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2 · 2019 i s s u e i n t e r e s t

Early-stage research provides provides Early-stage research insight into scientific advances s p e c i a l UNIVERSITY PARTNERSHIPS

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Manipulating matter at the atomic and molecular scale e y e TRANSITIONING

TODAY TECHNOLOGY

Highlighting Raytheon’s Engineering & Technology Innovations Technology Engineering & Highlighting Raytheon’s FOR GLOBAL DEFENSE CRITICAL SOLUTIONS ENABLING MISSION Raytheon Research Raytheon s p ot l i g h t

i s s u e 2 · 2019 A MESSAGE FROM MARK E. Technology-based companies such as Raytheon use research and technology development as the basis for new products and product upgrades. For a company RUSSELL to be successful, its technology portfolio needs to balance both near-term and long-term needs. Executing a strategy that optimizes for both has never been more important. We’re operating in an environment where technology is advancing at TECHNOLOGY TODAY unprecedented speed and competition is fierce. Companies are competing to extend their existing programs and win new ones that will fuel growth for decades to come. Technology development is often a deciding factor in these contests. Technology Today is published by the Office of Engineering, Technology and Mission Assurance. At a practical level, technologies are most valuable when they address a customer need. At Raytheon, we ensure this happens by creating a balanced portfolio of investments and seeking customer engagement, as well as funding, throughout the VICE PRESIDENT Mark E. Russell lifecycle. Our approach for unlocking the value of technologies comprises several key elements. Leaders from engineering and technology work with various partners — CHIEF TECHNOLOGY OFFICER including universities, research labs and start-ups — to ensure we have visibility into Bill Kiczuk emerging technology. We execute a disciplined technology planning and MANAGING EDITORS development process that includes competitive assessments and technology Tony Pandiscio Tony Curreri maps. Subject matter experts from across the company collaborate on a regular and ongoing basis to share knowledge and identify our strengths and gaps proactively to SENIOR EDITORS Corey Daniels guide investments. We pursue contract research and development programs to help Lisa Hubbard fund technology maturation while also gaining sponsorship from our government Eve Hofert customers. Finally, we invest across the continuum; making big bets at the right time DESIGN, AND WEB v i c e p r e s i d e n t o f while continuing to explore the potential of newer technologies and maturing them TBG engineering , to support product growth. Raytheon Advanced Media t e c h n o l o g y a n d In this edition of Technology Today we explore some of the many areas of research PUBLICATION DISTRIBUTION m i s s i o n a s s u r a n c e and collaboration key to developing the mission critical solutions Raytheon products Ali Solomont bring to the global defense industry. Our feature articles highlight research in CONTRIBUTORS advanced circuit technologies, such as three dimensional heterogeneous integration, Paul Bailey Steve Klepper wide bandgap and photonic integrated circuits. These efforts are Tony Marinilli creating opportunity for improvements in the areas of directed energy; radio Nora Tgavalekos frequency, electro-optical and sensing; and power . We also ON THE COVER discuss recent research activities in cybersecurity for weapon systems and the (RF) testing challenging embedded environment. In our Eye On Technology section we of a Monolithic Integrated look at nanotechnology, the ability to manipulate materials on the scale of tens to Circuit (MMIC) hundreds of atoms, which has opened new doors to research and development across a broad range of the physical, electronic and chemical sciences with application in both commercial and military industries. Wrapping up this edition is a discussion of our research partnership with the California Institute of Technology’s Center for Autonomous Systems and Technologies, one of our more than 75 academic partner institutions, and an insightful look at the Raytheon Innovation Challenge, a companywide initiative soliciting unique technical ideas and solutions to address our customer’s most This document does not contain technology or technical data controlled under either the U.S. International in Arms Regulations or challenging needs. Thisthe U.S. document Export Administration does not contain Regulations. technology or technical data controlled under either the U.S. Mark E. Russell International Traffic in Arms Regulations or the U.S. Export Administration Regulations.

TECHNOLOGY TODAy 2018 | 1 c o n t e n t s

e y e o n t e c h n o l o g y s p e c i a l i n t e r e s t f e at u r e 4 s p ot l i g h t Raytheon RESEARCH 32 42 52 A robust and balanced research portfolio ensures development of the next Advancing Weapon Systems transitioning raytheon’s university generation of mission critical Cybersecurity THROUGH nanotechnology partnerships solutions Raytheon will bring to the defense industry. AUTOMATION Advances in the ability to model, Raytheon actively partners with leading manipulate and characterize materials technologists at many universities to bring Automation technologies help to at the nanoscale are expanding the the best minds to bear on developing both protect operational systems implementation of nanotechnology across unique and strategic product solutions and harden software baselines during defense and commercial sectors. for the customer. design and maintenance.

s p e c i a l i n t e r e s t pat e n t s

56 Patents Issued to Raytheon 8 12 20 26 Recognizing our engineers and technologists for their contributions f e at u r e f e at u r e f e at u r e f e at u r e in their fields of interest. The Next Advanced 3dhi Photonic Generation of Electro- ELECTRONICS Integrated 38 Millimeter-Wave optical and TECHNOLOGY Circuits Wide Bandgap 48 RF Infrared (EOIR) Three dimensional RESEARCH heterogeneous Power Solid-state amplifiers are EO and IR Photonic integrated integration (3DHI) achieving power levels used in military and circuit (PIC) Electronics Conversion and Good Ideas Can Come helps create high previously attainable aerospace systems technologies promise performance RF and Control from Anyone: RAYTHEON with only require improved miniaturization optical electronics based systems. sensitivity, dynamic and large scale The rapid maturation and adoption of INNOVATION CHALLENGE while minimizing range, frame rates implementation of power switching devices based on wide size, weight, and The Raytheon Innovation Challenge fosters and image processing optical and electro- bandgap (WBG) semiconductors has power (SWaP). a culture of innovation and enterprise across the spectrum. optical devices. created significant improvements in collaboration, leveraging new technologies efficiency, power density and transient to create value-added solutions to key response. customer needs. 2 | TECHNOLOGY TODAy 2019 TECHNOLOGY TODAy 2019 | 3 s p ot l i g h t

Raytheon Research

Raytheon continually pushes the boundaries of technology to create the foundations for building solutions that make the world a safer place. As the pace of scientific discovery and technological advancement Raytheon uses a balanced approach to continues to accelerate, technology development that connects our domain experts to advances in Raytheon’s robust research external research communities and portfolio, leveraging internal companies, along with internal research and external technology sources and development (IRAD) efforts, to solve and partners, ensures our specific needs of our customers. This position as a technology leader issue of Technology Today highlights for defense and security. recent research projects from IRAD, external partnerships, customer funded activities and companywide innovation challenges. Readers may also be interested in our 2018 edition of Technology Today which presents Raytheon’s research and applications of Artificial Intelligence and Machine Learning. RAYTHEON RESEARCH

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s p ot l i g h t RAYTHEON RESEARCH

Two of this edition’s articles show new John Zolper, Ph.D. directions for research in core component Vice President Research and Innovation technology areas. In “The Next Generation John C. Zolper is vice president of research of Millimeter Wave RF Amplifiers,” Nick and innovation, corporate technology and Kolias and Andrew Brown present results research for Raytheon Engineering, Technology and Mission Assurance (ET&MA). He joined on extending the frequency of operation Raytheon in 2007. Zolper partners with of gallium nitride (GaN) monolithic the chief technology officer to develop and microwave integrated circuits (MMICs) up implement an integrated technology and through W band. Raytheon’s GaN MMICs research vision and strategy for Raytheon. have achieved a benchmark for W-band He leads several cross-company teams of subject matter experts exploring emerging power that will enable new system technology areas, including machine learning, applications such as high frequency data additive manufacturing, 3D integrated circuits, links. Lenonard Chen’s article, “Advanced power technology, nanotechnology and next Electro-optical and Infrared: Sensing Across generation monolithic microwave integrated the Spectrum,” discusses electro-optical Raytheon is a leader in producing gallium nitride components that form numerous circuit (MMIC) technology. He also leads the innovations featured in this issue. enterprisewide Raytheon Innovation Challenge and infrared (EOIR) focal plane array (FPA) to inspire creative solutions that address critical imagers that continue to drive higher customer needs. pixel counts, frame rates and dynamic Zolper seeks to challenge the status quo range, and that have sensitivities meeting in Raytheon’s technology development. “I tactical and strategic requirements. Chen am driven to ensure we are asking the hard conventional power electronics Another technology under development Jon Goding and Heather Romero, in Raytheon remains a technology explains how with the advent of efficient questions to connect technology potential to real and are reinvigorating the field of power to reduce system size, weight and power “Advancing Weapon Systems Cybersecurity driven company dedicated to creating 3D integration, smart sensors are feasible, mission needs, and do so rapidly,” he relates. electronic circuits and systems. (SWaP) is integrated . The article through Automation,” explore recent discriminating solutions for our customers from basic on-chip image processing to Prior to his position with Raytheon ET&MA, “Photonic Integrated Circuits Research research in cybersecurity for weapon through a broad portfolio of research Zolper served in roles of increasing implementing neuromorphic algorithms, In “Raytheon’s Three Dimensional and Development at Raytheon” by Richard systems and the drive for automation in science and technology. By driving responsibility at the Defense Advanced Research and how focal plane arrays span from near Heterogeneous Integration (3DHI) Belansky and Mo Soltani discusses work to enable humans and machines to next generation core technologies Projects Agency (DARPA). As director of the IR to long IR. Electronics Technology,” Thomas E. Kazior Microsystems Technology Office (MTO), he to exploit recent advances in photonic respond directly, rapidly and effectively and expanding capabilities into new and coauthors present 3DHI as an enabler was responsible for the strategic planning and integrated circuits (PICs) for applications to indicators of malicious activity. This technological domains, Raytheon is of future systems that execution of a portfolio of research programs such as sensing, imaging, , article examines research across the constantly evolving — setting a challenging will benefit from the covering all areas of advanced component communications, RF photonics entire life cycle of weapon systems, from pace as a leading provider of defense and technology, including electronics, photonics, intimate and flexible Raytheon is constantly evolving — and positioning, navigation and timing advanced algorithms, to deployment of civil solutions to make the world a safer MEMS (microelectromechanical systems), integration of multiple algorithms and component architecture. Major (PNT). With all the advances occurring those algorithms in operational weapon place. setting a challenging pace as a leading heterogeneous device MTO programs included work on Quantum in emerging PIC technologies, Raytheon platforms, to the automated development provider of defense and civil solutions. and circuit technologies. — John Zolper Information Science, Chip Scale Atomic Clocks, researchers and engineers are actively and maintenance tools now being piloted For example, the Wide Bandgap Semiconductor Technology, pursuing PIC implementations to provide by Raytheon’s own engineers. and Trusted Integrated Circuits, among others. 3D heterogeneous lower cost, higher yield technology Before joining DARPA, Zolper was a program integration of high power and efficiency With advances in the ability to model, officer at the Office of Naval Research (ONR) Sriram Chandrasekaran and Jon Rawstron insertion solutions for both existing and GaN power amplifiers (PAs) with manipulate and characterize materials and a principal member of the technical staff author “Wide Bandgap Semiconductor future Raytheon programs. functionally dense Silicon (Si) CMOS logic at the nanoscale, implementation of at Sandia National Laboratories. This wide Power Electronics Conversion and breadth of experience helps him to assess new will create a new class of compact, digitally nanotechnology across defense and Control,” an article on developing wide technologies and to then connect them to enhanced radio frequency (RF) integrated commercial sectors continues to expand. In bandgap semiconductors silicon carbide customer needs. circuits (ICs) that can revolutionize radar this edition’s Eye On Technology, the article (SiC) and gallium nitride (GaN) power Zolper states that he was excited to join and multifunction systems. The article “Transitioning Nanotechnology: Small electronic circuits to improve system power Raytheon to contribute to the continuing further discusses efforts to make this Dimensions, Big Impact” by K.C. Fong, development of Gallium Nitride (GaN) materials, efficiency and drive down associated size solution cost-effective by taking advantage C. Haynie, M. Herndon, and C. Koontz RF , and MMICs. “GaN technology is and weight. For a given power level, SiC of existing and emerging 3D commercial examines 2D materials and nanoscale a discriminator for all of Raytheon’s radar and and GaN power transistors can operate electronic warfare systems. I work with our GaN technologies, such as wafer bonding, design as enablers for future electronic and at higher frequency with lower loss, foundry to continue to push GaN technology to interposers, and 3D fabrication techniques. sensor technology capabilities. and therefore higher efficiency, than new levels of performance,” Zolper concludes. “I can safely say that we have only scratched the surface on the full potential of GaN MMIC technology. It will be a discriminator for Raytheon for many years to come.”

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The Next THE NEXT GENERATION OF Generation of Millimeter-Wave RF Amplifiers At Raytheon’s Radio Frequency (RF) Components facility, millimeter-WAVE engineers are producing the next generation of Gallium Nitride (GaN) Monolithic Microwave (MMIC) amplifiers that will rf AMPLIFIERS provide advanced capabilities to our defense systems in the areas of RF power, efficiency, and reliability at millimeter-wave (mm-wave) frequencies. Raytheon is at the Building from this strong foundation, forefront of GaN technology, Raytheon has developed higher frequency, mm-wave versions of the GaN having developed microwave process that operate through W-band GaN amplifiers that provide (higher than 30GHz). This W-band a five-times boost in power mm-wave GaN process has enabled over legacy Gallium Arsenide the development of highly reproducible (GaAs) amplifiers, meeting the watt-level solid-state MMIC amplifiers challenging requirements of at W-band. By combining these MMIC amplifiers, Raytheon has demonstrated key emerging defense systems solid-state power levels such as Raytheon’s Air Missile previously attainable with only vacuum Defense Radar (AMDR) and tube based systems. In particular, the the Next Generation Jammer free-space combining of 8,192 of these (NGJ). amplifiers has produced a solid-state transmitter capable of 7 kilowatts (kW) of power at W-band frequencies. This is more than two orders of magnitude higher than the highest published W-band solid-state power to date (less than 40 watts). This high power amplifier capability is an enabler for advanced future systems, including high power solid-state mm-wave radars and solid- state active denial systems.

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f e at u r e millimeter-WAVE RF AMPLIFIERS 2 1.75 Published Power Output of W-band MMIC Amplifiers (Watts) 1.5 Vacuum Tubes’ Last Frontier 1.25

Invented in 1904, vacuum tubes were the 1 key building block for early computers, 0.75 Nick Kolias, Ph.D. radios, and radar transmitters. Integrated Defense Systems Soon after its invention in 1947, the 0.5 Dr. Kolias is a principal engineering fellow began replacing vacuum tubes 0.25 for Raytheon’s Integrated Defense Systems in one application after another, which business. In his current role as Technical 0 Director for the Corporate resulted in compact, lighter weight and CMOS SiGe MHEMT GaAs InP HBT GaN Independent Research and Development more reliable systems than the tube-based Figure 1. The above bar chart shows the published power output of W-band Monolithic Microwave (IRAD) Program he is responsible for directing predecessors. However, one area where Integrated Circuit (MMIC) amplifiers as a function of semiconductor technology: complementary Figure 3. Active Denial System 1 utilizes a 100 kilowatt (kW) vacuum electron device (VED) and coordinating Raytheon’s microelectronics 2 3 vacuum tubes are still predominantly used metal–oxide–semiconductor (CMOS), silicon- (SiGe), metamorphic high-electron-mobility and is installed on a dedicated Humvee (left). Solid State Active Denial Technology (SSADT) enables research. “Our research program is focused 4 5 is for very high power (kilowatt-level) mm- transistor (MHEMT), gallium arsenide (GaAs), (InP) heterojunction bipolar transistor adjunct stand-alone systems for mounting on top of a variety of vehicles (right). on providing Raytheon with emerging wave sources. For a transistor to produce (HBT) 6 and gallium nitride (GaN) 7. microelectronics technology discriminators. I am fortunate that I get to work with a great gain at mm-wave frequencies, it must have team on envisioning the future of microwave small dimensions, which in turn limits its microelectronics technology and the best path power capability. Historically, the highest Raytheon’s mm-wave Solid-State 1W GaN PA MMIC System Application and Reliability to get there.” power transistor amplifiers at mm-wave Dr. Kolias joined Raytheon in 1996 as a senior Power Amplifiers (SSPAs) 7W Sub-Module The 7 kilowatt system’s array aperture is extrapolated lifetime of approximately 1 frequencies have been in the milliwatt scientist in the Microwave Circuits Research compact (approximately 25 inch by 25 million hours at typical transistor junction level, limiting their ability to compete with While the higher power capability of GaN Laboratory. “I went into inch) and is presently planned for use temperatures. In addition, unlike the single in college with a strong desire to learn more vacuum tubes for kilowatt level mm-wave technology makes kilowatt level power by the U.S. Army as a Solid State Active point of failure seen with the vacuum tube about computer architecture and the digital applications. GaN is now changing this. amplifiers possible, producing kilowatts Denial system. Active Denial is a nonlethal, in tube-based transmitter systems, the circuit design that was changing the world,” of output power at W-band requires the Dr. Kolias relates. “But while on that path I 100W Module counter-personnel weapon utilizing high- modular power combining approach of MM-WAVE G N low-loss combining of the output power discovered microwave circuits, which were a power mm-wave (approximately 95GHz) the SSPA allows for graceful degradation of thousands of MMICs. To accomplish first described to me as the fastest circuits in technology. Application of millimeter of system output power in the event of a the world and the most difficult to design and RF power performance improvements this, Raytheon has developed a patented afforded by new semiconductor waves causes rapid skin heating, quickly MMIC failure. Based on a system lifetime understand. I became intrigued. I very much modular, free-space combining approach enjoy being in this field as it a number technologies have been evolutionary, inducing activity-disrupting pain. The criteria of 1dB of power degradation, it (figure 2). This modular design approach of disciplines and allows me to work from the pain stops when the beam is turned off, is calculated that the kilowatt level GaN offering incrementally more power as provides economy-of-scale, enabling physics level, at an atomic scale, all the way to or the person leaves its path. Traditional W-band SSPA will have a system lifetime of RF semiconductors have evolved from significant production cost reductions, as systems level.” active denial weapons, such as “System over 30 years. Silicon to Gallium Arsenide (GaAs) and well as scalability to configure a variety 7kW Beginning in 2000, Dr. Kolias led the company’s Transmitter 1” (Figure 3, left), utilize vacuum electron Indium Phosphide (InP). Gallium Nitride of different-sized systems from the same Gallium Nitride (GaN) Monolithic Microwave device (VED) transmitters. These systems Integrated Circuit (MMIC) development (GaN) technology, however, is truly basic building block. As shown in figure What’s next revolutionary, resulting in dramatic (more require dedicated vehicles to house the efforts. He was co-recipient of the Raytheon 2, eight 1 watt (W) MMICs are free-space Raytheon is a leader in W-band solid-state Excellence in Technology Award in 2004 for than five times) improvement in amplifier relatively large VED and ancillary support combined to produce a tile-able 7W sub- power combining, producing state-of-the- his work designing and developing Raytheon’s power. Like Silicon and GaAs, GaN is a equipment. Solid State Active Denial module. Next, a four-by-four array of these art W-band GaN MMIC power amplifiers first GaN MMICs. “Being able to work semiconductor, but with a tighter crystal Technology (SSADT) enables smaller with this technology from initial laboratory sub-modules is constructed to produce a and pioneering the efficient power structure and a higher breakdown electric adjunct stand-alone tactical systems that demonstration to application in today’s 100W module. Multiple 100W modules combining of solid state MMICs to produce field, allowing for operation at higher can be mounted on top of a variety of systems has been a very exciting and rewarding can then be arrayed to produce kilowatt two orders-of-magnitude more solid- experience,” he remarked. voltages and producing more RF power. different type vehicles (Figure 3, right). In levels of output power. In the figure, an state power than previously shown. The When not designing microelectronic circuitry, Raytheon has pioneered the development addition to the active denial application, eight-by-eight array of modules was used kilowatt level power amplifiers produced Dr. Kolias enjoys playing basketball and of W-band (95 GHz) GaN MMIC power the mm-wave SSPAs are also finding to produce 7 kilowatts of RF output power in this manner have application in tube running, and is coach to youth basketball amplifiers, demonstrating the world’s application for vacuum tube replacement and soccer teams. “I find coaching to be at W-band. To put this remarkable result in replacement for both radar systems and first watt-level W-band MMICs.1 Figure 1 in radar and electronic warfare refreshing,” he relates, “and a good reminder perspective, the previous high-water mark Figure 2. Example of a modular 7 kilowatt (kW) Solid active denial systems. Raytheon’s future shows a comparison of published output applications. of the importance of working together, having for W-band power was less than 40W. State Power Amplifier comprised of 8,192 1 watt (W) work in this area will focus on extending confidence in your abilities, persevering, and power of MMIC amplifiers of the various Gallium Nitride (GaN) Output Monolithic Microwave Historically, a concern of tube-based the output power of these systems to tens most importantly, having fun and celebrating semiconductor technologies at 95 GHz. Integrated Circuits (MMICs), 1024 7W Sub-Modules millimeter power amplifiers has been successes.” and 64 100W Modules. of kilowatts by increasing the power of shorter-than-desired operational lifetime the individual GaN MMICs, as well as on Dr. Kolias received his B.S., M.S. and Ph.D. degrees in electrical engineering from Cornell 1  of both the tube and the required high demonstrating the feasibility of GaN SSPAs A. Brown, K. Brown, J. Chen, K.C. Hwang, N. Kolias, R. Scott, “W-band GaN Power Amplifier MMICs,” IEEE International Microwave Symposium Digest, May 2011. University, Ithaca, NY, where his Ph.D. research 2 A. Agah, J.A. Jayamon, P.M. Asbeck, L.E. Larson, and J.F. Buckwalter, “Multi-drive stacked-FET power amplifiers at 90 GHz in 45 nm SOI CMOS,” IEEE Journal of Solid-State Circuits, May 2014. voltage power supply. By contrast, the at even higher frequencies, such as 140 3  focused on microwave and millimeter-wave C.R. Chappidi and K. Sengupta, “A W-band SiGe power amplifier with Psat of 23 dBm and PAE of 16.8% at 95GHz,” IEEE International Microwave Symposium Digest, June 2017. GaN MMICs have very good reliability. GHz. 4 K.J. Herrick, S.M. Lardizabal, P.F. Marsh, C.S Whelan, "95 GHz metamorphic HEMT power amplifiers on GaAs", IEEE International Microwave Symposium Digest, June 2003. quasi-optical amplifier arrays. He is very 5 P. Huang, E. Lin, R. Lai, M. Biedenbender, T. W. Huang, H. Wang, C. Geiger, T. Brock, P. H. Liu, “A 94-GHz monolithic high-output power amplifier,” IEEE International Microwave Symposium Digest, June 1997. Raytheon’s W-band GaN technology has involved with the IEEE Microwave Theory and — Nick Kolias, 6 Z. Griffith, M. Urteaga, P. Rowell, and R. Pierson, “340–440mW broadband high-efficiency E-band PAs in InP HBT,” IEEE Compound Semiconductor Integrated Circuit Symp. Dig., October 2015. been shown, through testing, to have an Techniques Society and served as President of 7 J. Schellenberg, B. Kim, T. Phan, “W-Band Broadband 2W GaN MMIC,” IEEE International Microwave Symposium Digest, June 2013. — Andrew Brown the society in 2012.

