Orbbec's Front 3D Depth Sensing System in the Oppo Find X

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Orbbec 3D Depth Sensing System Oppo Find X features Orbbec’s 3D systems IMAGING report by Stéphane ELISABETH November 2018 – version 1

Overview / Introduction 4  SoC Die Process o Executive Summary  SoC Die Cross-Section o Reverse Costing Methodology  SoC Die Process Characteristic Company Profile 8 Oppo vs. Apple 116 o Orbbec Manufacturing Process 124 o Oppo Find X Teardwown o NIR Image Sensor Die Front-End Process & Fabrication Unit Market Analysis 27 o NIR VCSEL Process Flow o Ecosystem & Forecast o NIR VCSEL Die Front-End Process & Fabrication Unit o SoC Die Front-End Process & Fabrication Unit Physical Analysis 31 o Summary of the main parts o Summary of the Physical Analysis 32 Cost Analysis 134 o NIR Camera Module Assembly 35 o Summary of the cost analysis 135  Module Views o Yields Explanation & Hypotheses 137  Module Cross-Section o NIR Camera Module 139 o NIR Image Sensor Die 51  Sensor Die & Optical Front-End Cost  Sensor Die View & Dimensions  Sensor Die Probe Test, Thinning & Dicing  Sensor Delayering & main Blocs  Sensor Die Wafer Cost  Sensor Die Process  Lens Module & Component Cost  Sensor Die Cross-Section o DOT Projector Module 147  Sensor Die Process Characteristic  NIR VCSEL Front-End Cost o DOT Projector Module Assembly 71  NIR VCSEL Probe Test, Thinning & Dicing  Module Views  NIR VCSEL Die Wafer Cost  Module Cross-Section  Lens Module & Component Cost o NIR VCSEL Die 89 o SoC Component 156  Die View & Dimensions  SoC Die Front-End Cost  Die Process  SoC Die Probe Test, Thinning & Dicing  Die Cross-Section  SoC Component Cost  Die Process Characteristic Feedbacks 164 o SoC Component 103 SystemPlus Consulting services 166  SoC Die View & Dimensions  SoC Delayering & main Blocs ©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 2 Executive Summary

Overview / Introduction o Executive Summary This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price o Reverse Costing Methodology o Glossary of the Orbbec 3D sensing system found in the Oppo Find X.

Company Profile & Supply Chain • Located in the Find X’s front, around the speaker, the optical hub is packaged in one metal enclosure. It has several modules Market Analysis like a DOT projector, a Red/Green/Blue Camera, a flood illuminator, an ALS/Proximity sensor and a NIR camera Sensor. An Physical Analysis additional SoC component is soldered on the main board to process the signal from the latter devices. Separated into two dimensions, the optical hub has a flood illuminator, an RGB camera and a proximity sensor for the 2D sensing and a NIR Physical Comparison camera and DOT projector for the 3D sensing. This report will be focused on the 3D sensing system.

Manufacturing Process Flow

Cost Analysis • With standard component found on the market, a GS Image sensor featuring 3 µm pixel size and standard resolution of 1 MP and a VCSEL, the system is very cost efficient compared to other solutions. The camera and dot projector module Related Reports assembly use standard wire bonding to connect the sensor or the VCSEL dies, along with an optical module comprising four lenses for both modules. In order to structured the light, a special mask unlike a DOE system is used to give a dot pattern. About System Plus

• This report analyzes the complete 3D sensing system, including a complete analysis of the NIR camera module, the DOT projector and the SoC, along with a cost analysis and a price estimation for the system. It also includes a physical and technical comparison with other 3D sensing system, such as those from Apple in the iPhone X facing the system integration, the NIR camera module and the DOT projector architecture. Finally, to give an idea of the complete optical hub cost and compare it to other systems, the complete 3D sensing systems cost is estimated.

Overview / Introduction Flood Illuminator Proximity Sensor Front Camera Company Profile & Supply Chain o Orbbec NIR Camera Speaker o Oppo Find X Teardown Dot projector

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain o Orbbec o Oppo Find X Teardown

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain o Orbbec o Oppo Find X Teardown

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis o NIR Camera Module o NIR Image Sensor Die o Views & Dimensions o Delayering & Process o Die Cross-section o DOT Projector Module o NIR VCSEL Die o Views & Dimensions o Die Process o Die Cross-section o SoC Component o Die Views & Dimensions o Die Delayering & Process o Die Cross-section

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison o Oppo vs. Apple

Manufacturing Process Flow

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow o NIR Sensor Die Front-End Process o NIR Sensor Fabrication Unit o NIR VCSEL Process Flow o NIR VCSEL Fabrication Unit o SoC Die Front-End Process o SoC Fabrication Unit

Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o DOT Projector Module Cost o SoC Component Cost o Complete Module Cost

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o DOT Projector Module Cost o SoC Component Cost o Complete Module Cost

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis o Cost Analysis Summary o Yields Explanation & Hypotheses o NIR Camera Module Cost o DOT Projector Module Cost o SoC Component Cost o Complete Module Cost

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT Physical Analysis PACKAGING IMAGING • 3D Imaging & Sensing 2018 Physical Comparison • NEXT Biometric Fingerprint Sensor Flyer • FPC’s FPC1268 in the Huawei Mate 9 Pro and Huawei P10 • VCSELs - Technology, Industry and Market Trends Manufacturing Process Flow series • Consumer Biometrics: Market and Technologies Trends 2018 • Qualcomm® Snapdragon Sense™ ID 3D Fingerprint • Hardware and Software for AI 2018 – Consumer focus Cost Analysis

