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Avionics Thermal Management of Airborne Electronic Equipment, 50 Years Later
FALL 2017 electronics-cooling.com THERMAL LIVE 2017 TECHNICAL PROGRAM Avionics Thermal Management of Advances in Vapor Compression Airborne Electronic Electronics Cooling Equipment, 50 Years Later Thermal Management Considerations in High Power Coaxial Attenuators and Terminations Thermal Management of Onboard Charger in E-Vehicles Reliability of Nano-sintered Silver Die Attach Materials ESTIMATING INTERNAL AIR ThermalRESEARCH Energy Harvesting ROUNDUP: with COOLING TEMPERATURE OCTOBERNext Generation 2017 CoolingEDITION for REDUCTION IN A CLOSED BOX Automotive Electronics UTILIZING THERMOELECTRICALLY ENHANCED HEAT REJECTION Application of Metallic TIMs for Harsh Environments and Non-flat Surfaces ONLINE EVENT October 24 - 25, 2017 The Largest Single Thermal Management Event of The Year - Anywhere. Thermal Live™ is a new concept in education and networking in thermal management - a FREE 2-day online event for electronics and mechanical engineers to learn the latest in thermal management techniques and topics. Produced by Electronics Cooling® magazine, and launched in October 2015 for the first time, Thermal Live™ features webinars, roundtables, whitepapers, and videos... and there is no cost to attend. For more information about Technical Programs, Thermal Management Resources, Sponsors & Presenters please visit: thermal.live Presented by CONTENTS www.electronics-cooling.com 2 EDITORIAL PUBLISHED BY In the End, Entropy Always Wins… But Not Yet! ITEM Media 1000 Germantown Pike, F-2 Jean-Jacques (JJ) DeLisle Plymouth Meeting, PA 19462 USA -
Zalman TNN 500AF Totally No Noise Computer Case
※ For other language versions please visit our website. English English Edition ◈ Please read before installation. ◈ Visit our website and watch the TNN500AF installation video first to make your installation easier. www.zalman.co.kr www.zalmanusa.com ▣ Welcome Congratulations on your purchase of ZALMAN Tech’s TNN 500AF. With TNN500AF, you are now in the world of silent computing. TNN 500AF is the ultimate answer to every computer user’s dream of creating a silent computing environment with total system stability. English ▣ Contents 1. Safety Notices 3 2. Features 4 3. Patents 11 4. Components 12 5. Optional Components 15 6. Specifications 15 7. Operational Notes 19 8. Installation Guide 20 9. Trademarks and Copyright Notice 47 TNN 500AF 1 Safety Notices 1) Keep this unit away from heat sources and direct sunlight. 2) This unit should be placed on a flat, level, and solid surface. 3) Always shut down the operating system and switch the AC OFF before disassembling. 4) Keep this unit in an upright position when the AC power is ON. 5) Do not place or spill liquids on this unit. 6) Avoid inserting any objects into the system while it is ON. English 7) Lower the caster stops to immobilize the unit before using the system. 3 8) If this unit is to be transported a long distance, place it in the original packing box or a custom made hard case. 9) Do not drop or expose this unit to shock while it is in transit. 10) Store and use out of the reach of children. -
An Expansion on Applied Computer Cooling
An Expansion on Applied Computer Cooling By Spencer Ellsworth LAES 400 November 29, 2012 Abstract In the world of professional technology, many businesses utilize servers and Ap- ple products in their day-to-day work, relying upon these machines for the liveli- hood of their operations. However, the technology being used is limited by a single, ever-important factor: heat. The key to improved performance, increased computer longevity, and lower upkeep costs lies in managing machine temperatures. Previously, this topic was investigated for the world of PCs. In this paper, modifications, upgrades, and available components that improve cooling are discussed in regard to servers and Apple products. Through the use of these methodologies, the aformentioned improve- ments may be achieved. Contents 1 Introduction 1 2 Background 1 3 Servers 2 3.1 Freestanding . 3 3.2 Rack Mount . 3 4 Apple Products 5 4.1 Difficulties . 5 4.2 Mac Desktops . 5 4.2.1 iMac . 6 4.2.2 Mac Pro . 6 4.3 Mac Mini . 7 4.4 Apple TV . 7 4.5 MacBook . 8 5 Business Economics 8 5.1 Servers . 8 5.2 Apple . 9 6 Related Work 9 7 Conclusion 10 1 Introduction freestanding and rack mount servers, as their differences are significant. The topics of \Now this is not the end. It is not even this paper then make a transition to Ap- the beginning of the end. But it is, per- ple products, touching upon the difficulties haps, the end of the beginning." -Sir Win- in improving cooling for Apple machines, as ston Churchill, 1942 well as individual investigations of the iMac, Six months ago, the author completed a Mac Pro, Mac Mini, Apple TV, and Mac- research, analysis, and experimentation pa- Book. -
Motivair Cooling Solutions Report
