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Edi Con 2014会议指南

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Edi Con 2014会议指南 April 8-10, 2014 2014 年 4 月 8-10 日 Beijing International Convention Center 中 文 版 北京国际会议中心 Beijing, China 中国北京 2014 CONFERENCE GUIDE www.EDICONCHINA.com 1 EDI CON 2014主办单位诚挚感谢下列公司 对今年整个活动的帮助和宝贵支持！ 赞助商 主办单位： 首席赞助商： 钻石赞助商： 企业赞助商： 金牌赞助商： 银牌赞助商： 媒体伙伴： 官方出版物： 目 录 赞助商 封二 会议议程表 4 全体会议 7 参展商名单 102 展览平面图 103 致谢 104 会议日程 技术会议： 研讨会和小组会议： 2014年4月8日，星期二 2014年4月8日，星期二 TU101 ........................................................................... 13 WS_TU101：安捷伦研讨会 ................................................... 65 TU102 ........................................................................... 14 WS_TU201：飞思卡尔研讨会 ............................................... 66 TU103 ........................................................................... 15 WS_TU301：MACOM研讨会 ................................................ 66 ：罗德与施瓦茨研讨会 TU104 ........................................................................... 16 WS_TU102 ........................................ 67 WS_TU202：安立研讨会 ...................................................... 67 TU105 ........................................................................... 17 WS_TU302：Maury研讨会.................................................... 68 WS_TU103：美国国家仪器研讨会 ........................................ 69 2014年4月9日，星期三 WS_TU203：Mini-Circuits研讨会 .......................................... 70 WS_TU303：美国国家仪器研讨会 ........................................ 71 设计环节 ....................................................................... 19 WS_TU104：思博伦研讨会 ................................................... 72 WE101 ............................................................... 19 WS_TU204：CST研讨会 ...................................................... 72 WE201 ............................................................... 21 WS_TU304：EMSS研讨会 ................................................... 73 测量与建模环节 ............................................................ 23 WS_TU105：中电41所研讨会 ............................................... 74 WE102 ............................................................... 23 WS_TU205：Bonn Elektronik研讨会 .................................... 74 WE202 ............................................................... 25 系统级测量/建模环节 .................................................... 27 2014年4月9日，星期三 WE103 ............................................................... 27 PA_WE101：GaN小组会议 ................................................... 75 WE203 ............................................................... 29 WS_WE201：RFIC研讨会 .................................................... 77 系统工程环节 ................................................................ 31 WS_WE301：GaN功放设计讨论会（1） .............................. 78 WE104 ............................................................... 31 WS_WE401：GaN功放设计讨论会（2） .............................. 79 WE204 ............................................................... 33 WS_WE102：Peregrine研讨会 ............................................. 79 ： 研讨会 商业资源环节 ................................................................ 36 WS_WE202 OMMIC ................................................ 