Related Reports

About System Plus

Overview / Introduction

Company Profile & Supply Chain

Market Analysis Physical Analysis Custom Analyses Physical Comparison (>130 analyses per year)

Manufacturing Process Flow Cost Analysis Reports Related Reports (>40 reports per year) About System Plus o Company services o Contact Costing Tools

Trainings

Overview / Introduction

Company Profile & Supply Chain

Market Analysis

Physical Analysis FRANKFURT/MAIN Europe Sales Office

Physical Comparison NANTES LYON KOREA Headquarter YOLE HQ YOLE Manufacturing Process Flow TOKYO PHOENIX YOLE KK YOLE Inc. Cost Analysis GREATER CHINA YOLE Related Reports

About System Plus o Company services o Contact

Headquarters Europe Sales Office America Sales Office Asia Sales Office 22 bd Benoni Goullin Lizzie LEVENEZ Steve LAFERRIERE Takashi ONOZAWA 44200 Nantes Frankfurt am Main Phoenix, AZ Tokyo FRANCE GERMANY WESTERN US JAPAN +33 2 40 18 09 16 +49 151 23 54 41 82 T : +1 310 600 8267 T : +81 804 371 4887 [email protected] [email protected] [email protected] [email protected]

Troy Blanchette Mavis WANG EASTERN US TAIWAN www.systemplus.fr T : +1 704 859 0456 T :+886 979 336 809 [email protected] [email protected]

©2018 by System Plus Consulting | Oppo Find X 3D Depth Sensing System 24 ORBECC’S FRONT 3D DEPTH SENSING SYSTEM IN THE OPPO FIND X REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT ORDER FORM Please process my order for “Orbbec’s Front 3D Depth Sensing System in the Oppo Find X” Reverse Costing® – Structure, Process & Cost Report Return order by: Ref: SP18434 FAX: +33 2 53 55 10 59 MAIL: SYSTEM PLUS CONSULTING  Full Structure, Process & Cost Report : EUR 3,990* 22, bd Benoni Goullin  Annual Subscription offers possible from 3 reports, including this Nantes Biotech report as the first of the year. Contact us for more information. 44200 Nantes – France EMAIL: [email protected]

SHIP TO Name (Mr/Ms/Dr/Pr): ...... *For price in dollars please use the day’s exchange rate Job Title: ……...... *All reports are delivered electronically in Company: …...... pdf format Address: ……...... *For French customer, add 20 % for VAT *Our prices are subject to change. Please City: ………………………………… State: ...... check our new releases and price Postcode/Zip: ...... changes on www.systemplus.fr. The Country: ……...... present document is valid 6 months after its publishing date: November 2018 VAT ID Number for EU members: ...... Tel: ………………...... Email: ...... ANNUAL SUBSCRIPTIONS Date: ...... Signature: ...... Each year System Plus Consulting releases a comprehensive collection BILLING CONTACT of new reverse engineering and costing analyses in various domains. First Name : ...... You can choose to buy over 12 Last Name: ……...... months a set of 3, 4, 5, 7, 10 or 15 Email: …...... Reverse Costing® reports. Phone: ……...... Up to 47% discount!

PAYMENT More than 60 reports released each year on the following topics By credit card: (considered for 2018): Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| • MEMS & Sensors: Accelerometer |__|__|__|__| – Environment - Fingerprint - Gas Expiration date: |__|__|/|__|__| - Gyroscope - IMU/Combo - Microphone - Optics - Oscillator - Card Verification Value: |__|__|__| Pressure • Power: GaN - IGBT - MOSFET - Si Diode - SiC • Imaging: Camera - Spectrometer By bank transfer: • LED and Laser: UV LED – VCSEL - HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain France White/blue LED BIC code: CCFRFRPP • Packaging: 3D Packaging - • In EUR Embedded - SIP - WLP Bank code : 30056 - Branch code : 00955 - Account : • Integrated Circuits: IPD – 09550003234 Memories – PMIC - SoC IBAN: FR76 3005 6009 5509 5500 0323 439 • RF: FEM - Duplexer • In USD • Systems: Automotive - Consumer Bank code : 30056 - Branch code : 00955 - Account : - Energy - Telecom 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797 TERMS AND CONDITIONS OF SALES

1.INTRODUCTION The present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consulting except in the case of a particular written agreement. Buyer must note that placing an order means an agreement without any restriction with these terms and conditions. 2.PRICES Prices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and worked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged on these initial prices. System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commits itself in invoicing at the prices in force on the date the order is placed. 3.REBATES and DISCOUNTS The quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment. 4.TERMS OF PAYMENT System Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of a particular written agreement. If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is the current one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice deadline. This penalty is sent without previous notice. When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the total invoice amount when placing his order. 5. OWNERSHIP System Plus Consulting remains sole owner of the delivered services until total payment of the invoice. 6.DELIVERIES The delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order. 7.ENTRUSTED GOODS SHIPMENT The transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost or damage on the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carrier current ones (reimbursement based on good weight instead of the real value). 8.FORCE MAJEURE System Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described in the current terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French Code Civil? 9.CONFIDENTIALITY As a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential. A non-disclosure agreement can be signed on demand. 10.RESPONSABILITY LIMITATION The Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting. Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage, financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costing tools. 11.APPLICABLE LAW Any dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolved applying the French law. It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.