SHOW GUIDE CONNECTING DESIGN TO FAB TO ASSEMBLY CONFERENCE: September 9 – 12 EXHIBITION: Tuesday, September 10
Networking
ValuableConferenceIndustry Dan Beeker Selling PCB Assembly
Innovation Proceedings Buying
Lunch-n-Learn PCBs Vern Solberg Exhibits Networking Nick Koop Rick Hartley Gary Ferrari Fabrication Silicon Valley Learning
Training Designers EngineersLearning Flex Circuits PCB Assembly Webb Susy Mark Finstad Best Connecting Phil Marcoux Selling High-Speed Education
Artificial Intelligence Knowledge Bill Hargin Hargin Bill Certification Lee Ritchey Excelling Eric Bogatin Eric Bogatin
PCBWEST.COM SANTA CLARA CONVENTION CENTER, CA Brought to you by PRINTED CIRCUIT CIRCUITS DESIGN & FAB ASSEMBLY Wine, Cheese, and PCBs
Join us for a relaxing celebration after the exhibition, 5pm at Sierra Circuits’ booth #408
CIRCUITS
BOOTH #408 RISE ABOVE THE AVERAGE
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Visit Us at PCB West Booth #400 to Learn More 2 Visit Us at Booth 300
PCB West.indd 1 7/16/19 4:40 PM SCHEDULE-AT-A-GLANCE
MONDAY, SEPTEMBER 9 TITLE SPEAKER ROOM REGISTRATION 7:30AM - 5:00PM MCB LOBBY 8:00am CONFERENCE COFFEE BREAK - Sponsored by Sierra Circuits 8:30am - 12:00pm 1: Developing an AI Strategy to Address a CAD/CAM Design Process Bottleneck Daniel Smith, Raytheon Missile Systems 202 9:00am - 12:00pm 2: The Complete Guide to Characterizing Transmission Lines with a TDR Dr. Eric Bogatin, Teledyne LeCroy 201 Mark Finstad, Flexible Circuit Technologies, and 3: Ask the Flexperts – Flexible Circuit Design through Test with Lessons Learned 205 Nick Koop, TTM Technologies 9:00am - 5:30pm 4: PCB Stackup Design and Materials Selection Bill Hargin, Z-zero 206 5: The Basics of PCB Design for Novices and Engineers Susy Webb, Design Science 207 6: Advanced PCB Fabrication and Defects Paul Cooke, FTG 208 12:00pm – 1:00pm LUNCH-N-LEARN - Sponsored by Summit Interconnect (Monday Conference attendees only) 1:30pm - 5:00pm 7: Effective PCB Design: Techniques to Improve Performance Dan Beeker, NXP Semiconductor 202 1:30pm - 2:30pm 8: Accelerate PCB Design Layout Using AI and Machine Learning Naveid Rahmatullah and Xiao-Ming Gao, Intel 212 1:30pm - 3:30pm 9: IoT (Internet of Things) PC Board Design Rick Hartley, RHartley Enterprises BR H 10: From DC to AC - Power Integrity and Decoupling Primer for PCB Designers Ralf Bruening, Zuken EMC Technology Center 211 1:30pm - 5:00pm 11: Design, Fabrication and Assembly Process Principles for Flexible and Vern Solberg, Solberg Technical Consulting 201 Rigid-Flex Circuits 3:00pm - 5:00pm 12: How to Fight Magnetic Noise Gremlins Keven Coates, Geospace Technologies 205 3:30pm - 5:30pm 13: Signal Attenuation in Very High-Speed Circuits Rick Hartley, RHartley Enterprises BR H TUESDAY, SEPTEMBER 10 8:00am CONFERENCE COFFEE BREAK - Sponsored by Sierra Circuits REGISTRATION 8:00 AM - 5:00 PM MCB LOBBY 8:30am - 12:00pm 14: The Complexities of Fine Pitch BGA Design Susy Webb, Design Science 207 15: Moving Beyond SMT: Heterogeneous Assembly Phil Marcoux, PPM Associates 208 16: Embedding Passive