80 WS_WE302：伟博电讯研讨会 .............................................. 80 WE105 ............................................................... 36 WS_WE402：安捷伦研讨会 .................................................. 81 WE205 ............................................................... 38 WS_WE103：信号监测和频谱分析研讨会 ............................ 81 WS_WE203：COMSOL研讨会 ............................................. 83 2014年4月10日，星期四 PA_WE303：思博伦小组会议 ............................................... 84 WS_WE403：Richardson RFPD研讨会................................ 86 设计环节 ....................................................................... 42 WS_WE104：CST研讨会 ..................................................... 87 TH101 ................................................................ 42 WS_WE204：AWR研讨会 .................................................... 88 TH201 ................................................................ 45 WS_WE304：Ansys研讨会 ................................................... 89 射频/微波测量/建模环节 ................................................ 47 WS_WE404：WLAN生产测试研讨会 .................................... 89 ：力科研讨会 TH102 ................................................................ 47 WS_WE105 ..................................................... 90 ： 研讨会 TH202 ................................................................ 49 WS_WE205 MIMO OTA ........................................... 90 WS_WE305：罗德与施瓦茨研讨会 ....................................... 91 EMC/EMI与HSD测量/建模环节 .................................... 51 TH103 ................................................................ 51 TH203 ................................................................ 53 2014年4月10日，星期四 系统工程环节 ................................................................ 56 WS_TH101：AWR研讨会 ..................................................... 92 TH104 ................................................................ 56 WS_TH102：射频半导体研讨会 ............................................ 93 TH204 ................................................................ 58 WS_TH103：罗德与施瓦茨研讨会 ........................................ 94 ：雷达仿真研讨会 商业资源环节 ................................................................ 60 WS_TH104 ............................................... 95 ： 研讨会 TH105 ................................................................ 60 WS_TH105 Taconic ................................................. 96 PA_TH401：半导体小组会议 ................................................ 97 TH205 ................................................................ 62 PA_TH402：EDA设计流程小组会议 ..................................... 99 PA_TH403：电信小组会议 .................................................. 101 本书的部份内容在印刷后可能发生变更。最新信息请访问我们的网站：www.ediconchina.com 3 EDI CON 2014会议议程表：2014年4月8日，星期二 2014年4月7日开始现场注册 致欢迎辞：全体会议演讲嘉宾： 宋俊德，EDI CON 2014名誉主席、北京邮电大学教授 09:30-10:40 冯克明，北京无线电计量测试研究所所长 李尔平，浙江大学射频与纳米电子研究中心主任、特聘教授 Mario Narduzzi，安捷伦科技市场营销经理 10:40-10:50 EDI CON展览预览 行业主题演讲：5G蜂窝技术的挑战 Corbett Rowell，中国移动研究院5G研发总监 10:50-12:00 James Kimery，美国国家仪器营销总监 Josef Wolf，罗德与施瓦茨频谱/网络ANA和EMC总监 12:00-13:30 代表和贵宾午餐 一般技术会议 TU101: TU102: TU103: TU104: TU105: 会议 A 会议室 B 会议室C 会议室D 会议室E （201A/B） （201D） （203A） （203B） （203C） 针对下一代蜂窝无线基 放大器测试：包络跟 混合谐波负载拉移的阻 预选和修平滤波器对 动态频率选择的 础设施的 低噪声 踪技术 抗合成算法， 测量的影响， MMIC 测量要求， OTA 放大器， 13:30-13:50 