PRODUCTS GUIDE We make the world measurably better.

For over 100 years, CoorsTek has been perfecting the process of engineering advanced ceramics. We are prepared to apply expertise to the toughest engineering challenges around the world.

Much like the materials we work with, CoorsTek is versatile and endlessly extendible. we work with our customers to develop tomorrow’s technology for just about every industry in the global economy. We don’t simply deliver high-quality products. We partner to deliver solutions that make the world measurably better. Contents

Semiconductor Related Products 3

• Quartz Glass Crucibles • Alumina Plasma Etcher Parts • SiC Polishing Plates • Carbon Susceptors • Yttria Plasma Etcher Parts • In-line Gas Filters “CEPURE” • SiC Wafer Boats • Silicon Focus Rings • Vacuum-Break Filters • Photomask Substrates • Silicon Susceptors

FPD Related Products 6

• Large Scale Photomask Substrates

General Industrial Products 7

• Fused Silica Refractories • Quartz Carbon Heaters “QCH-HEATER” • SiC Heat-resistant Structural Parts • Foundry Filters “FLOW-RITE” • SiC Setters & Saggers

Automotive, Electric & Mechanical Products 9

• Carbon Brushes • Ceramic Balls “CERBEC”

Bio and Medical Related Products 10

• Ceramic Bone Substitutes

Main Material Line-up 11 Photomask Substrates Semiconductor SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Related Products pulling Polishing growth Deposition implantaton/ testing testing Sputtering CoorsTek KK develops and manufactures a variety of products APPLICATION : Photomasks for lithography processing made of inorganic materials such as quartz glass, graphite, silicon carbide, single crystal silicon and fine ceramics, all of which are MATERIAL : High-purity synthetic silica glass indispensable to the production of semiconductor devices. CoorsTek KK maintains a large market share for many products FUNCTIONS / FEATURES related to semiconductor manufacturing, a position we achieved by providing high-quality products that contribute to the higher ■ World's most popular substrates for lithography processing, including ArF integration and improved productivity of semiconductor devices ■ Superior UV transmittance and by utilizing our unique high-purity material and ■ high-precision machining technologies. Superior ArF laser durability ■ Low birefringence

Quartz Glass Crucibles Alumina Plasma Etcher Parts SEMICONDUCTOR MANUFACTURING PROCESS SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing pulling Polishing growth Deposition implantaton/ testing testing Sputtering Sputtering APPLICATION : Crucibles for single crystal silicon ingot pulling APPLICATION : Elements for plasma etching processing MATERIAL : High-purity quartz glass MATERIAL : High-purity translucent alumina “SAPPHAL”

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ Better yield by higher purity and less bubble ■ Extremely high purity (≧99.9%) ■ Longer process run by crystalline layer ■ Larger grain size and translucency ■ Less variation by process stability ■ Excellent electrical properties (LLT)

Carbon Susceptors Yttria Plasma Etcher Parts SEMICONDUCTOR MANUFACTURING PROCESS SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing pulling Polishing growth Deposition implantaton/ testing testing Sputtering Sputtering APPLICATION : Wafer carriers for epitaxial growth processing APPLICATION : Elements for plasma etching processing MATERIAL : High-purity SiC coated graphite “CLEAR CARBON” MATERIAL : High-purity yttria “EXYRIA”

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ High purity ■ Excellent plasma durability ■ Controllability of temperature distribution on wafer ■ High purity ■ Excellent high temperature durability ■ Large size production (up to Φ550mm)

SiC Wafer Boats Silicon Focus Rings SEMICONDUCTOR MANUFACTURING PROCESS SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing pulling Polishing growth Deposition implantaton/ testing testing Sputtering Sputtering APPLICATION : Wafer carriers for diffusion and LP-CVD processing APPLICATION : Focus rings for plasma etching processing MATERIAL : High-purity silicon impregnated silicon carbide “TPSS” MATERIAL : High-purity single crystal silicon