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Advanced Electro-optical and Infrared: Sensing across the Spectrum In applications from smart phones to industrial machine vision, the past decade has seen an exponentially increasing demand for larger format cameras with greater functionality. This is also true of the electro-optic, infrared (EOIR) cameras used in military and aerospace systems, where in addition to format size, there is need for increased sensitivity, higher dynamic range, faster frame rates, and improved image processing across the entire optical spectrum. Raytheon is meeting these demands with sensors that detect throughout the to infrared ADVANCED ELECTRO-OPTICAL AND INFRARED: wavebands, for applications on platforms ranging from the individual warfighter to ground vehicles to airborne and space assets. SENSING ACROSS THE SPECTRUM

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Visible NIR SWIR MWIR LWIR VLWIR

WAVELENGTH Si PiN Microbolometer NIR Near Infrared The focal plane arrays (FPAs) that Raytheon been the primary, high performance SWIR Short Wave Infrared develops and produces consist of a detector infrared (IR) detector for many years for VSWIR Very Short Wave Infrared InGaAs array integrated to a readout integrated both single and dual band FPAs. Over MWIR Mid-Wave Infrared VSWIR HgCdTe LWIR Long Wave Infrared circuit (ROIC). The detector array converts the past several years, Raytheon has VLWIR Very Long Wave Infrared incoming optical energy of a particular developed an alternative solution in SWIR HgCdTe waveband into electrical signals. The ROIC indium arsenide/gallium antimonide MATERIALS MWIR HgCdTe Si Silicon captures and formats the signals for each (InAs/GaSb) strained-layer-superlattice (SLS) InGaAs Indium Gallium Arsenide InSb pixel and transmits the data to electronics bandgap engineered barrier device (nBn) HgCdTe Mercury Cadmium Telluride for image and/or information processing. structures. These III-V devices have high Temperature Operating InSb Indium Antimonide LWIR HgCdTe As Arsenide producibility and can similarly be architected Most FPAs output digital data with format with different wavelength cutoffs. With Si: As Impurity Band Conduction sizes up to 64 megapixels. Dynamic ranges performance approaching that of HgCdTe can exceed 20 bits, while sensitivities detectors, they are candidates for next meet tactical and strategic requirements. generation sensors, especially those used 0.5 1 2.5 5 10 20 30 Frame rates range from 30 Hz to greater WavelengthWavelength ( µ m) in tactical MWIR applications. The last in than 1 kHz. With the advent of efficient the list of primary detector materials is Figure 2: Material sets commonly used to sense in different parts of the optical spectrum. 3D integration, smart sensors are feasible, silicon microbolometers with vanadium from basic on-chip image processing to oxide (VOx). In contrast to the materials implementing neuromorphic algorithms. previously discussed that are designed as Advanced EOIR Sensors photovoltaic devices, VOx microbolometers devices whose resistance changes when are microelectromechanical system (MEMS) thermal energy is absorbed. Raytheon customers need EOIR systems for The common detector materials and the a wide breadth of applications in ground, wavebands they address are depicted in maritime, airborne and space systems X-Ray High Sensitivity, Portable X-Ray Sensors Figure 2. which can detect ultraviolet (UV), visible, short wave infrared (SWIR), mid-wave Ultra infrared (MWIR), long wave infrared (LWIR), Advanced ROICs Provide Greater Visible and very long wave infrared (VLWIR) bands Large Format, High Dynamic Range Functionality of the electromagnetic spectrum. Some SWIR Linear and Geiger Mode LADAR Readout integrated circuits (ROICs) provide applications require combinations of bands Short Wave Infrared the first level of signal conditioning, to be imaged in the same aperture, such as Large Format, High Operating Temperature, processing and capabilities such as gain visible through SWIR, MWIR and LWIR and High Dynamic Range MWIR and offset non-uniformity correction, multiple LWIR . Mid-Wave Infrared Low-Cost MWIR/LWIR Tactical Cameras bi-directionality for scanners, and Detector Material windowing for regions of interest. 1980 1990 2000 2005 2010 2015 CMOS 500 nm 250 nm 180 nm 90 nm LWIR High Yield Sensor Chip Assemblies (SCAs) Each ROIC has an array of unit cells Raytheon works with and uses a variety Long Wave Infrared that interconnect one-to-one with the of materials to optimize detection in a detector array. The unit cells capture and Figure 3: Readout Integrated Circuits (ROICs), shown above in relative scale, have been Low-Cost, High Definition, Uncooled Cameras continually increasing in format size. particular waveband to provide sensor preprocess the signals from the detectors. capabilities across the optical spectrum VLWIR High Yield, Large Format SCAs Peripheral circuitry in the ROIC controls (Figure 1). Silicon P-intrinsic-N (PiN) Very Long Wave Infrared timing and output of the data. detectors are used for the visible band. Indium Gallium Arsenide (InGaAs) detectors Advanced ROICs feature even greater are used for the SWIR band up to 1.7 MMW capability and functionality for the FPA. Millimeter Wave Cameras micrometers (μm). Mercury Cadmium Millimeter Wave Fabricated in deep submicron CMOS Telluride (HgCdTe) is a versatile material processes, these devices have enabled large for all the infrared wavebands as its format arrays, from 128 x 128 to 8000 x cutoff wavelength is tunable based on its Figure 1: EOIR sensors for different parts of the optical spectrum are being developed 8000 (8K x 8K) pixel elements with pixel stoichiometric composition. It has and produced for a wide breadth of applications. pitches from 40 μm down to 8 μm. The chronological advancement of ROICs in relative format size is shown in Figure 3.

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Figure 4: Digital visible scanners are replacing Visible Time CCDs. IR scanners are available as well.

For imaging applications in both the visible color and dual band FPAs, with some

First Delay and IR domains, ROICs are designed designs capable of well capacities greater as either scanners or starers. Scanners than one billion electrons. These high produce an image line by line and starers well capacities allow high scene contrast produce an image simultaneously among imaging without pixels saturating. Middle Figure 6: Compact Dewar the two dimensional array. Figure 4 shows Time and cooler example. a visible scanning array that provides time- Delay Small Form Factor Cameras delayed integration at a fast scan rate and Image Last ultra-low power with digital outputs. It can (TDI) FPAs operate at a variety of temperatures. Rows replace traditional charge coupled device HgCdTe or III-V nBn/SLS detectors are (CCD) imagers. In Figure 5 is an example cryogenically cooled for high performance. of a staring array, which acquires an image InGaAs-based SWIR detectors are generally in one frame. Frame rate capabilities of thermoelectrically cooled (TEC) to various staring arrays range from 30 hertz approximately 280 degrees Kelvin (K) and (Hz) to 20 kilohertz (kHz). microbolometer arrays operate at ambient Integrated Image room temperature. All FPAs are packaged Most ROICs designed at Raytheon have on- Figure 7: Compact in some form of evacuated environment electronics example. chip analog-to-digital converters (ADCs). to enable cryogenic cooling, provide Massively parallel architectures with ADCs Lab imagery of a spinning temperature stabilization, or prevent drum using Raytheon’s at the columns are used for high sensitivity scanner technology. condensation on the detectors in various applications and provide 14 to 16 bits operating conditions. These environments of dynamic range. For those sensors are designed to be as compact as possible DETECTOR needing dynamic ranges greater than 18 (Figure 6) and the form factor of the bits, Raytheon has developed a family of Visible associated electronics is also small (Figure digital-in-pixel architectures, where signal 7). The electronics provide clocks and digitization occurs within the pixel. Digital biases to the FPA, calculate gain and ROICs have been designed for both single offset coefficients, and perform digital MWIR formatting, all while accommodating the increasing data rate from the FPAs, which ROIC can exceed 50 gigabits per second for large arrays. Figure 8: Cross section of wafer bonded Figure 5: Staring arrays are ROIC and detector. As discussed in this edition’s article, produced for visible and IR application in small to large “Raytheon’s Three Dimensional formats. Heterogeneous Integration (3DHI) Electronics Technology,” 3D Integration is becoming more pervasive to address the needs for compact sensors. A method of vertically bonding electronic components, this wafer-to-wafer integration is used to hybridize Si PiN detector arrays to the ROIC. Figure 8 is a cross section of

Figure 9: Multiple stacked wafer example.

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MWIR

LWIR a detector and ROIC directly bonded SWIR together. An example of multiple wafers bonded together is shown in Figure 9. This technology promises to enable compact BAND 1 (MWIR) intelligent sensors through the integration of FPAs with electronics. Imagery across the Spectrum In figure 13 is an example of LWIR In addition to the visible scanner, visible capability using a 3 megapixel starers have been produced in formats microbolometer-based FPA that can ranging from 512 x 540 to 8K x 8K. operate athermally at room temperature. Cameras with a large 1920 x 1200 format In the SWIR domain up to 1.7 μm cutoff have also been produced. wavelength, low noise tactical cameras in Figure 10: The VISTA sensor is a precision aligned FPA composed of a small pitch, 1920 x 1200 format have 1k x 1k subarrays. Credit: ESO/J. Emerson/VISTA and Digitized Sky Survey 2. Conclusion been developed using Raytheon’s InGaAs Acknowledgment: Davide De Martin. detectors. HgCdTe is used for cutoffs at Raytheon is developing next generation longer wavelengths in the SWIR band. EOIR sensors that span the entire optical Figure 10 shows one of the largest SWIR DAY spectrum. Increasingly higher yield FPAs for a ground made with BAND 2 (LWIR) processes and decreasing form factors HgCdTe detectors. continue to reduce product size, weight, Figure 12: A 720p dual band camera images the Mid-wave IR (MWIR) and Long Wave IR (LWIR) power, and cost (SWAP-C). And with the FPAs for Active SWIR applications are made bands with the same Focal Plane Array (FPA). with avalanche photo (APD) arrays. advent of higher functional ROICs and 3D APDs operate near the breakdown region wafer integration, a new era of intelligent of a diode to provide gain at the front sensors is emerging, where actionable MWIR Figure 13: Long end of the signal chain. A LADAR receiver Wave IR (LWIR) information is provided rather than just fabricated with HgCdTe detectors was used example of a raw signal data alone. On the ground, in for autonomous docking in a Space Shuttle microbolometer the air and in the far reaches of space, FPA. These sensors Raytheon’s sensors continue to provide the mission. Current development is focused operate uncooled. on dual mode (Linear and Geiger mode) capabilities required for customer mission APDs using III-V materials. NIGHT critical applications. Standard Definition Figure 11 shows MWIR capability for 640 X 480 — Leonard Chen tactical applications. The focus has been on high performance HgCdTe and III-V nBn/SLS detectors that operate at higher temperatures (e.g., 120 K). Dual band capability is shown for the MWIR and LWIR bands in Figure 12. Because each pixel has back-to-back diode detectors that can LWIR sense in both wavebands, the MWIR and LWIR imagery is perfectly co-registered. Figure 11: High operating temperature (HOT) Mid-wave IR (MWIR) sensors have been made with Mercury Cadmium Telluride (HgCdTe) and III-V bandgap 3 Megapixel engineered barrier device (nBn)/strained-layer-superlattice (SLS) detectors. Microbolometer-based Focal Plane Array 3 Megapixel Sensor

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The three-dimensional (3D) and flexible Raytheon’s integration of multiple heterogeneous device technologies can help address Three- these limitations in future systems. Dimensional The 3D heterogeneous integration (3DHI) of high power and efficiency Heterogeneous Gallium Nitride (GaN) power amplifiers (PAs) with functionally dense Si Integration (3DHI) CMOS (complementary metal-oxide- semiconductor) logic will create a new Electronics class of compact, digitally enhanced RF integrated circuits (ICs) that will Technology revolutionize radar and multifunction systems. Creating cost-effective 3DHI ICs Defense applications continue is both highly desirable and necessary to demand higher performance for the realization of advanced systems and efficiency from electronics capabilities. while minimizing size, weight, Raytheon’s approach to 3DHI takes and power (SWaP) across advantage of companywide design an increasing range of radio and fabrication capabilities in advanced frequency (RF) and optical microelectronics as well as existing and frequencies. In meeting emerging 3D commercial technologies, such as wafer bonding, interposers and these needs, traditional or 3D fabrication techniques. This cost- homogeneous Silicon (Si) and effective strategy of using both internal III-V material based solutions and external technology sources builds as well as other microelectronic on Raytheon’s expertise in the design of solutions face inherent RF circuits and Microelectromechanical technology performance limits Systems (MEMS) devices; fabrication of Focal Plane Arrays (FPAs) in 3D along with the SWaP limitations wafer bonded stacks; and assembly of of traditional two-dimensional electronic components and advanced (2D) and 2.5D1 fabrication packaging. Joint engineering design methods. efforts are focused on creating 3D wafer- scale packages that can house specially designed 3D GaN Monolithic Microwave Integrated Circuits (MMICs) integrated directly into the package, stacks of 2D MMICs or more traditional 2D ICs from external sources. With Raytheon’s 3D ELECTRONICS TECHNOLOGY wafer bonding capabilities, these wafers, which are already heterogeneous, can 3DHI then be used to create wafer-level microelectronic systems. By combining this wafer bonding technology with reconstituted wafers to create 3D wafer- level packages, Raytheon is developing an overall 3DHI process that is functionally dense, flexible, and high performance, with potential to significantly improve the effectiveness of future defense electronic systems. 1  2.5D refers to a three-dimensional (3D) surface comprised of multiple flat (or planar) surfaces at varying elevations, having no angled surfaces or undercuts.

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Figure 1: Scanning Electron cross section of RAYTHEON’S ADVANCED INVARIANT DIE (RAID) TECHNOLOGY DETECTOR a focal plane array (FPA) made with 3D wafer bonding with the multilevel Readout Integrated Circuit (ROIC) Figure 3: An example schematic of a on the bottom and the Detector on top. This proven multi-tier RAID package (left bottom) wafer bonding technology is foundational in Raytheon’s and a Scanning Electron Microscope 3D Wafer Stacks approach to 3D heterogeneous integration (3DHI).5 (SEM) image of a Gallium Nitride (GaN) Monolithic Microwave Integrated Circuit Raytheon’s 3DHI technology takes (MMIC) mounted inside a RAID package advantage of the successful fabrication of (right top). FPAs in 3D wafer bonded stacks, which ROIC has been refined into a Direct Bond Hybridization (DBH) process. DBH is used for the production of FPAs, in which very large format detector arrays are characteristics similar to the native GaN bonded directly onto Si readout ICs at the transistors. The GaN-Si CMOS HIMMIC wafer-level. An example of this process, WAFER-SCALE 3D INTEGRATION technology allows for the integration of used in a variety of formats currently in three different RF and digital functions Si CMOS or Silicon Germanium (SiGe) previously implemented separately in three production, is shown in Figure 1. bipolar plus CMOS (BiCMOS) different semiconductor technologies. The DBH wafer bonding technology is Now these functions are integrated as being extended with new design rules, part of an RF transceiver on a single chip which enable the development of highly with reduced X-Y foot print and greater integrated 3D systems.2,3,4 The changes RF performance (higher power, higher include an increase in interconnect GaN on Si – Si CMOS dynamic range, lower noise figure) to flexibility, increased thickness of metal bonded wafer pair enhance the performance and capabilities layers and the ability to use both high Oxide-oxide (200 mm) of next generation multifunction systems resistivity Si wafers or low-loss fused bonding of completed for radar, communications and electronic silica as substrate materials. These CMOS wafer to warfare applications. enhancements allow for increased flexibility completed GaN in the processing and the implementation on Si wafer Another area of 3DHI development is of very low-loss RF transmission lines in all Raytheon Advanced Invariant Die, or three axes. RAID (Figure 3), which is a multitier chip scale package capable of incorporating Design and Heterogeneous compound semiconductor RF devices. multiple types Integration Approach One example of this is the integration of and orientations.7,8 The RAID package GaN High Electron Mobility Transistors is manufactured using standard GaN on 200 mm diameter Si To address the challenges and (HEMTs) with silicon-based circuits, such semiconductor fabrication techniques. opportunities of 3DHI for RF and mixed as logic and control circuits, to create The RAID technology uses Silicon Carbide signal applications, Raytheon designers are “intelligent” or digitally enhanced RF 6 (SiC) as the base substrate material for creating 3D HIMMICs (Heterogeneously Figure 2: A Silicon (Si) CMOS (Complementary ICs. Figure 2 is an example of a 200 mm its tiers, ensuring a high degree of heat Integrated Monolithic Microwave metal–oxide–semiconductor) wafer oxide bonded diameter GaN-on-Si wafer bonded to, and spreading throughout the stack and Integrated Circuits) and 3D wafer-scale to a Gallium Nitride (GaN) on Si wafer. This interconnected with, a 200 mm diameter HIMMIC technology builds on many years of providing a lower coefficient of thermal packages that can house specially designed Si CMOS wafer to create wafer-scale RF circuit design expertise and brings together two expansion among the vertical tiers. Known- 3D GaN MMICs integrated directly into modules or, when diced, individual chips key technologies — GaN and Si CMOS — at the good9 MMICs can then be used for wafer- the package, stacks of GaN 2D MMICs, or wafer scale. or HIMMICs. Raytheon has achieved both scale manufacturing, with this technique traditional 2D ICs from external sources. A very high vertical interconnect yield and allowing high density packaging benefits key element of the underlying technology good RF electrical performance with this for the overall system. is the integration of high performance integration approach. The microwave and millimeter wave GaN transistors integrated into the HIMMIC have RF

2 S. Kilcoyne, B. Kean, J. Cantrell, J. Fierro, L. Meier, S. DeWalt, C. Hewett, J. Wyles, J. Drab, G. Grama, G. Paloczi, J. Vampola, K. Brown, “Advancements in Large Formal SiPiN Hybrid Focal Plane Technology.” Proc. SPIE 9219 Infrared Remote Sensing and Instrumentation XXII, Sept 2014. 7 H. Kazemi, M. J. Rosker, T. E. Kazior, S. A. O’Connor, E. Elswick, “A Reconstituted Wafer Structure.” US Patent Publication 2019/0165108, Pending, 2017. 3 J. Drab, “Multilevel Wafer Stacking for 3D Circuit Integration.” Raytheon Technology Today, No. 1, 2015. 8 H. Kazemi, S. A. O’Connor, M. J. Rosker, J. J. Maurer, T.E. Kazior, J.B. Langille, W. J. Davis, J. Kotce, J. C. Moran, “Millimeter-wave Wafer Scale Packaging using an Advanced 4 J. Drab, J.G. Milne, “Die Encapsulation in Oxide Bonded Wafer Stack.” US Patent No. 10,242,967. Invariant Die Architecture.” GOMACTech, March 2019. 5 J. Drab, “Multilevel Wafer Stacking for 3D Circuit Integration.” Raytheon Technology Today, No. 1, 2015. 9 Known-good refers to individual chips that have been screened and meet certain electrical performance criteria. These MMICs are chosen to be used in the 3D and/or 6 T.E. Kazior, J. LaRoche, “Wafer Scale Integration of GaN with Si CMOS for RF Applications.” Plenary Presentation, International Workshop on Nitride Semiconductors (IWN2016), Oct 2016. heterogeneous integration process, greatly reducing the possibility of discovering a problem or poor yield in testing of the final 3D assembly.

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Incorporating MMICs in a small cavity has Flexible and High Performing Using the CiW/RW approach with RAID potential consequences, including Integrated Systems brings together all aspects of the 3DHI undesirable resonances across the band of IC Chip 1 IC Chip 2 technology to maximize design flexibility RF operation. In order to suppress these The final element of Raytheon 3DHI is the and performance. The integration of the resonances, cutouts are selectively placed integration of all the constituent pieces and tiers and encapsulation of known-good throughout the tier stack and topped-off technologies to provide ultimate design MMICs builds toward a larger wafer-scale with an electronic bandgap (EBG) material flexibility and maximum performance. This and 3DHI integration with associated lid, which presents a similar impedance to requires combining the wafer bonding, interconnects, thermal management, and the MMIC as experienced in much larger Figure 4: Raytheon's Chip-In-Wafer (CIW) Technology. A Schematic cross HIMMIC and RAID technologies. The wafer the required electrical-thermal-mechanical section of heterogeneous chips integrated into a silicon (Si) CiW (top) and conventional package assemblies. This bonding and HIMMIC processes are readily co-design (Figure 5). an Image of an initial prototype 200 mm diameter CiW (right). This CiW allows the 3DHI stack to be approximately technology is a variation of a reconstituted wafer (RW) and allows for the compatible and can be directly integrated 100 times thinner than comparable incorporation of different integrated circuit (IC) device types into Si wafers, to make 3D wafer stacks of heterogeneous Conclusion microwave assemblies, enabling the stack where it can then be used in wafer-scale processes such as 3D wafer bonding. devices, which are then used in wafer-scale Building an effective defense against to be incorporated into the wafer-scale electronics or diced into 3D modules. today’s emerging threats demands future processing and bonding processes. RAID is In order to extend the use of wafer- DoD electronics to have both greater based on established RF and MEMS design scale stacking to individual chips and capability and higher performance in a techniques and is made in Raytheon’s Complete III-V Stack (known-good die RAID packages, Raytheon is developing reduced form factor, particularly as systems foundry using proven semiconductor of various advanced technologies) techniques to embed chips of different migrate to higher frequency bands and fabrication processes. Gallium Nitride (GaN) Indium-Phosphide (InP) technologies into 200 mm diameter more compact sizes. Raytheon is helping Gallium Arsenide (GaAs), etc. The RAID stack can incorporate multiple wafers. This structure is referred to as customers meet this need by developing MMICs, in either the X- or Y-direction Chip-in-Wafer (CiW) and is essentially a a range of 3D packaging technologies to or stacked on top of each other in the variation of the more commonly referred provide multiple options for integrating Z-direction. The interconnects traverse to reconstituted wafer (RW). Shown in semiconductors of differing materials and between the MMICs within the tiers Figure 4, CiW consists of a base wafer, a type for RF, mixed signal, optical, and and provide signal, control and power spacer, cavity or waffle wafer, and a lid digital applications. These technologies, lines that can be terminated on the top wafer, where each wafer contains vertical including advanced 3D wafer bonding, or bottom of the package. The RAID (3D) and horizontal (2D) interconnects. GaN-Si CMOS HIMMICs, RAID, and CiW, package can also provide interconnect The lid and base wafers can be either form the foundation of Raytheon’s 3DHI tabs on each side of the tiers, much like passive (interconnects only) or active approach and build on core competencies beamleads for integration to the wafer- (containing Si circuits) and can be thought in circuit design, assembly and packaging. scale assembly. The above design and of as “interposers,” or signal redistribution Raytheon’s 3DHI strategy is flexible and fabrication capabilities enable multiple layers, a substrate technology commonly promotes high performance in order to degrees of freedom in the overall system used to create 2.5D multichip assemblies. provide the advanced capabilities required integration approach, enhancing the by future electronic systems for the most functional density by incorporating the III-V RAID package, encapsulated into a much larger silicon demanding of customer missions. wafer,“Reconstituted Wafer” (RW) best available technologies in a single — Thomas E. Kazior wafer-scale package. The RAID package — Jeffrey LaRoche was demonstrated at 94 GHz using a — Hooman Kazemi GaN power amplifier MMIC packaged Wafer-scale processing using Silicon Germanium (SiGe), — John Drab in a six-tier vertical stack highlighting CMOS and RW to create the final product Figure 5: Conceptual — Jason G. Milne the high frequency quality factors of this illustration of Raytheon — Joseph J. Maurer approach.10 Advanced Invariant Die (RAID), allowing known- — Avram Bar-Cohen good-MMICs to be integrated at wafer-scale for 3DHI integration of next generation systems.

10 H. Kazemi, S. A. O’Connor, M. J. Rosker, J. J. Maurer, T.E. Kazior, J.B. Langille, W. J. Davis, J. Kotce, J. C. Moran, “Millimeter-wave Wafer Scale Packaging using an Advanced Invariant Die Architecture.” GOMACTech, March 2019.

