that combine standard microcontroller, sensor and radio frequency (RF) functions in a single system in package (SiP) solution.

This presentation will discuss the various advantages of Freescale’s SiP solution that is the first of its kind to integrate a pressure sensor, an 8-bit microcontroller unit (MCU), an RF transmitter and an XZ-axis accelerometer all in one package for reduced power, system development time and cost savings. The integrated XZ-axis accelerometer makes the tire localization capability possible – by detecting individual tires even while they are in motion or are rotated. The enhanced integration capabilities of the MEMS (micro-electro mechanical system) surface micro-machined capacitive sensors are described. Using CMOS technology, these sensors provide up to 50 times lower power consumption than traditional bulk micro-machined piezoresistive sensors, which is essential for low power battery driven applications such as TPMS. This presentation will describe how this level of integration is achieved, what performance advantages are gained and several possible future derivatives and systems from this platform design. This TPMS solution gives developers the core technology to reshape the competitive landscape in vehicle reliability and safety by offering highly integrated system-level quality at a lower total bill of materials cost.

Deadlines Abstract due date: February 15, 2007 Notification of Acceptance: March 1, 2007