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ High purity ■ High purity ■ High temperature stability (up to 1350℃) ■ Surface damage removed by acid etching ■ Less particle generation ■ Very low risk of particle generation in use ■ Certified by major furnace manufacturers ■ Large size production (up to Φ510mm)

3 PRODUCTS GUIDE PRODUCTS GUIDE 4 Photomask Substrates Semiconductor SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Related Products pulling Polishing growth Deposition implantaton/ testing testing Sputtering CoorsTek KK develops and manufactures a variety of products APPLICATION : Photomasks for lithography processing made of inorganic materials such as quartz glass, graphite, silicon carbide, single crystal silicon and fine ceramics, all of which are MATERIAL : High-purity synthetic silica glass indispensable to the production of semiconductor devices. CoorsTek KK maintains a large market share for many products FUNCTIONS / FEATURES related to semiconductor manufacturing, a position we achieved by providing high-quality products that contribute to the higher ■ World's most popular substrates for lithography processing, including ArF integration and improved productivity of semiconductor devices ■ Superior UV transmittance and by utilizing our unique high-purity material and ■ high-precision machining technologies. Superior ArF laser durability ■ Low birefringence

Quartz Glass Crucibles Alumina Plasma Etcher Parts SEMICONDUCTOR MANUFACTURING PROCESS SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing pulling Polishing growth Deposition implantaton/ testing testing Sputtering Sputtering APPLICATION : Crucibles for single crystal silicon ingot pulling APPLICATION : Elements for plasma etching processing MATERIAL : High-purity quartz glass MATERIAL : High-purity translucent alumina “SAPPHAL”

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ Better yield by higher purity and less bubble ■ Extremely high purity (≧99.9%) ■ Longer process run by crystalline layer ■ Larger grain size and translucency ■ Less variation by process stability ■ Excellent electrical properties (LLT)

Carbon Susceptors Yttria Plasma Etcher Parts SEMICONDUCTOR MANUFACTURING PROCESS SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing pulling Polishing growth Deposition implantaton/ testing testing Sputtering Sputtering APPLICATION : Wafer carriers for epitaxial growth processing APPLICATION : Elements for plasma etching processing MATERIAL : High-purity SiC coated graphite “CLEAR CARBON” MATERIAL : High-purity yttria “EXYRIA”

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ High purity ■ Excellent plasma durability ■ Controllability of temperature distribution on wafer ■ High purity ■ Excellent high temperature durability ■ Large size production (up to Φ550mm)

SiC Wafer Boats Silicon Focus Rings SEMICONDUCTOR MANUFACTURING PROCESS SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing pulling Polishing growth Deposition implantaton/ testing testing Sputtering Sputtering APPLICATION : Wafer carriers for diffusion and LP-CVD processing APPLICATION : Focus rings for plasma etching processing MATERIAL : High-purity silicon impregnated silicon carbide “TPSS” MATERIAL : High-purity single crystal silicon

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ High purity ■ High purity ■ High temperature stability (up to 1350℃) ■ Surface damage removed by acid etching ■ Less particle generation ■ Very low risk of particle generation in use ■ Certified by major furnace manufacturers ■ Large size production (up to Φ510mm)

3 PRODUCTS GUIDE PRODUCTS GUIDE 4 Silicon Susceptors GAISER Wire Bonding Tools SEMICONDUCTOR MANUFACTURING PROCESS SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing pulling Polishing growth Deposition implantaton/ testing testing Sputtering Sputtering APPLICATION : Wafer carriers/adjusters for various processing APPLICATION : Wire bonding of semiconductor chip MATERIAL : High-purity single crystal silicon MATERIAL : ZTA

