Intel's Core Family – the TICK Lines Penryn to Broadwell
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A Dual Core Processor Has Two Cores (Essentially, Two Cpus on One Chip)
Faculty of Engineering & Information Technology Al-Azhar University-Gaza Dr. Mohammad Aqel Microprocessors and Interfacing (ITCC 3301) Homework (1) Intel Core is a brand name used for various mid-range to high-end consumer and business microprocessors made by Intel. In general, processors sold as Core are more powerful variants of the same processors marketed as entry-level Celeron and Pentium. Similarly, identical or more capable versions of Core processors are also sold as Xeon processors for the server market. The current lineup of Core processors includes the latest Intel Core i7, Intel Core i5 and Intel Core i3, and the older Intel Core 2 Solo, Intel Core 2 Duo, Intel Core 2 Quad, and Intel Core 2 Extreme lines. 1- The original Core brand refers to Intel's 32-bit dual-core x86 CPUs. 2- Unlike the Intel Core, Intel Core 2 is a 64-bit processor, supporting Intel 64. The Core brand comprised two branches: the Duo (dual-core) and Solo (Duo with one disabled core). A dual core processor has two cores (essentially, two CPUs on one die (piece) silicon chip (IC)). Core2Duo is a specific dual-core processor design. Thus, all Core2Duo CPUs are dual-core CPUs, but not all Intel dual-core CPUs are Core2Duo designs. Core 2 is a brand encompassing a range of Intel's consumer 64-bit x86-64 single-, dual-, and quad-core microprocessors based on the Core microarchitecture. The single- and dual-core models are single-die, whereas the quad-core models comprise two dies, each containing two cores, packaged in a multi-chip module. -
Reviving the Development of Openchrome
Reviving the Development of OpenChrome Kevin Brace OpenChrome Project Maintainer / Developer XDC2017 September 21st, 2017 Outline ● About Me ● My Personal Story Behind OpenChrome ● Background on VIA Chrome Hardware ● The History of OpenChrome Project ● Past Releases ● Observations about Standby Resume ● Developmental Philosophy ● Developmental Challenges ● Strategies for Further Development ● Future Plans 09/21/2017 XDC2017 2 About Me ● EE (Electrical Engineering) background (B.S.E.E.) who specialized in digital design / computer architecture in college (pretty much the only undergraduate student “still” doing this stuff where I attended college) ● Graduated recently ● First time conference presenter ● Very experienced with Xilinx FPGA (Spartan-II through 7 Series FPGA) ● Fluent in Verilog / VHDL design and verification ● Interest / design experience with external communication interfaces (PCI / PCIe) and external memory interfaces (SDRAM / DDR3 SDRAM) ● Developed a simple DMA engine for PCI I/F validation w/Windows WDM (Windows Driver Model) kernel device driver ● Almost all the knowledge I have is self taught (university engineering classes were not very useful) 09/21/2017 XDC2017 3 Motivations Behind My Work ● General difficulty in obtaining meaningful employment in the digital hardware design field (too many students in the field, difficulty obtaining internship, etc.) ● Collects and repairs abandoned computer hardware (It’s like rescuing puppies!) ● Owns 100+ desktop computers and 20+ laptop computers (mostly abandoned old stuff I -
1 in the United States District Court
Case 6:20-cv-00779 Document 1 Filed 08/25/20 Page 1 of 33 IN THE UNITED STATES DISTRICT COURT WESTERN DISTRICT OF TEXAS AUSTIN DIVISION AURIGA INNOVATIONS, INC. C.A. No. 6:20-cv-779 Plaintiff, v. JURY TRIAL DEMANDED INTEL CORPORATION, HP INC., and HEWLETT PACKARD ENTERPRISE COMPANY, Defendants COMPLAINT Plaintiff Auriga Innovations, Inc. (“Auriga” or “Plaintiff”) files this complaint for patent infringeMent against Defendants Intel Corporation (“Intel”), HP Inc. (“HPI”), and Hewlett Packard Enterprise Company (“HPE”) (collectively, “Defendants”) under 35 U.S.C. § 217 et seq. as a result of Defendants’ unauthorized use of Auriga’s patents and alleges as follows: THE PARTIES 1. Auriga is a corporation organized and existing under the laws of the state of Delaware with its principal place of business at 1891 Robertson Road, Suite 100, Ottawa, ON K2H 5B7 Canada. 2. On information and belief, Intel is a Delaware corporation with a place of business at 2200 Mission College Boulevard, Santa Clara, California 95054. 3. On information and belief, since April 1989, Intel has been registered to do business in the State of Texas under Texas Taxpayer Number 19416727436 and has places of business at 1 Case 6:20-cv-00779 Document 1 Filed 08/25/20 Page 2 of 33 1300 S Mopac Expressway, Austin, Texas 78746; 6500 River Place Blvd, Bldg 7, Austin, Texas 78730; and 5113 Southwest Parkway, Austin, Texas 78735 (collectively, “Intel Austin Offices”). https://www.intel.com/content/www/us/en/location/usa.htMl. 4. On information and belief, HPI is a Delaware corporation with a principal place of business at 1501 Page Mill Road, Palo Alto, CA 94304. -
