PolarFire® SoC Icicle Kit

Introduction

The PolarFire® SoC FPGA Icicle Kit (MPFS250T-FCVG484EES) is an RoHS-compliant, cost-optimized kit with general-purpose interfaces that enables you to evaluate features of the PolarFire SoC family of FPGAs.

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Table of Contents

Introduction...... 1

1. Getting Started...... 4 1.1. Kit Contents...... 4 1.2. Block Diagram...... 4 1.3. Web Resources...... 5 1.4. Board Overview...... 5 1.5. Handling the Board...... 8 1.6. Operating Temperature...... 8 1.7. Powering Up the Board...... 8

2. Installation and Settings...... 10 2.1. Software Settings...... 10 2.2. Hardware Settings...... 10 2.3. Power Sources...... 12

3. Board Components and Operations...... 15 3.1. LDDR4 Memory Interface...... 15 3.2. SPI Serial ...... 15 3.3. eMMC and SDIO Interface...... 15 3.4. High Speed Transceivers Configuration...... 16 3.5. Communication Interfaces...... 16 3.6. Expansion Capabilities...... 16 3.7. Voltage and Current Monitoring...... 17 3.8. GPIO...... 17 3.9. User Interface...... 17 3.10. Mux for JTAG Selection...... 17 3.11. Programming Scheme...... 18 3.12. System Reset...... 18 3.13. 50 MHz Oscillator...... 18

4. Pin List...... 20

5. Board Component Placement...... 21

6. Demo Design...... 23

7. Appendix: Programming PolarFire SoC FPGA Using the On-Board Programmer...... 24

8. Revision History...... 25

The Microchip Website...... 26

Product Change Notification Service...... 26

Customer Support...... 26

Microchip Devices Code Protection Feature...... 26

Legal Notice...... 27

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Trademarks...... 27

Quality Management System...... 28

Worldwide Sales and Service...... 29

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Getting Started

1. Getting Started The PolarFire SoC Icicle Kit supports the following interfaces: • PCI Express Root Port • eMMC (DDR Model/HS200/HS400) • SD card • LPDDR4 • SGMII •I2C-Power Monitor • USB • UART • CAN • mikroBUS • 40 pin Raspberry Pi 4 interface connector The PolarFire SoC device available on Icicle Kit is programmed using the on-board FlashPro6 programmer. The on- board FlashPro6 programmer is used to develop and debug embedded applications using SoftConsole, Identify, or SmartDebug. Note: Embedded FlashPro6 is enabled only for the production kits. For PROTO kits, the device can be programmed using an external FlashPro 4, 5, or 6 programmer.

1.1 Kit Contents The following table lists the contents of the PolarFire SoC Icicle Kit. Table 1-1. Kit Contents

Item Quantity PolarFire SoC FPGA Icicle Kit ES featuring the MPFS250T-FCVG484EESEES device with 254 K logic 1 elements 12 V/5 A wall-mounted power adapter 1 Ethernet cable 1 USB 2.0 micro AB connector for UART interface to PC 1 Quickstart card 1

1.2 Block Diagram The following block diagram shows the components of the PolarFire SoC Icicle Kit.

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Getting Started

Figure 1-1. PolarFire SoC Icicle Kit Block Diagram

ICICLE KIT

5V 12V mikroBUS RaspberryPi CONN LEDs Push Buttons 3.3V CONN 1.0V Mikro Bus Socket Power 1.1V HDR Module 1.2V mikroBUS 2.5V eMMC CONN LPDDR4 SD-CARD 1.05V Memory 1.8V CAN x2

Micro USB CONN USB I2C Power sensor PHY PolarFire® SoC MPFS250T-FCVG484 (484 package) RJ-45 USB CONN CONN USB- To PCIe VSC8662 XCVR x4 UART X4 RJ-45 RP CONN CONN SC-SPI JTAG

SC-SPI MUX Flash XCVR x4 JTAG-PROG Embedded USB CONN 10-pin HDR FP6 -LITE PCIe RootPort- CONN x16

1.3 Web Resources For more information about the PolarFire SoC Icicle Kit, refer to PolarFire SoC Page.

1.4 Board Overview The PolarFire SoC Icicle Kit features a MPFS250T-FCVG484EES FPGA with the following capabilities: • VSC8662 with two RJ45 connectors for 10/100/1000 Mbps Ethernet • LPDDR4 memory • Power monitor module • PCIe root port • One SPI flash device • 40 pin raspberry Pi 4 interface connector • mikroBUS expansion port The following illustration highlights various components of the PolarFire SoC Icicle Kit.

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Getting Started

Figure 1-2. PolarFire SoC Icicle Kit

1.4.1 Form Factor The following are the dimensions of PolarFire SoC Icicle Kit. • Form factor is 7.2 x 4.95 inches. • Maximum height of the component at the top side: 0.59 inches. • Maximum height of the component at the bottom side: 0.51 inches.