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ High purity ■ Long life capillaries and high reliability wedge tools ■ Surface damage removed by acid etching ■ A wide range of capillaries for various types of package and wire ■ Very low risk of particle generation in use material (gold, silver and copper) ■ Large size production (up to Φ510mm) ■ A variety of wedge tools for small, large, ribbon and deep access < Manufactured by CoorsTek, Inc. (USA) > SiC Polishing Plates SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing Sputtering APPLICATION : Surface plates for wafer polishing MATERIAL : Sintered silicon carbide “CERASIC”

FUNCTIONS / FEATURES

■ Exclusive bonding technology ■ Large size production ■ Precise green body machining

In-line Gas Filters “CEPURE” SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final FPD Related Products pulling Polishing growth Deposition implantaton/ testing testing Sputtering APPLICATION : In-line gas filters for various processing Due to the enlargement of flat panel displays (FPD) and the glass substrates that are one of their main components, MATERIAL : Porous alumina (filter element), stainless steel, nickel & PTFE technologies required for FPD production have been advancing. As higher technical levels have become necessary FUNCTIONS / FEATURES for manufacturing FPD glass substrates, CoorsTek KK’s products for FPD glass substrate manufacturing are able to ■ Superior gas displacement characteristics meet these requirements with our unique high-purity material and high-precision machining technologies for large scale ■ High corrosion resistance products.

Vacuum-Break Filters Large Scale Photomask Substrates SEMICONDUCTOR MANUFACTURING PROCESS Silicon ingot Slicing/ Epitaxial Oxidation/ Lithography Etching Ion Wafer Dicing Assembly Final pulling Polishing growth Deposition implantaton/ testing testing Sputtering APPLICATION : Photomasks for LCD manufacturing MATERIAL : High-purity synthetic silica glass APPLICATION : Diffusers for vacuum chamber (loadlock, process, etc.) MATERIAL : Porous alumina / Porous silica FUNCTIONS / FEATURES

FUNCTIONS / FEATURES ■ Low thermal expansion ■ Superior transmittance in broad wavelength spectrum ■ Prevention of dust dispersion ■ High purity and high homogeneous ■ Reduction of venting time ■ Large size production (up to 1220x1400mm) ■ High corrosion resistance

5 PRODUCTS GUIDE PRODUCTS GUIDE 6 FPD Related Products

Due to the enlargement of flat panel displays (FPD) and the glass substrates that are one of their main components, technologies required for FPD production have been advancing. As higher technical levels have become necessary for manufacturing FPD glass substrates, CoorsTek KK’s products for FPD glass substrate manufacturing are able to meet these requirements with our unique high-purity material and high-precision machining technologies for large scale products.

Large Scale Photomask Substrates

APPLICATION : Photomasks for LCD manufacturing M A T E RIAL : High-purity synthetic silica glass

FUNCTIONS / FEATURES

■ Low thermal expansion ■ Superior transmittance in broad wavelength spectrum ■ High purity and high homogeneous ■ Large size production (up to 1220x1400mm)

PRODUCTS GUIDE 6 SiC Heating Elements “TECORUNDUM” General Industrial Products APPLICATION : Various high temperature industrial heating CoorsTek KK develops and manufactures a wide range of MATERIAL : Recrystallized silicon carbide products made of inorganic materials for use in many industries with extreme environments that require high heat FUNCTIONS / FEATURES resistance, corrosion resistance, abrasion resistance and/or cleanliness by using in-depth knowledge and an abundance of ■ High temperature (up to 1400℃) know-how with materials such as silicon carbide and quartz ■ High chemical and corrosion resistance glass. ■ Various material grades, shapes, and coatings

Fused Silica Refractories Quartz Carbon Heaters “QCH-HEATER”

APPLICATION : Elements of glass melting furnace APPLICATION : Various rapid, clean and partial heating MATERIAL : Fused silica refractory “GLASSUN” MATERIAL : Quartz glass & carbon wire

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ Extremely low thermal expansion ■ High-speed heating (reduction of heating time) ■ Low thermal conductivity ■ Long-life (reduction of running costs) ■ Complicated and very large size production ■ Clean and non-contact source of energy (up to 2000x3000x200mm)