Cooling System Considerations for High Density Colocation and Enterprise Data Centers By Rich Whitmore Executive summary The recent advances in computer technology and the growing adoption of high performance CPUs and GPUs are allowing users to achieve new heights in computer analytics including the use of Big Data, Artificial Intelligence, High-Frequency Trading, Oil & Gas research and web scale business models. This rapid rise in use has overtaken most Colocation and Enterprise facilities’ ability to cool the se often-densified server racks on a large scale. While many facilities publish the ability to provide cooling for higher than standard server racks on a watts per square foot basis, many if not all are unable to manage newer computer systems at that density on a large scale. Co location and Enterprise data centers must consider how these new computers will interact within the data center environment, educate themselves on the various solutions available to cool these dense servers and build the infrastructure that can support the latest computer racks being used both today and in the future. Cooling System Considerations for High Density Colocation and Enterprise Data Centers Introduction As the uses for high density computers continues to expand, the requirements for operating these advanced systems has also grown. The drive for higher efficiency data centers is a subject closely tied to a building’s Power Usage Effectiveness (PUE) which is defined as: (Total Facility Energy) / (IT Equipment Energy). High Performance Computing (HPC) clusters and high-density compute racks are consuming power densities of up to 100 kW per rack, sometimes higher, with an estimated average density of 35 kW per rack. -
“Cooling System for Electronics in Computer System- an Overview”
International Journal of Recent Engineering Research and Development (IJRERD) Volume No. 02 – Issue No. 02, ISSN: 2455-8761 www.ijrerd.com, PP. 01-04 “Cooling system for electronics in computer system- an overview” KunalPardeshi1, P.G Patil2, R.Y.Patil3 1 Master Scholar MechanicalEnineering Department, S.G.D.C.O.E. Jalgaon 2Assistant Professor, Mechanical Enineering Department, S.G.D.C.O.E. Jalgaon 3Head, Mechanical Department, S.G.D.C.O.E. Jalgaon Abstract: During the power management, the inevitable power losses induce heat generation in the power electronics. In this, effective design for the cooling system is essential in terms of safety, reliability, and durability. A liquid cooling system for the power electronics is applied to chill the electrical components below the thermal specifications. Nonetheless, the layout of cooling components is usually designed after the completion of the chassis and power electronics in the automotive applications, thus, only a little freedom is allowed to change the layout. Thus, it is significant and urgent to investigate the cooling performance before finalizing the layout design. In this work, one dimensional and computerized fluid dynamics code is employed to simulate the performance of the cooling system at the early stage of conceptual design. Three different layouts of cooling systems are chosen to compare the ensuing systematic cooling performances. The liquid flow rates, pressure drops, and maximum temperatures are computed by the numerical simulations of the cooling system which comprises the cold plates, liquid pump and heating electronic device. Index Terms: High performance CPUs, heat transfer enhancement, liquid impingement, heat transfer 1. -
Floor Mount & In-Rack Models
coolant distribution unit Floor Mount & In-Rack Models TM OUR BUSINESS IS COOLING YOURS motivaircorp.com COMPREHENSIVE COOLING FOR YOUR DIGITAL WORLD From Hyperscale to Exascale KEY REASONS A Coolant Distribution Unit (CDU) is designed to control and separate colder facility water supplies TO USE A from the IT cooling infrastructure. It allows you to deploy higher density, load diverse IT equipment in ® a smaller footprint & improve efficiency. MOTIVAIR CDU This action of “decoupling” allows the CDU to accurately monitor and control the flow and temperature of clean, cool fluid to all types of IT cooling systems, including Active and Passive Rear • Isolates a clean water supply Door Heat Exchangers or Liquid-Cooled Computer Systems (Direct-to-Chip or On-Chip). for IT cooling system The CDU maintains a secondary loop water temperature above the dew point in the data center to • Maintains water temperature eliminate the possibility of condensation. above data center dew point eliminating the possibility of condensation • Automatically adjusts water flow and temperature for scale-on-demand IT loads MODELS APPLICATION MCDU-4U 105 kW ChilledDoor® • Offers inherent redundancies MCDU15 310 kW Rack Cooling System & MCDU 25 625kW Liquid-Cooled Computer Systems for maximized uptime MCDU 40 1250kW • Ideal for W1 – W5 cooling systems Custom OEM Solutions • Made in the USA Motivair offers flexible CDU designs for unique liquid cooling applications, including custom OEM solutions. TM OUR BUSINESS IS COOLING YOURS motivaircorp.com HOW IT WORKS The Motivair® Coolant Distribution Unit (CDU) creates an isolated water loop and pumps this through the cooling system DECOUPLE to operate at maximum efficiency. -
A View from the Facility Operations Side on the Water/Air Cooling System of the K Computer