1.4.2 FPGA Bank IO Assignment for Individual Interfaces Table 1-2. FPGA Bank Assignment

Interfaces FPGA Bank Allocation LPDDR4 B6 SGMII B5, B1, B9, and B2 PCI XCVRO, B1, B9 mikroBUS B1, B9, and B2 USB-UART (x4) B1, B9 USB interface B2 SC-SPI_FLASH B3 JTAG Header B3

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Getting Started

...... continued Interfaces FPGA Bank Allocation eMMC/SDIO B4 CAN B2, B1 Raspberry Pi 4 interface connector B1 User defined LEDs/Switches B0

The following table lists the important components of the PolarFire SoC Icicle Kit. Table 1-3. PolarFire SoC Icicle Kit Components

Component Label Description on Board Featured Device PolarFire SoC FPGA MPFS250T-FCVG484EES Extended Commercial (0 °C to 100 °C) temperature support.

Power Supply and Monitoring 12 V power supply input J29 The board is powered by a 12 V power source using an external +12 V/5 A DC jack. ON/OFF switch SW6 Power ON/OFF switch from +12 V external DC jack. Clocks On-board 50 MHz clock oscillator X5 50 MHz clock oscillator with single-ended output. OSC X2 125 MHz oscillator (differential LVDS output) which is the input to the MSS Reference clk. FPGA Programming and Debugging SPI flash U43 1 Gb Micron MT25QL01GBBB8ESF-0SIT SPI flash memory device connected to SPI pins on bank3 of the PolarFire SoC device. JTAG programming header J23 Header to program and debug the PolarFire SoC device using FlashPro. The appropriate programmer must be selected in the FlashPro software. Note: For PROTO kits, the device can be programmed using an external FlashPro 4, 5, or 6 programmer.

Embedded FlashPro 6 U26 On-board programming. Expansion Interfaces mikroBUS J44, J8 mikrobus connector. Raspberry Pi 4 J26 Raspberry Pi 4 interface connector. PCIe X 16 J6 PCI Express Root port connector. Communication Interfaces 1000Base-X Gigabit Ethernet J1, J2 Ethernet (RJ45) jack with external magnetics interfacing with Transceiver RJ45 conn-2 VSC8662 in SGMII mode. USB-UART J11 USB Micro AB connector. CAN J25, J27 CAN Headers.

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Getting Started

...... continued Component Label Description on Board USB-ULPI J16 USB Micro AB connector. Memory Chips LPDDR4 U2 MT53D512M32D2DS-053 WT:D TR is used for LPDDR4 interface. Memory size: 16 Gb.

eMMC U45 SDINBDG4-8G eMMC is used for this interface. Memory size: 8 GB.

SD card J30 SD connector. General Purpose I/O Debug Switches SW1 to For debug. SW4 Light-emitting diodes (LEDs) LED1 to Four active-high LEDs connected to some of the user I/Os for LED4 debugging.

1.5 Handling the Board Pay attention to the following points while handling or operating the board to avoid possible or malfunction: • Handle the board with electrostatic discharge (ESD) precautions to avoid damage. For more information about using the board with ESD precautions, refer to Understanding Product Handling and ESD Precautions (for Hybrid Devices). • Power down the board to switch between the programming headers J17 and PCIe CONN (CON1).

1.6 Operating Temperature Extended commercial temperature range (0 °C to 100 °C).

1.7 Powering Up the Board To power up the board, do the following: 1. Connect 12 V/5 A power supply to J29. 2. Slide switch SW6 to ON position. 3. Power status LEDs 12P0, 5P0, 2P5V, VDDAUX4, 3P3V, VDD, 1P8, 1P1V_LPDDR4, and VDDA will glow. 4. Install the software required for developing designs and set the jumpers for the pre-programmed design. For more information, refer to 2. Installation and Settings. The following table provides the probing points for power rails. Table 1-4. Power Measurements

# Power Rail Probing Point Tolerance Allowed Expected Voltage (in Volt) 1 12P0V C476 ±5% 12 V 2 5P0V C482 ±5% 5 V 3 1P8V C542 ±5% 1.8 V

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Getting Started

...... continued # Power Rail Probing Point Tolerance Allowed Expected Voltage (in Volt) 4 2P5V C786 ±5% 2.5 V 5 1P5V_DDR3 C602 ±5% 1.5 V 6 0P75V_VTT_DDR3 C514 ±5% 0.75 V 7 VDD C499 ±3% 1 V 8 1P1V_LPDDR4 C574 ±5% 1.1 V 9 1P2V_PHY_VSC_FP6 C587 ±5% 1.2 V 10 3P3V C527 ±5% 3.3 V 11 VDDA C556 ±3% 1.05 V

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Installation and Settings

2. Installation and Settings This section provides information about the software and hardware settings required to run the pre-programmed demo design on the PolarFire SoC Icicle Kit.

2.1 Software Settings 1. Download and install the latest release of Libero® SoC software from the Microsemi website. 2. Generate a free silver license for your software. The Libero SoC installer includes FlashPro5 drivers. For instructions about installing Libero SoC, refer to Libero Software Installation and Licensing Guide. For instructions about how to download and install DirectCores and driver firmware cores on the PC where Libero SoC is installed, refer to Installing IP Cores and Drivers User’s Guide.

2.2 Hardware Settings This section provides information about jumper settings, switches, and LEDs on the PolarFire SoC Icicle Kit.