SiC Heat-resistant Structural Parts Quartz Electrostatic Chucks “ARISTORUM ESC”

APPLICATION : Radiant tubes, heat exchange tubes, etc. APPLICATION : Chucking for non-conductive substrates MATERIAL : Sintered silicon carbide “CERASIC” MATERIAL : Quartz glass & electrically conductive material

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ Long size production (up to 2350mm) ■ Chucking wafers of sapphire, quartz glass and silicon ■ High heat resistance and thermal conductivity ■ Quick chucking and de-chucking response: within 1 sec ■ Excellent chemical and corrosion resistance ■ Particle free and low outgassing ■ Long life

SiC Setters & Saggers Foundry Filters “FLOW-RITE”

APPLICATION : Kiln furniture for electric parts APPLICATION : Foundry filters for iron, aluminum and steel MATERIAL : Recrystallized silicon carbide MATERIAL : A kind of mullite

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ Excellent creep resistance and thermal shock resistance ■ Excellent hot strength ■ Eexcllent temperature followability caused by low heat capacity and ■ Stable filtration performance high thermal conductivity ■ Applicable to various sizes of casting, from small to large ■ Also available with prasma spray coating < Manufactured by CoorsTek, Inc. (USA) >

7 PRODUCTS GUIDE PRODUCTS GUIDE 8 Quartz Carbon Heaters “QCH-HEATER”

APPLICATION : Various rapid, clean and partial heating M A T E R I A L : Quartz glass & carbon wire

FUNCTIONS / FEATURES ■ High-speed heating (reduction of heating time) ■ Long-life (reduction of running costs) ■ Clean and non-contact source of energy

Foundry Filters “FLOW-RITE”

APPLICATION : Foundry filters for iron, aluminum and steel M A T E R I A L : A kind of mullite

FUNCTIONS / FEATURES ■ Excellent hot strength ■ Stable filtration performance ■ Applicable to various sizes of casting, from small to large < Manufactured by CoorsTek, Inc. (USA) >

PRODUCTS GUIDE 8 Automotive, Electric & Solar Cell Related Products Mechanical Products

CoorsTek KK develops and manufactures automotive, electric Using our experience in products related to semiconductor and mechanical products whose users require materials with manufacturing, CoorsTek KK applies in-depth knowledge of special functions not realized by metal or resin parts. silicon melting processes and manufacturing technology in fused silica refractories to provide products for solar cell manufacturing.

Carbon Brushes Crucibles for solar cell manufacturing

APPLICATION : Brushes for DC electric motors APPLICATION : Crucibles for polycrystalline silicon ingot casting MATERIAL : Carbon & copper MATERIAL : Fused silica

FUNCTIONS / FEATURES FUNCTIONS / FEATURES

■ Lead-free and silica-free ■ High purity and low contamination ■ Stable quality by high productivity manufacturing process ■ Large size production (up to □1300x500mm)

Ceramic Balls “CERBEC” Bio and Medical Related Products APPLICATION : High-temperature and high-speed bearings MATERIAL : Silicon nitride As bio and medical needs increase with a rapidly aging society, CoorsTek KK has been developing and manufacturing FUNCTIONS / FEATURES bio and medical related products with our advanced material and porous medium forming technology. ■ Harder and stier ■ High corrosion and electrical resistance ■ Light weight and low thermal expansion ■ Smooth surface and accurate geometry < Manufactured by CoorsTek, Inc. (USA) >

Ceramic Bone Substitutes

APPLICATION : Artifical bones for orthopedic surgery MATERIAL : 3D-interconnected porous structure hydroxyapatite

FUNCTIONS / FEATURES

■ New natural bone growing inside ■ High biocompatibility ■ Good machinability

9 PRODUCTS GUIDE PRODUCTS GUIDE 10 Bio and Medical Related Products

As bio and medical needs increase with a rapidly aging society, CoorsTek KK has been developing and manufacturing bio and medical related products with our advanced material and porous medium forming technology.