A View from the Facility Operations Side on the Water/Air Cooling System of the K Computer Jorji Nonaka∗ Keiji Yamamoto Akiyoshi Kuroda HPC Usability Dev. Unit System Operations & Dev. Unit Application Tuning Dev. Unit RIKEN R-CCS RIKEN R-CCS RIKEN R-CCS Kobe, Japan Kobe, Japan Kobe, Japan Toshiyuki Tsukamoto Kazuki Koiso Naohisa Sakamoto Facility Operations & Dev. Unit Grad. School of System Informatics Grad. School of System Informatics RIKEN R-CCS Kobe University Kobe University Kobe, Japan Kobe, Japan Kobe, Japan ABSTRACT ACM Reference Format: Eight years have been passed since the first appearance of the K Jorji Nonaka, Keiji Yamamoto, Akiyoshi Kuroda, Toshiyuki Tsukamoto, computer in the TOP500 list as the most powerful system at that Kazuki Koiso, and Naohisa Sakamoto. 2019. A View from the Facility Op- erations Side on the Water/Air Cooling System of the K Computer. In time. Currently, the count down for the final shutdown has already Proceedings of IEEE/ACM Supercomputing Conference (SC19 Poster). ACM, started, and the preparations for the substitution are also underway. New York, NY, USA, 3 pages. https://doi.org/10.1145/1122445.1122456 The Operations and Computer Technologies Division at the RIKEN R-CCS is responsible for the management and operations of the 1 INTRODUCTION entire Facility, which includes the auxiliary subsystems such as the Almost five years have been passed from the first detailed opera- power supply, and water/air cooling systems. It is worth noting that tion analysis [6], and four years from the detailed hardware failure part of these subsystems will be reused in the next supercomputer analysis [5] of the K computer system. -
ASHRAE Standard 90.1-2010 Equipment Final Rule Technical
CHAPTER 4. ENERGY USE CHARACTERIZATION TABLE OF CONTENTS 4.1 INTRODUCTION .............................................................................................................. 4-1 4.2 ENERGY USE ANALYSIS BY EQUIPMENT TYPE ..................................................... 4-1 4.2.1 Water-Cooled Air Conditioners .............................................................................. 4-1 4.2.1.1 Water-Cooled Compressor-Condenser Performance .................................. 4-3 4.2.1.2 Supply Water Temperature ......................................................................... 4-5 4.2.1.3 Supply Fan Power ....................................................................................... 4-5 4.2.1.4 Water-Cooled Compressor-Condenser-Only Cooling Coefficient of Performance vs. Energy Efficiency Ratio Relationship ......................................... 4-6 4.2.1.5 Baseline Annual Energy Use Per Ton – Water-Cooled .............................. 4-7 4.2.1.6 Energy Use Estimates for Baseline and Higher Efficiency Water-Cooled Air Conditioner Equipment by Equipment Class. ......................................................... 4-9 4.2.2 Evaporatively Cooled Air Conditioners................................................................ 4-11 4.2.2.1 Baseline Annual Energy Use Per Ton – Evaporatively Cooled ............... 4-12 4.2.2.2 Energy Use Estimates for Baseline and Higher Efficiency Evaporatively Cooled Air Conditioners by Equipment Class ...................................................... 4-13 4.2.3 -
Enhanced Cooling of Laptop Computer for Improvement of Processing Performance by Mohammed A
Global Journal of Computer Science and Technology: H Information & Technology Volume 15 Issue 5 Version 1.0 Year 2015 Type: Double Blind Peer Reviewed International Research Journal Publisher: Global Journals Inc. (USA) Online ISSN: 0975-4172 & Print ISSN: 0975-4350 Enhanced Cooling of Laptop Computer for Improvement of Processing Performance By Mohammed A. Bou-Rabee, Shaharin A. Sulaiman & Wan M. S. W. Mazlan U niversity Teknologi Petronas, Kuwait Abstract- A major problems in the operation of laptop computers is overheating since it can affect the performance and stability, sometimes leading to system crash and hardware fatality. The objective of this work was to study the thermal behavior inside a laptop computer and to test the effectiveness of aproposed cooling method to overcome overheating problem. The proposed cooling system contained a thermoelectric device that reduced the intake air temperature into the laptop internal cooling system. An external exhaust blower, located at the exhaust air outlet of the laptop, was mounted to ensure sufficient air flow rate delivered by the cooling system. To assess the effectiveness of the system, temperatures of critical components in the computer were measured. It was found from the study that, under extreme utilization situation, the temperature of the graphic processing unit could increase to 99°C. The proposed cooling system could bring down the temperature by up to 6°C. Keywords: computer; power electronics; laptop; overheating; cooking; heat dissipation; thermoelectric. GJCST-H Classification: B.5.2 B.7.1 EnhancedCoolingofLaptopCompterforImprovementofProcessingPerformance Strictly as per the compliance and regulations of: © 2015. Mohammed A. Bou-Rabee, Shaharin A. Sulaiman & Wan M. -