and Active Components: PCB Design, Fabrication Vern Solberg, Solberg Technical Consulting 211 Methodologies and Assembly Process Strategy 17: The Basics of PCB Fabrication (101) Paul Cooke, FTG 212 9:00am - 10:00am 18: How the IPC Digital Product Model (DPM) Working with IPC Connected Factory Hemant Shah, Cadence Design Systems and 202 Exchange (CFX) Can Improve Product Quality, Performance and Reliability Michael Ford, Aegis Software 9:00am - 11:00am 19: An Intuitive Approach to Understanding Basic High-Speed Layout Keven Coates, Geospace Technologies 205 20: PCB Layout of Switch Mode Power Supplies Rick Hartley, RHartley Enterprises 206 10:00am - 2:00pm BOOTH BARISTA - Sponsored by Zuken 10:00am - 12:00pm 21: PCB Design Techniques to Improve ESD Robustness Dan Beeker, NXP Semiconductor 202 11:00am - 12:00pm 22: Multidiscipline Real-Time Team Design Michael Catrambone, Cadence Design Systems 205 23: PCB Transmission Line 101 Atar Mittal, Sierra Circuits 201 10:00 AM - 6:00 PM EXHIBITS OPEN 4 SCHEDULE-AT-A-GLANCE
TUESDAY, SEPTEMBER 10 (continued) TITLE SPEAKER ROOM 12:00pm – 1:00pm LUNCH ON SHOW FLOOR - Sponsored by Sierra Circuits 1:30pm - 3:30pm 24: Power Distribution Made Easy Dan Beeker, NXP Semiconductor 202 1:30pm - 5:00pm 25: Designing PCBs with HDI Technology Susy Webb, Design Science 207 26: Circuit Grounding to Control Noise and EMI Rick Hartley, RHartley Enterprises 206 27: PCB Design for High Reliability Paul Cooke, FTG 201 28: Establishing an Effective PCB Systems Design Validation Process to David Wiens, Mentor, a Siemens Business 211 Reduce Design Spins and Increase Product Quality 29: Heat Management for SMD, LED, and Systems 1W to 50W Keven Coates, Geospace Technologies 205 30: Cost-Conscious Strategies for Electronic Products Robert Hanson, Americom 208 3:30pm - 5:30pm 31: Better Board Buying Greg Papandrew, Better Board Buyers 212 5:00pm - 6:00pm EVENING RECEPTION ON SHOW FLOOR - Sponsored by Ultra Librarian
TUESDAY, SEPTEMBER 10 - FREE SESSIONS
9am - 10:00am F1: Last Minute DfM in a Crazy Prototype World Duane Benson, Screaming Circuits BR H F2: Effect of Stimulus Patterns (Even/Odd) on Supply Rail Noise and Vinod Huddar, Western Digital GA 1 Resonance in PDN in Parallel Bus Interface 10:00 AM - 6:00 PM EXHIBITS OPEN 10:00am - 11:00am F3: What Every Circuit Board Designer Needs to Know about SI and PI Dr. Eric Bogatin, Teledyne LeCroy BR H F4: Tier 3 Reciprocal BoM Methods Contest Tier 1 Cost Models Joe Fama, TCE Inc. GA 1 11:00am - 12:00pm F5: How Leveraging Software-Powered Electronics Manufacturing Facilitates Shashank Samala, Tempo Automation BR H Innovation and Enables Faster Time-to-Market for PCBA F6: Design Considerations for Heavy Copper PCBs Greg Ziraldo, Advanced Assembly GA 1 1:00pm - 2:00pm F7: Unleashing Electronics Design with Additive Manufacturing Ofer Maltiel, Nano Dimension BR H F8: Going Paperless to Fab and Assembly with IPC-2581 Stan Keightley Jr., WISE Software Solutions GA 1 2:00pm - 3:00pm F9: An Overview of Glass-Weave Effect for PCB-Based RF and High-Speed John Coonrod, Rogers