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April 8-10, 2014 2014 年 4 月 8-10 日 Beijing International Convention Center 中 文 版 北京国际会议中心 Beijing, China 中国北京 2014 CONFERENCE GUIDE www.EDICONCHINA.com 1 EDI CON 2014主办单位诚挚感谢下列公司 对今年整个活动的帮助和宝贵支持！ 赞助商 主办单位： 首席赞助商： 钻石赞助商： 企业赞助商： 金牌赞助商： 银牌赞助商： 媒体伙伴： 官方出版物： 目 录 赞助商 封二 会议议程表 4 全体会议 7 参展商名单 102 展览平面图 103 致谢 104 会议日程 技术会议： 研讨会和小组会议： 2014年4月8日，星期二 2014年4月8日，星期二 TU101 ........................................................................... 13 WS_TU101：安捷伦研讨会 ................................................... 65 TU102 ........................................................................... 14 WS_TU201：飞思卡尔研讨会 ............................................... 66 TU103 ........................................................................... 15 WS_TU301：MACOM研讨会 ................................................ 66 ：罗德与施瓦茨研讨会 TU104 ........................................................................... 16 WS_TU102 ........................................ 67 WS_TU202：安立研讨会 ...................................................... 67 TU105 ........................................................................... 17 WS_TU302：Maury研讨会.................................................... 68 WS_TU103：美国国家仪器研讨会 ........................................ 69 2014年4月9日，星期三 WS_TU203：Mini-Circuits研讨会 .......................................... 70 WS_TU303：美国国家仪器研讨会 ........................................ 71 设计环节 ....................................................................... 19 WS_TU104：思博伦研讨会 ................................................... 72 WE101 ............................................................... 19 WS_TU204：CST研讨会 ...................................................... 72 WE201 ............................................................... 21 WS_TU304：EMSS研讨会 ................................................... 73 测量与建模环节 ............................................................ 23 WS_TU105：中电41所研讨会 ............................................... 74 WE102 ............................................................... 23 WS_TU205：Bonn Elektronik研讨会 .................................... 74 WE202 ............................................................... 25 系统级测量/建模环节 .................................................... 27 2014年4月9日，星期三 WE103 ............................................................... 27 PA_WE101：GaN小组会议 ................................................... 75 WE203 ............................................................... 29 WS_WE201：RFIC研讨会 .................................................... 77 系统工程环节 ................................................................ 31 WS_WE301：GaN功放设计讨论会（1） .............................. 78 WE104 ............................................................... 31 WS_WE401：GaN功放设计讨论会（2） .............................. 79 WE204 ............................................................... 33 WS_WE102：Peregrine研讨会 ............................................. 79 ： 研讨会 商业资源环节 ................................................................ 36 WS_WE202 OMMIC ................................................ 80 WS_WE302：伟博电讯研讨会 .............................................. 80 WE105 ............................................................... 36 WS_WE402：安捷伦研讨会 .................................................. 81 WE205 ............................................................... 38 WS_WE103：信号监测和频谱分析研讨会 ............................ 81 WS_WE203：COMSOL研讨会 ............................................. 83 2014年4月10日，星期四 PA_WE303：思博伦小组会议 ............................................... 84 WS_WE403：Richardson RFPD研讨会................................ 86 设计环节 ....................................................................... 42 WS_WE104：CST研讨会 ..................................................... 87 TH101 ................................................................ 