Design and Implementation of Pentium-M Based Floswitch for Intracluster Communication Veerappa Chikkagoudar, Dr
Design and Implementation of Pentium-M Based Floswitch for Intracluster Communication Veerappa chikkagoudar, Dr. U. N. Sinha, Prof. B. L. Desai. [email protected], [email protected], [email protected] Department of Electronics and Communication B. V. Bhoomaraddi college of Engg. And Tech. Hubli-580031 Abstract: aero dynamical problems, [1].Since 1986, six Flosolver MK6 is a Parallel processing system, generations of Flosolver machine have evolved based on distributed memory concept and built namely Flosolver MK-1, MK-2, MK-3, MK-4, MK-5 around Pentium-III processors, which acts as and MK-6. processing elements (PEs). Communication Flosolver MK-6 is the latest of the parallel between processing elements is very important, computer based on 128 Pentium III processors which is done through hardware switch called (which act as processing elements, PEs) in 64 dual Floswitch. Floswitch supports both message processor boards each with 1GB RAM and 80 GB passing as well as message processing. Message HDD. It is essentially a distributed memory system. processing is a unique feature of Floswitch. A group of four Dual processor boards with a Floswitch and an optical module is a natural cluster. In existing MK-6 system, communication 16 such clusters form the system. Processing between PEs is done through the Intel 486-based elements (PEs) communicate through Floswitch (a Floswitch, which operates at 32MHz and has 32- communication switch) using PCI-DPM interface bit wide data path. The data transfer rate and card. Clusters communicate through Optical module. floating point computation of existing switch need to be increased. -
Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance
White Paper Inside Intel® Core™ Microarchitecture Setting New Standards for Energy-Efficient Performance Ofri Wechsler Intel Fellow, Mobility Group Director, Mobility Microprocessor Architecture Intel Corporation White Paper Inside Intel®Core™ Microarchitecture Introduction Introduction 2 The Intel® Core™ microarchitecture is a new foundation for Intel®Core™ Microarchitecture Design Goals 3 Intel® architecture-based desktop, mobile, and mainstream server multi-core processors. This state-of-the-art multi-core optimized Delivering Energy-Efficient Performance 4 and power-efficient microarchitecture is designed to deliver Intel®Core™ Microarchitecture Innovations 5 increased performance and performance-per-watt—thus increasing Intel® Wide Dynamic Execution 6 overall energy efficiency. This new microarchitecture extends the energy efficient philosophy first delivered in Intel's mobile Intel® Intelligent Power Capability 8 microarchitecture found in the Intel® Pentium® M processor, and Intel® Advanced Smart Cache 8 greatly enhances it with many new and leading edge microar- Intel® Smart Memory Access 9 chitectural innovations as well as existing Intel NetBurst® microarchitecture features. What’s more, it incorporates many Intel® Advanced Digital Media Boost 10 new and significant innovations designed to optimize the Intel®Core™ Microarchitecture and Software 11 power, performance, and scalability of multi-core processors. Summary 12 The Intel Core microarchitecture shows Intel’s continued Learn More 12 innovation by delivering both greater energy efficiency Author Biographies 12 and compute capability required for the new workloads and usage models now making their way across computing. With its higher performance and low power, the new Intel Core microarchitecture will be the basis for many new solutions and form factors. In the home, these include higher performing, ultra-quiet, sleek and low-power computer designs, and new advances in more sophisticated, user-friendly entertainment systems. -
Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
Single Board Computer
Single Board Computer SBC with the Intel® 8th generation Core™/Xeon® (formerly Coffee Lake H) SBC-C66 and 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs High-performing, flexible solution for intelligence at the edge HIGHLIGHTS CONNECTIVITY CPU 2x USB 3.1; 4x USB 2.0; NVMe SSD Slot; PCI-e x8 Intel® 8th gen. Core™ / Xeon® and 9th gen. Core™ / port (PCI-e x16 mechanical slot); VPU High Speed Xeon® / Pentium® / Celeron® CPUs Connector with 4xUSB3.1 + 2x PCI-ex4 GRAPHICS MEMORY Intel® UHD Graphics 630/P630 architecture, up to 128GB DDR4 memory on 4x SO-DIMM Slots supports up to 3 independent displays (ECC supported) Available in Industrial Temperature Range MAIN FIELDS OF APPLICATION Biomedical/ Gaming Industrial Industrial Surveillance Medical devices Automation and Internet of Control Things FEATURES ® ™ ® Intel 8th generation Core /Xeon (formerly Coffee Lake H) CPUs: Max Cores 6 • Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Max Thread 12 HyperThreading • Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Intel® QM370, HM370 or CM246 Platform Controller Hub Chipset Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), (PCH) with HyperThreading • Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB 2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). Cache, 45W TDP (35W cTDP) Memory ® ™ ® ® ECC DDR4 memory modules supported only with Xeon Core Information subject to change. Please visit www.seco.com to find the latest version of this datasheet Information subject to change. -
"PCOM-B216VG-ECC.Pdf" (581 Kib)
Intel® Arrandale processor based Type II COM Express module support ECC DDR3 SDRAM PCOM-B216VG-ECC with Gigabit Ethernet 204pin ECC DDR3 SODIMM socket ® Intel QM57 ® Intel Arrandale processor FEATURES GENERAL CPU & Package: Intel® 45nm Arrandale Core i7/i5/i3 or Celeron P4505 ® Processor The Intel Arrandale and QM57 platform processor up to 2.66 GHz with 4MB Cache in FC-BGA package with turbo boost technology to maximize DMI x4 Link: 4.8GT/s (Full-Duplex) CPU & Graphic performance Chipset/Core Logic Intel® QM57 ® Intel Arrandale platform support variously System Memory Up to 8GB ECC DDR3 800/1066 SDRAM on two SODIMM sockets powerful processor from ultra low power AMI BIOS to mainstream performance type BIOS Storage Devices SATA: Support four SATA 300 and one IDE Supports Intel® intelligent power sharing Expansion Interface VGA and LVDS technology to reduce TDP (Thermal Six PCI Express x1 Design Power) LPC & SPI Interface High definition audio interface ® ® Enhance Intel vPro efficiency by Intel PCI 82577LM GbE PHY and AMT6.0 Hardware Monitoring CPU Voltage and Temperature technology Power Requirement TBA Support two ECC DDR3 800/1066 SDRAM on Dimension Dimension: 125(L) x 95(W) mm two SODIMM sockets, up to 8GB memory size Environment Operation Temperature: 0~60 °C Storage Temperature: -20~80 °C Operation Humidity: 5~90% I/O ORDERING GUIDE MIO N/A IrDA N/A PCOM-B216VG-ECC ® Standard Ethernet One Intel 82577LM Gigabit Ethernet PHY Intel® Arrandale processor based Type II COM Express module with ECC DDR3 SDRAM and Audio N/A Gigabit Ethernet USB Eight USB ports Keyboard & Mouse N/A CPU Intel® Core i7-610E SV (4M Cache, 2.53 GHz) Support List Intel® Core i7-620LE LV (4M Cache, 2.00 GHz) Intel® Core i7-620UE ULV (4M Cache, 1.06 GHz) Intel® Core i5-520E SV (3M Cache, 2.40 GHz) Intel® Celeron P4505 SV (2M Cache, 1.86 GHz) DISPLAY Graphic Controller Intel® Arrandale integrated Graphics Media Accelerator (Gen 5.75 with 12 execution units) * Specifications are subject to change without notice. -
2016 Kaby Lake Platforms Silicon Initialization Code Release Notes Intel Restricted Secret 5
2016 Kaby Lake Platforms Silicon Initialization Code Release Notes April 2020 Release Version 3.8.0 Intel Restricted Secret By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. -
Asrock G41C-VS Motherboard, a Reliable Motherboard Produced Under Asrock’S Consistently Stringent Quality Control