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Photonic Integrated Circuits Research and Development at Raytheon Photonic integrated circuit Since its inception in the 1960s, PIC technology has made significant progress (PIC) technologies promise — particularly at near-infrared (IR) and miniaturization and large-scale telecom band spectra with major focus implementation of optical and on applications in data communication electro-optical devices to meet and interconnects. Semiconductor optical the performance requirements materials such as silicon (Si) and III-V and complexity of next compounds (e.g. indium phosphide and gallium arsenide) with their technology generation radio frequency (RF) PHOTONIC developed in microelectronics have and optical system architectures. been the main driving factor for This is witnessed by large and implementing photonic components for diverse investments in recent these applications. A key advancement years through commercial INTEGRATED in PIC technology is the emerging area of industry and government , a field that substantially leverages complementary metal–oxide– funding in a wide range of semiconductor (CMOS) microelectronics, application areas including communications technology, sensors, timing/metrology (e.g. CIRCUITS and advances in nanofabrication chip-scale optical clocks), signal techniques to enable ultra-low-loss Si processing, communications, RESEARCH AND DEVELOPMENT AT RAYTHEON PIC components. The heterogeneous and computing. In this article we integration of different PIC materials on a Si photonic platform and the ability to review current PIC development couple the between the efforts in Raytheon domains of structures in these different materials has interest and focus on potential added more degrees of freedom to take applications that provide advantage of each material component, increased capabilities to meet creating the specific functionality needed customer requirements. to meet overall device performance requirements. Figure 1 shows the major milestone achievements in silicon photonic technology.

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Si PIC TECHNOLOGY AREA 2000 2010 2019 DATACOM, SENSING, Figure 2: Benefits of PIC INTERCONNECT, IMAGING, technology span a diverse Waveguide Loss (dB/cm) > 10 Approximately 3 < 1 COMPUTING SPECTROSCOPY group of application areas.

Fiber-to-Chip Loss (dB) X 3.6 < 1-3

On-Chip Laser X Flip-Chip & Heterogeneous Advancements in narrow linewidth Integration (<100KHz) lasers On-Chip Germanium Detector X Average Performance High-Speed (e.g. 35 GHz) detectors with low dark current (e.g. 10 nA) POSITION, TELECOM, While discrete photonic component devices NAVIGATION, INTEGRATED LASERCOM, PIC Foundry X Few Foundries More mature foundries TIMING (PNT) PHOTONICS BEAM have enabled unique solutions to specific POINTING product implementations, Raytheon PIC Packaging X Early Emerging capabilities researchers recognize the potential benefits of PIC technologies to reduce the size, Heterogeneous Integration X Early Mature weight, power and cost to enable the of Different PIC materials integration of complex photonic-based RADIO QUANTUM RF systems. Integrated photonics has had Figure 1: Milestone achievements in silicon (Si) photonic FREQUENCY & INFORMATION significant success in the digital domain. integrated circuit (PIC) technology. MICROWAVE However, there still remain some issues PHOTONICS with PIC components that limit device performance for RF applications. These PIC Technology Application Areas limitations may be fundamental to the Raytheon is actively participating in with improved understanding by the Developing system on a chip (SoC) PIC multichip-module (MCM) interconnects properties of the silicon-based materials this rapidly growing PIC technology to system engineering community. These solutions using silicon photonic is another application area that can be or may be a result of variations in the realize complex, system-level solutions to goals will all contribute to and strengthen technologies may soon provide an enabler for next generation radar and nanofabrication processing capabilities at support customer needs and demanding the establishment of a Raytheon PIC implementations that can overcome some multifunction systems. Under the DARPA the foundry compared to the modelling requirements by executing a variety of technology ecosystem that will enable the of the main challenges in cryogenic-based Photonics in the Package for Extreme parameters used to design the devices internal and external PIC-based projects. insertion of PIC technologies into Raytheon imaging, computing and Positioning, Scalability (PIPES) Program, Raytheon is into integrated photonic circuits. The An example is the Raytheon Core Research product lines. Navigation and Timing (PNT) systems. investigating the application of photonic- optical waveguide used to make photonic funded project, focusing on maturing Si- Raytheon has been developing cryogenic enabled MCMs to address the data integrated circuits has nonlinear properties The American Institute for Manufacturing based PIC device technologies (including PIC transceivers to transfer massive data movement bottle neck and enhance the at relatively low optical powers, as well Integrated Photonics (AIM Photonics) is ) as well as new emerging from cooled focal plane arrays (FPAs) to performance of digital beam forming as optical loss, two main factors that can an industry-driven, public-private national III-Nitride (e.g., GaN) PIC technologies. room temperature processors. We are arrays. affect dynamic range and performance for consortium supporting the advancement These different material technologies are also involved in a team project funded RF applications. For example, the silicon- of integrated photonic technology A promising direction that has been being investigated to address both near- by AIM Photonics and the Air Force based modulators that modulate RF signals throughout U.S. industry, government actively pursued recently by NASA, term and long-term business solutions and Research Laboratory (AFRL) to integrate onto an optical carrier have relatively and academia. Started in 2015 with a the Department of Defense and the customer needs based on these cutting cryogenic PIC transceivers with FPAs. low conversion efficiency, and designing fabrication facility located at the State commercial sector is deploying PIC edge applications in both the RF and On the applications of PIC for cryogenic these modulators for wide bandwidth University of New York (SUNY) Polytechnic technology for free-space optical optical domains. computing, Raytheon is a performer on has been challenging. In recent years, the Institute campus in Albany, New York, communications. In this area, Raytheon is a program funded by the Intelligence heterogeneous integration of high electro- A diverse group of application areas the consortium has made great progress developing silicon PIC phased array systems Advanced Research Project Agency (IARPA) optic coefficient III-V materials (e.g. Indium investigated by Raytheon engineers and establishing both silicon wafer processing for free-space communication funded to design and demonstrate cryogenic PIC Phosphide) on silicon has been pursued to scientists have potential to benefit from and package assembly capabilities. through external and internal programs. microsystems and transceivers scalable improve the conversion efficiency of these PIC technologies (Figure 2). Examples of Si Raytheon is a member of AIM Photonics to petabit/s data transfer rates from a 4 Another application area of interest modulators, though still more effort is PIC technology development at Raytheon and has been involved in a number of Kelvin superconducting computing system is using photonics for the distribution needed to bring performance comparable include fundamental Si PIC building block consortium-funded projects. to room temperature over optical fibers, and processing of analog RF/microwave to that of lithium niobate modulators. In design such as and a compact replacing the traditional copper cable signals, providing higher bandwidth and addition to modulators, the linearity and microresonator coupled to a Si waveguide technology. For PNT applications, Raytheon lower losses versus current approaches. power handling of high-speed optical (Figure 3), and the example PIC chip has been collaborating with the National Raytheon has been developing RF-over- detectors implemented on silicon photonics layout and experimental testbed shown in Institute of Standards and Technology fiber applications since the 1990s and has is another factor that impacts the utility of Figure 4. Included with the development (NIST) in developing PIC-based chip-scale successfully integrated discrete photonic these devices for RF applications. of these technologies is the analysis and optical clocks operating at cryogenic devices in fielded systems that have met modeling of how these PIC components temperatures with improved performance performance requirements, demonstrating perform as part of an entire system level and stability. to the customer community the feasibility processing chain, thus gaining acceptance of implementing photonic technologies.

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Figure 3: An example of fundamental Si PIC building blocks including waveguides Figure 4: A typical PIC chip layout with many different devices (left) and a PIC (left) and a compact microresonator coupled to a Si waveguide (right). experimental testbed with edge coupling using optical fiber (right).

There continues to be progress in visible applications. In addition, Raytheon fabrication from both a technical and competencies for Raytheon products improving and optimizing the design technologists are collaborating on internal cost perspective. While proof-of-concept requires the maturing of several packaging kits for both passive and active photonic programs to expand the capabilities of the prototype devices can be fabricated at a and manufacturing technologies, circuit elements provided by the different company’s GaN foundry to develop these small-scale foundry such as a university including optical, electrical, thermal, foundries. Despite the challenges of PIC III-Nitride-based PIC devices. foundry, any PIC design to be included in a mechanical, and advanced manufacturing devices for RF applications, Raytheon manufactured product needs to be capable processes. Raytheon’s long history with scientists and engineers are developing PIC fabrication and packaging of being fabricated at an established the manufacturing and packaging of PIC implementations for the distribution foundry that can provide both the required monolithic microwave integrated circuit of clock signals and other RF-over-fiber In recent years, silicon-based material processing technologies needed (MMIC) products at our Advanced Product applications. Raytheon is working on a microelectronic foundries in the U.S. to meet the technical requirements and Center (APC) can be leveraged to develop DARPA program investigating the use of (e.g. AIM Photonics, TowerJazz, Global the manufacturing capability to produce these needed packaging technologies. PIC-based photonic systems for Electronic Foundries, , IBM) and worldwide have a reliable wafer run to enable high device Packaging techniques to couple light into Warfare (EW) applications and the incorporated silicon photonics fabrication yields. In addition to designing and and out of these PIC devices at the chip potential for miniaturizing these systems. into their process lines and successfully manufacturing the PIC itself, the realization level of integration with minimal optical demonstrated fundamental building block of PIC-based solutions in manufactured loss and mechanical integrity are also There are other emerging application components, both passive and active. products will only occur when these PIC needed. areas where current silicon-based PIC These foundries have also demonstrated chips can be successfully integrated and technologies may not provide the required large scale PIC systems with performance packaged in robust modules. Path forward capability. One such area is for applications metrics that can meet a wide range within the visible wavelength spectrum of digital datacom and interconnect Developing these PIC packaging With all the advances occurring in in which Si is absorptive. Although application requirements. Several Defense capabilities for defense applications is emerging PIC technologies, Raytheon the integration with materials that are Advanced Research Projects Agency not on the current AIM Photonics road researchers and engineers are actively transparent in the visible spectrum and (DARPA) Microsystems Technology Office map. The AIM Photonics Test, Assembly pursuing both internal research and are compatible with silicon-based CMOS (MTO) programs have used AIM Photonics‘ and Packaging (TAP) facility is located customer-funded development programs platforms such as silicon nitride or Al2O3 foundry for making photonic microsystems in Rochester, New York, and is primarily to investigate applications of PIC can provide a working implementation, including chip-scale Light Detection and focused on the packaging of PIC devices technology in next generation products, the passive of these materials Ranging (LiDAR) systems. for commercial applications. Raytheon as well as to develop lower cost, higher inhibits making fast active and tunable is starting to look closely at developing yield PIC packaging and manufacturing Although there are a large number components. An alternative approach — the in-house expertise to package processes. other wide bandgap materials such as of material platforms currently being PICs in modules that meet mil-spec III-Nitrides that are transparent down to utilized by the research community for environmental requirements. Developing — Richard Belansky UV — has been pursued by Raytheon and the fabrication of PIC devices, from a these PIC packaging capabilities and — Mo Soltani the research community. Raytheon recently technical and cost standpoint, silicon- had a program with IARPA to develop based PIC foundries are the most mature. GaN and AlGaN PIC platforms for UV- This requires designers who intend to implement novel concepts in a PIC platform to consider the feasibility of the

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Advancing Weapon Systems Cybersecurity through Automation For decades, defense systems have been developed and deployed with a requirement for longevity, but generally without a high priority on cybersecurity. Traditionally, To reduce and mitigate these cybersecurity was not an identified vulnerabilities, there is a growing emphasis on security risk management processes need because these systems were for defense systems. One example of typically limited in their external this is the Department of Defense (DoD) access and contained customized cybersecurity Risk Management Framework hardware and software. With the (RMF) for integration of cybersecurity digital transformation, today’s into its acquisition programs.2 However, ADVANCING as programs deploy RMF and other defense weapon systems benefit cybersecurity controls, there are sometimes from additional capabilities unintended consequences. A requirement provided by more embedded to log cyber-relevant data, for example, processors, increasing volumes WEAPON SYSTEMS can create volumes of information that of software and external (or overwhelm system maintainers, who then networked) connections. For might discard full system logs simply to example, Figure 1 illustrates a keep up with the most recently generated data. The situation is more acute for modern aircraft utilizing processors CYBERSECURITY those operating weapon and defense ranging from basic controllers systems. For those warfighters, cyber to complex avionics systems, THROUGH AUTOMATION threats requiring immediate detection multiple internal networks and a and response can potentially interrupt variety of external connections. an already complex set of tasks requiring constant attention. Even system designers, Along with these advancements while having a longer timeline to create comes the potential for increased more resistant architectures, face related vulnerabilities. A recent report from challenges. It is inevitable that the millions the Government Accountability of lines of code in a typical operating Office revealed the routine system contain vulnerabilities, yet there discovery of mission-critical cyber is no method to efficiently evaluate all the risks. All of these factors contribute vulnerabilities during operational to cybersecurity automation being a rich 1 testing. area of research and a capability with the potential to enable humans to respond directly, rapidly and effectively to indicators of malicious activity.

2 DoD Program Manager’s Guidebook for Integrating the 1 WEAPON SYSTEMS CYBERSECURITY: DoD Just Beginning to Cybersecurity Risk Management Framework (RMF) into the Grapple with Scale of Vulnerabilities, GAO-19-128 (2018). U.S. System Acquisition Lifecycle (2015), Office Of The Under Government Accountability Office, https://www.gao.gov/products/ Secretary Of Defense For Acquisition, Technology, And Logistics, GAO-19-128. Washington, D.C.

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Automating Secure Configuration of Complex Systems in Continuous Development Figure 1: Rapid growth in the number In agile development environments, the of embedded processors and external “velocity” of software development and connections raises challenges in protecting today’s military weapon delivery is a key measure of performance. platforms and systems. Ensuring cybersecurity in the process can be particularly challenging. For example, it’s not uncommon for security verification of a complex system to include

checking the values and associations Raytheon’s research in cybersecurity and buses. Also, communications in these Figure 2: Demonstrating cyber intrusion detection – of tens of thousands of configuration automation covers applications across the environments are typically time-critical, “attacking” the processors of an aircraft flight simulator. settings. Moreover, the requirements lifecycle of weapon systems—from design where a delay of a few microseconds in and standards which govern a secure to deployment. This article describes some packet delivery can cause undesirable configuration, such as the Defense key areas of research, providing examples effects. Another important consideration Once an anomaly is detected, state, the analytics algorithms are able to Information Systems Agency (DISA) Secure of automation technologies applied to is that weapon system computers are characterizing the threat and the develop behavioral patterns and identify Technical Implementation Guide (STIG), both protecting operational weapon designed to interact with the physical appropriate response to that threat system activity indicative of a cyber threat are continually evolving to meet the ever systems and hardening software baselines world. They often actuate control becomes more difficult. Early prototypes in near real-time. ML algorithms can be changing nature of today’s cyber threat. during design and maintenance. surfaces, direct sensors, fire weapons and took a “check engine light” approach. trained using data from both authentic- Raytheon cyber researchers have developed control propulsion. Any security related Similar to an aircraft’s radar warning but-rare system operating sequences and an approach, incorporating both process applications in this area must ensure receivers, the detector provided an alert realistic cyber-attack sequences. These Automated Event Detection in and toolset to automate cyber hardening Embedded Bus Systems system state/context are accounted for. with no direct action or evaluation of algorithms are then used to develop mission impact. An invaluable tool used models which are more effective in not in this dynamic environment. Raytheon’s research in cyber event Weapon platforms and systems as well in the ongoing research and prototyping only detecting and characterizing a The primary tool used in this approach is detection for MIL-STD-1553B serial as many complex commercial systems is Raytheon’s in-flight cyber effect particular cyber threat but also in reducing Stigler, a software utility that automates data bus systems is addressing some often utilize embedded architectures demonstrator (see Figure 2), built to the likelihood of a false positive. the application of thousands of hardening with processors connected through of the challenges that come with these test and evaluate the technology as well Another important aspect of Raytheon’s rules necessary to secure both operating local networks, backplanes and/or serial embedded systems. The MIL-STD-1553B as solicit feedback from the customer research in automated event detection systems and computing infrastructure. buses that communicate via protocols is a serial network found on most military community. The demonstrator provides a is automated (or assisted) operator Stigler retrieves the STIG from the not having built-in security measures. and commercial aircraft, as well as some simulated aircraft environment for injection response to a cyber threat once it has DISA website, extracts the rulesets and Protecting these embedded systems ships and ground vehicles. The focus of of cyber effects to evaluate various been identified. Pilots and other weapon generates script code which can then starts with security functions found in Raytheon’s research is to prototype and response scenarios and the effectiveness system operators are subject to high be applied to harden the target system traditional security products such as policy evaluate various methods for detection of the display interface. Feedback from cognitive loads, so it is critical that response (Figure 3). Hardening of a complex system enforcement, intrusion detection, and and alert of anomalous events that might warfighters seeing the demonstration has interaction be rapid and effective while involves applying tighter security through event log collection and analysis. While indicate a cyberattack. included the question of false positives. In providing little to no distraction to the configuration settings, generally used to these mechanisms are effective for external other words, how do you limit authentic An early discovery of this research was mission at hand. Raytheon user experience enforce principle of least privilege (PoLP) connections found on ships, aircraft and but rare communications, perhaps those that one aspect of an embedded bus (or experts are developing various methods and mitigate vulnerabilities. PoLP is an unmanned aerial vehicles (UAVs), and other occurring during a complex battle scenario, network) that helps in cyber hardening of alert notification, which will include approach which limits a general user’s Protocol-based communications, from being identified as potential threats? is the predictability of the environment. parameters such as severity of impact and access level and privileges on a system the currently available versions of these Many have also asked for additional For example, mapping out the processors degree of certainty along with alternative to only those necessary to complete his/ services often fall short in addressing context with an alert, such as the impact that exchange requests and responses courses of action. The goal of this effort her assigned work activities. In addition unique aspects of embedded processing or severity of the threat to the mission. can expose consistent patterns of is to provide operators with positive and to the STIG, Stigler can also ingest and systems. For example, available IP-based communication. This consistency, when Raytheon utilizes both automated actionable information, while allowing translate from other sources of policy such security applications are incompatible coupled with well-defined message analytics and machine learning (ML) them to maintain their overall mission as Security Content Automation Protocol with the unique protocols and formats 3 formats, means data within frames of techniques to explore improved methods focus. (SCAP) files. used on embedded system backplanes information exchanged between any two of threat characterization and response. processors will fall within a predictable By continuously analyzing inter-processor range, making anomalous messages that communications and associated system 3 https://csrc.nist.gov/projects/security-content-automation- much easier to detect. protocol.

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Figure 4. “Competitors” Statements of Policy on stage for the DARPA Security Content Automation Enterprise System Cyber Grand Challenge Protocol (SCAP), Management Final Event. Secure Technical Implementation Guide (STIG), etc. Windows Hardening (Scripts and Group Apply Secure Configurations Policy Objects)

STIGLER Target System Generates Secure Configuration Test for and Scan Policies Compliance Cybersecurity Engineer Test Policies IT System Administrator Readable by Scanners Scanning Software Suite Figure 3. Stigler automates both the assessment of a system’s security posture and the changes to remediate risks.

Photo credit: DARPA.

In order to confirm that a system remains and attacked without human interaction Initial implementations of this tool are promising results for a combination of separate Adaboost and Random Forest securely configured, many systems use (Figure 4). Having participated as a finalist in homogenous environments, covering pre-processing the packets to calculate an machine learning models. When run scanning tools like Nessus® or Assured in that event, Raytheon has continued chipsets and operating systems of IP address distance metric, and applying against test datasets, the team found that Compliance Assessment Solution4 (ACAS) to build on the experience, researching interest to select Raytheon customers a k-NN (k-Nearest Neighbor) machine a composite of the two models was the for regular and independent verification. automated self-healing techniques that – an important early step toward self- learning model.6 K-means and Gaussian most successful, reducing false alarms by Stigler can also translate the STIG rulesets can be applied both to development healing systems able to diagnose and fix Mixture Models were also evaluated, but greater than 90%, and correctly identifying into scan policies in the formats required by environments and operational systems. themselves without loss of service. neither showed the consistency of k-NN to greater than 90% of the true alerts. These these tools, which is important in ensuring this use case. results demonstrated that having this type A recent effort in this research includes that the scanner is using the same version of system in place would allow analysts to a new tool, “Chipper,” that matures and Raytheon Research with the Army Another area of research addresses of the STIG. spend more time looking for novel attacks extends some of the features proven in Research Lab (ARL) alert response, a common challenge in and following up leads.7,8 Stigler automates the painstaking tasks the Cyber Grand Challenge. Chipper Raytheon employees working with the ARL cybersecurity operations. As events occur, of policy translation, critical system automates analysis, assessment and are performing more basic research into prioritizing alerts can be difficult since Summary configuration programming and verification, patching of a code base. It starts by automated cyber defense, including two the potential impact of a cyber threat repeating these tasks across any number of factoring programs into composable diverse applications of machine learning. greatly depends on the context in which Raytheon recognizes the challenges of systems. pieces, and then it orchestrates a it happens. Rather than defining a priori defending cyberspace as the domain combination of static and dynamic analysis One example of this work involves the the attributes of an authentic and high expands within the defense industry, and Automated Self-Healing tools to evaluate the pre-processed code. Semi-Supervised Learning for Exploits priority event, the ARL team investigated the value automation can bring in making Systems Research This results in more efficient discovery of and Exploit Kits (SSLEEK). SSLEEK is methods for having the environment operators, analysts and developers more software vulnerabilities, especially when an extensible set of network intrusion determine which events need attention. efficient in eliminating cyber vulnerabilities. The software used in future weapon and examining a large code base that utilizes detection tools, combining the pre- Starting with a large data set consisting of Our research spans the entire lifecycle of defense systems should be self-diagnosing multiple processors. When a potential processing of IP packets with various Intrusion Detection System (IDS) alerts from weapon and defense systems in areas and self-healing and, during normal vulnerability is identified, the tool tests the machine learning algorithms. These efforts an operational Department of Defense ranging from advanced algorithms to operation, have the ability to automatically exploitability of the flaw. Exploitability can have focused mainly on the detection (DoD) system, the team cross-referenced the operational systems using those find, assess and repair its own vulnerabilities be thought of as a measure of risk, which of botnets, which are cooperative the initial alerts with documented incident algorithms, to the automated development and/or unauthorized modifications. This is then used in an automated software instances of malicious software distributed reports and used these reports as the and maintenance of tools currently being was part of the Defense Advanced Research triage where easily exploited flaws undergo around a network of interest. Recently baseline for a training set. This data was piloted by Raytheon engineers. Projects Agency’s (DARPA) vision for the immediate mitigation while those that published findings of this research, using further processed to extract 23 attributes historic Cyber Grand Challenge competition cannot be triggered are deferred. For high the benchmark CTU-13 data set, show of each alert and then used to train — Jon Goding in 2016,5 where competitors’ systems risk vulnerabilities, Chipper will postulate — Heather Romero simultaneously defended, analyzed, patched and test fixes, and then patch the operational code base. 6 Leslie, N. O. (2018). Using Semi-Supervised Learning for Flow-Based Network Intrusion Detection. In Proceedings of the 23rd International Command and Control Research and Technology Symposium (ICCRTS): Multi-Domain C2. Pensacola, FL: ICCRTS. 7 Shearer, G., Leslie, N. O., Nelson, F. (2018). Integrating Human Knowledge in a Semi-Autonomous Prioritization System: An Approach for Improving Network Intrusion Detection Efficiency. In Proceedings of the 23rd International Command and Control Research and Technology Symposium (ICCRTS): Multi-Domain C2, 6-9 November 2018. Pensacola, FL: ICCRTS. 4 http://www.disa.mil/cybersecurity/network-defense/acas. 8 Shearer, G., Leslie, N. O., Ritchey, P., Braun, T., Nelson, F. (2017). IDS Alert Prioritization through Supervised Learning. In Proceedings of the NATO Specialists’ Meeting on Predictive Analytics and Analysis in 5 https://www.darpa.mil/program/cyber-grand-challenge. the Cyber Domain, 10-11 October 2017, Sibiu, Romania: NATO.