Ceramic Bone Substitutes

APPLICATION : Artifical bones for orthopedic surgery M A T E RIAL : 3D-interconnected porous structure hydroxyapatite

FUNCTIONS / FEATURES ■ New natural bone growing inside ■ High biocompatibility ■ Good machinability

PRODUCTS GUIDE 10 Main Material Line-up

Quartz Glass/Silica Alumina Yttria Silicon Silicon Carbide Boron Carbide Carbon Hydroxyapatite

SAPPHAL TPSS CERAPHITE 3D-inter- High-purity GLASSUN ADS EXYRIA High-purity CERASIC HE766 CLEAR CARBON High-purity High-purity High-purity silicon Sintered High-purity Robust connected porous synthetic Fused silica High-purity High-purity single crystal Sintered Recrystallized High-purity SiC quartz glass translucent impregnated boron carbide graphite and sturdy structure silica glass refractory alumina yttria silicon silicon carbide silicon carbide coated graphite alumina silicon carbide carbon hydroxyapatite

Quartz glass Photomask Fused silica Alumina plasma Lapping plates Yttria plasma Silicon focus SiC wafer boats SiC heat-resistant SiC setters & Blasting nozzles Carbon Carbon Carbon air Ceramic bone crucibles substrates refractories etcher parts etcher parts rings structural parts saggers crucibles susceptors sliders substitutes SiC process Typical Products Silicon tubes SiC polishing Carbon susceptors plates heaters

3 Bulk Density g/cm 2.2 2.2 1.95 3.99 3.9 4.9 2.33 3.0 3.15 2.4 2.52 1.88 - 1.40 0.79

Room Temp. MPa 105 105 13.1 300 350 110 ～300 260 450 42 400 40 40 90 4.95 Bending Strength 149 149 280 450 40 High Temp. MPa ------900℃ 900℃ 1200℃ 1450℃ 1300℃

Young's Modulus GPa 72 72 - 395 360 170 190 360 420 160 420～460 10 - 17 -

Poisson's Ratio - 0.17 0.17 - 0.23 0.23 0.30 0.27 0.16 0.18 - 0.21 0.12 - 0.18 -

GPa 9.7GPa 9.7GPa 17.7GPa 16GPa 6.1GPa 10.6GPa 20.4GPa 23.5GPa 28.6～34.7GPa

Mechanical Properties Vickers Hardness 2 - - 60Hs - 100Hs - (kgf/mm ) （950） （950） （1770） （1600） （600） （1040） （2000） （2300） （2800～3400）

Fracture Toughness 1/2 (MPa・m ) - - - 4.0 4.5 1.2 - 4.0 3.5 - 3～5 - - - - (KⅠc)

Coe cient of Thermal -6 0.5 0.65 0.4 8.0 7.8 8.2 3.9 4.2 4.5 4.3 4.5 4.8 4.8 3.2 x10 /K - Expansion RT～1000℃ RT～1000℃ RT～1000℃ RT～900℃ RT～900℃ RT～900℃ RT～1000℃ RT～1000℃ RT～1000℃ RT～1000℃ RT～1000℃ RT～450℃ RT～450℃ RT～450℃

Room Temp. W/(m・K) 1.5 1.4 - 35 30 14 157 220 170 105 20～40 107 - - 0.4 Thermal Conductivity 3（900℃） High Temp. W/(m K) - 1.02（1000℃） 9（1000℃） 8（1000℃） - - 55（1000℃） 55（1000℃） - 52（1000℃） - - ・ （t2.0mm）

Thermal Shock ＞1000 ＞1000 - 200 220 130 - 350 450 ------

Thermal Properties Thermal Resistance Tc

3000 1500 2000 Max. Use Temperature 1100 1000 1000 1800 1500 2000 1300 1370 1500 1500 - ℃ （inert atmos.） （inert atmos.） （inert atmos.）