Corp. GA 1 Digital Applications 2:00pm - 4:00pm Dave Hoover, TTM Technologies; Ray Fugitt, F10: 21 (and Counting) Most Common Design Errors, Caught by Fabrication, Downstream Technologies; and Mike Tucker, BR H and How to Prevent Them Kinwong 3:00pm - 4:00pm F11: Characterization of High-Tg FR-4 Reliability in High-Temperature Matthew LaBar, Bay Area Circuits, and Troy GA 1 Applications Topping, Ph.D. 4:00pm - 5:00pm F12: Jump-Starting your PCB Design – Getting the Data Upfront (Rules, Ed Acheson, Cadence GA 1 Stackup) F13: Writing Your Résumé and Marketing Yourself Within Your Company Gary Ferrari, FTG Corp. BR H SCHEDULE-AT-A-GLANCE
WEDNESDAY, SEPTEMBER 11 TITLE SPEAKER ROOM 8:00am CONFERENCE COFFEE BREAK - Sponsored by Sierra Circuits
REGISTRATION 8:00 AM - 2:00 PM 200 LOBBY 8:30am - 12:00pm 32: PCB Design of Power Distribution and Decoupling Rick Hartley, RHartley Enterprises BR H 33: A Beginner’s Guide to Intuitive RF/Microwave PCB design and Prototyping Benjamin Jordan, Altium 201 34: Part Placement Choices and Consequences Susy Webb, Design Science 207 9:00am - 11:00am 35: The Mystery of Bypass Capacitors Keven Coates, Geospace Technologies 202 36: Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold Dan Beeker, NXP Semiconductor 205 the Equations, Please! 9:00am - 5:30pm 37: Design Beyond the CAD Tool Gary Ferrari, FTG Corp. 211 11:00am - 12:00pm 38: CAE for Upfront DfM and Configuration Validation of PCB Plating Process Robrecht Belis, Elsyca 206 39: Integrated Design and Analysis for PCB Designers John Carney, Cadence 212 12:00 pm – 1:00 pm LUNCH-N-LEARN - Sponsored by Polar Instruments (Wednesday conference attendees only) 1:30pm - 3:30pm 40: Analytic Approach to Project Management of PCB Designs Timothy Lombard, PCBevo 201 1:30pm - 2:30pm 41: HDI – High Density Interconnect Harry Kennedy, NCAB Group 205 1:30pm - 5:00pm 42: Thermal Management Solutions Using PCBs and IMS Mike Tucker, Kinwong 206 43: RF and Mixed Signal PC Board Design Rick Hartley, RHartley Enterprises BR H 44: Mentoring Extended PCB Design Techniques Susy Webb, Design Science 207 2:30pm - 4:30pm 45: Laying Out Analog/Digital Planes Robert Hanson, Americom 208 THURSDAY, SEPTEMBER 12 TITLE SPEAKER ROOM REGISTRATION 8:00 AM - 12:00 PM GREAT AMERICA 1 9:00am - 5:00pm 46: Getting to 32Gb/S: A Tutorial on How to Design Very High-Speed Lee Ritchey, Speeding Edge GA 1 Differential Signals 12:00 pm – 1:00 pm LUNCH-N-LEARN - Sponsored by Isola (Thursday conference attendees only) Coming Together for the Future of 5G Nelco and Taconic RF and Digital Materials
Leading the way – It takes many different people, products and ideas to create a successful future. With Nelco and Taconic technologies, the future of 5G and the Internet of Things is one step closer.
fastRise family of non-reinforced prepreg/bonding plys (FREZp, EZpure, FR27) offer Best-in-Class loss tangents, for Rigid/Flex, HDI, and high frequency RF/Digital electronics. Meteorwave materials provide high reliability and advanced electrical performance in both e-glass and SI-glass options.