2.2.1 Jumper Settings The following table lists the default jumper settings on board. Table 2-1. Jumper Settings

Jumper Description Pin Default Setting J31 To select LPDDR4 Vref — Open J9 Select pin for programming FPGA with external FlashPro header — Open or with on-board programmer. J21 To select PolarFire SoC JTAG reset. — Open J46 To select 3.3 V for RPI connector from the Icicle Kit — Open J47 To select 5 V for RPI connector from the Icicle Kit — Open J15 To select USB ID Short pin 1-2 — J17 5 V for VBUS switch for USB3340 Short pin 1-2 — J43 To select 1.8 V 0r 3.3 V for eMMC modes Short pin 1-2 — J28 Jumper for PolarFire SoC Serdes Vref Short pin 1-2 — J24 5 V for VBUS switch for USB3320 Short pin 1-2 — J34 To select 1.8 V or 3.3 V for BANK4 voltage Short pin 1-2 — J35 To select 2.5 V or 3.3 V for BANK4 Aux voltage Short pin 1-2 — J45 To select 1 V or 1.05 V for VDD core voltage Short pin 1-2 —

2.2.2 Power Supply LEDs The following table lists the power supply LEDs on the PolarFire SoC Icicle Kit. Table 2-2. Power Supply LEDs

LED Description 12P0 12 V power supply 5P0 5 V power supply

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Installation and Settings

...... continued LED Description 2P5V 2.5 V power supply VDDAUX4 Bank4 Aux voltage 3P3V 3.3 V power supply VDD Core voltage 1P8 1.8 V power supply 1P1V_LPDDR4 LPDDR4 voltage VDDA Power for Serdes channels

2.2.3 Test Points The following test points are available on the PolarFire SoC Icicle Kit. Table 2-3. Test Points

Test Point Description GND1TP_BLK to GND10TP_BLK Test point for Ground SD_D0 Test point for SD_DATA0/eMMCMC_DATA0 at Mux SD_D1 Test point for SD_DATA1/eMMCMC_DATA1 at Mux SD_D2 Test point for SD_DATA2/eMMCMC_DATA2 at Mux SD_D3 Test point for SD_DATA3/eMMC_DATA3 at Mux SD_CLK Test point for SD_CLK/eMMC_CLK at Mux SD_CMD Test point for SD_CMD/eMMC_CMD at Mux eMMC_CLK Test point for eMMCMC_CLK at eMMCMC device SDC_CLK Test point for SD_CLK at SD connector SDC_CMD Test point for SD_CMD at SD connector SDC_D3 Test point for SD_DATA3 at SD connector SDC_D2 Test point for SD_DATA2 at SD connector SDC_D1 Test point for SD_DATA1 at SD connector SDC_D0 Test point for SD_DATA0 at SD connector SD_CLK_FB_EM_D4 Test point for SD_CLK_FB/eMMC_DATA4 at Mux SD_VSEL_EM_D5 Test point for SD_VSEL/eMMC_DATA5 at Mux SD_CMD_DIR_EM_D7 Test point for SD_CMD_DIR/eMMC_DATA7 at Mux SD_WP#_EM_RSTN Test point for SD_WP#/eMMC_RSTN at Mux SD_CD#_EM_STB Test point for SD_CD#/eMMC_STB at Mux TP19-UART0 TX Togg Test point for UART0 TX Togg TP17-UART0 RX Togg Test point for UART0 RX Togg TP16-UART1 TX Togg Test point for UART1 TX Togg TP15-UART1 RX Togg Test point for UART1 RX Togg TP12-UART2 TX Togg Test point for UART2 TX Togg

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Installation and Settings

...... continued Test Point Description TP13-UART2 RX Togg Test point for UART2 RX Togg TP14-UART3 TX Togg Test point for UART3 TX Togg TP18-UART3 RX Togg Test point for UART3 RX Togg XTAL2_VSC Test point for XTAL2 for Phy RCLK1_VSC Test point for Phy recovered clk1 RCLK2_VSC Test point for Phy recovered clk2 CKO_VSC Test point for Phy clkout THMDA1 Test point for THMDA1 FIBR_DIP_1 Test point for PHY_Serdes receiver input pair FIBR_DIN_1 Test point for PHY_Serdes receiver input pair FIBR_DOP_1 Test point for PHY_Serdes transmitter output pair FIBR_DON_1 Test point for PHY_Serdes transmitter output pair FIBR_DIP_0 Test point for PHY_Serdes receiver input pair FIBR_DIN_0 Test point for PHY_Serdes receiver input pair FIBR_DOP_0 Test point for PHY_Serdes transmitter output pair FIBR_DON_0 Test point for PHY_Serdes transmitter output pair TP1 to TP6 - Test points for PCIe reserved pins TP_VDD Test point for VDD_core voltage TP_1P1V Test point for 1.1 V GND_1P1V Test point for 1.1V_Ground TP_1P2V Test point for 1.2 V GND_1P2V Test point for 1.2V_Ground TP_3P3V Test point for 3.3 V TP_VDDA Test point for VDDA voltage TP_2P5V Test point for 2.5 V TP_1P8V Test point for 1.8 V TP_5P0V Test point for 5 V GND_1P8V Test point for 1.8V_Ground

2.3 Power Sources The PolarFire SoC Icicle Kit uses power supply devices. For more information about these power supply devices, refer to Power Management web page. The following table lists the key power supplies required for normal operation of the PolarFire SoC Icicle Kit.