Electrical Volume 18 18 17 16 16 4 +1 －1 4 6 -1 1 -3 -3 ℃ 10 10 - 10 10 10 2.4x10 10 ～10 10 ～10 - 10 ～10 1.1x10 5.0x10 - Resistivity

3.58 3.58 10.1 9.9 12.0 Dielectric Constant cm ------Ω・ 1MHz 1MHz 10GHz 10GHz 13.56MHz

-4 -4 -4 -3 -4 Dielectric Loss 1.5x10 1.5x10 1.0x10 1.0x10 6x10 ------1MHz 1MHz 10GHz 10GHz 13.56MHz Electrical Properties (Tan Delta)

These values are typical and should not be considered as specifications. The characteristic values may vary depending on product shape and conditions of use.

11 PRODUCTS GUIDE PRODUCTS GUIDE 12 Main Material Line-up

Quartz Glass/Silica Alumina Yttria Silicon Silicon Carbide Boron Carbide Carbon Hydroxyapatite

SAPPHAL TPSS CERAPHITE 3D-inter- High-purity GLASSUN ADS EXYRIA High-purity CERASIC HE766 CLEAR CARBON High-purity High-purity High-purity silicon Sintered High-purity Robust connected porous synthetic Fused silica High-purity High-purity single crystal Sintered Recrystallized High-purity SiC quartz glass translucent impregnated boron carbide graphite and sturdy structure silica glass refractory alumina yttria silicon silicon carbide silicon carbide coated graphite alumina silicon carbide carbon hydroxyapatite

Quartz glass Photomask Fused silica Alumina plasma Lapping plates Yttria plasma Silicon focus SiC wafer boats SiC heat-resistant SiC setters & Blasting nozzles Carbon Carbon Carbon air Ceramic bone crucibles substrates refractories etcher parts etcher parts rings structural parts saggers crucibles susceptors sliders substitutes SiC process Typical Products Silicon tubes SiC polishing Carbon susceptors plates heaters

3 Bulk Density g/cm 2.2 2.2 1.95 3.99 3.9 4.9 2.33 3.0 3.15 2.4 2.52 1.88 - 1.40 0.79

Room Temp. MPa 105 105 13.1 300 350 110 ～300 260 450 42 400 40 40 90 4.95 Bending Strength 149 149 280 450 40 High Temp. MPa ------900℃ 900℃ 1200℃ 1450℃ 1300℃

Young's Modulus GPa 72 72 - 395 360 170 190 360 420 160 420～460 10 - 17 -

Poisson's Ratio - 0.17 0.17 - 0.23 0.23 0.30 0.27 0.16 0.18 - 0.21 0.12 - 0.18 -

GPa 9.7GPa 9.7GPa 17.7GPa 16GPa 6.1GPa 10.6GPa 20.4GPa 23.5GPa 28.6～34.7GPa

Mechanical Properties Vickers Hardness 2 - - 60Hs - 100Hs - (kgf/mm ) （950） （950） （1770） （1600） （600） （1040） （2000） （2300） （2800～3400）

Fracture Toughness 1/2 (MPa・m ) - - - 4.0 4.5 1.2 - 4.0 3.5 - 3～5 - - - - (KⅠc)

Coe cient of Thermal -6 0.5 0.65 0.4 8.0 7.8 8.2 3.9 4.2 4.5 4.3 4.5 4.8 4.8 3.2 x10 /K - Expansion RT～1000℃ RT～1000℃ RT～1000℃ RT～900℃ RT～900℃ RT～900℃ RT～1000℃ RT～1000℃ RT～1000℃ RT～1000℃ RT～1000℃ RT～450℃ RT～450℃ RT～450℃

