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Keywords for Scripta Materialia Keywords for Scripta Materialia The keyword listing for Scripta Materialia is divided into five sections. 1. Synthesis and Processing; 2. Characterization; 3. Material Type; 4. Properties and Phenomena; and 5. Theory, Computer Simulations, and Modeling. Authors should select a maximum of five (5) keywords from the five sections as appropriate and ensure that the keywords are included in their manuscript in accordance with the Notes for the Guidance of Authors. Where deemed necessary, authors may provide one keyword that does not appear on the listing. The total number of keywords must not exceed five. The keywords selected will be used for search and retrieval purposes in an electronic environment as well as for the creation of subject indexes for Scripta Materialia. It is therefore recommended that authors pay careful attention to the selection of the keywords to ensure that they provide a useful description of the work being reported. 1. Synthesis and Processing aging liquid infiltration annealing slurry infiltration anodization vapor infiltration atomization ion-beam processing ball mill isothermal heat treatments blending austempering bonding martempering casting joining die casting brazing injection casting diffusion bonding investment casting soldering rheocasting laser treatment squeeze casting laser annealing suction casting laser deposition thixocasting laser peening chemical vapor deposition laser welding chemical vapor transport liquid-phase epitaxy (LPE) coating liquid-phase sintering cold working lithography crystal growth mechanical alloying Bridgman technique mechanical milling Czochralski technique melt spinning deposition metal injection moulding (MIM) chemical vapor deposition (CVD) mineralization laser deposition molecular beam epitaxy (MBE) molecular beam epitaxy (MBE) nitriding physical vapor deposition (PVD) photochemical processing sputtering plasma spraying drawing plating dynamic compaction polymer processing electroless plating powder consolidation electron beam methods powder processing electroplating quenching extrusion reactive ion etching firing recycling foaming rolling forming processes self-propagating high-temperature synthesis (SHS) cold isostatic pressing (CIP) semi-solid processing deep drawing severe plastic deformation (SPD) drawing accumulative roll bonding (ARB) extrusion equal channel angular extrusion (ECAE) forging equal channel angular pressing (ECAP) hot isostatic pressing (HIP) friction hot pressing high-pressure torsion rolling torsion solid freeform processes sintering galvanization spark plasma sintering high-speed deformation sol–gel homogenization/solutionization solidification hot working directional solidification implantation eutectic solidification infiltration monotectic solidification multicomponent solidification electron backscattering patterns (EBSP) peritectic solidification electron diffraction rapid solidification electron energy loss spectroscopy (EELS) solidification microstructure electron holography spark plasma sintering electron probe microanalysis (EPMA) spin coating energy dispersive X-ray spectroscopy (EDXS) splat quenching energy filtering transmission electron microscopy (EFTEM) sputtering field-ion microscopy (FIM) strain aging fluctuation electron microscopy (FEM) surface alloying focused ion beam (FIB) surface modification high-angle annular dark field (HAADF) tempering high-resolution electron microscopy (HREM) thermal barrier coating Lorenz microscopy thermal spray processing magnetic force microscopy (MFM) thermomechanical processing optical microscopy thin films orientation imaging microscopy (OIM) tissue engineering scanning electron microscopy (SEM) vapor deposition scanning/transmission electron microscopy (STEM) welding scanning tunneling microscopy (STM) friction stir welding three-dimensional atom probe (3DAP) friction welding transmission electron microscopy (TEM) wavelength dispersive X-ray spectroscopy (WDXS) Mo¨ssbauer effect nanoindentation 2. Characterization neutron diffraction acoustic methods neutron scattering activation analysis nuclear magnetic resonance (NMR) atom location by channeling enhanced microanalysis (ALCHEMI) nuclear reaction analysis atom probe tomography positron annihilation (PAL) Brillouin scattering radiography critical exponent analysis Rutherford backscattering spectrometry/channeling differential scanning calorimetry (DSC) (RBS) differential thermal analysis (DTA) small angle neutron scattering (SANS) dynamic mechanical analysis small angle scattering (SAS) electrical resistivity/conductivity small angle X-ray scattering (SAXS) electron diffraction surface analysis techniques electron holography Auger electron spectroscopy (AES) electron scattering deep level transient spectroscopy (DLTS) image analysis ion