G41C-VS User Manual Version 1.0 Published October 2009 Copyright©2009 ASRock INC. All rights reserved. 1 Copyright Notice: No part of this manual may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this manual may or may not be regis- tered trademarks or copyrights of their respective companies, and are used only for identification or explanation and to the owners’ benefit, without intent to infringe. Disclaimer: Specifications and information contained in this manual are furnished for informa- tional use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this manual. With respect to the contents of this manual, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warran- ties or conditions of merchantability or fitness for a particular purpose. In no event shall ASRock, its directors, officers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of profits, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the manual or product. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. -
Intel® G31 Express Chipset Product Brief
Product Brief Intel® G31 Express Chipset Intel® G31 Express Chipset Flexibility and scalability for essential computing The Intel® G31 Express Chipset supports Intel’s upcoming 45nm processors and enables Windows Vista* premium experience for value conscious consumers. The Intel G31 Express Chipset Desktop PC platforms, combined with either the Intel® Core™2 Duo or the Intel® Core™2 Quad processor, deliver new technologies and innovating capabilities for all consumers. With a 1333MHz system bus, DDR2 memory technology and support for Windows Vista Premium, the Intel G31 Express chipset enables scalability and performance for essential computing. Support for 45nm processor technology and Intel® Fast Memory Access (Intel® FMA) provide increased system performance for today’s computing needs. The Intel G31 Express Chipset enables a Intel® I/O Controller Hub (Intel® ICH7/R) balanced platform for everyday computing needs. The Intel G31 Express Chipset elevates storage performance with Serial Intel® Viiv™ processor technology ATA (SATA) and enhancements to Intel® Matrix Storage Technology2. Intel® Viiv™ processor technology1 is a set of PC technologies designed This chipset has four integrated SATA ports for transfer rates up to 3 for the enjoyment of digital entertainment in the home. The Intel G31 Gb/s (300 MB/s) to SATA hard drives or optical devices. Support for RAID Express Chipset supports Intel Viiv processor technology with either the 0, 1, 5 and 10 allows for different RAID capabilities that address specific Intel® ICH7R or ICH7DH SKUs. needs and usages. For example, critical data can be stored on one array designed for high reliability, while performance-intensive applications like Faster System Performance games can reside on a separate array designed for maximum The Intel® G31 Express Chipset Graphics Memory Controller Hub (GMCH) performance. -
Class-Action Lawsuit
Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 1 of 279 Steve D. Larson, OSB No. 863540 Email: [email protected] Jennifer S. Wagner, OSB No. 024470 Email: [email protected] STOLL STOLL BERNE LOKTING & SHLACHTER P.C. 209 SW Oak Street, Suite 500 Portland, Oregon 97204 Telephone: (503) 227-1600 Attorneys for Plaintiffs [Additional Counsel Listed on Signature Page.] UNITED STATES DISTRICT COURT DISTRICT OF OREGON PORTLAND DIVISION BLUE PEAK HOSTING, LLC, PAMELA Case No. GREEN, TITI RICAFORT, MARGARITE SIMPSON, and MICHAEL NELSON, on behalf of CLASS ACTION ALLEGATION themselves and all others similarly situated, COMPLAINT Plaintiffs, DEMAND FOR JURY TRIAL v. INTEL CORPORATION, a Delaware corporation, Defendant. CLASS ACTION ALLEGATION COMPLAINT Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 2 of 279 Plaintiffs Blue Peak Hosting, LLC, Pamela Green, Titi Ricafort, Margarite Sampson, and Michael Nelson, individually and on behalf of the members of the Class defined below, allege the following against Defendant Intel Corporation (“Intel” or “the Company”), based upon personal knowledge with respect to themselves and on information and belief derived from, among other things, the investigation of counsel and review of public documents as to all other matters. INTRODUCTION 1. Despite Intel’s intentional concealment of specific design choices that it long knew rendered its central processing units (“CPUs” or “processors”) unsecure, it was only in January 2018 that it was first revealed to the public that Intel’s CPUs have significant security vulnerabilities that gave unauthorized program instructions access to protected data. 2. A CPU is the “brain” in every computer and mobile device and processes all of the essential applications, including the handling of confidential information such as passwords and encryption keys.