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Wide Bandgap Semiconductor Power Electronics Conversion and Control High density, high efficiency power conversion, conditioning, and control is critical to achieving the SWaP (Size, Weight and Power) metrics necessary in current and future military systems. Power needs can differ depending on the application. They range from hundreds of watts for application-specific WIDE BANDGAP integrated circuits (ASICs) to hundreds of kilowatts and even megawatts for next generation radars and directed SEMICONDUCTOR energy weapons, such as high energy and high-power microwave systems. Over the past decade, power electronics have experienced a power revolutionary advancement in performance. The rapid maturation and adoption of power switching devices based on wide bandgap (WBG) semiconductors has resulted ELECTRONICS in significant improvements in areas such as efficiency, CONVERSION AND CONTROL determined by the ratio of power out to power in; power density, or the amount of power per unit volume; and transient response. WBG semiconductors enable the synthesis of power devices with improved Figures of Merit (FoMs), capable of operating at higher voltage levels, switching frequencies, and temperatures as compared to their conventional silicon counterparts.1

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f e at u r e 95 wide bandgap semiconductors Semiconductor Material SiC Silicon Gallium Arsenide Silicon Carbide Gallium Nitride 90 Si PARAMETER UNITS (Si) (GaAs) (4H-SiC) (GaN) Figure 3. Comparison Bandgap eV 1.1 1.4 3.3 3.4 85 of measured efficiency of isolated S iC - based Electron Mobility cm2/V-s 1400 8000 1000 1200 80 and S i- based DC/DC Critical Electric Field MV/cm 0.3 0.4 2.5 3.3 converters operating Sriram Chandrasekaran, Ph.D. Relative 11.8 12.9 9.7 9 Efficiency (%) 75 from 600V input to 30V output. Space and Airborne Systems Saturation Velocity x105 m/s 1.0 1.2 2.0 2.5 Sriram Chandrasekaran is a senior engineering 70 Thermal Conductivity W/m-K 150 50 370 130 fellow in the Hardware Engineering Center of Raytheon Space and Airborne Systems and is 65 FIGURE OF MERIT known across Raytheon for his expertise in 0 300 600 900 1200 1500 1800 2100 2400 Baliga (BFOM) 1 15 340 870 power conversion, power systems and related Output Power (Watts) Huang’s Material (HMFOM) 1 3 7 10 technologies. In addition to his role as subject 70Vin matter expert (SME) in power conversion systems Huang’s Chip Area (HCAFOM) 1 5 48 85 100Vin and architectures, Chandrasekaran is responsible 95 Huang’s High Temperature (HTFOM) 1 0.23 0.36 0.1 140 Vin for supplier interface and technology and product road mapping. He is currently the lead for the Figure 1: Comparison of Semiconductor Materials and Figures of Merit (FoMs). 90 Figure 4: Measured Opportunities in Power, Core Research Program. efficiency of a GaN- “It is exciting to have the opportunity to look Figure 1 provides a comparison of FoM DEFINITION APPLICATION 85 based, hard switched DC/DC converter at into the future, anticipate challenges and semiconductor materials and FoMs as BFOM BFOM On-state Conduction Loss provide a road map, a vision to address them,” 80 varying input voltages 2 Chandrasekaran relates. “I feel very fortunate described by Jensen . The associated FoM HMFOM HMFOM Switching Power Loss (Vin). that my role of providing technical leadership and definitions and their application from Efficiency (%) HCAFOM HCAFOM 75 3 Chip Area (Manufacturing) vision helps Raytheon deliver and deploy advanced Wang are shown in Figure 2. capability that supports the warfighter.” HTFOM HTF Thermal 70 As Figure 1 indicates, Silicon Carbide (SiC) With a broad technical background in power and Gallium Nitride (GaN) are the most converter technologies, analog and digital control, Figure 2: Definitions and Application of Figures of Merit (FoMs) listed in Table 1. 65 and the application of next generation switching mature WBG semiconductor devices to 0 300 600 900 1200 1500 1800 2100 2400 devices, Chandrasekaran is a key technical date, emerging as front-runners to replace lower power, lower voltage (typically < regulators in an AESA system, which Output Power (Watts) contributor to both customer programs and Silicon Insulated Gate Bipolar Transistors 600V) applications, enabling switching are distributed across the power system internal research and development. His efforts (IGBTs) and Metal Oxide Semiconductor frequencies that approach the MHz range. to provide galvanic isolation between impossible, to achieve with a Si-based Raytheon actively participates in university in recent years include championing the use of Field Effect Transistors (). SiC tightly integrated power buses and high solution. In addition to the above and industry consortia such as Power Silicon Carbide (SiC) and Gallium Nitride (GaN) Through both internal research and devices in high voltage, high power conversion MOSFETs are proving to be excellent density, kW-level DC/DC converters. applications, SiC MOSFET modules with America at North Carolina State University, development and industry collaboration, systems, and leading the Wide Bandgap Working candidates for replacing Si IGBTs in This configuration significantly reduces integrated gate drives are used in motor and Center for Power Electronics Systems Raytheon has taken full advantage of Group, a companywide Power SME community industrial motor drives and electric vehicle weight by eliminating high current cable drives for both control and actuation (CPES) at Virginia Tech, to form working to promote awareness of wide bandgap power the significant advancements in WBG powertrains, and in replacing Si MOSFETs harnesses. Another example can be seen systems. relationships within the WBG power switching devices and their applications. He semiconductors in their use in power in AC/DC and DC/DC power supplies for in the improved efficiency of the SiC-based electronics technical community. These also serves as principal investigator and point of conversion systems across many product Raytheon’s power team encourages and contact for Raytheon’s membership at the Center telecom and datacom applications. The DC/DC converter illustrated in Figure 3. relationships provide the opportunity lines. High-power active electronically works with suppliers to accelerate the for Power Electronics Systems (CPES), a University/ higher critical electric field of SiC and Here, the efficiency of an isolated DC/DC to learn about and leverage the latest scanned arrays (AESA) and radar systems insertion of SiC and GaN devices wherever Industry Consortium at Virginia Tech focused on GaN enables power switching devices converter operating from 600V DC input developments in WBG devices and research and development in power electronics benefit from a power conversion design the advantages of WBG technology can with lower on-state resistance, lower gate to provide regulated 30V to a radar system applications, influencing advanced and systems. utilizing SiC MOSFETs, while lower be realized. In addition, as members of charge, and lower chip area, resulting in is shown for both the SiC- and Si-based research, and helping to attract high “My job provides many opportunities to solve voltage systems, including DC/DC a companywide WBG working group, lower power dissipation, higher operating implementations. As seen in the figure, the quality talent to the field. difficult technical problems and work with converters driving ASICs, FPGAs and other Raytheon power subject matter experts engineers of varied backgrounds and expertise,” frequencies and power density. The measured efficiency with a SiC MOSFET digital systems, are achieving increased (SMEs) meet regularly to identify, capture, WBG semiconductor power electronics Chandrasekaran explains, “bridging the gaps to higher thermal conductivity results in is between 2% and 7% greater than a performance through the implementation and disseminate the latest technology delivers the performance and system make the end system work.” lower temperature rise, enabling higher comparable Si-based DC/DC converter. of GaN FET-based power converters. information from industry and academia. benefits predicted for many years and is a Chandrasekaran has a strong portfolio of operating temperatures; hence lighter Figure 4 shows the efficiency of a GaN- SMEs produce manuals that capture key technology in the future of Raytheon’s published papers and symposium and conference and smaller cooling systems. SiC devices With the introduction of SiC MOSFETs and presentations. He currently holds 24 U.S. patents, based, hard-switching DC/DC converter critical design, manufacturing, process, power products. With WBG applications maximize the system level enhancements GaN FETs to its power converters, Raytheon ranging from composite magnetic core for operating at multiple input voltages, and qualification guidelines. More focused ranging from device development to at voltages greater than 600V over their has experienced appreciable improvements -mode power converters, to isolated power providing regulated 28V output. An efforts are undertaken to develop high- converter topology and interface circuit converters, to magnetic devices and power Si counterparts. GaN FET power switching in SWaP metrics. One example of this efficiency of more than 95% in a hard- fidelity simulation models of WBG devices optimization, Raytheon continues its focus converters employing the same. devices are replacing Si MOSFETs in is point of load GaN-based isolated switching configuration at the specified that include device parasitic elements and on providing technologies that contribute Chandrasekaran holds a bachelor’s degree in switching frequencies is difficult, if not temperature effects. Collaboration with to the standards and quality that bring electrical and electronics engineering from the PSG 1 Wide Bandgap Semiconductors: Pursuing the Promise, Department of Energy, Office of Energy Efficiency and Renewable Energy, leading circuit simulation tool vendors reliable military and aerospace applications College of Technology, a master’s degree in power https://www.energy.gov/sites/prod/files/2013/12/f5/wide_bandgap_semiconductors_factsheet.pdf. electronics engineering from the Indian Institute 2 Jensen G., Chabak K., Green A., Moser N., McCandless J., Leedy K., Crespo A., Tetlak S. (2017). “Gallium oxide technologies and applications,” helps to create models appropriate for to customers’ missions. of Science, and a Ph.D. in power electronics from Proceedings of the 2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), pp 1-4. the stringent application environments Virginia Tech. — Sriram Chandrasekaran 3 Wang H., Wang F., Zhang J. (2008). “Power Semiconductor Device Figure of Merit for High-Power-Density Converter Design Applications,” IEEE Transaction on Electron Devices, vol.55, of deployed systems. No.1, January 2008, pp.466-470. — Jon Rawstron

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Transitioning Nanotechnology: Engineers and scientists at Raytheon Small are leveraging nanomaterials and Dimensions, to advance our next generation systems and manufacturing Big Impact capabilities. For example, two- dimensional (2D) materials are enabling Richard Feynman’s 1959 lecture epitaxial growth and transfer of “There’s Plenty of Room at the semiconductors for new integration opportunities. Controlling composition Bottom” suggests how manipulation and grain growth of nanopowder- of materials on the scale of tens based ceramics has resulted in highly to hundreds of atoms can be used transparent and mechanically robust to achieve unique properties.1 In materials for Mid-Wave Infrared (MWIR) the range of approximately one applications. Nanostructured coating nanometer (nm) to several hundred technologies that inhibit moisture and TRANSITIONING NANOTECHNOLOGY dirt retention, as well as fouling and nm, the number of surface atoms bacterial growth, are being implemented is a significant proportion of the for improved sustainability of fielded total number of atoms in a given systems. Thermal Interface Materials volume. Since surface atoms have (TIMs) benefit from nanoscale and 2D higher reactivity than atoms that SMALL dopants that enhance thermal transport. are fully bound, behaviors can be Additionally, emerging capabilities in quantum dots (QDs) and achieved that are very different have potential impact in many Raytheon from those found in bulk materials. DIMENSIONS, applications. This article discusses several The unique physical, electrical of these nanotechnologies and their and chemical properties enabled role in advancing Raytheon product by nanotechnology have become capabilities. more common and producible. BIG IMPACT And with advances in the ability to model, manipulate and characterize materials at the nanoscale, implementation of nanotechnology across defense and commercial sectors continues to expand.

1 Feynman, Richard P. (1960) “There’s Plenty of Room at the Bottom.” Engineering and Science, 23 (5). pp. 22-36.

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Figure 1: -based single-photon detector in a twin-slot .

Figure 3. A scanning electron microscope (SEM) image of two-phase nanocomposite material at 30,000 times magnification.

Figure 2. Covalent field is unaffected by the weak Van der Waals forces (Bottom). Epitaxial growth of gallium nitride (GaN) material with graphene transfer layer (Top). 2D Materials 2D materials enable novel electronics and graphene possesses some remarkable 2D materials, such as graphene and growth, which is not impacted by the These materials are mutually insoluble. sensor technologies not previously possible. properties based on its electron behaviors. hexagonal boron nitride, offer strong weak Van der Waals forces presented by Therefore, they could be densified at A recent joint study led by Raytheon BBN The electrons can move as massless in-plane bonding that can lead to high the intermediate graphene film. This work high temperature and pressure without and Harvard University indicates that 2D particles and follow relativistic dynamics thermal and electrical transport, as well has been demonstrated for a number of exhibiting the grain growth usually electrons flow like a fluid rather than like rather than Newtonian dynamics. This as mechanical strength. However, these substrate and epitaxial materials, as well promoted by these conditions. Restricting a gas.2 This discovery describes a new departure from conventional conductors materials have relatively weak bonds as for varying monolayers of graphene the grain growth results in higher strength electrical transport regime in which the gives rise to new fundamental physics in between planes, facilitating the ability to and hexagonal boron nitride.6 Potential materials and reduces optical scattering. interactions among the electrons are much graphene, such as high electronic mobility, form films with a thickness of a single or applications for Raytheon include flexible Grain size must be limited to approximately stronger than those between the electrons wide bandwidth electromagnetic wave small controlled number of monolayers. electronics, heterogeneous integration one twentieth of the wavelength ( /20) and the impurities inside the materials. absorption, and fast thermal response. of passive or active electronics, and to minimize scattering caused by refractive The Group at MIT, led by The Raytheon team, in collaboration with These properties translate to innovations in integration of active devices onto high index differences in the two constituent Dr. Jeehwan Kim, Associate Professor of MIT and Harvard University, is now using ultrafast infrared sensing and single-photon thermal conductivity substrates. materials. For MWIR wavelengths of 3 to 5 Mechanical Engineering, has published this electron fluid concept to develop detection. Raytheon BBN is a prominent microns, this means grain size must be work leveraging a 2D Material Layer electronics with lower power consumption player in the research and development of no larger than approximately 150nm. Transfer (2DLT) process for remote epitaxial Structuring at the Nanoscale as well as a new ultrawide bandwidth these new nanotechnologies with recent Figure 3 shows the microstructure of growth of single-crystal membranes amplifier enabled by steering the electron publications in the Physical Review Applied In 2007, Raytheon began a DARPA-funded Raytheon’s Y O -MgO nanocomposite that can readily be removed from their 2 3 fluid. The amplifier design is analogous to and Nature Nanotechnology scientific program to develop nanocomposite optical material. In Figure 4 is the resulting substrates for use as freestanding films 7 modulating the direction of a jet stream, journals.3,4 The graphene-based single- ceramic windows (NCOC) for MWIR transmission of the two-phase material, or for integrating onto other materials.5 achieving wide-bandwidth amplification to photon detector (Figure 1), for example, sensors. The objectives included increasing as well as a comparison to Spinel, ALON Raytheon is partnering with Professor more than 100 gigahertz (GHz). shows a sensitivity approximately 10,000 transmittance beyond approximately and Sapphire in the MWIR band. Kim’s group to evaluate gallium nitride times higher than current state-of-the-art 5 microns, and reducing emittance at Graphene is the first material in the entire (GaN) films grown on silicon carbide (SiC) detectors, and promises to enable novel elevated temperatures — two properties 2D material family to be exfoliated down substrates utilizing graphene for the 2DLT solutions and products in sensing, imaging, that were lacking in commonly used to mono-atomic layer thickness, opening process (Figure 2). This technology has and communication applications for MWIR materials like Sapphire, Spinel and up a new area of nanotechnology. In demonstrated that the strong atomic Raytheon in years to come. ALON (aluminum oxynitride). A material addition to its outstanding mechanical interactions between the substrate and system based on yttrium oxide (Y2O3) and properties and thermal conductivity, epitaxial material dominate the epitaxial magnesium oxide (MgO) was chosen.

2  Observation of the Dirac fluid and the breakdown of the Wiedemann-Franz law in graphene, Science 351, 1058 (2016). 5  Remote epitaxy through graphene for two-dimensional material based layer transfer, Nature 544, 340 (2017). 3  Graphene-Based Josephson-Junction Single-Photon Detector, Physical Review Applied 8, 024022 (2017). 6  Polarity governs atomic interaction through two-dimensional materials, Nature Materials 17, 999 (2018). 4  Fast thermal relaxation in cavity-coupled graphene bolometers with a Johnson noise read-out, Nature Nanotechnology 13, 797 (2018). 7  Properties of an Infrared-Transparent MgO:Y2O3 Nanocomposite, Journal of the American Ceramic Society 96, 3828 (2013).

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Shortwave calibration is provided by 1.0 Optical Sensing an array of light emitting (LEDs) Nanotechnologies enable Raytheon to 0.9 that provide a relatively flat illumination deliver lower cost, high performance pattern across the field of view when 0.8 optical instruments for earth science, placed at the entrance pupil. The LEDs defense applications and commercial 0.7 can contain engineered phosphors and/ NCOC sensing. Carbon-based materials, such as or CQDs that down-convert the ultraviolet 0.6 carbon nanotubes (CNTs), vertically aligned (UV) light emitted by the diodes to longer CNT (VACNT) forests and graphene can wavelengths. While phosphors are widely 0.5 absorb over 99.5% of incident . used in commercial LEDs to down-convert MWIR These carbon-based materials are often

Transmittance 0.4 from the emitted blue wavelength to used as light absorption coatings on yellow or green and red, phosphorescent 0.3 baffles and interior surfaces of the materials provide wideband emission optical assembly. The National Institute 0.2 and may continue to fluoresce after the VISIBLE LIGHT SPECTRUM of Standards and Technology (NIST) and excitation source is removed. Alternatively, 0.1 the National Aeronautics and Space CQDs provide narrow and ultra- Administration (NASA) are exploiting the narrowband down-conversion as well as 0 0 2 4 6 8 10 broadband absorption properties of VACNT quicker photon re-emission, making them Wavelength (microns) forests as an absorption coating on the more suitable for fast imaging detectors. next generation of space-based bolometers for radiometry.8 VACNTs are also replacing Summary 1.0 black paints and polyurethane coatings in state-of-the-art blackbody infrared The ability to manipulate matter at the 0.9 atomic and molecular scale has opened calibrators. Figure 5. A compact Leveraging available nanotechnologies, new doors to research and development 0.8 ultraviolet (UV) through Raytheon has developed a low-cost Optical calibration supports improved across a broad range of the physical, long-wave infrared (LWIR) compact onboard calibrator for ultraviolet imagery and scene analytics by providing Hyperspectral Calibrator electronic and chemical sciences. With 0.7 (UV) to LWIR hyperspectral imaging. flat field correction to remove artifacts shown on a smallsat applications throughout the commercial optical instrument. The calibrator illustrated in Figure 5 is 0.6 from the image and a reference datum and military industries, nanomaterials and approximately the size of a ping-pong for measuring the spectral radiance of the nanotechnologies are enabling capabilities 0.5 paddle, with patented calibration methods scene. Multispectral and hyperspectral never before possible. In collaboration NCOC utilizing VACNTs, graphene, colloidal Spinel calibration systems consist of an integrating

Transmittance with academic and industry partners, 0.4 quantum dots (CQDs), and engineered Sapphire MWIR sphere for visible calibration, and one or Raytheon applies its expertise in advanced ALON phosphors.9 Compared to traditional 0.3 more blackbody targets held at precise materials and manufacturing across calibration systems, the compact calibrator temperatures for long-wave infrared (LWIR) product lifecycles, exploiting the benefits of 0.2 is approximately 80% smaller, is lighter and calibration. For large apertures, integrating nanoscale technology to advance product has a lower orbit average power. These spheres quickly become impractical, capabilities and create value for the 0.1 characteristics enable installation on small because of the high volume, mass and customer. satellites, calibration within a single orbit, 0- power required. Co-locating multiband 2 2.5 3 3.5 4 4.5 5 5.5 6 sources for visible-through-LWIR calibration and the ability to scale to large apertures. — K.C. Fong — C. Haynie Wavelength (microns) results in large size, mass, power and cost Nanotechnologies in the longwave — M. Herndon impacts to the optical instrument. calibrator include a patented VACNT — C. Koontz high emissivity top layer and internal Figure 4. Transmission curves for two-millimeter thick nanocomposite graphene layers for heat spreading.10 optical ceramic (NCOC) material (top), and comparison through the mid-wave infrared (MWIR) spectrum to Spinel, aluminum oxynitride Graphene is lightweight and very thermally (ALON) and Sapphire (bottom). conductive, improving both thermal agility and temperature uniformity across the calibrator. 8 “NIST-on-a-Chip: Quantum and Radiometry - Chip- scale Radiometers and Detectors.” https://www.nist.gov/pml/ productsservices/nist-chip-portal/nist-chip-quantum-optics-and- 9  U.S. Patents # 9459154, 9086327, 10054485, 10139287. radiometry/nist-chip-quantum. 10  U.S. Patent # 9459154.

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Good Ideas Can Come from Anyone: Raytheon Innovation Challenge RIC Process The RIC process has been developed to As part of our technology strategy, maximize collaboration, innovation, trust, and to foster a culture of innovation respect, and accountability—Raytheon’s and enterprise collaboration, core values. Challenge topics are solicited Raytheon sponsors an annual each year from technology and business Raytheon Innovation Challenge leaders from across the company as well (RIC) to leverage new technologies as identified from Department of Defense (DoD) and Intelligence Community (IC) to create value-added solutions to guiding strategy documents and priorities. key customer needs. The premise of With topics defined, the RIC process is the RIC is that good ideas can come launched. from anyone; however, authors HOW DOES IT WORK: need to understand customer needs • Targeted capability statements and have a path for submission, • Raytheon-wide call for ideas refinement, and mentoring of ideas • White paper submissions towards initial product development • Review and initial downselect for and insertion. workshop participation • Workshop for expansion, refinement, The RIC starts by creating an and plan definition internal call for ideas whereby any • Peer-based downselect to most employee can submit a short white promising ideas paper and single chart describing GOOD IDEAS CAN COME FROM ANYONE: • Focused projects to address key the essence of an idea for a solution risk areas • Follow-on support from business to an announced topic challenge. unit or customer This targeted innovation process exposes employees to customer RAYTHEON This process is used to connect innovators from across Raytheon. Each year, about needs they may not have been half of the authors invited to the workshop aware of, and often connects have not attended a prior RIC workshop. the kernel of a solution from one About 30% have been with Raytheon for domain or product area to INNOVATION less than five years, and about 20% have customer needs. been with the company for more than 20 CHALLENGE years, resulting in a very diverse population.

