62Nd ELECTRONIC MATERIALS CONFERENCE
Total Page:16
File Type:pdf, Size:1020Kb
PROGRAM GUIDE 62nd ELECTRONIC MATERIALS CONFERENCE June 24-26, 2020 62nd ELECTRONIC MATERIALS CONFERENCE June 24-26, 2020 WELCOME TO THE CONFERENCE! It is with great pleasure that we welcome you to the 62nd Electronic Materials Conference (EMC 2020). Though produced this year in a totally virtual format—with both prerecorded and live-streaming presentations–the Conference will continue to follow in EMC’s long tradition of offering premier research on the preparation and characterization of electronic materials. We have a strong community, and we thank those volunteers who have stepped forward to make this Conference happen. We also thank you for choosing to join us! Conference Chair Program Chair Kris Bertness National Institute of Standards and Technology Lisa Porter Carnegie Mellon University CONFERENCE HIGHLIGHTS SPECIAL THANKS! The 62nd EMC Program Scientists from around the world will participate virtually this week to share ideas, present technical information and contribute to the advancement of electronic materials research. Featuring over 350 oral/poster presentations, the 62nd EMC will offer a strong program with 45 technical sessions dimatixmaterialsprinter.com focused on: electronic materials science and technology; energy storage and conversion materials; nanoscale science and technology; organic materials, thin films and devices; oxide semiconductors and dielectrics; and wide bandgap semiconductors. Poster Sessions are slated for Wednesday evening and Thursday morning. EMC Awards Ceremony & Plenary Session The 62nd EMC kicks off Wednesday morning with the Awards Ceremony & Plenary Session. First, the 2019 Best Student Presentation Award recipients will be announced and honored. ngc.com The Plenary lecture follows, with Joan Redwing, The Pennsylvania State University, presenting Epitaxial Growth and Properties of Atomically Thin Semiconductors – Moving Beyond Flakes. Learn more on page 4. Save the Dates 63rd Electronic Materials Conference 64th Electronic Materials Conference June 23-25, 2021 June 22-24, 2022 mocvd.jp University of California, Santa Barbara The Ohio State University Santa Barbara, California Columbus, Ohio TABLE OF CONTENTS Committees ...................................................2 Wednesday Oral Presentations ...................19 EMC Awards Ceremony & Plenary Session ..4 Poster Presentations ...................................43 Daily Schedule of Events ...............................5 Thursday Oral Presentations .......................56 tms.org/foundation Program At-A-Glance ....................................6 Friday Oral Presentations ............................89 Poster Sessions .............................................9 EMC Index .................................................120 RECORDING/PHOTO POLICY No photographs/recordings of presentations permitted. Any files temporarily downloaded for viewing will be deleted upon completion of the session unless explicit permission is given by the authors. EMC is being coordinated with the Device Research Conference, held virtually this year, June 21-24 The 62nd EMC has been managed by CONFERENCE SERVICES Because the Experience Matters mrs.org/conference-services 1 COMMITTEES Executive Committee Metamaterials and Materials for THz, Plasmonics ENERGY STORAGE AND and Polaritons CONVERSION MATERIALS Joshua Caldwell, Vanderbilt University Chair Kris Bertness Electrochemical Energy Storage and Conversion Kurt Eyink, Air Force Research Laboratory National Institute of Susan Fullerton, University of Pittsburgh Rachel Goldman, University of Michigan Standards and Technology David Gundlach, National Institute of Standards Anthony Hoffman, University of Notre Dame and Technology Vice-Chair Lisa Porter Stephanie Law, University of Delaware Carnegie Mellon University Zetian Mi, University of Michigan Berardi Sensale Rodriguez, The University of Utah Louis Piper, Binghamton University, Secretary Daniel Wasserman Jason Valentine, Vanderbilt University The State University of New York The University of Texas Daniel Wasserman, The University of Texas at Austin Edward Yu, The University of Texas at Austin at Austin Huili Grace Xing, Cornell University Energy Harvesting Treasurer Rebecca Peterson Nano-Magnetic, Magnetic Memory Alan Doolittle, Georgia Institute of Technology University of Michigan and Spintronic Materials Ken Jones, U.S. Army Research Laboratory Michael Flatte, The University of Iowa Jamie Phillips, University of Michigan Roland Kawakami, The Ohio State University ELECTRONIC MATERIALS Shadi Shahedipour-Sandvik, State University Xinyu Liu, University of Notre Dame of New York Polytechnic Institute SCIENCE AND TECHNOLOGY Angel Yanguas-Gil, Argonne National Laboratory Contacts to Semiconductor