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Installation and Settings

Table 2-4. I/O Voltage Rails

Supply Name Description Value (in Voltage) VDD Core Power 1.0/1.05 VDD25 Power for PLL/ICB/Bank Controller/PNVM/Programming Analog 2.5 block VDDA Power for SerDes RX Channels [3:0] Power for SerDes TX 1.0/1.05 Channels [3:0] VDDA25 Power for SerDes PLLs 2.5 VDD18 HSIO/MSS_DDR Receiver Input Power SE Corner Oscillator 1.8 Power for programming blocks, analog block and SW Corner Oscillator VDDI0 HSIO Bank Power 1.2, 1.5, 1.8 VDDI1 GPIO Bank Power 1.2, 1.5, 1.8, 2.5, 3.3 VDDI2 MSSIO Bank Power 1.2, 1.5, 1.8, 2.5, 3.3 VDDI3 Power for JTAG Ios 1.8, 2.5, 3.3 VDDI4 MSSIO Bank Power 1.2, 1.5, 1.8, 2.5, 3.3 VDDI5 MSS SGMII Bank Power and Pre-Driver 2.5, 3.3 VDDI6 MSS DDR (HSIO) Bank Power 1.2, 1.5, 1.8 VDDI7 GPIO Bank Power 1.2, 1.5, 1.8, 2.5, 3.3 VDDI8 HSIO Bank Power 1.2, 1.5 1.8 VDDI9 GPIO Bank Power 1.2, 1.5, 1.8, 2.5, 3.3 VDDAUX1 GPIO Pre-Driver Bank Power 2.5, 3.3 VDDAUX2 MSSIO Pre-Driver Bank Power 2.5, 3.3 VDDAUX4 MSSIO Pre-Driver Bank Power 2.5, 3.3 VDDAUX7 GPIO Pre-Driver Bank Power 2.5, 3.3 VDDAUX9 GPIO Pre-Driver Bank Power 2.5, 3.3 XCVR_VREF All SerDes RefClk receiver's voltage reference pin 0.9/1.25

Note: Bank 9 VDDI power pins are connected to Bank 1 VDDI power pins within the package substrate for pin migration compatibility. The following figure shows voltage rails (12 V, 5 V, 3.3 V, 2.5 V, 1.8 V, 1.2 V, and 1.0 V) available on the PolarFire SoC Icicle Kit.

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Installation and Settings

Figure 2-1. Voltage Rails on PolarFire SoC Icicle Kit

The following table lists the power regulators used for PolarFire SoC FPGA Icicle voltage rails. Table 2-5. Power Regulators

Voltage Rail Part Number Description Current 5 V MIC26950JL IC REG BUCK ADJ 12 A VDD (1 V) MIC22705YML IC REG BUCK ADJUSTABLE 7 A VSC_PHY(1.2 V) MIC23303YML-T5 IC REG BUCK ADJUSTABLE 3 A 1.1V_LPDDR4 MIC23303YML-T5 IC REG BUCK ADJUSTABLE 3 A 1P8V MIC23303YML-T5 IC REG BUCK ADJUSTABLE 3 A 2P5V MIC69502WR IC REG LINEAR POS ADJ 5 A 3P3V MIC26950JL IC REG BUCK ADJ 12 A VDDA MIC69502WR IC REG LINEAR POS ADJ 5 A 1P5V_DDR3 MIC23303YML-T5 IC REG BUCK ADJUSTABLE 3 A VTT MIC5166YML-TR IC PWR SUP 3 A HS DDR TERM 10MLF 3 A

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Board Components and Operations

3. Board Components and Operations This section describes the key components of the PolarFire SoC Icicle Kit and provides information about important board operations. For device datasheets, refer to PolarFire SoC Page. For more information, refer to Board Level Schematics document.

3.1 LDDR4 Memory Interface LPDDR4 is connected to the MSS BANK 6. • Part number: MT53D512M32D2DS-053 WT:D TR • Manufacturer: Micron • Frequency range: 800 MHz • Memory size: 16 Gb

3.2 SPI Serial Flash PolarFire SoC Icicle Kit has one SPI flash 1 Gb. Flash is connected to BANK3 SC-SPI pins to support IAP programming. • Part number: MT25QL01GBBB8ESF-0SIT • Manufacturer: Micron • Flash Type: NOR The following figure shows the SPI Flash interface of the PolarFire SoC Icicle Kit. Figure 3-1. SPI Flash Interface

PolarFire® SoC FPGA SDO F7 H10 SDI SC-SPI BANK3 Flash G7 SS (1 Gb) E6 SCK

3.3 eMMC and SDIO Interface PolarFire SoC MSS BANK4 has MUXed IOs for SDIO or eMMC interface. PolarFire SoC Icicle Kit uses on board MUX U44 and U29 to select interface between 8 GB eMMC device or SD card connector.