48 | TECHNOLOGY TODAy 2019 TECHNOLOGY TODAy 2019 | 49 s p e c i a l i n t e r e s t raytheon innovation challenge NATE PROJECT SIO LEA The principles of innovation underpinning War Head by Additive Manufacturing AS DE P RS the RIC process and workshop methods (WHAM): Used novel AM design and are outlined in Figure 1. manufacturing methods to increase the effectiveness of the blast pattern CUSTOMER Along with the innovation principles, there of munitions. NEEDS are essential elements to an innovative culture, as listed in Figure 2, which must also be fostered and reinforced for successful outcomes. INNOVATIVE SOLUTIONS All of the RIC process and innovation MARKET TECHNICAL innovation Principles VIABILITY workshop activities work to pull out the FEASIBILITY key attributes of a successful RIC project as shown in Figure 3: customer needs, 1 Innovation occurs at the market viability, and technical feasibility for of needs and ideas an innovative solution led by a passionate 2 Trust is crucial to collaboration project leader. The project leader, and and sharing of ideas Figure 3: Key elements of RIC success. their team, are the most critical elements of a successful RIC project within a robust 3 Radical/disruptive ideas more innovation culture. likely come from diversity of

thought created by intersections of Generalized Representation Algorithm for in fostering collaboration and innovative Overall Impact and Employee RIC Outcomes people with differences Presentation of Heuristics (GRAPH): Applied thinking. 84% agreed or strongly agreed Feedback graph analytics to digital system models to that the most promising ideas for A successful RIC project is one that 4 Truly radical/disruptive ideas will enable system engineers to visualize and One of the measures of a successful Raytheon were selected at the workshop addresses the critical technical risk often initially be viewed as not more efficiently search the system design innovation program is the culture it helps for further development. Finally, and elements associated with the key technical feasible, impractical, or of no value trade space. create, the excitement it generates in perhaps the best test of the overall nugget of the project. With pull from a 5 Different people have different employees, along with the new products process, 85% responded that they will strong business champion, this results Deliverable Additive Manufacturing System and methods that are produced. The RIC consider submitting another idea to a in follow-on funding, typically from a styles of creating ideas for Harsh Environments (DAMSHE): Took an has other important outcomes as well, future RIC. business unit, for additional maturation for Additive Manufacturing (AM) process and 6 Domain knowledge is critical to including: product demonstration or insertion. extending the solution space improved it with post-processing to provide Summary a watertight, high strength /metal • Broadens exposure of customer needs Examples of successful RIC projects include: composite for an underwater vehicle. • Energizes workforce The Raytheon Innovation Challenge is one Remote Maintenance for Reduced Manning • Novel solutions with initial refinement mechanism the company uses to foster Figure 1: Innovation Principles. Autonomous Learning Employing Shape (RM2): Demonstrated the key technical • New Intellectual Property (IP) innovation to challenge the status quo and Estimation (ALESE): Applied an emerging aspects for using for a • Contributes to new discriminators act with speed to drive global growth. The machine learning method based on field support engineer to perform tasks • Enhances enterprise collaboration RIC process has been refined over many data shape estimation to improve target with direct participation of a remote • Strengthens culture of innovation years to accommodate different innovation classification. subject matter expert, thus expediting the ELEMENTS OF INNOVATIVE CULTURE styles and foster an intrapreneurial (i.e., repair, reducing travel and support costs, internal entrepreneurial) process whereby After each RIC workshop, an anonymous and increasing system up-time. any employee can propose an idea for 1 Knowledge of the challenge survey of the attendees is done to garner an opportunity to develop it towards a Kaleidoscope – Network Maneuver: domain and customer needs feedback on areas for improvement and new product, process or method to add Developed a dynamic, random, network to gauge the effectiveness of the process. 2 Teams where every voice counts quantifiable value to the company. application maneuvering method that The answer to each question ranges reduced the dwell time of advanced 3 Courage to think and act differently from strongly disagree to strongly agree. — John Zolper persistent threats in cyber-physical systems. Over the last 5 years, 96% of the survey 4 Perseverance – determination — Michael Vahey responses agreed or strongly agreed that Magnetic Aided Initial Navigation System to succeed the RIC workshop was of high value to (INS) with Automated Assisted 5 Passion to make a difference Raytheon overall, and 89% agreed or TARgeting (MAIN AVATAR): Developed a strongly agreed that the workshop was of method for using the profile of the earth’s 6 Curiosity high value to their career development. magnetic field for navigation in a GPS- 95% of the responses agreed or strongly denied environment. Figure 2: Elements of Innovative Culture. agreed that the workshop was successful

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Raytheon’s University Partnerships Technology is a key discriminator for Raytheon in bringing the most advanced capabilities to our customers. Raytheon’s research and development of new technologies often occurs in a highly collaborative environment where ideas can originate internally or externally from partners in industry, RAYTHEON’S academia and national laboratories. University partnerships, in particular, involve participation in, and support UNIVERSITY for, early stage or basic research activities which provides insight into scientific advances—a critical input into the development of PARTNERSHIPS technology roadmaps. Raytheon actively partners with leading technologists at more than 75 In 2017, Caltech opened CAST to stimulate interdisciplinary research and universities to bring the best minds to accelerate innovation in the way to bear on developing unique and machines help humans achieve scientific, strategic product solutions for engineering, and humanitarian goals. At the customer. In this article, we CAST, researchers from Caltech and the highlight one of these important Jet Propulsion Laboratory are collaborating partnerships with the California on the development of autonomous drones, robotics and satellite technology. Institute of Technology’s (Caltech) Raytheon currently sponsors three Center for Autonomous Systems and biologically inspired projects at CAST that Technologies (CAST) programs. align with the company’s core technology interests: Learn to Fly, Swarm Artificial Intelligence and Safe Autonomy.

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s p e c i a l i n t e r e s t raytheon UNIVERSITY PARTNERSHIPS

the ability of swarms to solve difficult problems. Example applications of this technology include consensus path planning, distributed decision optimization, and collaborative autonomy. Through a Tony Marinilli greater understanding of the potential Raytheon Corporate Engineering applications of swarm technology, Tony Marinilli is Raytheon’s chief hardware engineer, with more than 41 years of experience in his Raytheon will be better able to provide field. As a member of the Corporate Engineering new solutions to service the needs of the organization, he provides technical leadership future warfighter. and supports the hardware development of new and innovative products by driving performance, Assured Autonomy disciplined processes, and innovation throughout the implementation of disruptive, leading-edge Assured Autonomy, the third CAST project technologies. One of Marinilli’s primary areas of Figure 1: Action sequence of a single neural lander performing circles subject to unknown ground effects over a focus is the discovery and development of new supported by Raytheon, is about forming table. The sequence is taken at the first 0, 45, 180, and 235 degrees of the circle.1 technologies emerging from university research teams with assured safety objectives. laboratories. Similar to Learn-to-fly and Swarm AI, “As a technology company, Raytheon is always in handling unknowns in a safe manner is pursuit of advanced technologies that provide the Learn to Fly the key driver of Assured Autonomy. Just best solution to our customers,” Marinilli observes. as a group of predators coordinate to “I feel fortunate to be part of the team responsible CAST’s Learn to Fly project is focused not guarantee safe operation of the flight together can successfully solve challenges safely and successfully engage dangerous for creating new and future opportunities.” on the application of machine learning system during the learning process. Learn that individuals cannot. The Swarm AI prey, CAST is addressing ways that Previously, Marinilli was a principal engineering techniques to address challenging flight to Fly research focuses on safe learning. A project researches fundamental problems Figure 2: A heterogeneous set of robots is used to fellow for Raytheon Integrated Defense Systems teams of heterogeneous robots can work control problems and to ensure safe robust learning algorithm must ensure that in collaborative operations where individual explore, find, and recover a target in the CAST arena. where he provided systems and technology support together in an unknown environment to learning. The dynamics of flight can be the vehicle remains in a safe-state during agents (e.g. drones, robots, satellites, etc.) In the foreground is a Rover Robotics Flipper robot within the Engineering organization. Earlier in his achieve a mission with as little human capable of traversing rugged terrain. In the background career, he was a senior manager and engineering extremely complex and often difficult the learning process for the technique to within a swarm may only communicate input as possible, while still providing is a modified Segway® Personal Transporter (PT) fellow for the northeast region’s Radar Design and to accurately describe using traditional be truly effective. For example, a system with their near neighbors to achieve mission guarantees and robot safety carrying a quadcopter. The Segway PT is being used as a Electronics Laboratory. In this role, he provided models. For example, a given flight (such as the multirotor vehicle shown a common goal. Such configurations mobile platform for the longer range, directed exploring overall management for the technology and and survivability. Compared to a single vehicle’s design can make its dynamic in Figure 1) must be prevented from are scalable since they do not overload quadcopter. Credit: Ames, Ahmadi, and Singletary. engineering process department, including work robot housing a suite of capabilities (e.g., motion difficult to characterize with the contacting obstacles or the ground while the ability for any one individual to on design, development and the advancement Curiosity rover on Mars), heterogeneous of state-of-the-art radar technology for domestic, confidence required to adequately control still allowing the learning algorithm to communicate within their network. robots allow for specialization while foreign and commercial radar and SATCOM the vehicle while in flight. Often, an adapt unknown vehicle dynamics. Flight Another benefit of collaborative behavior is systems. In addition, Marinilli was responsible for simultaneously improving robustness level control is required, bringing us to the extensive amount of ground testing and vehicles may also demonstrate rapid that it can be extremely robust to the loss radar technology, strategic planning, and research, and decreasing the cost and complexity contributions of the work: the abstraction characterization are required to develop departures from stable flight. A safe of individuals if sufficient communication providing continuous improvement to processes, of individual robots. These teams of of control barrier functions 2 to ensure safe and robust flight control systems control strategy must therefore ensure persists among the group. Understanding tools, and products that operate across the radar specialized robots enable larger scope safety of not only each robot, but also and RF spectrum. for these vehicles. By demonstrating the simultaneous learning and stabilization. how to achieve collective consensus, missions. An example of this is shown in provide task assignments suited for each “One of the few constants in life is change,” ability of machine learning algorithms By fusing concepts from machine learning where a large group of communicating Figure 2, where a small rugged robot is robot and mathematical guarantees of Marinilli comments. “This is particularly true in to learn complex aerodynamic behaviors and control theory, CAST research agents has the ability to agree on a series used in conjunction with a taller robot and mission success. technology. Many technologies become ubiquitous that are not adequately captured with demonstrates the ability of machine of specific tasks or functions, is a prime flying robot to perform a search mission. in our daily personal and work environments in typical modeling approaches, one can fly learning techniques to guarantee safety focus area for existing research applications Since a core focus of Raytheon is to both an astonishingly short time. To see a product in in more challenging environments where during the learning process. In partnering throughout academia. Taking this research Operating multiple robots with loose create and demonstrate new products operation that was only dreamt of years ago is the motivation that drives and excites me in my role.” the application of traditional model-based with CAST, Raytheon is positioned to one step further, training swarms of agents mission requirements in an unknown and services for our customers, we are Marinilli has published 13 papers in the areas of design techniques might not be feasible. rapidly mature complex flight systems from to achieve an objective and learning environment is where humans-in-the-loop working with our Caltech partners to missile seekers, photonic technology, SATCOM and becomes necessary. Humans have the Ideally, in the future, the implementation development to deployment. from observed swarm behaviors will help validate the results of their technological solid-state transmitters. He is involved in activities of learning and adaptation of control us better understand the benefits and innate ability to parse measurements and advances through several challenging to promote initiatives among institutions of higher algorithms will be conducted in real time Swarm Artificial Intelligence (AI) limitations associated with large ensembles semantics, plan and assign tasks to achieve physical demonstrations. CAST’s Raytheon- education that help increase the number of students without the aid of large amounts of of communicating agents. a mission, while simultaneously considering sponsored research directly supports the preparing for and entering careers that employ The second CAST project, Swarm AI, engineering, science, technology, and mathematics. simulation data. the safety of the robot. To achieve continuing efforts to provide customers is motivated by collaborative behaviors CAST’s fundamental research in developing autonomy from humans, robots explore an with the most innovative solutions available “I would advise any new employee, regardless of The use of learning techniques to modify found in nature that achieve common artificial intelligence and machine learning discipline or age, to be a continual learner,” Marinilli unknown environment using perception in aerospace and defense. the control laws of vehicles while in flight goals of self-preservation and protection, techniques for the Swarm AI project is offers, “whether it’s attending lectures or seminars, and mapping. However, exploration comes participating in workshops, reading up on new topics, can be difficult because the algorithms may demonstrating that large groups working an important step toward enhancing — Rob Fuentes with risks such as obstacles that could attending classes, or earning an advanced degree. incapacitate a robot. For the robot to — James Fisher Education can never be taken away from you.” 1  — Richard B. Choroszucha Shi, Shi, O’Connell, Yu, Azizzadenesheli, Anandkumar, Chung, and Yue: https://youtu.be/FLLsG0S78ik. remain safe during exploration and mission Marinilli holds a bachelor’s degree and master’s 2 A. D. Ames, X. Xu, J. W. Grizzle, and P. Tabuada. Control barrier function based quadratic programs for safety critical — Anthony Marinilli systems. IEEE Transactions on Automatic Control, 62(8):3861{3876}, 2017. execution, high level planning and low degree in electrical engineering from Tufts University.

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United States HARRY B. MARR, DANIEL THOMPSON, BRADLEY M. BIGGS SEAN D. KELLER, GERALD P. UYENO CHARLES HOKE, DANIEL D. REIMANN, PATENTS MARK YEARY 10197611 Systems and methods for testing arm and 10209439 Multi-directional optical receiver and JEFFREY R. RICHARDS, ROBERT D. TRAVIS STEPHEN T. FASOLINO, JOSHUA NG, 10181862 Parameterizable bandpass delta-sigma fire devices method 10222189 Stage separation mechanism and method JASON L. WHEELER modulator ANDREW L. BULLARD DAVID M. FILGAS, STEPHEN H. MCGANTY SEAN MOORE ISSUED TO 10167155 Fixture to support reel-to-reel inspection JACOB BEAL, MATTHEW DAILY, JASON HOLMES, 10197792 Reaction compensated steerable platform 10211590 Dual-function optical bench and cooling 10222623 Composite graded-index fiber mode field of semiconductor devices or other components MICHAEL NICOLETTI, CHRISTOPHER PARK, manifold for high-power laser system adaptor for high-aspect-ratio core optical fibers RAYTHEON THOMAS PATRICK BIDIGARE, JOHN HO ANDREW L. BULLARD, LACY G. COOK, SCOTT RITTER 10198937 Systems, devices, and methods for GARY M. GRACEFFO, ANDREW KOWALEVICZ EDUARDO M. CHUMBES, KELLY P. IP, JOHN F. SILNY, SUSAN B. SPENCER 10182760 Smart garment and method for detection At Raytheon, we encourage remotely interrogated chemosensor electronics 10211880 Rate line suppression using chaotic THOMAS E. KAZIOR, JEFFREY R. LAROCHE 10168209 Modular imaging spectrometer assembly of body kinematics and physical state spreading codes 10224285 Nitride structure having gold-free contact people to work on technological and method RUSTON KEETON, BLAKE S. SHIMATA THOMAS DEPPERT, WILLIAM C. MOLLBERG, and methods for forming such structures 10198957 Computer-based virtual trainer MATTHEW D. CHAMBERS, MICKY HARRIS, challenges to make the world ERIC C. FEST, JON E. LEIGH DAVID R. SMITH, FRANK A. WOLF JOHN L. VAMPOLA ROBERT E. LEONI, THOMAS BENJAMIN REED, 10168542 Polarized pixelated filter array with 10184054 Coating for the mitigation of metal a safer place and develop ALAN J. BIELUNIS, CHRISTOPHER M. LAIGHTON, 10213126 Detector arrays with electronically JASON C. SORIC reduced sensitivity to misalignment for polarimetric whiskers ISTVAN RODRIGUEZ adjustable detector positions 10224895 innovative commercial products. imaging 10199470 Field effect transistor having staggered JEREMY C. DANFORTH, FREDERICK B. KOEHLER, field effect transistor cells MATTHEW D. CHAMBERS, MICKY HARRIS, BENJAMIN DOLGIN, GARY M. GRACEFFO, Part of that process is identifying GARY M. GRACEFFO, ANDREW KOWALEVICZ MATT H. SUMMERS, JOHN L. VAMPOLA ANDREW KOWALEVICZ and protecting our intellectual 10169613 Systems and methods for waveform JAMES KENDALL VILLARREAL PAUL MATTHEW ALCORN, BORYS PAWEL KOLASA, 10213127 Detector arrays with electronically 10225020 Systems and methods for demodulation of watermarking 10184762 Base drag reduction fairing using shape property. Once again, the EDWARD P. SMITH adjustable detector positions PSK modulated optical signals memory materials 10199520 Reduced junction area barrier-based DUSTIN HAMILL, KIRK A. MILLER, U.S. Patent Office has recognized PHUOC T. HO, STANLEY I. TSUNODA, BRANDON H. DAUGHERTY, JASON B. EMERY, MAURICIO A. SALINAS THOMAS H. BOOTES, GEORGE DARRYL BUDY, ALBERT YOON PAUL J. LEWIS, MICHAEL S. MITCHENER, our engineers and technologists 10174772 Device and method for controlling fluid WAYNE Y. LEE, RICHARD POLLY, JASON M. SHIRE, JIM R. HICKS, DOUGLAS MILLS, MARK A. OWENS, 10215836 Geolocation on a single platform having BRIAN D. SIROIS, BRADLEY D. STAAL flow over an optical instrument JESSE T. WADDELL for their contributions in their JERRY D. ROBICHAUX, GLAFKOS K. STRATIS, flexible portions 10225230 System and method for address-mapped 10184763 Munition with nose kit connecting to aft WAYNE L. SUNNE fields of interest. We congratulate JOHN DEVITT, PAOLO MASINI control of field programmable gate array (FPGA) via casing connector 10199722 Systems and techniques for IAN S. ROBINSON 10175113 Thermal protection mechanisms for ethernet our inventors who were awarded radome-antenna configuration 10215850 Orbital determination (OD) of uncooled microbolometers JOHN A. COGLIANDRO, CHRISTOPHER R. ECK, geosynchronous satellites STEPHEN M. PALIK, HECTOR A. QUEVEDO, patents from January 2019 LINDA A. GEE ETHAN HETTWER, ANTONY J. KURTH, JAMES E. TABER STEPHEN P. SHAFFER 10184974 Systems and methods for determining JOEL C. ROPER MITCHELL B. HAERI, MICHAEL USHINSKY through June 2019. 10176249 System for image intelligence exploitation 10225441 Time delay and integration (TDI) imaging whether a circuit is operating properly 10199742 Passive frequency multiplexer 10217875 Broadband graphene-based optical and creation sensor and method limiter for the protection of backside illuminated CMOS LACY G. COOK JOHN P. GIANVITTORIO, DENPOL KULTRAN, NICHOLAS WAYNE BARRETT, BLAINE K. BOULE detectors THOMAS DEPPERT, CARL SHANHOLTZ, 10185133 Reflective triplet foreoptics for HARRY B. MARR 10176251 Systems and methods for identifying DAVID R. SMITH multi-channel double-pass dispersive spectrometers 10200075 Discrete time analog signal processing for JOSHUA COCHIN, EDIN INSANIC, ALEX JORDAN similarities using unstructured text analysis 10227267 Bonding agents for nitrogen-containing simultaneous transmit and receive 10217920 Buried sensor system KASSIE BOWMAN, PHILIP P. HERB, oxidizers RYAN NOBES, KEVIN BURGESS WAGNER ANDREW C. MARCUM RYAN G. BECK, MICHAEL G. CARLSEN, ELICIA HARPER, CHRISTOPHER M. LAIGHTON, BRUCE FREEMAN, MICHAEL D. STOKES, 10176375 High speed pupil detection system and 10185350 Multi-processor system and method for DAVID A. HAIRFIELD, COLT JAMES, SHAWNA ONG SUSAN C. TRULLI RYAN D. WHITE method internal time synchronization and event scheduling of 10200222 Low cost and low frequency baseband 10218045 Serially connected transmission line 10228225 Passive impact sensor for high velocity multiple processors KHASHAN F. ALAM, JAMES A. HINSDALE, two-tone test set using direct digital synthesizers as sections each having a conductive shield member projectiles signal generators and a fully differential amplifier as the overlying a portion of a strip conductor ERIK W. MATTER HARI KROVI power combiner PATRICIA D. CHIN, JOHN D. ISKER 10177519 Connector demating tool and method 10185916 for high dimensional ALAN CUERDEN, JOHN MCGINTY, 10228527 Gimbal transmission cable management DAVID A. ROCKWELL, VLADIMIR V. SHKUNOV Schur transform MAKAN MOHAGEG, ROY ZAMUDIO STEPHEN R. REID 10203461 Techniques for forming waveguides for use 10218264 Method of eliminating power converter FRED PALMIERI 10177521 Optical fiber for light amplification having JAMES M. BOWDEN, TIMOTHY R. HOLZHEIMER in laser systems or other systems and associated devices input power variations and minimizing energy storage 10230164 Antenna positioning mechanism a core with low bend loss and end features with high 10186771 Optically-activated array utilizing photonic bend loss and related method requirements for a pulsed load system integrated circuits (PICS) SCOTT BALABAN, CHRISTOPHER A. COX KYLE DAVIDSON, WILLIAM KRUPP, 10203475 Curved magnetic actuators, and systems, PETER D. MORICO, JOHN D. WALKER DANIEL C. MCGOWAN MOSTOFA HOWLADER, ANTHONY REID FABIO DI TEODORO and methods for mounting tilt platforms 10219375 Hybrid circuit assembly 10230207 Connector removal tool 10177853 Binomial pulse-position modulation 10186828 Laser transmitter for generating a (BPPM) using sparse recovery for free-space optical coherent laser output signal with reduced self-phase DARRYN A. JOHNNIE, STEPHEN H. KIM, RICHARD D. LOEHR, JAMES KENDALL VILLARREAL SUSAN C. TRULLI fading/turbulent channels modulation and method ANDY D. NGO 10220809 Electrically operated propellants with 10232582 Anisotropic thermal conduit BENJAMIN DOLGIN, GARY M. GRACEFFO, 10203964 Mobile device external controller module elevated self-sustaining threshold pressures STEVEN MILLER ANDREW L. BULLARD, THEODORE J. CONRAD, ANDREW KOWALEVICZ 10190907 Convex warm shield for thermal imaging ANDREW KOWALEVICZ JEREMY C. DANFORTH, FREDERICK B. KOEHLER, BRIAN R. SCHAEFER, ROBERT D. SCHAEFER, 10177856 Systems and methods for demodulation of device 10205526 Methods and systems for reducing noise MARK T. LANGHENRY, WARD D. LYMAN, BRIAN RYAN YATES phase modulated optical signals in optoelectronic oscillators M. PAPE, PAUL E. PONTIUS, JARED D. STALLINGS, 10234075 Non-rotating flexure bearings with SAIKAT GUHA JOSEPH E. MCCORKLE, RICHARD A. ZAPOR MATT H. SUMMERS, THOMAS VILLARREAL, enhanced dynamic stability for cryocoolers and other 10193722 Holevo capacity achieving joint detection MAURICE J. HALMOS 10178334 System for and method of configurable JAMES KENDALL VILLARREAL devices receiver 10209351 Non-uniform sampling for unambiguous diagonal and multi-mission line scan array imaging 10220966 Satellite with integral thrusters doppler measurement ERIC C. FEST, VIJAY MURGAI THOMAS DEPPERT, DAVID R. SMITH ANDREW L. BULLARD, SHANE E. WILSON 10234606 Nano diffuser SEAN D. KELLER, GERALD P. UYENO 10196324 Ferrocenyl bonding agent oxidizers 10178451 Optical data switching circuitry 10221993 Vibration suspension system ROBERT M. EMERSON, SEAN P. KILCOYNE, JAYSON KAHLE BOPP MICHAEL V. LIGUORI 10221997 Enclosure pressurization device 10236226 In-situ calibration structures and methods of use in semiconductor processing

