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In the United States District Court for the District of Delaware
IN THE UNITED STATES DISTRICT COURT FOR THE DISTRICT OF DELAWARE SEMCON TECH, LLC, Plaintiff, v. C.A. No. _________ APPLIED MATERIALS, INC., APPLIED MATERIALS SOUTH EAST ASIA PTE. JURY TRIAL DEMANDED LTD., APPLIED MATERIALS TAIWAN, LTD., APPLIED MATERIALS CHINA, APPLIED MATERIALS FRANCE S.A.R.L., AND APPLIED MATERIALS ITALIA SRL, Defendants. COMPLAINT FOR PATENT INFRINGEMENT This is an action for patent infringement arising under the Patent Laws of the United States of America, 35 U.S.C. § 1 et seq. in which Plaintiff Semcon Tech, LLC makes the following allegations against Defendants Applied Materials, Inc., Applied Materials South East Asia Pte. Ltd., Applied Materials Taiwan, Ltd., Applied Materials China, Applied Materials France S.A.R.L., and Applied Materials Italia Srl (collectively, “AMAT” or “Defendants”). PARTIES 1. Plaintiff Semcon Tech, LLC (“Semcon”) is a Delaware limited liability company. 2. On information and belief, Defendant Applied Materials, Inc. (“AMAT- US”) is a Delaware corporation with its principal place of business at 3050 Bowers Avenue, Santa Clara, California. On information and belief, AMAT can be served through its registered agent, The Corporation Trust Company, Corporation Trust Center, 1 1209 Orange Street, Wilmington, Delaware 19801. 3. On information and belief, Defendant Applied Materials South East Asia Pte. Ltd. (“AMAT-SG”) is a corporation organized under the laws of Singapore with its principal place of business at 8 Upper Changi Road North, Singapore 506906. 4. On information and belief, Defendant Applied Materials Taiwan, Ltd. (“AMAT-TW”) is a corporation organized under the laws of Taiwan with its principal place of business at No. -
DYNAMIC RANDOM ACCESS MEMORY and NAND FLASH MEMORY DEVICES and PRODUCTS Investigation No
UNITED STATES INTERNATIONAL TRADE COMMISSION Washington, D.C. In the Matter of CERTAIN DYNAMIC RANDOM ACCESS MEMORY AND NAND FLASH MEMORY DEVICES AND PRODUCTS Investigation No. 337- TA-803 CONTAINING SAME NOTICE OF A COMMISSION DETERMINATION NOT TO REVIEW INITIAL DETERMINATIONS TERMINATING THE INVESTIGATION AS TO ALL REMAINING RESPONDENTS; TERMINATION OF THE INVESTIGATION AGENCY: U.S. International Trade Commission. ACTION: Notice. SUMMARY: Notice is hereby given that the U.S. International Trade Commission has determined not to review initial determinations ("IDs") (Order Nos. 70, 71, and 72) of the presiding administrative law judge ("ALJ") terminating the above-captioned investigation as to all remaining respondents based on settlement and license agreements. The remaining respondents included the following: Acer Inc. of Taipei, Taiwan; Acer America Corp. of San Jose, California; ADATA Technology Co., Ltd. of New Taipei City, Taiwan; ADATA Technology (U.S.A.) Co., Ltd. of Hacienda Heights, California; Asustek Computer Inc. of Taipei City, Taiwan; Asus Computer International Inc. of Freemont, California; Dell, Inc. of Round Rock, Texas; Hewlett-Packard Company of Palo Alto, California; Kingston Technology Co., Inc. of Fountain Valley, California; Logitek International S.A. ("LISA") ofVaud, Switzerland; Logitech, Inc. of Fremont, California; Best Buy Co., Inc. of Richfield, Minnesota; and Wal-Mart Stores, Inc. of Bentonville, Arkansas (collectively, "the remaining respondents"); Elpida Memory, Inc. of Tokyo, Japan and Elpida Memory (USA) of Sunnyvale, California (collectively, "Elpida"); and SK Hynix Inc. (f/k/a Hynix Semiconductor Inc.) ofGyeonggi-do, Korea and Hynix Semiconductor America, Inc. of San Jose, California (collectively, "Hynix"). FOR FURTHER INFORMATION CONTACT: Clint Gerdine, Esq., Office of the General Counsel, U.S. -