42 WS_WE204：AWR研讨会 .................................................... 88 TH201 ................................................................ 45 WS_WE304：Ansys研讨会 ................................................... 89 射频/微波测量/建模环节 ................................................ 47 WS_WE404：WLAN生产测试研讨会 .................................... 89 ：力科研讨会 TH102 ................................................................ 47 WS_WE105 ..................................................... 90 ： 研讨会 TH202 ................................................................ 49 WS_WE205 MIMO OTA ........................................... 90 WS_WE305：罗德与施瓦茨研讨会 ....................................... 91 EMC/EMI与HSD测量/建模环节 .................................... 51 TH103 ................................................................ 51 TH203 ................................................................ 53 2014年4月10日，星期四 系统工程环节 ................................................................ 56 WS_TH101：AWR研讨会 ..................................................... 92 TH104 ................................................................ 56 WS_TH102：射频半导体研讨会 ............................................ 93 TH204 ................................................................ 58 WS_TH103：罗德与施瓦茨研讨会 ........................................ 94 ：雷达仿真研讨会 商业资源环节 ................................................................ 60 WS_TH104 ............................................... 95 ： 研讨会 TH105 ................................................................ 60 WS_TH105 Taconic ................................................. 96 PA_TH401：半导体小组会议 ................................................ 97 TH205 ................................................................ 62 PA_TH402：EDA设计流程小组会议 ..................................... 99 PA_TH403：电信小组会议 .................................................. 101 本书的部份内容在印刷后可能发生变更。最新信息请访问我们的网站：www.ediconchina.com 3 EDI CON 2014会议议程表：2014年4月8日，星期二 2014年4月7日开始现场注册 致欢迎辞：全体会议演讲嘉宾： 宋俊德，EDI CON 2014名誉主席、北京邮电大学教授 09:30-10:40 冯克明，北京无线电计量测试研究所所长 李尔平，浙江大学射频与纳米电子研究中心主任、特聘教授 Mario Narduzzi，安捷伦科技市场营销经理 10:40-10:50 EDI CON展览预览 行业主题演讲：5G蜂窝技术的挑战 Corbett Rowell，中国移动研究院5G研发总监 10:50-12:00 James Kimery，美国国家仪器营销总监 Josef Wolf，罗德与施瓦茨频谱/网络ANA和EMC总监 12:00-13:30 代表和贵宾午餐 一般技术会议 TU101: TU102: TU103: TU104: TU105: 会议 A 会议室 B 会议室C 会议室D 会议室E （201A/B） （201D） （203A） （203B） （203C） 针对下一代蜂窝无线基 放大器测试：包络跟 混合谐波负载拉移的阻 预选和修平滤波器对 动态频率选择的 础设施的 低噪声 踪技术 抗合成算法， 测量的影响， MMIC 测量要求， OTA 放大器， 13:30-13:50 Frank-Werner Thuemmler， 孙现福， Brian Avenell， 封翔，安捷伦科技 Loo Kah Cheng， 罗德与施瓦茨 Focus Microwaves 美国国家仪器 Mini-Circuits 宽带和超高速器件 实时扩展至 的监 应对包络跟踪测试解决 160MHz 针对多天线相控阵列应 针对高度集成应用的新 表征的混合信号有 测跳频信号和针对研发应 方案的同步挑战， 用的基于数字化仪的 技术， 源谐波负载拉移， 用的强大频谱分析工具， ED-PHEMT 13:50-14:10 David Hall， 相位相干测量， Cheng-Kuo Lin， Mauro Marchetti， Wolfgang Wendler， 美国国家仪器 Zhiyin Yun，安捷伦科技 WIN Semiconductors Anteverta 罗德与施瓦茨 研讨会 新闻发布会 (12:30开始) WS_TU101 WS_TU102 WS_TU103 WS_TU104 WS_TU105 记者参观展 览将从13:00 SI测量和信道表征– 开始 安捷伦研讨会： 数字系统的信 罗德与施瓦茨研讨会： 美国国家仪器 研讨会： 中电 所研讨会： 10G-32G DPD 思博伦研讨会： 41 号完整性测量技术， 功率放大器的 移动功率放大器测试的 复杂电磁信号测试与 信道验证， 14:15-15:00 孙灯亮，安捷伦科技； 精确高效测试， 数字预失真技术， MIMO OTA 分析技术， Hui Xiao，思博伦 展览时间 用于表征28Gb/s SER- 杨洪文，罗德与施瓦茨 David Hall，美国国家仪器 王峰，中电41所 DES信道的先进技术， (12:00 - 17:00) Robert Sleigh，安捷伦科技 15:00-15:30 咖啡/茶歇 WS_TU201 WS_TU202 WS_TU203 WS_TU204 WS_TU205 飞思卡尔研讨会： Bonn Elektronik 安立研讨会： 研讨会： 研讨会： 通过灵活的 设计实现 Mini-Circuits 研讨会： RF 及以上稳定晶圆 针对射频产品和系统认证的 CST 用于 测试的 部署， 110GHz 天线系统仿真， EMC 15:30-16:15 TD-LTE 上宽带器件的表征， 便携式和生产测试设备， MIMO 高功率放大器， Eric Westberg， Cier Siang Chua，CST Bob Buxton，安立 Chi Man Shum, Mini-Circuits Gerald Puchbauer， 飞思卡尔半导体 Bonn Elektronik WS_TU301 WS_TU302 WS_TU303 WS_TU304 美国国家仪器研讨会： 现代无线标准中的无线 研讨会： 研讨会： 研讨会： MACOM Maury 发射器指标调查， EMSS 突破GaN的千瓦界限， 基于矢量接收机的负载牵 电路板级的噪声耦合和 David Hall，美国国家仪器； 16:15-17:00 Damian McCann， 引测量系统， 天线设计， 现代无线标准中的无线 LTE MIMO MACOM 杨栋梁，Maury Microwave Peter Futter，EMSS 