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DAVID D. CROUCH STEPHEN BAGG, JEREMY C. DANFORTH, PAUL J. LANZKRON, PATRICK J. POWERS GRAY FOWLER, RICHARD W. MCKNIGHT JEREMY C. DANFORTH, DAVID G. GARRETT, JOHN G. HESTON, IAN S. ROBINSON, 10236588 High-powered wideband tapered slot DAVID G. GARRETT, MATT H. SUMMERS 10263329 Dynamic azimuth scanning for rotating 10273369 Use of benzoxazine as a structural thermal MARK T. LANGHENRY, MATT H. SUMMERS JAMES TOPLICAR antenna systems and methods 10247530 Projectile with single-piece main body active electronic scanned array radar protective system (TPS) and heat shield material 10287218 Solid propellant additive manufacturing 10298256 Analog to digital conversion using method and system differential dither KEVIN M. NAKANO, JOHN P. NORBUTAS, JASON M. BURKE, JOSEPH CHANG, ALAN J. BIELUNIS, CHRISTOPHER M. LAIGHTON, ROBERT W. BYREN CARLOS PERALTA, CHRISTAL J. SUMNER STEPHEN R. PECK, TYLER THOMAS, SHUWU WU EDWARD A. WATTERS 10273595 Method for tailoring the dopant profile in JOSEPH R. CORRADO ANDREW CAHILL, SEAN F. HARRIS, 10236611 Electrical interfaces using modular VPX 10247829 Systems and methods for real time carrier 10263566 Radio frequency power amplifier a laser crystal using zone processing 10288393 Flight vehicle with control surfaces usable DANIEL D. LOFGREEN technologies phase monitoring as momentum wheels 10300649 Enhancing die flatness PETER JENSEN, RYAN SNYDER, STEPHEN T. FASOLINO, WILLIAM J. WOLFGONG DEANNA K. HARDEN, TIMOTHY J. HUGHES DELMAR L. BARKER, JOHN OKERSON CRAWFORD WILLIAM WYSOCKI 10274468 Methods and kit for determining presence JAMES M. BOWDEN MICHAEL BRENNAN 10237766 Estimation of available user data rate in a 10248015 Dynamic blackbody scene display 10264028 Central emulator device and method for of trivalent chromium conversion coating 10288715 Systems and methods for direction finding 10300659 Material deposition system for additive communications channel distributed emulation using augmented spatial sample covariance matrices manufacturing DAVID F. MCCOY BOULAT BASH, SAIKAT GUHA KEITH A. ELKINS, ORLANDO L. MIJARES, 10248697 Method and system for facilitating RICHARD BURNE, JOHN DISHON III, JOSHUA 10274587 Covert sensor JAMES M. BOWDEN MICHAEL D. FUCHS, CAROLYN MOORE JACK W. REANY interactive review of data EDMISON, ZACHARY LEUSCHNER, JOHN-FRANCIS 10288716 Systems and methods for direction 10302740 System and method for fast adaptive 10240896 Tube to bulkhead bonded joint design MERGEN, TYLER SHAKE, LAURIE WAISEL, NORMAN ARMENDARIZ, LANCE A. AUER, finding based on minimum distance search to principal range doppler compression JACK H. ANDERSON, CHARLES G. GILBERT, KERRY WOOD DONALD A. BOZZA, JOHN B. FRANCIS, components WILLIAM M. CASEY, DAVID U. FLUCKIGER, ROBYN JIMENEZ, JACKSON NG 10264440 Apparatus and method for rapid electronic PHILIP M. HENAULT, RANDAL W. OBERLE, ANDREW HUARD, AMEDEO LARUSSI, COLIN M. JOHNSTON, TERRY MCLEAN, 10249953 Directive fixed beam ramp EBG antenna device discovery ANGELO M. PUZELLA, SUSAN C. TRULLI, RICK MCKERRACHER, TONY M. PONSFORD KIM MCINTURFF RAYMOND SAMANIEGO, JOHN L. TOMICH DIMITRY ZARKH 10288726 Impulse noise detection and removal for 10302743 Systems and methods for antenna analysis 10240900 Systems and methods for acquiring and BRUCE LINDSAY DAVID H. ALTMAN, JONATHAN BALDUCCI, 10276282 transmission line structure radar and communication systems and validation launching and guiding missiles to multiple targets 10250058 Charge management system JOHN BUSTAMANTE, NICHOLAS MANISCALCO, CHRISTIAN RODRIGUEZ, JOSHUA SOLE EDUARDO M. CHUMBES, BRIAN SCHULTZ JAMES BALLEW, GARY R. EARLY ROBERT W. BYREN, VLADIMIR V. SHKUNOV ERIC J. BEUVILLE, CHRISTIAN M. BOEMLER, BENJAMIN DOLGIN, GARY M. GRACEFFO, 10276705 Group III — nitride double-heterojunction 10289586 High performance computing (HPC) node 10302858 Low-latency, hollow-core optical fiber with ANDREW KOWALEVICZ 10267569 Thermal storage heat exchanger structures JULIETTE COSTA, MICKY HARRIS, MARK MASSIE employing phase change materials field effect transistor having a plurality of switch coupled processors total internal reflection mode confinement 10242268 Pixel-based event detection for tracking, 10250292 Optical rake receiver using an etalon hostile fire indication, glint suppression, and other detector CHARLES J. BERSBACH, ADAM C. WOOD JOHN P. BETTENCOURT, ALAN J. BIELUNIS, NEEL SHAH, LUKE WOLFF PATRICIA D. CHIN, JOHN D. ISKER ISTVAN RODRIGUEZ, ZHAOYANG C. WANG 10289779 Universal verification methodology (UVM) 10302889 Gimbal transmission cable management applications ALVIN STETSON 10267578 Shape memory material based thermal coupler/decoupler and method 10277176 Bias circuitry for depletion mode amplifiers register abstraction layer (RAL) traffic predictor JOHN J. DRAB, JASON G. MILNE 10252937 Vitreous frit TIMOTHY CAMPBELL, DAVE S. DOUGLAS, JACQUELINE M. BOURGEOIS, ELI BROOKNER, RICHARD BURNE, JOHN DISHON III, RYAN QUILLER 10242967 Die encapsulation in oxide bonded wafer JOHN M. CONNOLLY, GEOFF HARRIS, BRIEN ROSS THOMAS H. BOOTES, GEORGE DARRYL BUDY, stack WAYNE Y. LEE, RICHARD POLLY, JASON M. SHIRE, YUEH-CHI CHANG, PETER R. DRAKE, LEON JOSHUA EDMISON, ZACHARY LEUSCHNER, 10304001 Robust target identification 10254084 Co-aligned close quarters battlefield sight GREEN, FRANCIS G. HARTWICH, YUCHOI F. LOK, JOHN-FRANCIS MERGEN, TYLER SHAKE, JESSE T. WADDELL JAMES A. CARR, MARK B. HANNA PARTHA SARATHI DUTTA, MITCHELL B. HAERI, FREDERICK B. KOEHLER, WARD D. LYMAN 10267607 Munition with outer enclosure DANIEL F. RYPYSC, THOMAS V. SIKINA LAURIE WAISEL, KERRY WOOD GERARD L. RAFANELLI 10281571 Phased array antenna using stacked 10291274 Apparatus and method for remote analysis 10305161 Method of providing dual stripline tile 10254097 Shape memory alloy disc vent cover circulator utilizing thick film post-fired substrate 10243089 Photovoltaic device for generating release SEAN D. KELLER, GERALD P. UYENO beams in elevation and azimuth of a target device electrical power using nonlinear multi-photon 10267915 Optical system for object detection and stacking RICK MCKERRACHER, TONY M. PONSFORD, JAMES M. ELLIOTT, BRIAN W. JOHANSEN, absorption of incoherent radiation IVOR BROWN, NATHAN CARPENTER, location CRAIG R. ADAMS, DAVID A. BUELL, DANIEL NAGLE DEREK YEE JUSTIN KASEMODEL ELICIA HARPER, CHRISTOPHER M. LAIGHTON, ADAM M. KENNEDY, DUANE SMITH, 10281573 Retrodiction tracking system and related 10292255 Expanding thermal device and system for AMEDEO LARUSSI, CHRISTOPHER MOSHENROSE 10255370 Automated compliance checking through 10305193 Wide-band high speed communications SUSAN C. TRULLI analysis of cloud infrastructure templates EDWARD P. SMITH, techniques effecting heat transfer within electronics assemblies 10243246 Phase shifter including a branchline JUSTIN GORDON ADAMS WEHNER channel for cryogenic applications coupler having phase adjusting sections formed by MARCOS BIRD, BRIAN D. PAUTLER 10267997 Infrared scene projector with per-pixel MARCO A. AVILA, DOUGLAS J. HARTNETT, JOHN DISHON III, JOSHUA EDMISON, MARK NOETHEN ZACHARY LEUSCHNER, JOHN-FRANCIS MERGEN, DAVID D. HESTON, CLAIRE E. MOONEY connectable conductive pads 10256836 Resolver to digital conversion apparatus spectral and polarisation capability 10305376 Switchable for multi-mode and method 10281694 Anamorphic refractive objective lens TYLER SHAKE, CHRISTOPHER WILDER, ROBERT P. BERNARD, JAMES A. PRUETT EVGENY N. HOLMANSKY, BORIS S. JACOBSON, assembly THOMAS WILKERSON operation 10243301 Blind mate connector housing and BENJAMIN DOLGIN, GARY M. GRACEFFO, LEV VOLFSON 10295593 Operating general purpose hardware as SHUBHA KADAMBE, JUAN C. SOTELO, ANDREW L. MARTIN, DAVID W. PALMER assembly ANDREW KOWALEVICZ 10270356 High voltage high frequency power radio 10305492 Clock frequency control system 10256917 Optically sensed demodulation systems converter KALIN SPARIOSU SEAN D. KELLER, GERALD P. UYENO and methods for optical communications 10282630 Multi-channel compressive sensing-based DANIEL T. DONOHOO, RICHARD STEINBERG BENJAMIN DOLGIN, GARY M. GRACEFFO, 10243654 Electronically steered inter-satellite optical JOHN DISHON III, JOSHUA EDMISON, object recognition 10296174 Coding for tracks ANDREW KOWALEVICZ communication system and methods MAC A. CODY ZACHARY LEUSCHNER, JOHN-FRANCIS MERGEN, BRIAN A. GUNN CHARLES G. GILBERT, JACKSON NG, 10305602 Demodulation of QAM modulated 10257655 Contact graph generation for mobile and TYLER SHAKE, LAURIE WAISEL, KERRY WOOD optical beam using Fabry-Perot etalons and microring BENJAMIN DOLGIN, GARY M. GRACEFFO, ground station nodes 10270482 Automated avionics testing 10284202 Generating analog output from a field SERGIO A. PIZARRO ANDREW KOWALEVICZ programmable gate array by combining scaled digital 10297919 Directive artificial magnetic conductor demodulators 10243670 Optical signal processing using an optical JEREMY C. DANFORTH, DAVID G. GARRETT, JOHN P. GIANVITTORIO, HARRY B. MARR, outputs (AMC) dielectric wedge waveguide antenna CHRISTOPHER E. PENTLAND, RYAN REESER, resonator MATT H. SUMMERS VICTOR S. REINHARDT GARY M. GRACEFFO, ANDREW KOWALEVICZ DAVID M. FILGAS, STEPHEN H. MCGANTY DESIREE SCHAUB 10259756 Solid propellant with integral electrodes, 10270488 Binary high-power modulator 10307851 Techniques for providing stop-offs for BENJAMIN DOLGIN, GARY M. GRACEFFO, and method 10285049 Device and method for baseband signal 10297968 High-gain single planar waveguide (PWG) ANDREW KOWALEVICZ PARTHA PAL, AARON PAULOS, encryption amplifier laser system brazing materials or other materials on structures being 10243673 Frequency demodulation systems and MAURICE J. HALMOS RICHARD SCHANTZ joined CHARLES T. HANSEN, JOUD KHOURY, MARK GOHLKE, GARY R. HERRINGTON, methods for optical signals 10261187 Optical phasograms for ladar vibrometry 10270739 System and method for protecting WILLIAM LAWRENCE GERECKE, service-level entities MICHAEL KREMER, JEFFERY JAY LOGAN, STEVEN PALOMINO, JAMES ROBARGE, GARY M. GRACEFFO, ANDREW KOWALEVICZ STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH, SUBRAMANIAN RAMANATHAN, LAWRENCE E. SAVAGE II, PATRICK J. SIGLER SUSAN N. GOTTSCHLICH, RAIMUND MERKERT, 10243735 Device and method for modulated ADAM M. KENNEDY, THOMAS ALLAN KOCIAN WILLIAM CONEY, YEVGENIY DORFMAN, CHRISTOPHER VANDER VALK 10298164 Linear actuator force matching using back BRIAN STONE waveform encryption 10262913 Wafer level package solder barrier used as GREGORY DUCKWORTH 10285190 Scheduling access to a shared medium EMF 10311307 Methods and apparatus for video wall vacuum getter 10272979 Systems and method for subsea with feed indicators NAYAN D. SAMPAT propulsion and energy harvesting using current shear KEITH A. ELKINS, CLAYTON B. MELTON, STEPHEN KUZNETSOV 10247519 Methods and apparatus for controlling THOMAS M. SEACH 10298212 Method and apparatus for control of BENJAMIN DOLGIN, GARY M. GRACEFFO, line of sight drift 10287027 Expandable flexible fuel tank device and pulsed power in hybrid energy storage module ANDREW KOWALEVICZ system for externally pressurized fuel systems 10313022 Active demodulation systems and methods for optical signals

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STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH, YI-CHAO SIMON CHUANG, STEVE DAVIDSON, SUNDER S. RAJAN LUCIAN A. BRASIER, LAUREN M. GARCIA, WILLIAM M. BOWSER, MATTHEW T. KUIKEN, RYAN A. EGBERT, CHRISTOPHER L. HERNANDEZ ADAM M. KENNEDY, THOMAS ALLAN KOCIAN MU-CHENG WANG 2856373 Superelastic and method of formation JAMES E. LEWIS, WAID A. PAINE, TODD E. SESSLER, ROBERT M. STOKES 2678631 Optical element retaining system for sensor 10315918 Method of stress relief in anti-reflective 10333839 Routing a data packet in a communication THOMAS H. TAYLOR 2387704 System and method for athermal operation systems coated cap wafers for wafer level packaged infrared network CHRISTOPHER JACOB REIMER 2463961 Method for RF connector grounding of a focal plane array (method for athermal operation of focal plane arrays 2884029 Wide field of view multibeam optical uncooled fpas) KENNETH W. BROWN, ANDREW K. BROWN, APRIL CANTY, COLIN M. JOHNSTON, apparatus ALEXANDER A. BETIN, DAVID A. ROCKWELL, DARIN M. GRITTERS, THOMAS A. HANFT, PATRICK RAY TEN-SHING HSU, HARRY B. MARR, RICHARD C. VERA VLADIMIR V. SHKUNOV IVANS S. CHOU, CLARA CURIEL, J. KOCUREK, MICHAEL A. MOORE CHRIS MCLEAN 10334175 System and method for sensor pointing STEVE DAVIDSON, MARK W. HENRY, 2677609 Method and apparatus for generation and LAWRENCE C. DE PAULA, FREDERICK C. MERTZ, 2783419 High frequency, high bandwidth, low loss 10317514 Programmable apparatus for synthesized control MATT A. KAHN, GREGORY S. SCHRECKE, amplification of light in a semi-guiding high aspect ratio ROBERT K. PINA, KARLEEN G. SEYBOLD microstrip to waveguide transition filter notch MU-CHENG WANG core fiber 2408360 Imaging station and method for repeatable Australia 2910899 Method for indirect link characterization alignment of images KIRK A. MILLER GREGORY HILDSTROM and quality measurement of a digital network STANLEY I. TSUNODA 2798390 Optical switching system 10318209 Secure file transfer to process STEPHEN KUZNETSOV 3230761 System and method to provide a dynamic SCOTT E. ADCOOK, STAN W. LIVINGSTON TERRY ANTHONY DORSCHNER, IRL W. SMITH DAVID A. ROCKWELL, VLADIMIR V. SHKUNOV 2014318758 Electromagnetic DC pulse power situational awareness of attack radar threats 2434575 Plug-in antenna CHRISTOPHER A. LEDDY, STEPHEN R. NASH, 2926296 High power optical switch 2815229 Multi-media Raman resonators and related system including integrated fault limiter HECTOR A. QUEVEDO LACY G. COOK, JOHN F. SILNY system and method TIM GEHLE, STAN W. LIVINGSTON, Finland 10319098 System for real-time moving target DAVID U. FLUCKIGER 2437038 Two material achromatic prism JOSE I. VALDEZ, ROBERT G. YACCARINO, DAVID A. KLUVER SR, DAVID E. NORMAN, detection using vision based image segmentation 2014381641 Robust autofocus algorithm for CHARLES A. HALL, ANTHONY T. MCDOWELL, FANGCHOU YANG ALEXANDER A. BETIN, DAVID A. ROCKWELL, WALTER W. NORMAN multi-spectral imaging systems TINA P. SRIVASTAVA, KENNETH M. WEBB ALEXANDER BRAILOVSKY, YUEH-CHI CHANG, 2939996 Array antenna with shaped beam pattern VLADIMIR V. SHKUNOV 2826235 Beam steering element feed forward 3042451 Feed-forward canceller PAUL FINN, CRAIG D. GENDRON ERIC J. GUDIM, WILLIAM H. WELLMAN for collection system applications 2451031 Method and apparatus for generation and command aiding architecture 10320080 Tri-band feed assembly systems and 2015244406 Methods and apparatus for determin- JAMES R. CHOW, WILLIAM E. ELIAS, amplification of light in a semi-guiding high aspect ratio GARY D. COLEMAN, JOHN F. SILNY CHET L. RICHARDS methods ing angle of arrival (AOA) in a radar warning receiver KURT S. KETOLA, DAVID M. LA KOMSKI, core fiber 2941745 Multi-function beacon for optical 2836806 Adaptive multispectral imaging STUART J. MARBLE, CARL W. TOWNSEND HARRY B. MARR, DANIEL THOMPSON ANDREW D. HUSS, JOHN MCGINTY communications laser LUCIAN A. BRASIER, LAUREN M. GARCIA, 3221673 Multi-layer advanced carbon nanotube PAUL H. GROBERT, WILLIAM K. WALLACE 10320596 System and method for modulating filter 2015324533 Real-time multi-array sum power JAMES E. LEWIS, WAID A. PAINE, ROBERT E. DESROCHERS II, GARY MOORE blackbody for compact, lightweight, and on-demand 2841964 GPS aided open loop coherent timing coefficients in a channelizer spectrum control THOMAS H. TAYLOR 2973658 Amplitude-noise reduction system and infrared calibration 2463961 Method for RF connector grounding STEPHEN H. BLACK, BUU DIEP SEAN D. KELLER, GERALD P. UYENO STEPHEN KUZNETSOV method for ultra-low phase-noise oscillators 2865002 Fabrication of window cavity cap structures 10321037 Active pushbroom scanning system and 2016205226 Method and apparatus for control of France JOSEPH M. ANDERSON, TODD HATCH in wafer level packaging method pulsed power in hybrid energy storage module 2474071 Broadband/multi-band horn antenna with China MICHAEL J. DELCHECCOLO, JOHN M. FIRDA, compact integrated feed (broad band & multi band ANDREW MALCZEWSKI, CODY B. MOODY, ELICIA HARPER, CHRISTOPHER M. LAIGHTON, ROBERT E. DESROCHERS II, GARY MOORE DOUGLAS J. HARTNETT, LYALE F. MARR, JOSEPH PLEVA, MARK E. RUSSELL, quad ridge waveguide horn antenna with compact FRANCIS J. MORRIS SUSAN C. TRULLI 2016206585 Amplitude-noise reduction system and RICHARD L. SCOTT, RANDY W. WHITE HERMAN B. VAN REES, WALTER G. WOODINGTON integrated feed) 2878003 Switchable capacitor 10321555 based RF circuit method for ultra-low phase-noise oscillators ZL201580039406.3 Precision optical mount for 1417512 Near object detection system module optical devices (AUTOMOTIVE) STEPHEN J. SCHILLER, JOHN F. SILNY STEPHEN J. SCHILLER, JOHN F. SILNY KAICHIANG CHANG, YONG LIU, 2525198 Method and system for spectral calibration JOHN S. ANDERSON, JAMES ANDREW, 2888557 Geometric calibration of a remote sensor JOSEPH O. CHAPA, PAUL C. HERSHEY, DAVID R. SCHMIDT, STEPHEN M. SPARAGNA, EDUARDO M. CHUMBES, WILLIAM E. HOKE, of a remote sensing sensor and a synthetic target ROBERT K. DODDS, ADAM M. KENNEDY, ELIZABETH UMBERGER FREDERIC C. STEVENS IV KEVIN MCCARTHY, KAMAL TABATABAIE having a tunable spectral composition JAMES S. BLACKMON, HOWARD M. DE RUYTER 10323910 Methods and apparatuses for eliminating 2016280434 Sequential multi-beam radar for ZL201380030015.6 Gallium nitride devices having TODD E. SESSLER, DMITRY SHMOYS, 2888567 Calibration system for detector a missile threat maximum likelihood tracking and fence search low ohmic contact resistance DAVID VAN LUE SAMUEL S. BLACKMAN, KEIAN CHRISTOPHER, 1709406 Thermally stabilized radiation detector ROBERT DEMPSTER, ROBERT A. ROSEN STEPHEN J. SCHILLER, JOHN F. SILNY SAEED ALIPOUR STEVEN G. DANIELSON, JULIA L. KARL, MAKAN MOHAGEG, NEIL R. NELSON, utilizing temperature controlled radiation filter 2581758 Methods for resolving radar ambiguities 2888568 Polarimetric calibration of a remote sensor 10326357 Adaptive power converter topologies HARRY B. MARR, WILLIAM B. NOBLE, JEFFREY L. SABALA, ALEXANDER S. SOHN using multiple hypothesis tracking supporting active power factor correction (PFC) LARISA ANGELIQUE NATALYA STEPHAN, ZL201480032426.3 Four-braid resistive heater and KENNETH GERBER, ROBERT GINN ERIC C. FEST, PAGE E. KING, MICHAEL P. SCHAUB DANIEL THOMPSON, PAUL YUE devices incorporating such resistive heater 2100324 Method of construction of CTE matching CHET L. RICHARDS, VICTOR WANG 2891003 Movable pixelated filter array MARTIN G. FIX, STEPHEN A. STREIB 2017202110 Runtime creation, assignment, structure with wafer processing and resulting structure 2590399 Hadamard enhanced sensors 10330449 Dispenser and dispensing system for radar ROLAND TORRES deployment and updating of arbitrary radio waveform JOHN C. TREMBLAY, COLIN S. WHELAN jamming material JEFFREY J. LAYTON, EDWARD C. SCHLATTER, MATTHEW T. CASHEN, TODD O. CLATTERBUCK, 2932587 Methods and apparatus for EMI filter techniques for a radio waveform generation device ZL201510789224.X Impedance matching circuit PETER H. VO GABRIEL PRICE, JEFFREY L. SABALA, having switched based on loading JOHN J. ANAGNOST, ANDREW L. BULLARD, STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH, 2191163 Z-leg shock isolator STEVEN R. WILKINSON Belgium JOE A. ORTIZ KYLE HEIDEMAN, MATTHEW E. JENKINS ADAM M. KENNEDY, THOMAS ALLAN KOCIAN 2629381 Precision photonic oscillator and method for BRANDON H. ALLEN, RICHARD M. WEBER, 2982031 Bidirectional motor driver low voltage 10330460 Calibration method and system for a fast ZL201580006410.X Getter structure and method for generating an ultra-stable frequency reference using a WILLIAM M. BOWSER, MATTHEW T. KUIKEN, DANIEL J. WEISSMANN, WILLIAM G. WYATT power supply (LVPS) steering mirror forming such structure two-photon rubidium transition TODD E. SESSLER, ROBERT M. STOKES 2201311 System and method for cooling structures 2387704 System and method for athermal operation GARY D. COLEMAN, MACIEJ D. MAKOWSKI, DAVID N. SITTER JR. PARTHA SARATHI DUTTA, MITCHELL B. HAERI, having both an active state and an inactive state WILLIAM B. NOBLE, WALTER F. SCHOONOVER JR, of a focal plane array (method for athermal operation of WILLIAM J. MINISCALCO, STEPHEN D. NORDEL 10330929 Cross-band apochromatic correction and GERARD L. RAFANELLI JAMES M. SKORA, LARISA ANGELIQUE NATALYA uncooled FPAs) DANIEL GREGOIRE, ANDREW HUNTER 2982060 Laser relay for free space optical applications in the LWIR and SWIR bands ZL201580032710.5 Photovoltaic device for STEPHAN generating electrical power using nonlinear 2206152 Multiple-band detector using frequency communications JAYNA SHAH, ALBERTO F. VISCARRA 2654334 Phased array antenna having assignment Canada multi-photon absorption of incoherent radiation selective slots 10333212 Radiator, solderless interconnect thereof based control and related techniques STEVEN R. COLLINS RYAN NOBES, BRIEN ROSS, KEVIN BURGESS DELMAR L. BARKER, WILLIAM RICHARD OWENS, 3004979 Adaptive optic having meander and grounding element thereof ROBERT D. TRAVIS WAGNER Denmark ABRAM YOUNG CHARLES T. HANSEN, JOUD KHOURY, 2675732 Belted toroid pressure vessel and method MAKAN MOHAGEG, NEIL R. NELSON, 179637 Reticle disc ALEXANDER A. BETIN, DAVID A. ROCKWELL, 2269110 Methods and system for optical focusing MICHAEL KREMER, JEFFERY JAY LOGAN, for making the same JEFFREY L. SABALA, ALEXANDER S. SOHN VLADIMIR V. SHKUNOV using negative index CHRISTOPHER VANDER VALK SAMUEL S. BLACKMAN, STEPHEN A. CAPPARELLI, 3005829 Four-braid resistive heater and devices 2451031 Method and apparatus for generation and ALEXANDER A. BETIN, DAVID A. ROCKWELL, 10333421 Polymorphic waveform generation DOUGLAS E. CARROLL, RACHEL B. NORMAN, JAMES BARGER, SCOTT RITTER incorporating such resistive heater amplification of light in a semi-guiding high aspect ratio VLADIMIR V. SHKUNOV STEFAN SCHWOEGLER 2318802 Systems and methods for detecting shooter core fiber 2677609 Method and apparatus for generation and ANNA JOHNSTON, BISHARA SHAMEE, 2762677 Multiple hypothesis tracking locations from an aircraft STEVEN R. WILKINSON amplification of light in a semi-guiding high aspect ratio 10333698 Entwined encryption and error correction core fiber

