materials Review Copper/Epoxy JointsJoints inin PrintedPrinted CircuitCircuit Boards:Boards: Manufacturing andand InterfacialInterfacial FailureFailure MechanismsMechanisms Philipp Nothdurft 1,2,*, Gisbert Riess 1 and Wolfgang Kern 1,2 Philipp Nothdurft 1,2,*, Gisbert Riess 1 and Wolfgang Kern 1,2 1 Chair of Chemistry of Polymeric Materials, Montanuniversität Leoben, A-8700 Leoben, Austria; 1 Chair of Chemistry of Polymeric Materials, Montanuniversität Leoben, A-8700 Leoben, Austria;
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[email protected] (W.K.)
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[email protected] (W.K.) 2 Polymer Competence Center Leoben GmbH, Roseggerstraße 12, A-8700 Leoben, Austria 2 * PolymerCorrespondence: Competence
[email protected] Center Leoben GmbH, Roseggerstraße 12, A-8700 Leoben, Austria * Correspondence:
[email protected] Received: 23 January 2019; Accepted: 5 February 2019; Published: 12date February 2019 Abstract:Abstract: Printed circuit boards (PCBs) have a wide rangerange of applications in electronics where they are used for electricelectric signal transfer. For a multilayermultilayer build-up, thin copper foils are alternated with epoxy-based prepregsprepregs and and laminated laminated to each to other.each Adhesionother. Adhesion between between copper and copper epoxy and composites epoxy iscomposites achieved byis achieved technologies by technologies based on mechanical based on interlockingmechanical orinterlocking chemical bonding,or chemical however bonding, for futurehowever development, for future development, the understanding the understanding of failure mechanisms of failure mechanisms between these between materials these ismaterials of high importance.is of high importance. In literature, In variousliterature, interfacial various failures interfacial are reportedfailures are which reported lead to which adhesion lead loss to adhesion between copperloss between and epoxy copper resins.