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Heat Transfer Enhancement by Heat Sink Fin Arrangement in Electronic Cooling

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Heat Transfer Enhancement by Heat Sink Fin Arrangement in Electronic Cooling Journal of Multidisciplinary Engineering Science and Technology (JMEST) ISSN: 3159-0040 Vol. 2 Issue 3, March - 2015 Heat Transfer Enhancement by Heat Sink Fin Arrangement in Electronic Cooling Mohamed H.A. Elnaggar Engineering Department Palestine Technical College-Deir EL-Balah Gaza Strip, Palestine [email protected] Abstract—This paper presents an analytical increase the probability of failure to electronic investigation of the effect of fins number and fin components. thickness on the performance of heat sink. The In modern electronic components, the processor’s results showed that both the increase in fins surface where most heat is generated is usually small, number and thickness leads to an increase in heat however, for better cooling, the heat must spread over transfer rate, but the increase in fins numbers a larger surface area [5]. significantly has more effect on the heat transfer rate than the increase in fin thickness does. The The space available near the processor is limited. increase in the thickness of fin results in an Hence, low power consumption is desired. The heat increase in the heat transfer rate, but more sink performance has become the focus of many studies. Heat sinks should be designed to have a large increase of the fin thickness results in a decrease surface area since heat transfer takes place at the in the distance between fins. The distance among surface [6]. fins must be maintain to allow the cooling fluid to reach all cooling fins and to allow good heat Additionally, the distance between the fins must be transfer from the heat source to the fins as well. maintain to allow the cooling fluid to reach all cooling fins and to allow good heat transfer from the heat Keywords—heat sink; electronic cooling; heat source to the fins as well. transfer; styling; fins arrangement. Therefore, the current study investigates the effect I. INTRODUCTION of fins number and fin thickness on the performance of heat sink with embedded heat pipes to further enhance Development of information technology IT growing the heat transfer rate. rapidly, as a result performance requirement for computers and other electronic devices becomes II. MATERIALS AND METHODS higher and higher, this means the core of computers or devices, central processing unit (CPU), must have a A. Prototype design higher efficiency and can conduct operations faster. The appearance of the new heat sink with Consequently CPU generates more and more heat, embedded heat pipes is shown in Fig. 1, where the and this trend will continue in the coming future. Thus construction has multiple heat pipes, with four heat one of the bottlenecks of IT’s further development is pipes each and increased surface area. The heat cooling technique. Hence it’s highly desirable to pipes use Fluid Mechanics to draw heat away from the investigate the high-performance cooling devices. copper base and move it to the fins. This is designed The traditional method to dissipate heat from to handle the newer releases of CPU's more efficiently electronic components was forced convection using a and effectively. The lower half is the copper base and fan with a heat sink directly [1]. In the past, the method the upper half is made from aluminum. These two used for solving the high heat capacity of electronic halves sandwich four copper heat pipes, creating a components has been to install a heat sink with a fan total of eight heat pipe risers. These copper risers (four directly on the heat source, removing the heat through on each side) pass through 56 aluminum fins. On most forced convection. Webb [2] pointed out that it is heat sinks of this type, the fins create one large area of necessary to increase the fin surface and fan speed of cooling, but the present design has two distinct towers the direct heat removal heat sink in order to solve the are created, thus giving you 112 aluminum fins and ever-increasing high heat flux generated by CPUs. The total thermal resistance is used to evaluate the thermal more surface area for cooling. confirm that you have performance of a heat sink. Zhipeng and Mzychka [3] the correct template for your paper size. The exterior increased the heat dispersing surface area of the heat dimensions of this heat pipes–heat sink are sink fins, reducing the total thermal resistance from 120x120x25 mm. It is well known that the heat 0.55 oC/W to 0.35 oC/W. Lin et al. [4] boosted the fan transmitted from the evaporator to the condenser must speed to obtain an optimum total thermal resistance