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KENNETH S. KOMISAREK, ANGELO M. PUZELLA, LACY G. COOK ANDREW HUARD, AMEDEO LARUSSI, MATTHEW T. CASHEN, TODD O. CLATTERBUCK, JOSEPH J. ICHKHAN, MICHAEL USHINSKY, MICHAEL M. FITZGIBBON, ETHAN S. HEINRICH, JAMES A. ROBBINS 3218740 Advanced optics for IRST sensor having KIM MCINTURFF GABRIEL PRICE, JEFFREY L. SABALA, DAVID A. VASQUEZ CHAD PATTERSON, DUKE QUACH 3028341 Stacked bowtie radiator with integrated afocal foreoptics positioned between a scanning 3308187 Systems and methods for antenna analysis STEVEN R. WILKINSON 3169968 Optical window system with aero-optical 3357128 Coaxial electrical interconnect balun coelostat mirror and focal imaging optics and validation 2629381 Precision photonic oscillator and method conductive blades for generating an ultra-stable frequency reference using MARK T. LANGHENRY, DANIEL V. MACINNIS, CHARLES A. HALL, ANTHONY T. MCDOWELL, JOHN F. SILNY MORRISON R. LUCAS, JOHN H. STEELE a two-photon rubidium transition RONALD LAPAT MATT H. SUMMERS, TINA P. SRIVASTAVA, KENNETH M. WEBB 3221672 Multi-mode imaging spectrometer 3356767 Multidimensional angle determination using 3172799 Electronically reconfigurable, JAMES KENDALL VILLARREAL 3042451 Feed-forward canceller fine position sensors ALEXANDER A. BETIN, DAVID A. ROCKWELL, piecewise-linear, scalable analog monopulse network 3359796 Electrically operated pulse initiators and JAMES R. CHOW, WILLIAM E. ELIAS, VLADIMIR V. SHKUNOV ignition MACIEJ D. MAKOWSKI, HANS P. NAEPFLIN, KURT S. KETOLA, DAVID M. LA KOMSKI, MICHAEL M. FITZGIBBON, ETHAN S. HEINRICH, 2677609 Method and apparatus for generation and BRADLEY A. FLANDERS, IAN S. ROBINSON ALEXANDER RICHA K. RACO STUART J. MARBLE, CARL W. TOWNSEND CHAD PATTERSON, DUKE QUACH amplification of light in a semi-guiding high aspect ratio 3180861 Defeat of aliasing by incremental sampling DANIEL W. BRUNTON, JON E. LEIGH, 3044624 Optimal kinematic mount for large mirrors 3221673 Multi-layer advanced carbon nanotube 3357128 Coaxial electrical interconnect core fiber PAUL M. LYONS blackbody for compact, lightweight, and on-demand BRANDON J. CUNDIFF, KEITH A. KERNS, 3362746 Joule Thomson aided Stirling cycle cooler WALTER W. NORMAN, ARMANDO VILLARREAL infrared calibration MARK T. LANGHENRY, DANIEL V. MACINNIS, DAVID A. ROCKWELL, VLADIMIR V. SHKUNOV JOHN J. SPILOTRO 3066824 Nadir/zenith inertial pointing assistance for MATT H. SUMMERS, 2815229 Multi-media Raman resonators and related 3186584 Munition modification kit and method of KEITH A. KERNS, WAYNE Y. LEE, JOHN J. SPILOTRO two-axis gimbals RAYMOND A. GRAFFAM, DAVID J. KNAPP, JAMES KENDALL VILLARREAL system and method modifying munition 3365578 Shock attenuation device with stacked DOUGLAS MILLS, MICHAEL S. SMITH, 3359796 Electrically operated pulse initiators and nonviscoelastic layers ANDREW L. BULLARD GLAFKOS K. STRATIS ignition DAVID A. KLUVER SR, DAVID E. NORMAN, STEVE DAVIDSON, MARK W. HENRY, 3074776 High bandwidth linear flexure bearing 3221921 Wideband antenna structure with optics WALTER W. NORMAN MATT A. KAHN, GREGORY S. SCHRECKE, JOHN BEDNARZ, THOMAS H. BOOTES, DANIEL W. BRUNTON, JON E. LEIGH, MU-CHENG WANG WAYNE Y. LEE LOWELL A. BELLIS, JAMES R. CHOW, reflector as ground plane and associated methods 2826235 Beam steering element feed forward PAUL M. LYONS command aiding architecture 3186927 Network path selection in policy-based 3377844 Munition having penetrator casing with THEODORE J. CONRAD, MICHAEL JOSEPH ELLIS, KELLIE CANIDA, LEO LINSKY, HARRY B. MARR, 3362746 Joule Thomson aided Stirling cycle cooler networks using routing engine fuel-oxidizer mixture therein TROY T. MATSUOKA, BRIAN R. SCHAEFER CRAIG A. CHET L. RICHARDS 3092449 Cryocooler regenerator containing one or 3224716 Apparatus and method for allocating KEITH A. KERNS, WAYNE Y. LEE, JOHN J. SPILOTRO 2836806 Adaptive multispectral imaging LACY G. COOK JEREMY C. DANFORTH, FREDERICK B. KOEHLER, more carbon-based anisotropic thermal layers resources using prioritization of requests and updating 3365578 Shock attenuation device with stacked 3218740 Advanced optics for IRST sensor having MATT H. SUMMERS, of requests nonviscoelastic layers PAUL H. GROBERT, WILLIAM K. WALLACE afocal foreoptics positioned between a scanning JAMES KENDALL VILLARREAL KENNETH W. BROWN, SAMUEL DE LA TORRE, 2841964 GPS aided open loop coherent timing coelostat mirror and focal imaging optics 3384229 Base drag reduction fairing using shape TRAVIS B. FEENSTRA, ALAN RATTRAY PABLO ARAMBEL, MARIO MARTINEZ, JOHN BEDNARZ, THOMAS H. BOOTES, memory materials 3108586 Reflective-type antenna band and ARTHUR M. NEWMAN WAYNE Y. LEE ANDREW MALCZEWSKI, CODY B. MOODY, JOHN F. SILNY polarization selectable transceiver using a rotatable 3224808 Method and system for processing a 3377844 Munition having penetrator casing with FRANCIS J. MORRIS 3221672 Multi-mode imaging spectrometer KIM L. CHRISTIANSON, GASTON P. JENNETT, quarter-wave plate fuel-oxidizer mixture therein 2878003 Switchable capacitor ROBERT P. JOHNSON, HENRI Y. KIM, sequence of images to identify, track, and/or target an KELLIE CANIDA, LEO LINSKY, HARRY B. MARR, object on a body of water DMITRY KNYAZEV SIDDHARTHA GHOSH, JUSTIN GORDON ADAMS JEREMY C. DANFORTH, FREDERICK B. KOEHLER, STEPHEN J. SCHILLER, JOHN F. SILNY CRAIG A. SNOW 3387365 Multiple explosively formed projectiles liner WEHNER DAWSON R. BRUCKMAN, THEODORE J. CONRAD MATT H. SUMMERS, 2888557 Geometric calibration of a remote sensor 3224716 Apparatus and method for allocating fabricated by additive manufacturing 3149928 Dynamic polarizer having material operable 3227995 Method and apparatus for back electro- JAMES KENDALL VILLARREAL resources using prioritization of requests and updating to alter its conductivity responsive to an applied 3384229 Base drag reduction fairing using shape STEPHEN J. SCHILLER, JOHN F. SILNY of requests MICHAEL J. DELCHECCOLO, JOHN M. FIRDA, motive force (EMF) position sensing in a cryocooler or 2888568 Polarimetric calibration of a remote sensor stimulus other system having electromagnetic actuators memory materials JOSEPH PLEVA, MARK E. RUSSELL, PABLO ARAMBEL, MARIO MARTINEZ, HERMAN B. VAN REES, WALTER G. WOODINGTON JOSEPH J. ICHKHAN, MICHAEL USHINSKY, KIM L. CHRISTIANSON, GASTON P. JENNETT, ERIC C. FEST, PAGE E. KING, MICHAEL P. SCHAUB ARTHUR M. NEWMAN STANLEY I. TSUNODA 2891003 Movable pixelated filter array 60249767.1 Near object detection system DAVID A. VASQUEZ 3230761 System and method to provide a dynamic ROBERT P. JOHNSON, HENRI Y. KIM, 3224808 Method and system for processing a 3169968 Optical window system with aero-optical situational awareness of attack radar threats DMITRY KNYAZEV GARY D. COLEMAN, MACIEJ D. MAKOWSKI, sequence of images to identify, track, and/or target an KENNETH GERBER, ROBERT GINN conductive blades 3387365 Multiple explosively formed projectiles liner WILLIAM J. MINISCALCO, STEPHEN D. NORDEL object on a body of water 602007057926.0 Method of construction of CTE ANTHONY R. VULCANO, CHAD WENN fabricated by additive manufacturing matching structure with wafer processing and resulting RONALD LAPAT 2982060 Laser relay for free space optical DAWSON R. BRUCKMAN, THEODORE J. CONRAD 3256809 Boresight insert for alignment of aiming communications structure 3172799 Electronically reconfigurable, system with firing system of weapon Germany 3227995 Method and apparatus for back electro- piecewise-linear, scalable analog monopulse network MAKAN MOHAGEG, NEIL R. NELSON, motive force (EMF) position sensing in a cryocooler or JEFFREY J. LAYTON, EDWARD C. SCHLATTER, MYRON E. CALKINS JR, THOMAS M. CRAWFORD, BRANDON H. ALLEN, RICHARD M. WEBER, other system having electromagnetic actuators PETER H. VO BRADLEY A. FLANDERS, IAN S. ROBINSON JEFFREY L. SABALA, ALEXANDER S. SOHN PERRY H. FRAHM, WILLIAM RICHARD OWENS, DANIEL J. WEISSMANN, WILLIAM G. WYATT 602008058706.1 Z-leg shock isolator 3180861 Defeat of aliasing by incremental sampling 3005829 Four-braid resistive heater and devices STANLEY I. TSUNODA KENT P. PFLIBSEN, JAMES G. SIERCHIO, 2201311 System and method for cooling structures incorporating such resistive heater 3230761 System and method to provide a dynamic DANIEL GREGOIRE, ANDREW HUNTER RICHARD J. WRIGHT having both an active state and an inactive state ALEXANDER A. BETIN, VLADIMIR V. SHKUNOV situational awareness of attack radar threats 602008059446.7 Multiple-band detector using 3183827 Apparatus and method for reducing signal 3262369 Long range KV-to-KV communications to MACIEJ D. MAKOWSKI, HANS P. NAEPFLIN, SCOTT E. ADCOOK, STAN W. LIVINGSTON frequency selective slots fading due to atmospheric turbulence inform target selection of follower KVs ALEXANDER RICHA K. RACO ANTHONY R. VULCANO, CHAD WENN 2434575 Plug-in antenna 3044624 Optimal kinematic mount for large mirrors 3256809 Boresight insert for alignment of aiming DELMAR L. BARKER, WILLIAM RICHARD OWENS, BRANDON J. CUNDIFF, KEITH A. KERNS, BRUCE E. BOZOVICH, MARTIN S. DENHAM ALEXANDER A. BETIN, DAVID A. ROCKWELL, system with firing system of weapon ABRAM YOUNG JOHN J. SPILOTRO 3275178 Current to frequency converter WALTER W. NORMAN, ARMANDO VILLARREAL VLADIMIR V. SHKUNOV 602009057424.8 Methods and system for optical 3186584 Munition modification kit and method of 3066824 Nadir/zenith inertial pointing assistance for MATTHEW D. CHAMBERS, MICKY HARRIS, MARCO A. AVILA, JEFF M. GALLAGHER, 2451031 Method and apparatus for generation and focusing using negative index metamaterial modifying munition two-axis gimbals OHN L. VAMPOLA DAVID CHRISTOPHER MANN, DAVID RUSSELL amplification of light in a semi-guiding high aspect ratio 3295664 Detector arrays with electronically JAMES BARGER, SCOTT RITTER MCDONALD, STEVEN A. MILES, TJ WILLIAM ROSS core fiber ANDREW L. BULLARD STEVE DAVIDSON, MARK W. HENRY, adjustable detector positions 602009057645.3 Systems and methods for MATT A. KAHN, GREGORY S. SCHRECKE, 3283860 Image plane sensor alignment system and 3074776 High bandwidth linear flexure bearing STEPHEN J. SCHILLER, JOHN F. SILNY detecting shooter locations from an aircraft MU-CHENG WANG method ANDREW HUARD, AMEDEO LARUSSI, 2525198 Method and system for spectral calibration LOWELL A. BELLIS, JAMES R. CHOW, 3186927 Network path selection in policy-based KIM MCINTURFF WILLIAM M. BOWSER, MATTHEW T. KUIKEN, MAKAN MOHAGEG of a remote sensing sensor and a synthetic target THEODORE J. CONRAD, MICHAEL JOSEPH ELLIS, networks using routing engine 3308187 Systems and methods for antenna analysis TODD E. SESSLER, ROBERT M. STOKES 3295228 Single mode large mode area optical fiber having a tunable spectral composition TROY T. MATSUOKA, BRIAN R. SCHAEFER and validation 602010057197.1 System and method for athermal ERIC C. FEST, JUSTAN V. FORSYTH, PAGE E. KING coil 3092449 Cryocooler regenerator containing one or CHET L. RICHARDS, VICTOR WANG operation of a focal plane array (method for athermal 3204730 Optical position encoder more carbon-based anisotropic thermal layers MORRISON R. LUCAS, JOHN H. STEELE MATTHEW D. CHAMBERS, MICKY HARRIS, 2590399 Hadamard enhanced sensors operation of uncooled FPAs) JOHN L. VAMPOLA 3356767 Multidimensional angle determination using 3295664 Detector arrays with electronically fine position sensors adjustable detector positions

62 | TECHNOLOGY TODAy 2019 TECHNOLOGY TODAy 2019 | 63 pat e n t s

JOSEPH M. ANDERSON, TODD HATCH JOE A. ORTIZ SUNG I. PARK, DENH T. SY STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH, KENNETH S. KOMISAREK, ANGELO M. PUZELLA, STEVEN E. LAU, STEFFANIE S. UNG 602010057440.7 Broadband/multi-band horn 602014047310.5 Bidirectional motor driver low 312972 Communications scheduling of network ADAM M. KENNEDY, THOMAS ALLAN KOCIAN JAMES A. ROBBINS 6482568 Reworkable epoxy resin and curative blend antenna with compact integrated feed (broad band & voltage power supply (LVPS) nodes using a cluster coefficient 246363 Getter structure and method for forming such 3028341 Stacked bowtie radiator with integrated for low thermal expansion applications multi-band quad ridge waveguide horn antenna with structure balun compact integrated feed) KENNETH S. KOMISAREK, ANGELO M. PUZELLA, MAKAN MOHAGEG JAMES A. ROBBINS JOHN T. BROAD STEVE DAVIDSON, MARK W. HENRY, 6482670 Pyramidal spacer for increased stability IVANS S. CHOU, CLARA CURIEL, 602014049081.6 Stacked bowtie radiator with TODD O. CLATTERBUCK, THOMAS NELSON, 246819 Direct geolocation from TDOA, FDOA, and MATT A. KAHN, GREGORY S. SCHRECKE, Fabry-Perot resonator LAWRENCE C. DE PAULA, FREDERICK C. MERTZ, integrated balun STEVEN R. WILKINSON AGL MU-CHENG WANG JOHN P. GIANVITTORIO, HARRY B. MARR, ROBERT K. PINA, KARLEEN G. SEYBOLD 206579 Ultra stable short pulse remote sensor 3186927 Network path selection in policy-based 602010058584.0 Imaging station and method for RAYMOND A. GRAFFAM, DAVID J. KNAPP, BRADLEY A. FLANDERS, IAN S. ROBINSON networks using routing engine WALTER B. SCHULTE JR repeatable alignment of images DOUGLAS MILLS, MICHAEL S. SMITH, ROBERT D. TRAVIS 252233 Basis vector spectral image compression 6486968 Analog RF memory system GLAFKOS K. STRATIS 227743 Belted toroid pressure vessel and method for (BVSIC) LUCIAN A. BRASIER, LAUREN M. GARCIA, STEPHEN BLACK, BUU DIEP, ADAM M. KENNEDY, LUCIAN A. BRASIER, LAUREN M. GARCIA, 602015023267.4 Wideband antenna structure making the same JAMES E. LEWIS, WAID A. PAINE, JAMES E. LEWIS, WAID A. PAINE, with optics reflector as ground plane and associated MARCO A. AVILA, JEFF M. GALLAGHER, THOMAS H. TAYLOR THOMAS ALLAN KOCIAN, GREGORY D. TRACY, THOMAS H. TAYLOR methods MICHAEL BOARDMAN, BRIAN A. CRONIN, DAVID CHRISTOPHER MANN, DAVID RUSSELL 502019000025573 Method for RF connector TSE E. WONG 602011055881.1 Method for RF connector RAY B. HUFFAKER, NICHOLAS J. PLOPLYS, MCDONALD, STEVEN A. MILES, TJ WILLIAM ROSS grounding 6487032 Hermetically sealed package having stress grounding BRUCE E. BOZOVICH, MARTIN S. DENHAM NICHOLAS SUN 253628 Image plane sensor alignment system and reducing layer 602015026572.6 Current to frequency converter 234988 Locally invariant global hypothesis tracking method ALEXANDER A. BETIN, VLADIMIR V. SHKUNOV LACY G. COOK, JOHN F. SILNY 502019000043392 Apparatus and method for ANDREW L. BULLARD 602011058691.2 Two material achromatic prism ALEXANDER A. BETIN, VLADIMIR V. SHKUNOV BRYAN FAST LACY G. COOK reducing signal fading due to atmospheric turbulence 6495432 Solar rejection system with movable 602015028038.5 Apparatus and method for 238167 Meandered slow wave taper matching 253629 Optical forms for multi-channel double-pass sunshade ROBERT D. TRAVIS reducing signal fading due to atmospheric turbulence network dispersive spectrometers JAMES R. CHOW, WILLIAM E. ELIAS, 602011058892.3 Belted toroid pressure vessel and KURT S. KETOLA, DAVID M. LA KOMSKI, THOMAS DEPPERT, WILLIAM C. MOLLBERG, method for making the same SIDDHARTHA GHOSH, ANDREW L. BULLARD MATTHEW J. KOETH, MICHAEL R. PATRIZI STUART J. MARBLE, CARL W. TOWNSEND DAVID R. SMITH, BRIAN J. ZELINSKI JUSTIN GORDON ADAMS WEHNER 239132 Multi-stage thermal isolator for focal plane 256219 Dynamically clocked DDS for spur 502019000062970 Multi-layer advanced carbon 6495454 Zinc sulfide coupling agents WILLIAM B. NOBLE, WALTER F. SCHOONOVER JR, 602015028835.1 Dynamic polarizer having material arrays and other devices optimization nanotube blackbody for compact, lightweight, and DAVID M. FILGAS JAMES M. SKORA, operable to alter its conductivity responsive to an on-demand infrared calibration LARISA ANGELIQUE NATALYA STEPHAN applied stimulus STEPHEN J. SCHILLER, JOHN F. SILNY MARK T. BUSCH, JOSEPH G. SHANKS, 6501869 Asymmetric PWG with asymmetric cooling 239412 Polarimetric calibration of a remote sensor JOHN F. SILNY 602012056148.3 Phased array antenna having Japan WILLIAM P. BALLANCE, DANIEL KILFOYLE, assignment based control and related techniques JAMES R. CHOW, WILLIAM E. ELIAS, 257387 Temporally adaptive processing KURT S. KETOLA, DAVID M. LA KOMSKI, ERIC J. GUDIM, LEE M. SAVAGE, IAN S. ROBINSON CHRISTOPHER J. BEARDSLEY, SAMUEL S. BLACKMAN, KEIAN CHRISTOPHER, STUART J. MARBLE, CARL W. TOWNSEND WILLIAM H. WELLMAN CHRISTIAN M. BOEMLER 6501971 Apparatus and method for selective signal DAVID U. FLUCKIGER, CRAIG R. FRANKLIN ROBERT DEMPSTER, ROBERT A. ROSEN 602015031164.7 Multi-layer advanced carbon 239615 Iterative kalman filtering process 258151 Gain adaptable unit cell cancellation 6462152 Full motion color video atmospheric 602012056404.0 Methods for resolving radar nanotube blackbody for compact, lightweight, and JAMES R. CHOW, CARL W. TOWNSEND JAMES L. DEAN, LYALE F. MARR, turbulence correction processing STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH, ambiguities using multiple hypothesis tracking on-demand infrared calibration 239630 Methods of etching carbon nanotube sheet RICHARD L. SCOTT, RANDY W. WHITE ADAM M. KENNEDY, THOMAS ALLAN KOCIAN DAVID B. BRANDT, NATHAN R. FRANCIS, ANDREW K. BROWN, KENNETH W. BROWN, ERIC C. FEST, JUSTAN V. FORSYTH, PAGE E. KING material for electrical circuit and thin film thermal 258247 Primary mirror mount assembly and method 6502401 Method of stress relief in anti-reflective BYRON E. SHORT JR DARIN M. GRITTERS, THOMAS A. HANFT, 602015031838.2 Optical position encoder structure applications coated cap wafers for wafer level packaged infrared STEPHEN H. BLACK, ADAM M. KENNEDY 6466028 Multi-level oscillating heat pipe PATRICK J. KOCUREK, MICHAEL A. MOORE focal plane arrays DALE R. FLOWERS 258591 Use of an external getter to reduce package implementation in an electronic circuit card module 602012058028.3 High frequency, high bandwidth, MARCO A. AVILA, JEFF M. GALLAGHER, DAVID CHRISTOPHER MANN, DAVID RUSSELL 240412 Impaired carrier coding pressure CHRISTOPHER A. COX low loss microstrip to waveguide transition BRYAN W. KEAN, JOHN L. VAMPOLA MCDONALD, STEVEN A. MILES, TJ WILLIAM ROSS 6503142 Thermally insensitive open-loop hung mass JOE A. ORTIZ CHRISTIAN M. BOEMLER 6469224 Method and apparatus for increasing pixel JAMES S. BLACKMON, HOWARD M. DE RUYTER 602016011581.6 Image plane sensor alignment accelerometer with differential eddy current sensing 240851 Bidirectional motor driver low voltage power 259582 Imaging circuits and method sensitivity and dynamic range 602012059147.1 Calibration system for detector system and method supply (LVPS) CURTIS B. CARLSTEN, ERIK F. ITEM, CHRISTIAN M. BOEMLER MATTHEW D. CHAMBERS, MICKY HARRIS, KIRK A. MILLER MAKAN MOHAGEG MARK S. LANGELIER, DANIEL B. MINARIK FREDERICK A. DOMINSKI, JOHN P. GIANVITTORIO, 259761 Imaging system unit cell and methods for JOHN L. VAMPOLA 602012059632.5 Optical switching system 602016012351.7 Single mode large mode area 6505017 Unmanned underwater vehicle JASON G. MILNE dynamic range imaging 6469241 Detector arrays with electronically optical fiber coil 241212 RF module for individual or integrated use adjustable detector positions JAMES M. ELLIOTT, SCOTT M. HESTON, RYAN A. EGBERT, CHRISTOPHER L. HERNANDEZ CHRISTIAN M. BOEMLER 602012060111.6 Optical element retaining system MYRON E. CALKINS JR, THOMAS M. CRAWFORD, CARY C. KYHL GARY D. COLEMAN, MACIEJ D. MAKOWSKI, 261390 Digital unit cell with analog counter element STEPHEN T. FASOLINO, JOSHUA NG, for sensor systems PERRY H. FRAHM, WILLIAM RICHARD OWENS, 6509252 Method to align surface mount packages WILLIAM J. MINISCALCO, STEPHEN D. NORDEL JASON L. WHEELER KENT P. PFLIBSEN, JAMES G. SIERCHIO, DEVON G. CROWE, CALEB KNOERNSCHILD for thermal enhancement 241895 Laser relay for free space optical 6472935 Fixture to support reel-to-reel inspection of STEVEN R. COLLINS RICHARD J. WRIGHT 261448 Computational imaging with uncalibrated communications semiconductor devices or other components THOMAS DEPPERT, DAVID R. SMITH 602013049869.5 Adaptive optic having meander 602016013258.3 Long range KV-to-KV pupil phase resistors 6510063 Ferrocenyl bonding agent oxidizers communications to inform target selection of follower MICHAEL A. GRITZ, STEVEN M. LARDIZABAL, VIJAY MURGAI DAVID N. SITTER JR. KVs ZHAOYANG C. WANG 6475755 Reflection/absorption coating for laser slabs DAWSON R. BRUCKMAN, THEODORE J. CONRAD ROLAND TORRES 262137 Optical configurations for optical field 602013049930.6 Methods and apparatus for EMI 243072 Loss-less frequency dependent Dicke- 6516844 Method and apparatus for back electro- mappings for back-scanned and line-scanned imagers JAMES R. CHOW, THEODORE J. CONRAD, filter having switched capacitance based on loading India switched radiometer motive force (EMF) position sensing in a cryocooler or WILLIAM E. ELIAS other system having electromagnetic actuators STEPHEN H. BLACK, BUU DIEP CARLOS R. COSTAS, CHRISTOPHER R. ECK RICHARD HENNEGAN Italy 6475822 Method for forming lanthanide 308127 Algal cell lysis and lipid extraction using 244372 Methods and apparatus for signal sideband nanoparticles CHRISTIAN M. BOEMLER, JOHN J. DRAB, 602013052675.3 Fabrication of window cavity cap BRANDON H. ALLEN, RICHARD M. WEBER, electromagnetic radiation-excitable metallic receiver/transceiver for phased array radar antenna JUSTIN GORDON ADAMS WEHNER structures in wafer level packaging DANIEL J. WEISSMANN, WILLIAM G. WYATT nanoparticles CHRISTIAN M. BOEMLER 6517380 Pin diode structure having surface charge CHARLES A. HALL, ANTHONY T. MCDOWELL, STEPHANIE BOSTWICK, EDWARD P. SMITH, 2201311 System and method for cooling structures 6475900 Imaging circuits and method suppression TINA P. SRIVASTAVA, KENNETH M. WEBB JOHN C. TREMBLAY, COLIN S. WHELAN JUSTIN GORDON ADAMS WEHNER having both an active state and an inactive state ERIC J. BEUVILLE, MARTIN S. DENHAM, 602014045912.9 Feed-forward canceller 309588 Impedance matching circuit 245527 Two color detector leveraging resonant cavity DAVID R. KRALJ, MATTHEW P. LITTLE, enhancement for performance improvement RICHARD S. JOHNSON DAVID U. FLUCKIGER, ROBERT C. GIBBONS LANDON L. ROWLAND, JACQUELYN A. VITAZ KENNETH W. BROWN, SAMUEL DE LA TORRE, DELMAR L. BARKER, WILLIAM RICHARD OWENS, 2385583 Wideband cavity-backed slot antenna 6482012 Read-out integrated circuit with integrated 6522246 Dual-polarized wideband radiator with TRAVIS B. FEENSTRA, ALAN RATTRAY ROSS D. ROSENWALD, NITESH N. SHAH, HAO XIN compressive sensing single-plane stripline feed 602014046594.3 Reflective-type antenna band and 310726 Dynamic control of Planck radiation in polarization selectable transceiver using a rotatable photonic crystals quarter-wave plate