3.3.1 eMMC • Part number: SDINBDG4-8G • Manufacturer: SanDisk • eMMC 5.1 • Supports variable clock frequencies of 0-20 MHz, 0-26 MHz (default), 0-52 MHz (high-speed), 0-200 MHz SDR (HS200), and 0-200 MHz DDR (HS400) • Dual power system: Core voltage (Vcc) 2.7 to 3.3 V, IO (VCCQ) voltage either: 1.7-1.95 V or 2.7-3.6 V

3.3.2 SD Card PolarFire SoC Icicle Kit has one SD card connector.

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Board Components and Operations

• Part number: 10067847-001RLF • Manufacturer: Amphenol ICC (FCI) • SD interface is connected using a voltage translator between SD card connector and MUX (eMMC/SD) • Supported modes are default speed (25 MHz), high speed (50 MHz), UHS-I (SDR12, SDR25, SDR50, SDR14, and DDR50)

3.4 High Speed Transceivers Configuration

3.4.1 Transceivers Block Allocations • MPFS250T-FCVG484EES has one XCVR block and 4 SERDES LANES available.

3.4.2 PCIx16 Connector XCVR x4 lanes are mapped to PCIe CONN. On board PCIx16 straddle Mount root port connector is available in PolarFire SoC Icicle Kit. • Part number: 10025026-10103TLF • Manufacturer: Amphenol ICC • 4-TX/RX pairs are connected to SERDES block • 100 MHz reference clock is provided to connector

3.5 Communication Interfaces

3.5.1 Ethernet – SGMII Interface VSC8662 device is a low-power, dual Gigabit Ethernet transceiver (1000BASE-X Gigabit Ethernet Transceiver PHY) • Part number: VSC8662 • VSC8662 MAC interface dual port signals (Port 0 and Port1) RX/TX is connected on MSS SGMII Bank 5 • VSC8662 MDC and MDIO signals are connected MSS BANK 2

3.5.2 CAN Interface PolarFire SoC Icicle Kit has two CAN interfaces. One interface is from the MSS BANK 2 and another interface is from the GPIO BANK 1. • Part number: MCP2562FDT-E/SN • Manufacturer: Microchip

3.5.3 USB OTG USB3340 is a Hi-Speed USB 2.0 Transceiver that provides a physical layer (PHY) solution well-suited for portable electronic devices. • Part number: USB3340-EZK-TR • Manufacturer: Microchip • USB interface uses MSS BANK 2 • 26 MHz on board crystal for reference clock

3.6 Expansion Capabilities The following sections explain the expansion connectors for PolarFire SoC Icicle Kit.

3.6.1 Raspberry Pi 4 Connector PolarFire SoC Icicle Kit has 40 pin Raspberry pi connector.

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Board Components and Operations

• Part number: 61204021621 • Manufacturer: Wurth Electronics • Raspberry pi signals use GPIO BANK 1 and BANK 9

3.6.2 mikroBUS Connector PolarFire SoC Icicle Kit has 16 pin mikroBUS interface connector. • UART, SPI, and I2C signals • SPI signals use MSS BANK 2 •I2C, UART, and other GPIO signals use GPIO BANK 1 and BANK 9

3.7 Voltage and Current Monitoring PolarFire SoC Icicle Kit has provision to measure current for four power rails. • VDD • VDD25 • VDDA25 • VDDA Current sensing is done by PAC1934T-I/JQ. The I2C interface is available on digital values to read back values. Sensor’s I2C interface is connected to the MSS I2C interface.

3.8 GPIO

3.8.1 Switches and LEDs PolarFire SoC Icicle Kit is equipped with four tact switches and four LED indicators. • Switches and LEDs are connected to HSIO BANK 0

3.8.2 LEDs LED’s to indicate: • Power • User defined LEDs (quantity – 4)

3.9 User Interface The PolarFire SoC Icicle Kit has four user defined LEDs and four push-button switches.

3.9.1 USB to UART Interface CP2108 is a USB to quad UART bridge controller to support 4 UART interface on board. UART IOs are connected to the Fabric IOs (Bank1) of PolarFire SoC. • Part number: CP2108-B02-GM • Manufacturer: Silicon Labs • UART interface uses GPIO BANK 1 and BANK 9

3.10 Mux for JTAG Selection Multiplexer U22 is used for JTAG selection for External Flash Pro header and On board Programmer . • Part number: 74CBTLV3257BQ,115 • Manufacturer: NXP

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Board Components and Operations

Table 3-1. Mux for JTAG Selection

Jumper (J9) JTAG Selection Open External Flash Pro header Close On-board Programmer

3.11 Programming Scheme PolarFire SoC silicon is programmed in two ways: • Using FlashPro header connected to BANK3 of PolarFire SoC • On-board programmer (BANK 7) The following is the block diagram for programming scheme of PolarFire SoC. Figure 3-2. PolarFire SoC Programming Scheme Block Diagram

FP Header

PolarFire® SoC Bank 3 MUX On-board Bank 7 Programmer

3.12 System Reset DEVRST_N is an input-only reset pad that allows a full reset of the chip to be asserted at any time. The following figure shows a sample reset circuit that uses a Microchip MCP121T-240E/TT device. Figure 3-3. Reset Circuit

3.13 50 MHz Oscillator A 50 MHz clock oscillator with an accuracy of ±10 ppm is available on the board. This clock oscillator is connected to the FPGA fabric to provide a system reference clock. The pin number of the 50 MHz oscillator is W12, and the pin name is HSIO92PB0/CLKIN_N_2/ CCC_NW_CLKIN_N_2/CCC_NW_PLL1_OUT0. The following figure shows the 50 MHz clock oscillator interface.