Amd Filed: February 24, 2009 (Period: December 27, 2008)
FORM 10-K ADVANCED MICRO DEVICES INC - amd Filed: February 24, 2009 (period: December 27, 2008) Annual report which provides a comprehensive overview of the company for the past year Table of Contents 10-K - FORM 10-K PART I ITEM 1. 1 PART I ITEM 1. BUSINESS ITEM 1A. RISK FACTORS ITEM 1B. UNRESOLVED STAFF COMMENTS ITEM 2. PROPERTIES ITEM 3. LEGAL PROCEEDINGS ITEM 4. SUBMISSION OF MATTERS TO A VOTE OF SECURITY HOLDERS PART II ITEM 5. MARKET FOR REGISTRANT S COMMON EQUITY, RELATED STOCKHOLDER MATTERS AND ISSUER PURCHASES OF EQUITY SECURITIES ITEM 6. SELECTED FINANCIAL DATA ITEM 7. MANAGEMENT S DISCUSSION AND ANALYSIS OF FINANCIAL CONDITION AND RESULTS OF OPERATIONS ITEM 7A. QUANTITATIVE AND QUALITATIVE DISCLOSURE ABOUT MARKET RISK ITEM 8. FINANCIAL STATEMENTS AND SUPPLEMENTARY DATA ITEM 9. CHANGES IN AND DISAGREEMENTS WITH ACCOUNTANTS ON ACCOUNTING AND FINANCIAL DISCLOSURE ITEM 9A. CONTROLS AND PROCEDURES ITEM 9B. OTHER INFORMATION PART III ITEM 10. DIRECTORS, EXECUTIVE OFFICERS AND CORPORATE GOVERNANCE ITEM 11. EXECUTIVE COMPENSATION ITEM 12. SECURITY OWNERSHIP OF CERTAIN BENEFICIAL OWNERS AND MANAGEMENT AND RELATED STOCKHOLDER MATTERS ITEM 13. CERTAIN RELATIONSHIPS AND RELATED TRANSACTIONS AND DIRECTOR INDEPENDENCE ITEM 14. PRINCIPAL ACCOUNTANT FEES AND SERVICES PART IV ITEM 15. EXHIBITS, FINANCIAL STATEMENT SCHEDULES SIGNATURES EX-10.5(A) (OUTSIDE DIRECTOR EQUITY COMPENSATION POLICY) EX-10.19 (SEPARATION AGREEMENT AND GENERAL RELEASE) EX-21 (LIST OF AMD SUBSIDIARIES) EX-23.A (CONSENT OF ERNST YOUNG LLP - ADVANCED MICRO DEVICES) EX-23.B -
Semiconductor Contract Manufacturing Worldwide, 1997
t). Semiconductor Contract Manufacturing Worldwide—SCMS-WW to Re- Document Publication order Code Date Document Title Tab: Perspective • SCMS-WW-DP-9701 February 3, 1997 DQ Predicts: Semiconductor Contract Manufacturing in 1997 y a SCMS-WW-DP-9702 March 17, 1997 Telebriefing Summary: Is the Recovery Around the Corner in Wafer Fab Equipment? Or Will the Slowdow/n Extend into 1998? ^ a SCMS-WW-DP-9703 May 12, 1997 Semiconductor Contract Manufacturing W^fer Pricing Trends / a SCMS-WW-DP-9704 June 9, 1997 1996 Fabless Semiconductor Review v a SCMS-WW-DP-9705 June 16. 1997 System-Level Integration ASICs Add Embedded DFIAM y a SCMS-WW-DP-9706 July 21, 1997 Wafer Fab Equipment Market Forecast and Capacity Update • SCMS-WW-DP-9707 August 25, 1997 The Challenges of Embedded DRAM in ASICs: A Manufacturing K/" Economics Point of View • SCMS-WW-DP-9708 September 1, 1997 Capital Spending And Wafer Fab Equipment Midyear Forecast Update: Real Recovery in Progress? Or Is Another Stall in the Works'' ^-^ a SCMS-WW-DP-9709 December 1, 1997 Amkor Wafer Fabrication Services'^ • SCMS-WW-DP-9710 October 13, 1997 IBM Transfers First Copper Metallization Process into Production) a SCMS-WW-DP-9711 November 10, 1997 A Ride Down Intel's Pricing Escalator • SCMS-WW-DP-9712 December 22, 1997 Semiconductor Contract Manufacturing Wafer Pricing Trends: Fall 1997 y Tab: Market Trends a SCMS-WW-MT-9701 September 15, 1997 Midyear 1997 Forecast: Semiconductor Contract Manufacturing Tab: Market StatisUes a SCMS-WW-MS-9701 November 24, 1997 1996 Semiconductor Contract Manufacturing -