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CHRISTIAN M. BOEMLER Norway Spain KIUCHUL HWANG, AMANDA KERR, IVANS S. CHOU, CLARA CURIEL, ANDREW K. BROWN, KENNETH W. BROWN, 6523575 Digital unit cell with analog counter BRIAN SCHULTZ LAWRENCE C. DE PAULA, FREDERICK C. MERTZ, DARIN M. GRITTERS, THOMAS A. HANFT, element STEPHEN H. BLACK, BUU DIEP LUCIAN A. BRASIER, LAUREN M. GARCIA, I663635 Semicondcutor material growth of a high ROBERT K. PINA, KARLEEN G. SEYBOLD PATRICK J. KOCUREK, MICHAEL A. MOORE 2865002 Fabrication of window cavity cap structures JAMES E. LEWIS, WAID A. PAINE, resistivity nitride buffer layer using 2408360 Imaging station and method for repeatable 2783419 High frequency, high bandwidth, low loss VALERY S. KAPER in wafer level packaging THOMAS H. TAYLOR alignment of images microstrip to waveguide transition 6526192 Output matching network having a single ROBERT E. DESROCHERS II, GARY MOORE 2463961 Method for RF connector grounding combined series and shunt capacitor component South Korea / Republic of Korea I663831 Amplitude-noise reduction system and SCOTT E. ADCOOK, STAN W. LIVINGSTON KIRK A. MILLER method for ultra-low phase-noise oscillators 2434575 Plug-in antenna 2798390 Optical switching system ERIC J. GRIFFIN, ERIK D. JOHNSON, Sweden LUKE M. FLAHERTY, RANDAL E. KNAR KALIN SPARIOSU LACY G. COOK, JOHN F. SILNY DAVID A. ROCKWELL, VLADIMIR V. SHKUNOV 10-1948841 Room temperature low contact pressure WILLIAM M. BOWSER, MATTHEW T. KUIKEN, Turkey 6526910 Radioactive anomaly detector 2437038 Two material achromatic prism 2815229 Multi-media Raman resonators and related method TODD E. SESSLER, ROBERT M. STOKES STANLEY I. TSUNODA system and method MARWAN M. ARYAN, LOWELL A. BELLIS, 2387704 System and method for athermal operation ALEXANDER A. BETIN, DAVID A. ROCKWELL, BRYAN W. KEAN, JOHN L. VAMPOLA 3230761 System and method to provide a dynamic DAWSON R. BRUCKMAN, THEODORE J. CONRAD, of a focal plane array (method for athermal operation of VLADIMIR V. SHKUNOV DAVID A. KLUVER SR, DAVID E. NORMAN, 10-1949625 Method and apparatus for increasing situational awareness of attack radar threats MICHAEL H. KIEFFER uncooled FPAs) 2451031 Method and apparatus for generation and WALTER W. NORMAN pixel sensitivity and dynamic range 6527581 Temperature control of multi-stage STEPHEN H. BLACK, BUU DIEP amplification of light in a semi-guiding high aspect ratio 2826235 Beam steering element feed forward LUCIAN A. BRASIER, LAUREN M. GARCIA, cryocooler with load shifting capabilities 2019/07749 Fabrication of window cavity cap core fiber command aiding architecture MAKAN MOHAGEG, ROY ZAMUDIO JAMES E. LEWIS, WAID A. PAINE, 10-1954014 Techniques for forming waveguides for structures in wafer level packaging EMMANUEL NEGATU, THEODORE VORNBROCK, THOMAS H. TAYLOR LUCIAN A. BRASIER, LAUREN M. GARCIA, JAMES CHET L. RICHARDS use in laser systems or other systems and associated JOHN GEORGE WITZEL 2463961 Method for RF connector grounding E. LEWIS, WAID A. PAINE, THOMAS H. TAYLOR 2836806 Adaptive multispectral imaging devices United Kingdom 6530656 Search and rescue using ultraviolet 2463961 Method for RF connector grounding CHARLES A. HALL, ANTHONY T. MCDOWELL, PAUL H. GROBERT, WILLIAM K. WALLACE radiation DOUGLAS J. HARTNETT, LYALE F. MARR, MICHAEL J. DELCHECCOLO, JOHN M. FIRDA, TINA P. SRIVASTAVA, KENNETH M. WEBB JOSEPH M. ANDERSON, TODD HATCH 2841964 GPS aided open loop coherent timing RICHARD L. SCOTT, RANDY W. WHITE JOSEPH PLEVA, MARK E. RUSSELL, STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH, 3042451 Feed-forward canceller 2474071 Broadband/multi-band horn antenna with 10-1955130 Precision optical mount for optical HERMAN B. VAN REES, WALTER G. WOODINGTON ADAM M. KENNEDY, THOMAS ALLAN KOCIAN compact integrated feed (broad band & multi-band STEPHEN H. BLACK, BUU DIEP devices 1417512 Near object detection system 6532465 Method of forming deposited patterns on Switzerland quad ridge waveguide horn antenna with compact 2865002 Fabrication of window cavity cap structures in wafer level packaging a surface JAYNA SHAH, ALBERTO F. VISCARRA JOHN S. ANDERSON, JAMES ANDREW, integrated feed) STANLEY I. TSUNODA 10-1958128 Radiator, solderless interconnect thereof ROBERT K. DODDS, ADAM M. KENNEDY, ALAN J. BIELUNIS, CHRISTOPHER M. LAIGHTON, 3230761 System and method to provide a dynamic STEPHEN J. SCHILLER, JOHN F. SILNY ANDREW MALCZEWSKI, CODY B. MOODY, and grounding element thereof TODD E. SESSLER, DMITRY SHMOYS, ISTVAN RODRIGUEZ situational awareness of attack radar threats 2525198 Method and system for spectral calibration FRANCIS J. MORRIS DAVID VAN LUE 2878003 Switchable capacitor 6532596 Field effect transistor having MICHAEL S. MITCHENER of a remote sensing sensor and a synthetic target ANDREW HUARD, AMEDEO LARUSSI, 1709406 Thermally stabilized radiation detector two-dimensionally distributed field effect transistor cells 10-1965097 Fast time acquisition in a having a tunable spectral composition KIM MCINTURFF utilizing temperature controlled radiation filter STEPHEN J. SCHILLER, JOHN F. SILNY frequency-hopped communications link ANDREW R. ROLLINGER 3308187 Systems and methods for antenna analysis SAMUEL S. BLACKMAN, KEIAN CHRISTOPHER, 2888557 Geometric calibration of a remote sensor KENNETH GERBER, ROBERT GINN 6535753 Optical component including nanoparticle and validation ROBERT DEMPSTER, ROBERT A. ROSEN ROBERT S. ISOM, CARY C. KYHL, WAID A. PAINE, 2100324 Method of construction of CTE matching JAMES S. BLACKMON, HOWARD M. DE RUYTER heat sink 2581758 Methods for resolving radar ambiguities JAMES S. WILSON structure with wafer processing and resulting structure 2888567 Calibration system for detector 10-1972241 Vertical radio frequency module Taiwan using multiple hypothesis tracking NORMAN W. CRAMER, MATTHEW L. HAMMOND, JEFFREY J. LAYTON, EDWARD C. SCHLATTER, STEPHEN J. SCHILLER, JOHN F. SILNY ROBERT G. KRESSIG II JOHN J. DRAB, MARY A. TESHIBA CHET L. RICHARDS, VICTOR WANG ALEXANDER A. BETIN, VLADIMIR V. SHKUNOV PETER H. VO 2888568 Polarimetric calibration of a remote sensor 6545356 Secure switch assembly I647813 Coaxial connector feed-through for 2590399 Hadamard enhanced sensors 10-1976548 Apparatus and method for reducing 2191163 Z-leg shock isolator signal fading due to atmospheric turbulence multi-level interconnected semiconductor wafers ERIC C. FEST, PAGE E. KING, MICHAEL P. SCHAUB ANDREW HUARD, AMEDEO LARUSSI, MATTHEW T. CASHEN, TODD O. CLATTERBUCK, BRANDON H. ALLEN, RICHARD M. WEBER, 2891003 Movable pixelated filter array KIM MCINTURFF ISAAC C. CHEN, SUNDER S. RAJAN, GABRIEL PRICE, JEFFREY L. SABALA, STEVEN R. GARY D. COLEMAN, EVAN J. MATTHEWS, DANIEL J. WEISSMANN, WILLIAM G. WYATT 6545369 Systems and methods for antenna analysis SCOTT T. TURNER, MICHAEL USHINSKY WILKINSON ROLAND TORRES WILLIAM J. MINISCALCO 2201311 System and method for cooling structures and validation I648243 Molding composite and method of making 2629381 Precision photonic oscillator and method for 2932587 Methods and apparatus for EMI filter 10-1976549 Electro-optical payload for having both an active state and an inactive state high-bandwidth free space optical communications molded part generating an ultra-stable frequency reference using a having switched capacitance based on loading KIRK A. MILLER DANIEL GREGOIRE, ANDREW HUNTER two-photon rubidium transition 6545392 Optical path switching device FIKRET ALTUNKILIC, JOE A. ORTIZ ALICIA G. ALLEN, DAVID B. BRANDT, 2206152 Multiple-band detector using frequency DAVID W. CHU, ROBERT K. DODDS, CHRISTOPHER J. MACDONALD, WILLIAM B. NOBLE, WALTER F. SCHOONOVER JR, 2982031 Bidirectional motor driver low voltage DAVID M. FILGAS selective slots GREGORY PHILLIP SCHAEFER KAMAL TABATABAIE, ADRIAN WILLIAMS JAMES M. SKORA, power supply (LVPS) 6545899 Self-seeding high power laser I648775 Monolithic microwave integrated circuit LARISA ANGELIQUE NATALYA STEPHAN 10-1977452 Monolithic multi-module electronics DELMAR L. BARKER, WILLIAM RICHARD OWENS, GARY D. COLEMAN, MACIEJ D. MAKOWSKI, (MMIC) and method for forming such MMIC having 2654334 Phased array antenna having assignment chassis with multi-planar embedded fluid cooling ABRAM YOUNG WILLIAM J. MINISCALCO, STEPHEN D. NORDEL Mexico rapid thermal annealing compensation elements based control and related techniques channels 2269110 Methods and system for optical focusing 2982060 Laser relay for free space optical BRENDAN H. ROBINSON, JOHN H. STEELE, using negative index metamaterial CHRISTIAN M. BOEMLER YORAM BAXTER, MARCO ORDONEZ, ROBERT D. TRAVIS communications JOHN K. YOOK 10-1986970 Digital unit cell with analog counter BILL STEADMAN, BRAD S. WILLIAMS JAMES BARGER, SCOTT RITTER 2675732 Belted toroid pressure vessel and method 360357 Power producing device with control STEVEN R. COLLINS element I649018 removal device 2318802 Systems and methods for detecting shooter for making the same mechanism 3004979 Adaptive optic having meander resistors locations from an aircraft MAURICE J. HALMOS ALEXANDER A. BETIN, DAVID A. ROCKWELL, STEPHEN H. BLACK, BUU DIEP, ROLAND GOOCH, MAKAN MOHAGEG, NEIL R. NELSON, I652495 Optical phasograms for ladar vibrometry VLADIMIR V. SHKUNOV Netherlands ADAM M. KENNEDY, THOMAS ALLAN KOCIAN WILLIAM M. BOWSER, MATTHEW T. KUIKEN, JEFFREY L. SABALA, ALEXANDER S. SOHN 10-1993107 Getter structure and method for forming TODD E. SESSLER, ROBERT M. STOKES 2677609 Method and apparatus for generation and EDUARDO M. CHUMBES, KELLY P. IP, 3005829 Four-braid resistive heater and devices LUCIAN A. BRASIER, LAUREN M. GARCIA, such structure 2387704 System and method for athermal operation amplification of light in a semi-guiding high aspect ratio THOMAS E. KAZIOR, JEFFREY R. LAROCHE incorporating such resistive heater JAMES E. LEWIS, WAID A. PAINE, of a focal plane array (method for athermal operation of core fiber I658558 Nitride structure having gold-free contact THOMAS H. TAYLOR uncooled FPAs) KENNETH S. KOMISAREK, ANGELO M. PUZELLA, and methods for forming such structures RYAN A. EGBERT, CHRISTOPHER L. HERNANDEZ 2463961 Method for RF connector grounding JAMES A. ROBBINS 2678631 Optical element retaining system for sensor 3028341 Stacked bowtie radiator with integrated JAMES R. CHOW, WILLIAM E. ELIAS, KYLE DAVIDSON, WILLIAM KRUPP, systems KURT S. KETOLA, DAVID M. LA KOMSKI, DANIEL C. MCGOWAN balun I660550 Connector removal tool STUART J. MARBLE, CARL W. TOWNSEND CHARLES A. HALL, ANTHONY T. MCDOWELL, 3221673 Multi-layer advanced carbon nanotube TINA P. SRIVASTAVA, KENNETH M. WEBB blackbody for compact, lightweight, and on-demand 3042451 Feed-forward canceller infrared calibration

66 | TECHNOLOGY TODAy 2019 TECHNOLOGY TODAy 2019 | 67 patents

MACIEJ D. MAKOWSKI, HANS P. NAEPFLIN, LACY G. COOK MAKAN MOHAGEG ALEXANDER RICHA K. RACO 3218740 Advanced optics for IRST sensor having 3295228 Single mode large mode area optical fiber 3044624 Optimal kinematic mount for large mirrors afocal foreoptics positioned between a scanning coil coelostat mirror and focal imaging optics WALTER W. NORMAN, ARMANDO VILLARREAL MATTHEW D. CHAMBERS, MICKY HARRIS, 3066824 Nadir/zenith inertial pointing assistance for JOHN F. SILNY JOHN L. VAMPOLA two-axis gimbals 3221672 Multi-mode imaging spectrometer 3295664 Detector arrays with electronically adjustable detector positions ANDREW L. BULLARD JAMES R. CHOW, WILLIAM E. ELIAS, 3074776 High bandwidth linear flexure bearing KURT S. KETOLA, DAVID M. LA KOMSKI, ANDREW HUARD, AMEDEO LARUSSI, STUART J. MARBLE, CARL W. TOWNSEND KIM MCINTURFF LOWELL A. BELLIS, JAMES R. CHOW, 3221673 Multi-layer advanced carbon nanotube 3308187 Systems and methods for antenna analysis THEODORE J. CONRAD, MICHAEL JOSEPH ELLIS, blackbody for compact, lightweight, and on-demand and validation TROY T. MATSUOKA, BRIAN R. SCHAEFER infrared calibration 3092449 Cryocooler regenerator containing one or MORRISON R. LUCAS, JOHN H. STEELE more carbon-based anisotropic thermal layers RAYMOND A. GRAFFAM, DAVID J. KNAPP, 3356767 Multidimensional angle determination using DOUGLAS MILLS, MICHAEL S. SMITH, fine position sensors KENNETH W. BROWN, SAMUEL DE LA TORRE, GLAFKOS K. STRATIS TRAVIS B. FEENSTRA, ALAN RATTRAY 3221921 Wideband antenna structure with optics MICHAEL M. FITZGIBBON, ETHAN S. HEINRICH, 3108586 Reflective-type antenna band and reflector as ground plane and associated methods CHAD PATTERSON, DUKE QUACH polarization selectable transceiver using a rotatable 3357128 Coaxial electrical interconnect quarter-wave plate KELLIE CANIDA, LEO LINSKY, HARRY B. MARR, CRAIG A. SNOW MARK T. LANGHENRY, DANIEL V. MACINNIS, SIDDHARTHA GHOSH, 3224716 Apparatus and method for allocating MATT H. SUMMERS, JUSTIN GORDON ADAMS WEHNER resources using prioritization of requests and updating JAMES KENDALL VILLARREAL 3149928 Dynamic polarizer having material operable of requests 3359796 Electrically operated pulse initiators and to alter its conductivity responsive to an applied ignition stimulus PABLO ARAMBEL, MARIO MARTINEZ, ARTHUR M. NEWMAN DANIEL W. BRUNTON, JON E. LEIGH, JOSEPH J. ICHKHAN, MICHAEL USHINSKY, 3224808 Method and system for processing a PAUL M. LYONS DAVID A. VASQUEZ sequence of images to identify, track, and/or target an 3362746 Joule Thomson aided Stirling cycle cooler 3169968 Optical window system with aero-optical object on a body of water conductive blades KEITH A. KERNS, WAYNE Y. LEE, JOHN J. SPILOTRO DAWSON R. BRUCKMAN, THEODORE J. CONRAD 3365578 Shock attenuation device with stacked RONALD LAPAT 3227995 Method and apparatus for back electro- nonviscoelastic layers 3172799 Electronically reconfigurable, motive force (EMF) position sensing in a cryocooler or piecewise-linear, scalable analog monopulse network JOHN BEDNARZ, THOMAS H. BOOTES, other system having electromagnetic actuators WAYNE Y. LEE BRADLEY A. FLANDERS, IAN S. ROBINSON STANLEY I. TSUNODA 3377844 Munition having penetrator casing with 3180861 Defeat of aliasing by incremental sampling 3230761 System and method to provide a dynamic fuel-oxidizer mixture therein ALEXANDER A. BETIN, VLADIMIR V. SHKUNOV situational awareness of attack radar threats JEREMY C. DANFORTH, FREDERICK B. KOEHLER, 3183827 Apparatus and method for reducing signal ANTHONY R. VULCANO, CHAD WENN MATT H. SUMMERS, fading due to atmospheric turbulence 3256809 Boresight insert for alignment of aiming JAMES KENDALL VILLARREAL system with firing system of weapon 3384229 Base drag reduction fairing using shape BRANDON J. CUNDIFF, KEITH A. KERNS, memory materials JOHN J. SPILOTRO MYRON E. CALKINS JR, THOMAS M. CRAWFORD, 3186584 Munition modification kit and method of PERRY H. FRAHM, WILLIAM RICHARD OWENS, KIM L. CHRISTIANSON, GASTON P. JENNETT, modifying munition KENT P. PFLIBSEN, JAMES G. SIERCHIO, ROBERT P. JOHNSON, HENRI Y. KIM, DMITRY KNYAZEV STEVE DAVIDSON, MARK W. HENRY, RICHARD J. WRIGHT 3262369 Long range KV-to-KV communications to 3387365 Multiple explosively formed projectiles liner MATT A. KAHN, GREGORY S. SCHRECKE, fabricated by additive manufacturing MU-CHENG WANG inform target selection of follower KVs 3186927 Network path selection in policy-based BRUCE E. BOZOVICH, MARTIN S. DENHAM networks using routing engine 3275178 Current to frequency converter ERIC C. FEST, JUSTAN V. FORSYTH, PAGE E. KING MARCO A. AVILA, JEFF M. GALLAGHER, 3204730 Optical position encoder DAVID CHRISTOPHER MANN, DAVID RUSSELL MCDONALD, STEVEN A. MILES, TJ WILLIAM ROSS 3283860 Image plane sensor alignment system and method

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