Room Temp. W/(m・K) 1.5 1.4 - 35 30 14 157 220 170 105 20～40 107 - - 0.4 Thermal Conductivity 3（900℃） High Temp. W/(m K) - 1.02（1000℃） 9（1000℃） 8（1000℃） - - 55（1000℃） 55（1000℃） - 52（1000℃） - - ・ （t2.0mm）

Thermal Shock ＞1000 ＞1000 - 200 220 130 - 350 450 ------

Thermal Properties Thermal Resistance Tc

3000 1500 2000 Max. Use Temperature 1100 1000 1000 1800 1500 2000 1300 1370 1500 1500 - ℃ （inert atmos.） （inert atmos.） （inert atmos.）

Electrical Volume 18 18 17 16 16 4 +1 －1 4 6 -1 1 -3 -3 ℃ 10 10 - 10 10 10 2.4x10 10 ～10 10 ～10 - 10 ～10 1.1x10 5.0x10 - Resistivity

3.58 3.58 10.1 9.9 12.0 Dielectric Constant cm ------Ω・ 1MHz 1MHz 10GHz 10GHz 13.56MHz

-4 -4 -4 -3 -4 Dielectric Loss 1.5x10 1.5x10 1.0x10 1.0x10 6x10 ------1MHz 1MHz 10GHz 10GHz 13.56MHz Electrical Properties (Tan Delta)

These values are typical and should not be considered as specifications. The characteristic values may vary depending on product shape and conditions of use.

11 PRODUCTS GUIDE PRODUCTS GUIDE 12 CoorsTek KK

Head Office Osaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku, Tokyo 141-0032, Japan TEL +81-3-5437-8411 FAX +81-3-5437-7172

Oguni Facility 378, Oguni-machi Oaza, Oguni-machi, Nishiokitamagun, Yamagata Prefecture 999-1351, Japan TEL +81-238-62-5902 FAX +81-238-62-5178

Hadano Facility 30, Soya, Hadano City, Kanagawa Prefecture 257-8566, Japan TEL +81-463-81-1050 FAX +81-463-81-1664

Kariya Facility 1, Minami-Fuji, Ogakie-cho, Kariya City, Aichi Prefecture 448-8665, Japan TEL +81-566-21-2851 FAX +81-566-21-6365

CoorsTek Sales KK (Domestic Sales Company )

Head Office Osaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku, Tokyo 141-0032, Japan TEL +81-3-5437-8411 FAX +81-3-5437-7395

Chubu Branch 1, Minami-Fuji, Ogakie-cho, Kariya City, Aichi Prefecture 448-8665, Japan TEL (0566)21-3507 FAX (0566)21-3152

Tohoku Branch 5-15, Kamisugi 1-chome, Aoba-ku, Sendai City, Miyagi Prefecture 980-0011, Japan TEL +81-22-264-2241 FAX +81-22-264-2242

CoorsTek Japan, which until recently had handled product sales in Japan for CoorsTek Inc., is now “CoorsTek Sales KK” as the result of a merger that took place on July 1, 2016.

Domestic Subsidiaries

CoorsTek Tokuyama Corporation 2-1-32, Eguchi, Shunan City, Yamaguchi Prefecture 745-0862, Japan TEL+81-834-32-3400 FAX+81-834-22-5898

CoorsTek Nagasaki Corporation 296, Kawatana-cho Momozugo, Higashisonogi-gun, Nagasaki Prefecture 859-3605, Japan TEL+81-956-82-3111 FAX+81-956-82-3111