Epilayers, Solar Cell Materials and Devices Nanostructures and Organic Films Nanofabrication and Processing Geoffrey Bradshaw, Air Force Research Laboratory Leonard Brillson, The Ohio State University Bruno Azeredo, Arizona State University Rachel Goldman, University of Michigan Shadi Dayeh, University of California, San Diego Kris Bertness, National Institute of Standards Mark Goorsky, University of California, Los Angeles and Technology Chris Hinkle, University of Notre Dame Andrej Lenert, University of Michigan Mona Ebrish, U.S. Naval Research Laboratory Suzanne Mohney, The Pennsylvania State University Steve Ringel, The Ohio State University Xiuling Li, University of Illinois at Urbana-Champaign Lisa Porter, Carnegie Mellon University Oleg Rubel, McMaster University Parsian Mohseni, Rochester Institute of Technology Tae-Yeon Seong, Korea University Jae-Hyun Ryou, University of Houston Andre Zeumault, The University of Tennessee, Knoxville Jerry Woodall, University of California, Davis Mike Scarpulla, The University of Utah Narrow Bandgap Materials and Devices Embedded Nanoparticles and Nanocomposite Films Christian Wetzel, Rensselaer Polytechnic Institute Ganesh Balakrishnan, The University of New Mexico Seth Bank, The University of Texas at Austin Mark Wistey, Texas State University Brian Bennett, U.S. Naval Research Laboratory Matt Doty, University of Delaware Jerry Woodall, University of California, Davis Bob Biefeld, Retired Kurt Eyink, Air Force Research Laboratory Thermoelectrics and Thermal Transport Sanjay Krishna, The Ohio State University Minjoo (Larry) Lee, University of Illinois Ferdinand Poudeu, University of Michigan Andrej Lenert, University of Michigan at Urbana-Champaign Xiaojia Wang, University of Minnesota Kyle McNicholas, Lincoln Laboratory, Roberto Myers, The Ohio State University Yaguo Wang, The University of Texas at Austin Massachusetts Institute of Technology Joshua Zide, University of Delaware Andre Zeumault, The University of Tennessee, Knoxville Kunal Mukherjee, University of California, Santa Barbara Joshua Zide, University of Delaware Epitaxial Materials and Devices Jamie Phillips, University of Michigan Seth Bank, The University of Texas at Austin Gregory Triplett, Virginia Commonwealth University Kurt Eyink, Air Force Research Laboratory Christine Wang, Lincoln Laboratory, NANOSCALE SCIENCE Archie Holmes, University of Virginia Massachusetts Institute of Technology AND TECHNOLOGY Sriram Krishnamoorthy, The University of Utah Daniel Wasserman, The University of Texas at Austin Graphene, BN, MoS2 and Other 2D Materials Charles Lutz, Lumentum Operations LLC Joshua Zide, University of Delaware and Devices Nadeemullah Mahadik, U.S. Naval Research Laboratory Thomas Beechem, Sandia National Laboratories Point Defects, Doping and Extended Defects Kyle McNicholas, Lincoln Laboratory, Kevin Daniels, University of Maryland Andrew Armstrong, Sandia National Laboratories Massachusetts Institute of Technology Mona Ebrish, U.S. Naval Research Laboratory Ramon Collazo, North Carolina State University Siddharth Rajan, The Ohio State University Randall Feenstra, Carnegie Mellon University Rachel Goldman, University of Michigan Shadi Shahedipour-Sandvik, State University Susan Fullerton, University of Pittsburgh Lincoln Lauhon, Northwestern University of New York Polytechnic Institute Roland Kawakami, The Ohio State University Kunal Mukherjee, University of California, Santa Barbara Stephanie Tomasulo, U.S. Naval Research Laboratory Manos Kioupakis, University of Michigan Steve Ringel, The Ohio State University Christine Wang, Lincoln Laboratory, Rachel Koltun, Guardian Industries Massachusetts Institute of Technology Shadi Shahedipour-Sandvik, State University Lincoln Lauhon, Northwestern University Kin-Man Yu, City University of Hong Kong of New York Polytechnic Institute Jun Suda, Kyoto University Suzanne Mohney, The Pennsylvania State University Materials for Memory and Computation Christian Wetzel, Rensselaer Polytechnic Institute Siddharth Rajan, The Ohio State University Ritesh Agarwal, University of Pennsylvania Jerry Woodall, University of California, Davis Joan Redwing, The Pennsylvania State University Alan Doolittle, Georgia Institute of Technology Joshua Robinson, The Pennsylvania State University Quantum Materials Susan Fullerton, University of Pittsburgh Michael Spencer, Morgan State University Matt Doty, University of Delaware Angel Yanguas-Gil, Argonne National Laboratory Christine Wang, Lincoln Laboratory, Rachel Goldman, University of Michigan Massachusetts Institute of Technology Materials Integration Anthony Hoffman, University of Notre Dame Huili Grace Xing, Cornell University Daniel Ewing, Department of Energy’s Kansas City National Security Campus Stephanie Law, University of Delaware Mark Goorsky, University