scattering spectroscopy (ISS) sterology infrared (IR) spectroscopy 2D quantitative analysis low-energy electron diffraction (LEED) 3D reconstruction optical spectroscopy ion microprobe Raman spectroscopy Kerr–Faraday–magnetometry reflection high-energy electron diffraction (RHEED) mechanical properties testing secondary ion mass spectroscopy (SIMS) bending test X-ray photoelectron spectroscopy (XPS) compression test thermally stimulated acoustic methods creep test thermogravimetric analysis fatigue test three-dimensional tomography hardness test X-ray high cycle fatigue extended X-ray absorption fine structure (EXAFS) impact test line broadening low cycle fatigue small angle X-ray scattering (SAXS) microindentation synchrotron radiation nanoindentation X-ray diffraction (XRD) scratch test X-ray fluorescence tension test Z-contrast microscopy toughness microscopy and microanalysis techniques analytical electron microscopy atomic force microscopy (AFM) 3. Material Type atom-probe field-ion microscopy (AP-FIM) aerogel convergent beam electron diffraction (CBED) amorphous materials electron backscattering alloys electron backscattering diffraction (EBSD) block polymers carbon insulators liquids intermetallics polymers iron aluminides silicon nickel aluminides beryllides niobium aluminides biomaterials titanium aluminides bone transition metal silicides hydroxyapatite ionic conductors polymeric biomaterials hydrides polymers Langmuir–Blodgett film block copolymers laves phases borides layered structures buckminster fullerene lead-free solder bulk metallic glass liquids carbides lithium-ion batteries carbon and graphite low-dielectric materials carbon fiber-reinforced plastics luminescent materials carbon fibers macromolecular materials carbon nanotubes magnetic materials carbon–carbon composites exchange spring magnet cellular materials hard magnetic materials cement and concrete magnetic random access memory (MRAM) ceramic thin films magnetic recording head ceramics magnetic recording media cermets soft magnetic materials chalcogenide glasses magnetostrictive materials composites metallic glass ceramic matrix composites (CMC) bulk metallic glass (BMG) fiber reinforced composites metal and alloys metal matrix composites (MMC) alkaline earth particulate reinforced composites aluminum polymer matrix composites aluminum alloys whisker reinforced composites copper compounds copper alloys intercalation compounds iron intermetallic compounds iron alloys ionic compounds magnesium semiconductor compounds magnesium alloys cuprate superconductors nickel diamond films nickel alloys diamond-like carbon platinum group diblock polymers rare earth dielectrics refractory metals electroceramics semiconductor electrochromics steels electronic ceramics titanium electronic packaging titanium alloys fast-ion conductors transition metals fast-ion glasses metallizations ferrites microelectromechanical systems (MEMS) ferroelectric ceramics microelectronics packaging ferroelectric materials minerals ferromagnetic materials multilayers ferromagnetic semiconductor nanocomposite ferromagnetic shape memory alloy nanocomposite magnet fibers nanocrystalline materials foams nanocrystalline metal fuel cell materials nanocrystalline soft magnetic material functionally graded materials (FGM) nanostructured materials glass nitrides glass fiber optical materials granular materials optical waveguides half-metal optoelectronic packaging Heusler phases organic electronic materials high-temperature superconductors oxide dispersion strengthened (ODS) alloy oxides buckling amorphous oxides capillary phenomena binary oxides catalysis crystalline oxides cellular growth non-binary oxides coarsening permanent magnet convection perovskite corrosion piezoelectric ceramics creep polymers rupture porous material Coble creep quantum dots crystallization quantum wells crystal defects quantum wires crystal structure quasicrystal damping rare earth magnets decomposition semiconducting polymers clustering decomposition semiconductors ordering decomposition compound semiconductors spinodal decomposition elemental semiconductors defects semiconductor devices etching defects semimetals lattice defects sensors point defects shape memory alloys (SMA) defects in semiconductors ferromagnetic shape memory deformation structure silica glass dendritic growth silicides dielectric transition metal silicides diffusion solar cells bulk diffusion sol–gel materials grain boundary diffusion solid electrolytes interface diffusion steels interstitial diffusion austenitic steels ionic diffusion bainitic steels liquid diffusion carbides pipe diffusion dual phases stress-assisted diffusion ferritic steels substitutional diffusion heat-resistant steels surface diffusion high-strength low-alloy (HSLA) steels diffusion-induced grain boundary
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