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Intel(R) X38 Chipset External Design Specification

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Intel(R) X38 Chipset External Design Specification Intel® 3200 and 3210 Chipset Datasheet — For the Intel® 3200 and 3210 Chipset Memory Controller Hub (MCH) November 2007 Document Number: 318463-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® 3200/3210 Memory Controller Hub (MCH) may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. I2C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed by Intel. Implementations of the I2C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation. No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) is a security technology under development by Intel and requires for operation a computer system with Intel® Virtualization Technology, a Intel® Trusted Execution Technology- enabled Intel processor, chipset, BIOS, Authenticated Code Modules, and an Intel or other Intel® Trusted Execution Technology compatible measured virtual machine monitor. In addition, Intel® Trusted Execution Technology requires the system to contain a TPMv1.2 as defined by the Trusted Computing Group and specific software for some uses. Intel, Pentium, Xeon, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright© 2007, Intel Corporation 2 Datasheet Contents 1Introduction............................................................................................................ 15 1.1 Terminology ..................................................................................................... 17 1.2 MCH Overview .................................................................................................. 20 1.2.1 Host Interface........................................................................................ 20 1.2.2 System Memory Interface ....................................................................... 20 1.2.3 Direct Media Interface (DMI).................................................................... 21 1.2.4 PCI Express* Interface............................................................................ 22 1.2.5 MCH Clocking ........................................................................................ 23 1.2.6 Power Management ................................................................................ 23 1.2.7 Thermal Sensor ..................................................................................... 23 2 Signal Description ................................................................................................... 25 2.1 Host Interface Signals........................................................................................ 26 2.2 System Memory (DDR2) Interface Signals ............................................................ 29 2.2.1 System Memory Channel A Interface Signals.............................................. 29 2.2.2 System Memory Channel B Interface Signals.............................................. 30 2.2.3 System Memory Miscellaneous Signals ...................................................... 31 2.3 PCI Express* Interface Signals............................................................................ 31 2.4 Controller Link Interface Signals.......................................................................... 32 2.5 Clocks, Reset, and Miscellaneous......................................................................... 32 2.6 Direct Media Interface........................................................................................ 33 2.7 Power and Grounds ........................................................................................... 34 3 System Address Map ............................................................................................... 35 3.1 Legacy Address Range ....................................................................................... 38 3.1.1 DOS Range (0h – 9_FFFFh) ..................................................................... 38 3.1.2 Expansion Area (C_0000h-D_FFFFh) ......................................................... 39 3.1.3 Extended System BIOS Area (E_0000h–E_FFFFh)....................................... 39 3.1.4 System BIOS Area (F_0000h–F_FFFFh) ..................................................... 40 3.1.5 PAM Memory Area Details........................................................................ 40 3.2 Main Memory Address Range (1MB – TOLUD)........................................................ 40 3.2.1 ISA Hole (15 MB –16 MB)........................................................................ 41 3.2.2 TSEG .................................................................................................... 42 3.2.3 Pre-allocated Memory ............................................................................. 42 3.3 PCI Memory Address Range (TOLUD – 4 GB) ........................................................ 43 3.3.1 APIC Configuration Space (FEC0_0000h–FECF_FFFFh)................................. 45 3.3.2 HSEG (FEDA_0000h–FEDB_FFFFh) ........................................................... 45 3.3.3 FSB Interrupt Memory Space (FEE0_0000–FEEF_FFFF)................................ 45 3.3.4 High BIOS Area...................................................................................... 45 3.4 Main Memory Address Space (4 GB to TOUUD)...................................................... 46 3.4.1 Memory Re-claim Background .................................................................. 47 3.4.2 Memory Reclaiming ................................................................................ 47 3.5 PCI Express* Configuration Address Space ........................................................... 47 3.6 PCI Express* Address Space ............................................................................... 48 3.7 System Management Mode (SMM) ....................................................................... 49 3.7.1 SMM Space Definition ............................................................................. 49 3.7.2 SMM Space Restrictions .......................................................................... 50 3.7.3 SMM Space Combinations........................................................................ 50 3.7.4 SMM Control Combinations ...................................................................... 51 3.7.5 SMM Space Decode and Transaction Handling ............................................ 51 3.7.6 Processor WB Transaction to an Enabled SMM Address Space....................... 51 Datasheet 3 3.7.7 SMM Access Through TLB.........................................................................51 3.8 Memory Shadowing............................................................................................52 3.9 I/O Address Space .............................................................................................52 3.9.1 PCI Express* I/O Address Mapping............................................................53 4 MCH Register Description.........................................................................................55 4.1 Register Terminology .........................................................................................56 4.2 Configuration Process and Registers .....................................................................57 4.2.1 Platform Configuration Structure...............................................................57 4.3 Configuration Mechanisms ..................................................................................58 4.3.1 Standard PCI Configuration Mechanism......................................................58 4.3.2 PCI Express Enhanced Configuration Mechanism .........................................59 4.4 Routing Configuration Accesses ...........................................................................60 4.4.1 Internal Device Configuration Accesses......................................................61 4.4.2 Bridge Related Configuration Accesses.......................................................62
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