INKJET FOR R&D AND VOLUME PRODUCTION PiXDRO IJP · 04/2020 · BR_PiXDRO_IJP_2020 · V1 INKJET PRINTING PiXDRO INKJET PRINTING TECHNOLOGY FOR A LARGE VARIETY OF PROCESSES

The PiXDRO industrial inkjet printing equipment applies printed and flexible electronics, displays, OLED, sensors, functional materials for a variety of applications. These PCB, semiconductor assembly, chemical machining, functional materials can have dielectric, conductive, photovoltaics, life science, and optics. Inkjet printing can adhesive, mechanical, optical or chemical properties, and create very fine features, down to 20 micron, and can are printed with pico-liter sized droplets from a digital file. replace conventional techniques such as , Inkjet printing is an additive manufacturing technology, , spray coating and dispensing. Because hence has great advantages in relation to material usage, it is fully digital, there is no need for masks and screens, productivity, environmental impact and costs. significantly saving material usage, and enabling fast Because of its precise drop placement and volumes, product changeover times. functional inkjet printing has numerous applications in

Direct Patterning Masking Functional materials, Etchants , Plating

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0 m 0 m Print Process Result Print Process Post processing Result ( /printhead /surface interaction) (Finished product) (Ink /printhead /surface interaction) (Functional layer) (Finished product)

Print Process Result Print Process Post processing Result (Ink /printhead /surface interaction) (Finished product) (Ink /printhead /surface interaction) (Functional layer) (Finished product) Homogenous Layers Lift-off Masking High precision coatings, Encapsulation

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0 m Pre processing Print Process Result 5 m Print Process Post processing Result (Sampel preparation) (Ink /printhead /surface interaction) (Finished product) (Ink /printhead /surface interaction) (Functional layer) (Finished product)

Pre processing Print Process Result Print Process Post processing Result (Sampel preparation) (Ink /printhead /surface interaction) (Finished product) (Ink /printhead /surface interaction) (Functional layer) (Finished product)

2 UNIQUE BENEFITS OF INKJET PRINTING

Injekt Benefits Litho Screen Spin/Spray Dispense Cost Additive Less process steps No waste Save materials Feature Size Smaller features High accuracy Productivity Thousands of parallel nozzles

Topology Contact free 3D substrates Higher yield Flexibility Digital patterning Easy product changes Product Size Scalable Wide range of product dimensions

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PiXDRO LP50 PiXDRO JETx

Desktop R&D INKJET Mass production INKJET Printer + Research and development of inkjet processes and appli- + Configurable design for various applications cations + Low cost of ownership + For printing dielectric, masking, conductive and adhesive + High productivity patterns + Accurate motion systems + High precision stages and alignment system + Small footprint + Robust, open and flexible platform + Direct roadmap to mass production

3 ACCURATE, VERSATILE AND FAST

As inkjet printing is compatible with a wealth of functional for fragile and 3D substrates, and can fill trenches and cavi- materials, it is a very versatile technology. It can be used ties. Furthermore, it is excellent for direct printing of etching for direct material deposition for patterned or homogeneous and plating masks. coatings, from tens of nanometers up to tens of microme- Because industrial printheads have hundreds or thousands ters (depending on ink materials). By printing multiple layers of parallel nozzles, and operate at very high frequencies, of material on top of each other, it can also be used as a 3D inkjet achieves very high throughput. The PiXDRO mass printing method. production inkjet printers can hold arrays of multiple print- Inkjet is a non-contact deposition technAology, so suitable heads, enabling high productivity and flexibility.

Additive + Non-contact + Material saving + Printing on topography

Flexible + Digital manufacturing + Individualized products + Fast prototyping and pilot runs + Correction of product tolerances Precise + Complex structures and uniform coatings + Pico-liter droplets for micro-accurate patterning

Many applications + Dielectric, conductive, masking and adhesive materials + Semiconductor, , PCB, pharma Lower cost + Less process steps + Low material consumption + Less equipment + Lower maintenance 4 ENABLING FUTURE TECHNOLOGIES INKJET APPLICATION EXAMPLES

Printed Circuit Board (PCB) Semiconductor Printed Electronics (PE) Others

Solder Mask Passivation Metallization Pharma

Solder Dam Photo Resist Encapsulation Micro Etching

Etching Mask Leadframe Coating Multilayers Sensor Activation

INKJET APPLICATIONS OVERVIEW

DIELECTRIC MASKING CONDUCTIVE ADHESIVE

Isolation, protection, filling, Direct printing of Die bonding, sensor Applications stress buffer, encapsulation, Etching, plating, lift-off conductive traces assembly, glass bonding solder resist

Layer Thickness 1 – 100 µm 5 – 40 µm 0.5 – 5 µm 5 – 30 µm

Epoxy (solvent or solid) or nanopar- Acrylate Ink Types Polyimide (solvent) Hotmelt, UV curable ticles in solvent; up to 40% (solvent) Acrylate (solid) solid content

Feature Size > 40 µm > 50/20 µm L/S > 40 µm > 50 µm

Pencil Hardness up to 4H Acid and alkaline Conductivity up to Adhesion on silicon, glass, Properties Resistivity up to 1016 Ω.cm resistant 50% of bulk silver PET/PEN foil, metals

Baking, drying, Drying, Drying, Baking, drying, Post Treatments UV curing UV curing (thermal, photonic, laser) UV curing

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PiXDRO IJP · 04/2020 · BR_PiXDRO_IJP_2020 · V1