Intel Announces X25-V 40GB Solid-State Drive for $125 15 March 2010
Intel Announces X25-V 40GB Solid-State Drive for $125 15 March 2010 applications and their favorite gaming application, such as Dragon Age: Origins, and experience up to 43 percent faster overall system performance or 86 percent improvement in their gaming experience. The SSD also speeds operations such as system start up, the opening of applications and files or resuming from standby. The Intel X25-V SSD The Intel X25-V features 40GB of 34nm NAND flash memory. This non-volatile memory retains data, even when the power is turned off, and is used in applications such as smartphones, Intel Corp. announced today a new addition to its personal music players, memory cards or SSDs for award-winning lineup of high-performance solid- fast and reliable storage of data. SSD benefits over state drives (SSDs): the Intel X25-V Value SATA a traditional HDD include higher performance, SSD. Priced at $125, the 40 gigabyte (GB) drive is battery saving and ruggedness. "Adding the Intel aimed at value segment netbooks and dual- X25-V to our existing family of high-performance drive/boot drive desktop set-ups to offer users the SSDs gives our resellers a full range of high- performance and reliability advantages of solid- performing, quality SSDs for notebook upgrades, state computing at an affordable, entry-level price. dual-drive desktop set ups or embedded applications," said Pete Hazen, director of SSDs can replace or coexist with traditional hard marketing for the Intel NAND Solutions Group. disk drives (HDDs). With no movable parts or spinning platters, SSDs are more reliable and The 40GB Intel X25-V complements Intel's higher higher performing than HDDs. -
Redacted Public Version 28
Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page1 of 109 MICHAEL S. ELKIN (admitted pro hac vice) 1 [email protected] THOMAS P. LANE (admitted pro hac vice) 2 [email protected] WINSTON & STRAWN LLP 3 200 Park Avenue New York, NY 10166-4193 4 Telephone: 212.294.6700 Facsimile: 212.294.4700 5 ERIN R. RANAHAN (No. 235286) 6 [email protected] DREW A. ROBERTSON (No. 266317) 7 [email protected] WINSTON & STRAWN LLP 8 333 S. Grand Avenue, Suite 3800 Los Angeles, CA 90071-1543 9 Telephone: 213.615.1700 Facsimile: 213.615.1750 10 DANIEL B. ASIMOW (No. 165661) 11 [email protected] ROBERT D. HALLMAN (No. 239949) 12 [email protected] ARNOLD & PORTER LLP 13 Three Embarcadero Center, 10th Floor San Francisco, CA 94111-4024 14 Telephone: 415.471.3100 Facsimile: 415.471.3400 15 Attorneys for Plaintiff 16 PNY TECHNOLOGIES, INC. 17 UNITED STATES DISTRICT COURT 18 NORTHERN DISTRICT OF CALIFORNIA 19 SAN FRANCISCO DIVISION 20 21 PNY TECHNOLOGIES, INC., Case No.: 11-cv-04689 WHO 22 Plaintiff, THIRD AMENDED COMPLAINT FOR 23 ANTITRUST VIOLATIONS; v. DECLARATORY RELIEF; AND 24 UNFAIR COMPETITION SANDISK CORPORATION, 25 DEMAND FOR JURY TRIAL Defendant. 26 27 REDACTED PUBLIC VERSION 28 PNY’S THIRD AMENDED COMPLAINT 11-cv-04689-WHO LA:355215.1 Case3:11-cv-04689-WHO Document250 Filed06/11/14 Page2 of 109 1 Plaintiff PNY Technologies, Inc. (“PNY”), by and through its attorneys, Winston & Strawn 2 LLP and Arnold & Porter LLP, files this Third Amended Complaint against Defendant SanDisk 3 Corporation (“SanDisk”) to secure damages, declaratory relief and injunctive relief, and demanding 4 trial by jury, claims and alleges as follows: 5 NATURE OF ACTION 6 1. -
Intel and Micron Produce Breakthrough Memory Technology