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Board Components and Operations

Figure 3-4. 50 MHz Clock Oscillator

1.8V

PolarFire® SoC FPGA

50 MHz Oscillator Bank0 W12

For more information, refer to Board-Level Schematics document (provided separately).

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Pin List

4. Pin List For more information about all package pins on the PolarFire SoC, refer to PolarFire SoC MPFS250T_MPFS250TS- FCVG484 Package Pin Assignment Table.

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Board Component Placement

5. Board Component Placement The following figure shows the placement of various components on the PolarFire SoC Icicle Kit silkscreen.

Figure 5-1. Silkscreen Top View BRD EDGE BRD

BRD EDGE C476 C209 D5 1 R245 39 R254 R244 R241 R247 R243 R259 R253 R283 J16 R165 5 CR1 DS2 VDD R284 C486 J17 VDDA 1P8V LED4 LED1 R246 LED3 Q3 R171 40 2 LED2 CR2 J26 Raspberry Pi 4 Interface GND9 C480 SW4 SW1 R279 C483 R261 R250 R169 R249 J47 R172 C888 D4 C474 C472 R503 1P1V_LPDDR4 C479 C488 C473 J2 2 J15 C246 R173 R396 R397 LD7 R162 LD4 LD2 LD1 LD3 LD6 LD8 LD5 U5 C239 R152 C236 24 C87

C242 J46 C240 U53 R158 R281 R150 C485 R285 R282 SW3 SW2 C478 J30 X4 C234 C592 R159 C487 R280 R289 U34 R365R366 R33 R395 C94 PCB EDGE SPK_L1

R290 SPK_R1 C484 R368R362 R28 R24 TP_5P0V C588 T R398 A XTAL2_VSC C523 R314 R315 R318 R361 C530 C90 L7 U57 1 R364

GND_5PV0 C586 R344 R399 R35 C580 R287 C579 C577 R317 J29 C531 SDC_CMD R199 J19 R363 FB1 12 13 DS14 D7 5P0V SDC_CLK

Q4 C517 SDC_D3 SDC_D2 C578 8 5 7 SDC_D1 R278 GND_3P3V SDC_D0 U41 R316 C289 C581 U46 C265 C286 SD_WP#_EM_RSTN L14 U4 GND8 1 C582 C288 E C525 C528 A R312 SD_CD#_EM_STB C585 J3 2 U45 GND7 FIBR_DON_1 FIBR_DOP_1 J1

3P3V 24

C524 C135 U29 C516 U52 D6 GND_1P2V R320 C583 BRD EDGE R275 C533 C522 C521 TP11 P TP_1P2V 16 TP_3P3V SD_CMD_DIR_EM_D7 C69 RCLK1_VSC THMDA1 EMMC_CLK CKO_VSC C61 TP10 C68 C60 D3 SD_CLK SD_VEN_EM_D6

R276 TP9 FIBR_DIN_1 FIBR_DIP_1

U58 SD_VSEL_EM_D5 R41

C126 R407 R401 R343 R406 R40 R353 C532 PCB EDGE R277 R356 C573 SD_CMD C575 A SD_CLK_FB_EM_D4 R383 U44 R322 R42 C883 R358 TP8 C558 C564 C595 R405 C567 C566 R313 SW6 GND10 C596 R323 U56 SD_D3 FIBR_DON_0 1 R180C597 R355 FIBR_DOP_0 R135 J25 C529 R48 14 SD_D0 12 13 SD_D2 C230 SD_D1 RCLK2_VSC R360 R226 J27 R233 U3

C565 X2 L11 8 7

C598 C568 J43 R234 C515 C569 L13 R227 C298 LED5 C259 C76 C77 J31 C78 C79 R138 R136

C258 U21 GND1 R198 C572 U47 U48 C295 FIBR_DIP_0 FIBR_DIN_0

U17 J34 C469 C410 R102 C574 C437 C601 C602 C600 C513 R235 R1 C34 R240

C684 LD11 C599 L9 C514 1 C6 12 C434 J44

C512 R257 C39 LD12

R182 GND_1P1V TP_1P1V R179 R178 C431 A C370 C4 C24 C607 R239 U19 C683 R242 C621 C398 R50 C686 A C652

C51 C419 R504 U1 A R238 R452 R228 C5 R202 LD9 C16 R474 R237 R204 GND4 R201 C656 C655 C653 C658 C654 LD10 C679 C334 1 C53 AB 1