What designs can you dream up? See us at PCB West What just became possible? Booth 409
www.agc-nelco.com / www.4taconic.com
AGC Nelco Coming Together Ad embedded.indd 1 7/29/2019 9:59:28 AM Free Tuesday Sessions - Overview by Subject Beginner Intermediate Advanced
ADDITIVE MANUFACTURING Unleashing Electronics Design with Additive Manufacturing Ofer Maltiel, Nano Dimension
ASSEMBLY PROCESSES Last Minute DfM in a Crazy Prototype World Duane Benson, Screaming Circuits
Going Paperless to Fab and Assembly with IPC-2581 Stan Keightley Jr., WISE Software Solutions How Leveraging Software-Powered Electronics Manufacturing Facilitates Innovation and Shashank Samala, Tempo Automation Enables Faster Time-to-Market for PCBA DESIGN SOFTWARE 21 (and Counting) Most Common Design Errors, Caught by Fabrication, and How to Prevent Dave Hoover, TTM Technologies; Ray Fugitt, Downstream Them Technologies; and Mike Tucker, Kinwong DFF/DFM/DFA/DFT 21 (and Counting) Most Common Design Errors, Caught by Fabrication, and How to Prevent Dave Hoover, TTM Technologies; Ray Fugitt, Downstream Them Technologies; and Mike Tucker, Kinwong Last Minute DfM in a Crazy Prototype World Duane Benson, Screaming Circuits Jump-Starting your PCB Design – Getting the Data Upfront (Rules, Stackup) Ed Acheson, Cadence
FABRICATION PROCESSES/HDI Unleashing Electronics Design with Additive Manufacturing Ofer Maltiel, Nano Dimension 21 (and Counting) Most Common Design Errors, Caught by Fabrication, and How to Prevent Dave Hoover, TTM Technologies; Ray Fugitt, Downstream Them Technologies; and Mike Tucker, Kinwong An Overview of Glass-Weave Effect for PCB-Based RF and High-Speed Digital Applications John Coonrod, Rogers Corp. Going Paperless to FAB and Assembly with IPC-2581 Stan Keightley Jr., WISE Software Solutions
Design Considerations for Heavy Copper PCBs Greg Ziraldo, Advanced Assembly HIGH-SPEED DESIGN
Effect of Stimulus Patterns (Even/Odd) on Supply Rail Noise and Resonance in PDN in Parallel Vinod Huddar, Western Digital Bus Interface LAMINATES Characterization of High-Tg FR-4 Reliability in High-Temperature Applications Matthew LaBar, Bay Area Circuits, and Troy Topping, Ph.D. An Overview of Glass-Weave Effect for PCB-Based RF and High-Speed Digital Applications John Coonrod, Rogers Corp. MANAGEMENT/MARKETS/PROGRAM MANAGEMENT Tier 3 Reciprocal BOM Methods Contest Tier 1 Cost Models Joe Fama, TCE Inc. Writing Your Résumé and Marketing Yourself Within Your Company Gary Ferrari, FTG Corp. PCB DESIGN/LAYOUT/PLACEMENT What Every Circuit Board Designer Needs to Know about SI and PI Dr. Eric Bogatin, Teledyne LeCroy Design Considerations for Heavy Copper PCBs Greg Ziraldo, Advanced Assembly 21 (and Counting) Most Common Design Errors, Caught by Fabrication, and How to Prevent Dave Hoover, TTM Technologies; Ray Fugitt, Downstream Them Technologies; and Mike Tucker, Kinwong Unleashing Electronics Design with Additive Manufacturing Ofer Maltiel, Nano Dimension Characterization of High-Tg FR-4 Reliability in High-Temperature Applications Matthew LaBar, Bay Area Circuits, and Troy Topping, Ph.D. Jump-Starting your PCB Design - Getting the Data Upfront (Rules, Stackup) Ed Acheson, Cadence An Overview of Glass-Weave Effect for PCB-Based RF and High-Speed Digital Applications John Coonrod, Rogers Corp. PURCHASING Tier 3 Reciprocal BOM Methods Contest Tier 1 Cost Models Joe Fama, TCE Inc. RF/MICROWAVE An Overview of Glass-Weave Effect for PCB-Based RF and High-Speed Digital Applications John Coonrod, Rogers Corp. SIGNAL INTEGRITY/POWER INTEGRITY Effect of Stimulus Patterns (Even/Odd) on Supply Rail Noise and Resonance in PDN in Parallel Vinod Huddar, Western Digital Bus Interface What Every Circuit Board Designer Needs to Know about SI and PI Dr. Eric Bogatin, Teledyne LeCroy TEST An Overview of Glass-Weave Effect for PCB-Based RF and High-Speed Digital Applications John Coonrod, Rogers Corp. Characterization of High-Tg FR-4 Reliability in High-Temperature Applications Matthew LaBar, Bay Area Circuits, and Troy Topping, Ph.D.
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