July 28, 2015 Intel and Micron Produce Breakthrough Memory Technology New Class of Memory Unleashes the Performance of PCs, Data Centers and More NEWS HIGHLIGHTS ● Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years. 1 ● New 3D XPoint™ technology brings non-volatile memory speeds up to 1,000 times faster than NAND, the most popular non-volatile memory in the marketplace today. ● The companies invented unique material compounds and a cross point architecture for a memory technology that is 10 times denser than conventional memory2. ● New technology makes new innovations possible in applications ranging from machine learning to real-time tracking of diseases and immersive 8K gaming. SANTA CLARA, Calif. & BOISE, Idaho--(BUSINESS WIRE)-- Intel Corporation and Micron Technology, Inc. today unveiled 3D XPoint™ technology, a non-volatile memory that has the potential to revolutionize any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989. This Smart News Release features an interactive multimedia capsule. View the full release here: http://www.businesswire.com/news/home/20150728005534/en/ The explosion of connected devices and digital services is generating massive amounts of new data. To make this data useful, it must be stored and analyzed very quickly, creating challenges for service providers and system builders who must balance cost, power and performance trade-offs when they design memory and storage solutions. -
Career Center Annual Report
CAREER CENTER ANNUAL REPORT 2019–2020 th Best Return on 5Investment 1 73 % Students Utilized Mines % Career Services 95 Positive Outcomes Rate2,3 IN A YEAR OF UNPRECEDENTED CHALLENGES, 1,200 Organizations THE STUDENTS, FACULTY, AND STAFF OF Recruited or MINES HAVE RISEN TO THE OCCASION, Hired at Mines REFLECTING THE INDOMITABLE OREDIGGER SPIRIT OF RESILIENCE THAT IS AT THE HEART OF THE MINES EXPERIENCE. THE CAREER Average CENTER HAS BEEN NIMBLE IN ADAPTING TO Starting $ Salary 3 NEW CIRCUMSTANCES AND CHANGING NEEDS. k 1 Among public universities nationwide 2 Employed79 in industry, government, military, www.payscale.com/college-salary-report/best-schools-by- continuing education, or international students type/bachelors/public-schools returning to their home countries. 3 Combined BS, MS, and PhD grads “IT IS ABSOLUTELY AMAZING TO BE ABLE TO PUT ON GLOVES AND TOUCH A VEHICLE THAT IS GOING INTO SPACE, LET ALONE CONTRIBUTE TO A TEAM OF INCREDIBLY SMART INDIVIDUALS TO HELP BUILD THIS VEHICLE AND GET IT INTO SPACE.” NADIA SMITH Mechanical Engineering REACHING BS, Class of 2021 FOR THE STARS GR ADUATED $ STUDENT 79K Average Starting OUTCOMES Salary 1 % A Record 22 Graduates Continue with 1,548 Advanced Education3 Total Graduates The Class of 2020 graduated into a labor market unlike any in recent history with a pandemic impacting course delivery and an unexpected, % sudden shift in the economy. Despite these Positive challenges, Mines graduates saw positive outcomes, Outcomes similar to prior years—a testament to their enduring 95 1,2 Rate value as professionals and graduates. 2 Employed in industry, government, military, continuing education, 1 BS, MS, and PhD grads or international students returning to their home countries. -
Media Briefing