R445 C619 C31 C43 U23 C668

BRD EDGE C460 R447

C745 C46 R309 C21 C27 J13 J12 U26 C174 C750 C674 R109 C9 C50 R433 C741 C638 C18 C738

J33 J24

C509 R475 C743 R203 A1

R256 C618 AB U2 TP_VDD R443 U43 C58 R496 CR3 C612 C736 C611 C402 C408 C369 C496 R373 R372 R310 R262 C657 C498 C885 R491 C390 C673 C80 C379 R291 5 C742 R441 C672 R302 C329 C681 U22 C508 C357 L8 Y3 J21 R301 U55 J35 J8 CR4 R446 R437 J9 X5 22 R436 C506 R110 C497 TP16TP17TP19 R450R448 R300 C422 J28 TP15

R451R449 R299 J45 GND_VDD C884 C511 J10

R114 R274 C186 C184 C191 C187 C188 C185 C189 GND3 C190 C201 VDDAUX4 C490 TP12 C199 C746 C747 C594

C200 C197 5 C446 R115 B C493 TP13 C510 R304

GND6 C367 C591 R331 R328

R296 TP14 GND_VDDA D1 SPK_L SPK_R R341 R340 J23

R499 R410 C505 C196 C198 R149 R143 R148 R142 R133 R134 R501 R306 R129 R298 C503 R295 R325 R329 C204

GND_2P5V1 C438 TP18 J11 C545 R391 R297 U32 TP_VDDA U54 TP_1P8V GND5 R337 R132 C494 C205 FB3 R326 L12 TP_2P5V A C502 C491 C202 GND2 C203 A C492 C539 R392 D9 C227 C225 C226 U59 C228 C229 TP2 BRD EDGE C541

R327 C540

R417 TP1 R498 B R500 R73

2P5V R97 R338 R100 C180 R83 R78 C544 TP4 R101 C176 R76 C177

R113 U61 TP6 R292 C500 C501

TP7 R107 R86 TP5 R339

R389 R89 C557 J6 GND_1P8 B82 TP3 B1 C547 C537 U71 C546 R324 R390 C535 C538 C788 ICICLE Kit Rev:0.1 DVP-102-000536-001

The following figure shows the bottom view of the PolarFire SoC Icicle Kit silkscreen.

© 2021 Microchip Technology Inc. User Guide DS60001679A-page 21

Board Component Placement

Figure 5-2. Silkscreen Bottom View

C701 C887 R224 R225 R369 C691C725 C667 A C238 C665 C717 C698C723 C718 C722 C704 C475 C699 C697 C245 R164 C712 R426 C671 R431 C690 C733 R46 C737 C705 C732 C713 C703 R47 U49 U50 C886 R156 C889 U35 C669 C726 R370 R230 C75 R229 C734 R286 R393

C233 R168R174 R160 C481 24 R166R170 C477 R251 R272 R4 R9 R18 R12 R19 R17 R10 R11 U33 R248 R271 Y4 R15525 C489 C299 C302 R157 R151

R154 C471 R16 C71 R288 C232 9 R15 C72 R167 8

U6 C84 C95 C88 C235 C244 R14 C73 C237 C243 R260 R266 R31 R22 R21 R30 R255 C82 R163 R265

R400 C83

FB2 R161 C292 C482 C300 C301 R13 C74 C100 R153 C86 R23 C291

C92C97 R34 R367 C136 R32 C89 C290 C93 C125 C767 R29 R20 C85 C91

C118 C119 C120 C121 C122 C123 C766

C98 C266 R38 C130 C584 R222 R221 R36 C129 C519 C70 C132 R189 C131 C587 C589

C96 C287 C128 C114 R220 R497 C62 C106 C139 R37 R39 C140 C752 C101 C117 C116 C115 C113 C99 C111 C109 C107 C105 C103

C141 C282 C526 C275 C281 R319 R394 C124 C110 R8 C63 C104 C138 C137 C413 C344 C279 C108 C331 C332 C350 C134 C352 C280 C272 C273 C518 C112 C133 C326 R214 C276 C751 C102 R7 C64 C325 C345 R215 C274 C534 R45 R384 R44 R408 C328 C327 C358 C527 R218

C318 R217 C277

C426 C310 C421 C427 C341 R321 R6 C65 C353 C278 C520

R43 C880 C127

C321 R213 C339 C337 R211 C319 C309 R5 C66 C354 R219 R212 C432 C424 R402 R404 R403 C443 R359 C284 C283 R206 R216 R208 C435 C724

C441 C285 C442 C359 C355 R495 C411 R207 R210 C571 C702 C389 C388C409 R209 C696 C711 R3 R2 R181 C397 C404 C C576 C700 C708 C41