Miniature Loop Heat Pipe with Flat Evaporator for Cooling Computer CPU Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Mastaka Mochizuki, and Roger R
View metadata, citation and similar papers at core.ac.uk brought to you by CORE provided by RMIT Research Repository 42 IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 30, NO. 1, MARCH 2007 Miniature Loop Heat Pipe With Flat Evaporator for Cooling Computer CPU Randeep Singh, Aliakbar Akbarzadeh, Chris Dixon, Mastaka Mochizuki, and Roger R. Riehl Abstract—This paper presents an experimental investigation Subscripts on a copper miniature loop heat pipe (mLHP) with a flat disk Ambient. shaped evaporator, 30 mm in diameter and 10-mm thick, designed for thermal control of computer microprocessors. Tests were Compensation chamber. conducted with water as the heat transfer fluid. The device was Condenser. capable of transferring a heat load of 70 W through a distance up to 150 mm using 2-mm diameter transport lines. For a range of Evaporator. power applied to the evaporator, the system demonstrated very Junction. reliable startup and was able to achieve steady state without any symptoms of wick dry-out. Unlike cylindrical evaporators, flat Heat pipe. evaporators are easy to attach to the heat source without need of Total. any cylinder-to-plane reducer material at the interface and thus offer very low thermal resistance to the heat acquisition process. Vapor. In the horizontal configuration, under air cooling, the minimum Liquid. value for the mLHP thermal resistance is 0.17 C/W with the corresponding evaporator thermal resistance of 0.06 C/W. It is concluded from the outcomes of the current study that a mLHP I. INTRODUCTION with flat evaporator geometry can be effectively used for the thermal control of electronic equipment including notebooks with limited space and high heat flux chipsets. -
User's Manual
User’s Manual (English) Ultra Quiet Heatpipe VGA Cooler Model : VF1000 LED Please visit our website (www.zalmanusa.com) and watch the VF1000 LED installation video for easy installation. ※ Please read this manual thoroughly before installation. ※ The specifications of this product and its components may change without prior notice to improve performance. http://www.zalman.co.kr http://www.zalmanusa.com Cautions on Use and Installation 1. By installing this product on a VGA (Video Graphics Array) card, a PCI slot adjacent to the PCIe (or AGP) slot will become unusable. 2. If this product is to be installed on a recently released VGA card, please check for compatibility at Zalman’s website first. 3. The product cannot be installed on Matrox VGA cards, NVIDIA PCX 5*** , NVIDIA Geforce 6600 AGP Series, Geforce 7600/7900 AGP Series, and ATI Radeon 9550/9600 Series. 4. If the VGA card and/or its components interfere with the installation of this product, then stop the installation, refer to the list of compatible VGA cards at Zalman’s website, and install this product with one of the compatible VGA cards. 5. NVIDIA’s Geforce 8800 Series requires the installation of Zalman’s RAM Heatsink ZM-RHS88 before installing VF1000 LED. 6. The use of an exhaust fan positioned on the rear side of the case is recommended for enhancement of product performance. Disclaimer Zalman Tech Co., Ltd. is not responsible for any damages due to external causes, including but not limited to, improper use, problems with electrical power, accident, neglect, alteration, repair, improper installation, or improper testing. -
Building a PC-Based Music Server / Transport
Building A PC-based Music Server / Transport Installation Guide for Windows 8.1 Contents References ................................................................................................. 3 Overview - The Principles of Computer Audio ............................................ 6 The Advantages of Computer Audio [from DCS guide to Computer Audio] .............................................................................................................. 6 The Disadvantages of Computer Audio [from DCS guide to Computer Audio] .................................................................................................... 7 The Computer as a Music File Transport ................................................. 8 “VerseTrasport” Hardware Components...................................................... 9 “VerseTrasport” Software Components ..................................................... 10 Digital-To-Analog Converter ................................................................... 11 VerseTrasport H/W Installation Procedure ................................................ 13 VerseTrasport S/W Installation Procedure................................................. 13 Install Windows 8.1 PRO ....................................................................... 13 Install ASUS Motherboard Drivers .......................................................... 13 Install AQUA DAC Drivers (Thesycon USB ASIO Driver Class 2.0 USB Audio drivers version 1.61b) ..........................................................................