Media Briefing SANJAY MEHROTRA | President and Chief Executive Officer Mr. Mehrotra joined Micron in May 2017, after a long and distinguished career at SanDisk Corporation where he led the company from start-up in 1988 until its eventual sale in 2016. In addition to being a SanDisk co-founder, Mr. Mehrotra served as its president and CEO from 2011 to 2016, overseeing its growth to an industry-leading Fortune 500 company. Prior to SanDisk, Mr. Mehrotra held design engineering positions at Integrated Device Technology, Inc., SEEQ Technology and Intel Corporation. Mr. Mehrotra earned both bachelor’s and master’s degrees in electrical engineering and computer science from the University of California, Berkeley and is a graduate of the Stanford Graduate School of Business Executive Program (SEP). He currently serves on the board of directors of Cavium, Inc. Mr. Mehrotra holds more than 70 patents and has published articles in the areas of nonvolatile memory design and flash memory systems. MANISH BHATIA | Executive Vice President, Global Operations Mr. Bhatia is responsible for driving the vision and direction for Micron’s end-to-end operations. Mr. Bhatia joined Micron in 2017. Mr. Bhatia most recently served as the executive vice president of Silicon Operations at Western Digital Corporation. Prior to that, Mr. Bhatia held several executive roles at SanDisk Corporation and was the company’s executive vice president of Worldwide Operations when it was acquired by Western Digital. Prior to SanDisk, Mr. Bhatia’s career included positions at Matrix Semiconductor, McKinsey & Company and Saint Gobain Corporation. Mr. Bhatia earned bachelor’s and master’s degrees in mechanical engineering from the Massachusetts Institute of Technology and a master’s degree in business administration from MIT’s Sloan School of Management, which he attended as a Leaders for Manufacturing fellow. -
Click Here for a High-Res Headshot SANJAY MEHROTRA | President
SANJAY MEHROTRA | President and Chief Executive Officer Mr. Mehrotra joined Micron in May 2017, after a long and distinguished career at SanDisk Corporation where he led the company from start- up in 1988 until its eventual sale in 2016. In addition to being a SanDisk co-founder, Mr. Mehrotra served as its president and CEO from 2011 to 2016, overseeing its growth to an industry-leading Fortune 500 company. Prior to SanDisk, Mr. Mehrotra held design engineering positions at Integrated Device Technology, Inc., SEEQ Technology and Intel Corporation. Mr. Mehrotra earned both bachelor’s and master’s degrees in electrical engineering and computer science from the University of California, Berkeley and is a graduate of the Stanford Graduate Click here for a high-res School of Business Executive Program (SEP). He currently serves on headshot the board of directors of Cavium, Inc. Mr. Mehrotra holds more than 70 patents and has published articles in the areas of nonvolatile memory design and flash memory systems. JEFF VERHEUL | Senior Vice President of Nonvolatile Engineering Jeff VerHeul is senior vice president of nonvolatile engineering at Micron Technology. He is responsible for leading the nonvolatile memory engineering team and driving execution of Micron’s storage and Managed NAND products. Mr. VerHeul joined Micron in 2017. Prior to Micron, Mr. VerHeul most recently served as senior vice president of corporate engineering for SanDisk. His career has also included senior and corporate vice president positions with SMSC (acquired by Microchip) and AMD, as well as 25 years with IBM where he held several positions of increasing responsibility, including director, vice president, systems development – IBM Systems Group; Click here a for high-res vice president, product development – IBM Microelectronics; and vice president, engineering and technology services. -