C67 C294 C570 R453

C297 C412 C439 R502

C374 C603 C643 R311 R263

C416 C642 C296 C293 C414 C633

R232 R269 C175 C436 C470 R375 R200 C682 C675 C38 R428 C55 C44

C52 R305 R307 R303 C676 C688 C748 R236

R231 R267 C606

R492 R103 C881 C666 R223 C403 C468 C451 C609 C182

C11 R432 C445 C457 C30 C749 C456 C608 C610 C650 C647 C649 C646 C425 R345 C461 C615 C448 C447 C605 C689 C364 C361 R371 B C459 C645 C719 C420 C340 C455 C449 C616 C45 C444 C430 C450 C695 C706 C385 C428 C433 C465 C685 C744 R429 C727 Y5 C270 C462 C464 C716 C386 C391 C49 C415 C315 C463 C360 C33 C48 C692 U25 C394 C399 C13 C622 C634 C715 C305 C458 C40 C714 U18 C15 R191 C20 C32 C631 C721 C423 C306 C467 C466 C320 C348 C314 C313 C375 C405 R192 C322 C7 C3 C635 C371 C346 C453 R505 B C14 C640 C636 R374

C12 C644 R190 C349 C648 C454 R188 C56 C639 A R435C739C740 C401 C317 C17 C632 C362 R193 C336 C28 C29 R308 R380R442 R434 C312 C311 C342 C365 R195 C407 C323 C614 R444 C351 C378 C8 C613 C730 R379 C418 C356 C338 C368 C333 C387 C C347 C59 C23 C651 C604 C628 C629 R425 C366 C731 C37 C26 C47 C10 C22

C324 C36 C35 C54 C627 R378 U24 C380 C308 C57 C641 C659 C720 C630 C735 C384 R104 R105 R106 C395 C382 C42 C377 C680 R427 C343 C330 C25 R268 C623 R438 C376 C383 C624 R430 C335 C19 C559 R488

C381 C507

C417 C637 C620 C626 R439 C81 C670 R440 C316 C307 C217 C882 C372 C617 C392 C393 C625 R196

C499 C400 C363 U14 R194 C396 C593 R409 48 33 C304 R121 C879 C406 C303 C429 R346 R354 R348 R349 C194 R120 32 R270 R258 R264 R108 C452 R293 R119 C195 U66 R118

C504 R294 R205 C271 R126 C555 17 C556 C590 C193 C787 C786

R117 R124 C440 D8 C495 C373 R123 R122 R125 C192 C553 C179 C554 C785 C181 C178 R91 C543 C542 C784 R77 R85 R88 J6 A1 A82 C536 R330

BRD EDGE

© 2021 Microchip Technology Inc. User Guide DS60001679A-page 22

Demo Design

6. Demo Design For the Icicle kit reference design, refer to the documentation provided on GitHub.

© 2021 Microchip Technology Inc. User Guide DS60001679A-page 23

Appendix: Programming PolarFire SoC FPGA Using the...

7. Appendix: Programming PolarFire SoC FPGA Using the On-Board Programmer The PolarFire SoC Icicle Kit includes an on-board programmer. An external programmer hardware is, therefore, not required to program the PolarFire SoC device. The device can be programmed using the FlashPro software installed on the host PC. Follow these steps to program an on-board PolarFire SoC device using the on-board programmer. Notes: The programming file will be available in a future release. 1. Connect the power supply cable to the J23 connector on the board. 2. Close Jumper J9 for mux U22. 3. Power on the board using the SW6 slide switch. 4. When the board is successfully set up, the power LEDs start glowing. 5. Download FlashPro Express from the following location: https://www.microsemi.com/product-directory/ programming/4977-flashpro#software 6. On the host PC, start the FlashPro Express software. 7. Click New Project to create a new project. 8. In the New Project window, do the following, and click OK. • Enter a project name. • Select Single device as the programming mode 9. Click Configure Device. 10. Click Program to program the device. 11. From the View Programmer pane, select the on-board FlashPro6 programmer. 12. Click Browse, and select the .stp file from the Load Programming File window. The Programmer List window in the FlashPro Express software shows the programmer name, programmer type, port, programmer status, and information about whether the programmer is enabled. When the device is programmed successfully, a Run Program PASSED status is displayed.

© 2021 Microchip Technology Inc. User Guide DS60001679A-page 24

Revision History

8. Revision History The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication.

Revision Date Description

A 01/2021 Following is a list of changes made in this release: • Converted this document from Microsemi format to Microchip format. Document number is changed from 50200882 to DS60001679A. • Information about 1.4.1 Form Factor has been updated in this revision.

2.0 — The following is a summary of the changes made in this revision. • Updated Table 10. • Updated the Appendix: Programming PolarFire SoC FPGA Using the On-Board Programmer.

1.0 — This is the first publication of this document.

© 2021 Microchip Technology Inc. User Guide DS60001679A-page 25

The Microchip Website

Microchip provides online support via our website at www.microchip.com/. This website is used to make files and information easily available to customers. Some of the content available includes: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip design partner program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

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Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Embedded Solutions Engineer (ESE) • Technical Support Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in this document. Technical support is available through the website at: www.microchip.com/support

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip’s intellectual property rights. • Microchip is willing to work with any customer who is concerned about the integrity of its code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

© 2021 Microchip Technology Inc. User Guide DS60001679A-page 26

Legal Notice

Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED BY MICROCHIP “AS IS”. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.

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The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge, In- Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL , Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2021, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-7505-7

© 2021 Microchip Technology Inc. User Guide DS60001679A-page 27

Quality Management System

For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

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