13 PRODUCTS GUIDE CoorsTek KK

Head Office Our 100 year history Osaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku, Tokyo 141-0032, Japan The roots of CoorsTek, Inc. and CoorsTec KK originated in the US and Japan respectively in the TEL +81-3-5437-8411 FAX +81-3-5437-7172 early 1900s. We will continue to provide our customers with Amazing Solutions for the next 100 years based on assets cultivated each company over our combined 200 years. Oguni Facility 378, Oguni-machi Oaza, Oguni-machi, Nishiokitamagun, CoorsTek KK (Japan) CoorsTek, Inc. (USA) Yamagata Prefecture 999-1351, Japan 1918 Toyo Fire Brick Company established 1910s 1910 Herold China and Pottery Company TEL +81-238-62-5902 FAX +81-238-62-5178 (later becomes Thoshiba established Refractories Co., Ltd.) 1920s (later becomes CoorsTek, Inc. (USA)) Hadano Facility 1928 Denki Kinyu K.K. established 1923 Introduces heat-resistant 30, Soya, Hadano City, (later becomes Thoshiba Denko Co., Ltd.) 1930s ovenware products Kanagawa Prefecture 257-8566, Japan 1938 Oguni facility built Develops isostatic press technology TEL +81-463-81-1050 FAX +81-463-81-1664 1940s 1942 1950s Kariya Facility 1, Minami-Fuji, Ogakie-cho, Kariya City, 1968 Thoshiba Denko and Toshiba 1960s 1965 Introduces ceramic substrates Aichi Prefecture 448-8665, Japan Refractories merge to become for use in electronic equipment Toshiba Ceramics Co., Ltd. TEL +81-566-21-2851 FAX +81-566-21-6365 1970s 1972 Introduces TPSS Si-Impregnated Silicone Cabide Products 1980s 1986 Coors Porcelain becomes Coors Ceramics CoorsTek Sales KK (Domestic Sales Company) 1997 Develops and markets super 1990s high-purity quartz glass 2007 Covalent Materials Corporation established 2000s 2000 Coors Ceramics changes Head Office through management buyout its name to CoorsTek Osaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku, 2015 Covalent Materials changes its name to 2010s 2011 Acquires Saint-Gobain's Tokyo 141-0032, Japan CoorsTek KK advanced ceramics business 2014 Acquires Covalent Materials Corporation TEL +81-3-5437-8411 FAX +81-3-5437-7395

Chubu Branch 1, Minami-Fuji, Ogakie-cho, Kariya City, Aichi Prefecture 448-8665, Japan TEL (0566)21-3507 FAX (0566)21-3152 CoorsTek, Inc. (USA)

Tohoku Branch Based in Colorado in the United States, CoorsTek is the world’s largest engineered ceramics 5-15, Kamisugi 1-chome, Aoba-ku, Sendai City, manufacturer. With over 50 manufacturing bases throughout the world, CoorsTek supplies Miyagi Prefecture 980-0011, Japan products to customers in more than 10,000 businesses across 70 countries in many fields, TEL +81-22-264-2241 FAX +81-22-264-2242 including the semiconductor, energy, automotive and medical industries.

CoorsTek Japan, which until recently had handled product sales in Japan for CoorsTek Inc., is now “CoorsTek Sales KK” as the result of a merger that took place on July 1, 2016.

Domestic Subsidiaries

CoorsTek Tokuyama Corporation 2-1-32, Eguchi, Shunan City, Yamaguchi Prefecture 745-0862, Japan TEL+81-834-32-3400 FAX+81-834-22-5898

CoorsTek Nagasaki Corporation 296, Kawatana-cho Momozugo, Higashisonogi-gun, Nagasaki Prefecture 859-3605, Japan TEL+81-956-82-3111 FAX+81-956-82-3111

Corporate Headquarters Overseas Subsidiaries ★ ● CoorsTek Manufacturing Facility ● CoorsTek Sales/Distribution Center CoorsTek Taiwan Corp. 16F-4, No. 295, Sec. 2, Kuang-Fu Road, Hsin-Chu 30017, Taiwan TEL +886-(0)3-575-1238 FAX +886-(0)3-575-1633

13 PRODUCTS GUIDE PRODUCTS GUIDE 14 PRODUCTS GUIDE

Osaki Wiz Tower, 11-1, Osaki 2-chome, Shinagawa-ku, Tokyo 141-0032, Japan www.coorstek.co.jp