be finally dissipated to ambient air as long as air value of 0.33 oC/W at a maximum speed of 4000rpm. convection cooling is one part of cooling system. There However, increasing the surface area results in an are several methods to enhance air-side heat transfer increase in cost and boosting the fan speed results in efficiency, one of them is to apply extended surface in noise, vibration and more power consumption, which air side. In the present design, the heat released in the www.jmest.org JMESTN42350544 457 Journal of Multidisciplinary Engineering Science and Technology (JMEST) ISSN: 3159-0040 Vol. 2 Issue 3, March - 2015 condenser is removed by forced air convection. In 푁퐴푓 푞푡 = ℎ퐴푡 [1 − (1 − η푓)] (푇푠 − 푇푎) (5) order to increase the heat transfer rate, the outside 퐴푡 surfaces of the condenser are finned (see Fig. 1). So Where Ts is temperature of surface of heat pipe and this kind of finned-multi-heat pipes has a much larger Ta is the ambient air temperature. condenser surface area than that of a traditional heat III. DESIGN OF EXPERIMENT (DOE) pipe to transfer heat to the ambient air. The total surface area of fins of the heat pipe tested is estimated Design of Experiment (DOE) software program is about 0.3 m2. used for the design of experiments, statistical analysis, modeling and optimization. Depending on a selected criterion and a given number of design runs, the best design is created by a selection process. The optimality of a design depends on the statistical model and is assessed with respect to a statistical criterion, which is related to the variance- matrix of the estimator. Specifying an appropriate model and specifying a suitable criterion function require both an understanding of statistical theory and practical knowledge [9]. In this study, the analysis depends on the analytical results instead of experiments to obtain the maximum removed heat transfer rate. Factors Definition Fig. 1. Heat sink with embedded heat pipes Define This program was implemented based on B. Determine heat transfer coefficient the analytical results rather than the results of experiments. The two significant factors considered The heat transfer coefficient required depend on are fin thickness (A) and fins number (B), as presented the flow patterns involved, the characteristic velocity, in Table 1. Each independent variable is varied over V used in determining the Reynolds number. For the three levels. The low, center, and high levels of each surface of plate fins, h is evaluated by using an f variable are designated as −1, 0, and +1, respectively. expression for the Nusselt number for developing flow Additionally, in this design, the response factor is heat between isothermal parallel plates [7]: 0.024휒−1.14 transfer rate. For more details, see Elnaggar [9]. 푁푢 = 7.55 + (1) 1+0.0358휒−0.64푃푟0.17 TABLE I. INDEPENDENT VARIABLES OF CCD DESIGN 푥 Where 휒 = 푎푛푑 퐷푐 = 2Δ for parallel plate 퐷푐.푅푒.푃푟 Fin thickness Fins number Level of value fins and hf is obtained from equation (2) (A) (mm) (B) ℎ 퐷 푁푢 = 푓 푐 (2) 퐾푎푖푟 -1 0.4 44 C. Overall Surface Efficiency 0 0.7 50 The efficiency of fin and surface area depend on fin geometry. Assuming that fin shape is rectangular the 1 1.0 56 single fin efficiency can be expressed as: tanh (푚퐿) 휂푓 = (3) 푚퐿 IV. RESULTS AND DISCUSSIONS Where L is fin length, ηf is the fin efficiency and Fig. 2 shows the effect of thickness of fin on heat 2ℎ 푚 = √ transfer rate. It was found that the heat transfer rate 푘푓푡푓 increases as a result of the increase in thickness of fin (varied from 0.1 mm to 1 mm with increment of 0.1 where kf is the fin conductivity, tf is the fin thickness. mm). It is also noticeable if the increase in the thickness of the fin continues, this will result in an In contrast to the fin efficiency ηf , which characterizes the performance of a single fin the overall surface increase in the heat transfer rate. However, the increase in the fin thickness reduces the spacing efficiency ηo characterizes an array of fins and the base surface to which they are attached [8] between the fins. NA η = 1 − f (1 − η ) (4) o At f Where N is the number of fins in array and each of surface area Af. D. Determine Heat transfer rate The total rate of heat transfer by convection from fins may be expressed as www.jmest.org JMESTN42350544 458 Journal of Multidisciplinary Engineering Science and Technology (JMEST) ISSN: 3159-0040 Vol. 2 Issue 3, March - 2015 180 180 160 Fin thickness=0.4 mm 160 Fin thickness=0.7 mm 140 Fin thickness=1.0 mm 140 120 100 120 80 100 60 Heat transfer Heat q rate (w) Removal Removal heat transfer (W) rate 40 80 20 60 0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60 Thickniss of Fin (m) -4 Number of Fins (N) x 10 Fig.
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