Frank-Werner Thuemmler， 孙现福， Brian Avenell， 封翔，安捷伦科技 Loo Kah Cheng， 罗德与施瓦茨 Focus Microwaves 美国国家仪器 Mini-Circuits 宽带和超高速器件 实时扩展至 的监 应对包络跟踪测试解决 160MHz 针对多天线相控阵列应 针对高度集成应用的新 表征的混合信号有 测跳频信号和针对研发应 方案的同步挑战， 用的基于数字化仪的 技术， 源谐波负载拉移， 用的强大频谱分析工具， ED-PHEMT 13:50-14:10 David Hall， 相位相干测量， Cheng-Kuo Lin， Mauro Marchetti， Wolfgang Wendler， 美国国家仪器 Zhiyin Yun，安捷伦科技 WIN Semiconductors Anteverta 罗德与施瓦茨 研讨会 新闻发布会 (12:30开始) WS_TU101 WS_TU102 WS_TU103 WS_TU104 WS_TU105 记者参观展 览将从13:00 SI测量和信道表征– 开始 安捷伦研讨会： 数字系统的信 罗德与施瓦茨研讨会： 美国国家仪器 研讨会： 中电 所研讨会： 10G-32G DPD 思博伦研讨会： 41 号完整性测量技术， 功率放大器的 移动功率放大器测试的 复杂电磁信号测试与 信道验证， 14:15-15:00 孙灯亮，安捷伦科技； 精确高效测试， 数字预失真技术， MIMO OTA 分析技术， Hui Xiao，思博伦 展览时间 用于表征28Gb/s SER- 杨洪文，罗德与施瓦茨 David Hall，美国国家仪器 王峰，中电41所 DES信道的先进技术， (12:00 - 17:00) Robert Sleigh，安捷伦科技 15:00-15:30 咖啡/茶歇 WS_TU201 WS_TU202 WS_TU203 WS_TU204 WS_TU205 飞思卡尔研讨会： Bonn Elektronik 安立研讨会： 研讨会： 研讨会： 通过灵活的 设计实现 Mini-Circuits 研讨会： RF 及以上稳定晶圆 针对射频产品和系统认证的 CST 用于 测试的 部署， 110GHz 天线系统仿真， EMC 15:30-16:15 TD-LTE 上宽带器件的表征， 便携式和生产测试设备， MIMO 高功率放大器， Eric Westberg， Cier Siang Chua，CST Bob Buxton，安立 Chi Man Shum, Mini-Circuits Gerald Puchbauer， 飞思卡尔半导体 Bonn Elektronik WS_TU301 WS_TU302 WS_TU303 WS_TU304 美国国家仪器研讨会： 现代无线标准中的无线 研讨会： 研讨会： 研讨会： MACOM Maury 发射器指标调查， EMSS 突破GaN的千瓦界限， 基于矢量接收机的负载牵 电路板级的噪声耦合和 David Hall，美国国家仪器； 16:15-17:00 Damian McCann， 引测量系统， 天线设计， 现代无线标准中的无线 LTE MIMO MACOM 杨栋梁，Maury Microwave Peter Futter，EMSS 接收器指标调查， David Hall，美国国家仪器 17:00-18:00 鸡尾酒会 18:00-20:00 贵宾晚宴 4 EDI CON 2014会议议程表：2014年4月9日，星期三 设计环节： 测量与建模环节： 系统级测量/建模： 系统工程环节： 商业资源环节： 会议室A（201A/B） 会议室B（201D） 会议室C（203A） 会议室D（203B） 会议室E（203C） WE101 WE102 WE103 WE104 WE105 用于 位 的 用金属圆柱腔抑制带状线 4GS/s 6 ADC 自动夹具移除技术 A-GNSS OTA测试 基于FPGA的DiSEqC发 InGaP/GaAs HBT比较器， （ ）的演进， 方法论的演进， 生器和分析仪系统， 功分器的谐波， 08:30-08:50 Jincan Zhang， AFR 谢欢欢， 西安电子科技大学 程宁，安捷伦科技 Ron Borsato，思博伦 Jian Xu，高通 西安导航技术研究所 采用注入频率分频电路 区分好/坏2x2 MIMO天线 全球导航卫星系统及 的 频段低功率 高频 设计与分析： 21.6GHz 现代宽带接收机的 系统的基于电波暗室 其广泛应用， PCB 锁相环芯片设计， 新校准要求， 的MIMO OTA测试， 跨平台流程/解决方案， 08:50-09:10 Frank-Werner Thuemmler， Wen Cheng Lai， Chunlan Qin，安捷伦科技 Lars Foged， Milton Lien，AWR 国立台湾科技大学 Microwave Vision Group 罗德与施瓦茨 基于混合波形工程技术的 使用集成EM和电路设计 针对MIMO吞吐量测试的 在轨卫星的群延迟测量， 高速和高功率连接器 高效率高压氮化镓 仿真软件优化芯片 辐射两阶段法， Doherty - Thilo Bednorz， 设计， 09:15-09:35 功率放大器设计， 模块-板转换， 刘克峰， 罗德与施瓦茨 ， 王占仓，诺基亚 John Dunn，AWR General Test Systems Klaus Krohne CST 基于调谐技术的高压氮 针对 器件性能 卫星频率上变频器的 MIMO 不断创新满足信号互连 化镓反型 功率 射频系统仿真的演变， 评估的辐射两阶段 表征， Doherty 3D OTA 的复杂要求， 09:35-09:55 放大器设计， Rickard Petersson，ANSYS 测试方法， Thilo Bednorz， Robert Shen，Emerson 王占仓，诺基亚 Ya Jing，安捷伦科技 罗德与施瓦茨 10:00-10:30 咖啡/茶歇 WE201 WE202 WE203 WE204 WE205 用于无线发射机的 利用频谱分析仪和外 高频率下的温度可变 基高电子迁移率晶 部谐波混频测量 波段 大规模 原型设计， 高功率、多频带 GaN E MIMO 衰减器性能， Doherty放大器， 体管建模方法的选择， 的无线电链路， James Kimery， 10:35-10:55 Moamer Hasanovic， Jarod Geng， Qiang Chen，安捷伦科技 Wolfgang Wendler， 美国国家仪器 飞思卡尔半导体 罗德与施瓦茨 EMC/Florida RF Labs 采用简化实频技术的宽带 用于高效毫米波测量的 了解蓝牙的低能耗 金刚石上的氮化镓： 功率放大器设计， 微波电路的稳定性分析， 测试模块和乘法器， 及其测试， 下一个GaN， 10:55-11:15 Chengcheng Xie， Stephane Dellier，AMCAD 安捷伦科技 Kent Whitney，Millitech Yvonne Liu，安捷伦科技 Justin Saeheng，Element 6 针对高功率应用的 DPD模型的性能比较和 毫米波信号产生 雷达系统的现代 针对高频应用的印刷 11:20-11:40 线性化技术， 降低复杂性， 及分析方案， 测量方法， 电路板材料， Qin Shen-Schultz，Auriga Tong Li，安捷伦科技 马志刚,
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  • M&C 13 Download
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