接收器指标调查， David Hall，美国国家仪器 17:00-18:00 鸡尾酒会 18:00-20:00 贵宾晚宴 4 EDI CON 2014会议议程表：2014年4月9日，星期三 设计环节： 测量与建模环节： 系统级测量/建模： 系统工程环节： 商业资源环节： 会议室A（201A/B） 会议室B（201D） 会议室C（203A） 会议室D（203B） 会议室E（203C） WE101 WE102 WE103 WE104 WE105 用于 位 的 用金属圆柱腔抑制带状线 4GS/s 6 ADC 自动夹具移除技术 A-GNSS OTA测试 基于FPGA的DiSEqC发 InGaP/GaAs HBT比较器， （ ）的演进， 方法论的演进， 生器和分析仪系统， 功分器的谐波， 08:30-08:50 Jincan Zhang， AFR 谢欢欢， 西安电子科技大学 程宁，安捷伦科技 Ron Borsato，思博伦 Jian Xu，高通 西安导航技术研究所 采用注入频率分频电路 区分好/坏2x2 MIMO天线 全球导航卫星系统及 的 频段低功率 高频 设计与分析： 21.6GHz 现代宽带接收机的 系统的基于电波暗室 其广泛应用， PCB 锁相环芯片设计， 新校准要求， 的MIMO OTA测试， 跨平台流程/解决方案， 08:50-09:10 Frank-Werner Thuemmler， Wen Cheng Lai， Chunlan Qin，安捷伦科技 Lars Foged， Milton Lien，AWR 国立台湾科技大学 Microwave Vision Group 罗德与施瓦茨 基于混合波形工程技术的 使用集成EM和电路设计 针对MIMO吞吐量测试的 在轨卫星的群延迟测量， 高速和高功率连接器 高效率高压氮化镓 仿真软件优化芯片 辐射两阶段法， Doherty - Thilo Bednorz， 设计， 09:15-09:35 功率放大器设计， 模块-板转换， 刘克峰， 罗德与施瓦茨 ， 王占仓，诺基亚 John Dunn，AWR General Test Systems Klaus Krohne CST 基于调谐技术的高压氮 针对 器件性能 卫星频率上变频器的 MIMO 不断创新满足信号互连 化镓反型 功率 射频系统仿真的演变， 评估的辐射两阶段 表征， Doherty 3D OTA 的复杂要求， 09:35-09:55 放大器设计， Rickard Petersson，ANSYS 测试方法， Thilo Bednorz， Robert Shen，Emerson 王占仓，诺基亚 Ya Jing，安捷伦科技 罗德与施瓦茨 10:00-10:30 咖啡/茶歇 WE201 WE202 WE203 WE204 WE205 用于无线发射机的 利用频谱分析仪和外 高频率下的温度可变 基高电子迁移率晶 部谐波混频测量 波段 大规模 原型设计， 高功率、多频带 GaN E MIMO 衰减器性能， Doherty放大器， 体管建模方法的选择， 的无线电链路， James Kimery， 10:35-10:55 Moamer Hasanovic， Jarod Geng， Qiang Chen，安捷伦科技 Wolfgang Wendler， 美国国家仪器 飞思卡尔半导体 罗德与施瓦茨 EMC/Florida RF Labs 采用简化实频技术的宽带 用于高效毫米波测量的 了解蓝牙的低能耗 金刚石上的氮化镓： 功率放大器设计， 微波电路的稳定性分析， 测试模块和乘法器， 及其测试， 下一个GaN， 10:55-11:15 Chengcheng Xie， Stephane Dellier，AMCAD 安捷伦科技 Kent Whitney，Millitech Yvonne Liu，安捷伦科技 Justin Saeheng，Element 6 针对高功率应用的 DPD模型的性能比较和 毫米波信号产生 雷达系统的现代 针对高频应用的印刷 11:20-11:40 线性化技术， 降低复杂性， 及分析方案， 测量方法， 电路板材料， Qin Shen-Schultz，Auriga Tong Li，安捷伦科技 马志刚,
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  • M&C 13 Download

    M&C 13 Download

    M&C issue 13 – 2019 13 Happy Birthday, UniFor! Born in 1969, this lady with a vocation for architecture is celebrating her first 50 years with the story of a family – the truest portrait of the Italian design industry. A book, an installation, an exciting future. It all began, as with many industrial design traditions, in Brianza, the heart of Italy’s furniture district. This was a time when design culture was ferrying craftsmanship over to industry, all in the service of aesthetics and practicality. UniFor developed from the story of a family into a whole new chapter in Italian history. Originally, it was an idea of a community cherished by its founding fathers, brothers, cousins, relations and friends, all of whom shared the same vision and talent. But it was also testament to exceptional far-sightedness, skills, competence and creativity. Very soon, UniFor established itself as synonymous with elegance, reliability and innovation – design for life, if you will, rather than just a design industry. And so, this year sees Molteni&C open three new flagship stores, all designed by Vincent Van Duysen, in cities that never fail to amaze: New York, London and Tokyo. This publication chronicles new and unexpected encounters, new worldwide projects and new designers from every continent. It also reviews a major Gio Ponti exhibitionat at the Paris MAD. Living is not just a question of style, or, as the great Gio himself said: “Architecture is an interpretation of life”. Chapeau les artistes! moltenigroup.com #MolteniGroup #MDW19 #UniFor50 by Ron Gilad Unifor 50th Anniversary Installation 9 – 14 April 2019 Palazzo di Brera via Brera 28 Milano Monday – Saturday 10.00am – 21.00pm Sunday 10.00am – 19.00pm Tuesday 9 April Cocktail Party 18.00 – 22.00 by Francesca Molteni It was 1968, the year of great and definitive events that left their mark on consciences, cultures, populations, Art, culture and industry come together at Palazzo certain exemplary moments, from UniFor’s collaborations A Commitment Una vocazione di Brera for UniFor’s 50th anniversary.