Trabajo De Graduación: Valuación De Micron Technology Inc. Autor: Nicolas Vallejos DNI: 40127617 Director De Tesis: Ignacio Warnes Buenos Aires, El 11 De Mayo 2021
Universidad de San Andrés Universidad de San Andrés Escuela de Administración y Negocios Magister en Finanzas Trabajo de Graduación: Valuación de Micron Technology Inc. Autor: Nicolas Vallejos DNI: 40127617 Director de tesis: Ignacio Warnes Buenos Aires, el 11 de mayo 2021 1 Universidad de San Andrés Contenido Micron Technology 4 1. La industria de semiconductores: 8 1.1 El plan “made in China.” 9 2. Mercado de DRAM y NAND: 11 2.1 DRAM: 13 2.1.1. El mercado DRAM 13 2.1.2. Una Consolidación del mercado 16 2.1.3 Clases de DRAM: 19 2.2 NAND: 20 2.2.1. El mercado NAND 21 2.2.2. Una Consolidación del mercado 23 2.2.3. Tipos de NAND: 24 3. Análisis macroeconómico: 25 3.1 Estados Unidos: 25 3.2 Europa: 26 3.3 China: 28 4. Análisis financiero 28 4.1 Ratios de crecimiento: 28 4.2 Ratios de deuda: 35 4.3 Análisis de Dupont 35 4.4 Márgenes de Micron 37 4.5 Ratios de eficiencia: 38 5. Capex e I+D: 39 6. Manufactura: 42 7. Adquisiciones: 44 8. Patentes 45 9. Valuación por flujos descontados 46 9.1 Proyección de mercados 46 9.1.1 Mercado DRAM y NAND 46 9.1.2 Proyección cuotas de mercado Micron en DRAM 56 9.1.3 Proyección cuotas de mercado Micron en NAND 58 2 Universidad de San Andrés 9.2 Proyección inversión y desarrollo 61 9.3 Proyección de CAPEX 61 9.4. Estimación costo de los bienes vendidos 62 9.5 Estimación de depreciación y amortización 63 9.6. -
PART I ITEM 1. BUSINESS Industry We Are
PART I ITEM 1. BUSINESS Industry We are the world’s largest semiconductor chip maker, based on revenue. We develop advanced integrated digital technology products, primarily integrated circuits, for industries such as computing and communications. Integrated circuits are semiconductor chips etched with interconnected electronic switches. We also develop platforms, which we define as integrated suites of digital computing technologies that are designed and configured to work together to provide an optimized user computing solution compared to ingredients that are used separately. Our goal is to be the preeminent provider of semiconductor chips and platforms for the worldwide digital economy. We offer products at various levels of integration, allowing our customers flexibility to create advanced computing and communications systems and products. We were incorporated in California in 1968 and reincorporated in Delaware in 1989. Our Internet address is www.intel.com. On this web site, we publish voluntary reports, which we update annually, outlining our performance with respect to corporate responsibility, including environmental, health, and safety compliance. On our Investor Relations web site, located at www.intc.com, we post the following filings as soon as reasonably practicable after they are electronically filed with, or furnished to, the U.S. Securities and Exchange Commission (SEC): our annual, quarterly, and current reports on Forms 10-K, 10-Q, and 8-K; our proxy statements; and any amendments to those reports or statements. All such filings are available on our Investor Relations web site free of charge. The SEC also maintains a web site (www.sec.gov) that contains reports, proxy and information statements, and other information regarding issuers that file electronically with the SEC.